CN103214910A - Radiation heat dissipation coating for reducing light-emitting diode (LED) chip junction temperature and preparation method thereof - Google Patents
Radiation heat dissipation coating for reducing light-emitting diode (LED) chip junction temperature and preparation method thereof Download PDFInfo
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- CN103214910A CN103214910A CN2013101153279A CN201310115327A CN103214910A CN 103214910 A CN103214910 A CN 103214910A CN 2013101153279 A CN2013101153279 A CN 2013101153279A CN 201310115327 A CN201310115327 A CN 201310115327A CN 103214910 A CN103214910 A CN 103214910A
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Abstract
The invention discloses a radiation heat dissipation coating for reducing the light-emitting diode (LED) chip junction temperature and a preparation method thereof. The coating comprise the following components in percentage by weight: 30-70% of macromolecular resin, 5-40% of solvent, 10-30% of far infrared ceramic powder, 5-20% of silicon carbide, 0.5-3% of cerium oxide and 1-5% of addition agent. By utilizing the radiation heat dissipation coating disclosed by the invention, the LED chip junction temperature can be greatly lowered, and the service life of an LED chip in a lamp can be prolonged.
Description
Technical field
The present invention relates to a kind of optical coating, further, relate to a kind of heat loss through radiation coating that can reduce the led chip junction temperature.
Background technology
Employed in the market ir radiation heat radiation coating, its major part can only reduce the temperature of spreader surface, as the disclosed high heat-conductive coating of patent CN201110253676.8, and its color dullness, ornamental poor, radiant ratio is low, and purposes is limited.The disclosed heat radiation coating of patent CN201110031374.6 for another example, though have the thermal conductivity of 5w/m3k, 0.8 far infrared transmissivity, but its in, the low temperature range cooling extent is limited, therefore, junction temperature for the led chip in the low temperature range in being in, cooling extent is also not obvious, can't solve the junction temperature problem of led chip.And, common in the market heat loss through radiation coating application complexity, glossiness is low.
Summary of the invention
The present invention provides a kind of heat loss through radiation coating that reduces the led chip junction temperature for solving the problems of the technologies described above, and this heat loss through radiation coating can significantly reduce the junction temperature of led chip, prolongs the working life of led chip.
Simultaneously, the present invention also provides a kind of preparation method of heat loss through radiation coating of above-mentioned reduction led chip junction temperature.
For achieving the above object, the technical solution used in the present invention is as follows:
A kind of heat loss through radiation coating that reduces the led chip junction temperature, it is characterized in that, comprising: weight percent is: 30～70% macromolecule resin, 5～40% solvent, 10～30% far infrared ceramic powder, 5～20% silicon carbide, 0.5～3% cerium oxide and 1～5% auxiliary agent.
Described far infrared ceramic powder is to be mixed by metal oxide and nonmetal oxide, and by the liquid-phase coprecipitation prepared, its particle diameter is the 5-80 nanometer, and emission wavelength is 2～18 μ m under the normal temperature.
The component of described far infrared ceramic powder comprises: weight percent is respectively: 25.10% Al
2O
3, 24.81% SiO
2, 8.5% TiO
2, 6.41% B
2O
3, 5.18% Fe
2O
3
Described macromolecule resin be Resins, epoxy, acrylic resin, urethane resin or silicone resin wherein
One or more components.
Described solvent is two or more the collocation wherein of dimethylbenzene, pimelinketone, propyl carbinol, Virahol, butylacetate, propyl acetate.
Described silicon carbide is six sides or rhombohedral α-SiC, and particle diameter is in 10 nanometers to 80 micron.
Described cerium oxide is the nanometer grade powder of 99.9%～99.99% high-purity content, particle diameter in 5 nanometers to 80 nanometers.
The preparation method of the heat loss through radiation coating of above-mentioned reduction led chip junction temperature, its step are that at first with load weighted macromolecule resin, solvent, far infrared ceramic powder, silicon carbide, cerium oxide mixing stirring, stirring velocity 2000r/min adds auxiliary agent while stirring; Regulate stirring velocity then to 3500r/min, stir 45min after, grinding machine for grinding 2 hours, grinding rate was 3000r/min, then churning time is 30min in stirrer, stirring velocity 2000r/min; Regulate suitable viscosity at last, filter, packing with 300 order filtering nets.
A kind of high-power LED lamp is coated with the above-mentioned heat loss through radiation coating that can reduce the led chip junction temperature on its case body or the scatterer.
The far infrared ceramic powder that is comprised in the coating disclosed in this invention by the liquid-phase precipitation method prepared, with kind of mineral compound and trace metal or certain natural crystal surplus 20, cooperates by a certain percentage, through ball milling, drying, sieve, synthetic, be prepared from.This far infrared ceramic powder emissivity values in the long scope of all-wave is 0.94, and emissivity values can be greater than 0.95 in wavelength is 8～14 mu m ranges.Add a small amount of rare earth oxide and micro-transition metal oxide, can improve far-infrared ceramic powder material lattice vibration activity, thereby significantly improve the normal direction total radiation emittance of heat loss through radiation paint coatings.And this heat loss through radiation coating (containing nano-titanium oxide) has the catalyzed oxidation function, under sunlight (especially ultraviolet ray) irradiation, generates OH-, can effectively remove indoor benzene, formaldehyde, sulfide, ammonia and stink substance, and have sterilizing function.
Heat loss through radiation coating disclosed in this invention uses the far infrared ceramic powder of high radiant rate and the silicon carbide with high thermal conductance, employing has the compounded mix of over-all properties, make coatingsurface present the nano material constituent element of the pattern of macroscopical bright and clean micro-rough, give full play to synergistic effect between emission, reflection, radiation and the refraction, solidify the back form have a nanometer micropore structure have filming of radiating and cooling function.Easy to use, (20～40um) applications have good protection and decoration functions to thin layer simultaneously, can be used for the object of any needs heat radiation, as all trades and professions such as aluminium shell, aluminium radiator, electronic component, industrial equipments, air conditioner energy savings.
Embodiment
Below by specific embodiment coating provided by the present invention is done a detailed explanation, below per-cent among each embodiment all be weight percentage.
Embodiment one
At first weighing Resins, epoxy 20%, aminoresin 10%, butylacetate 12%, propyl carbinol 5%, dimethylbenzene 5%, far infrared ceramic powder 30%, silicon carbide 12%, cerium oxide 3% mix stirring with above-mentioned each component, and stirring velocity is 2000r/min.Add HX-3200 flow agent 0.5%, HX-4021 dispersion agent 0.3%, HX-301 anti-settling agent 1.5%, EFKA – 2021 defoamers 0.7% while stirring.Regulate stirring velocity then to 3500r/min, stir 45min after, grinding machine for grinding 2 hours, grinding rate was 3000r/min.Then churning time is 30min in stirrer, and stirring velocity is 2000r/min.Regulate suitable viscosity at last, filter, packing with 300 order filtering nets.
Test result: when the led chip junction temperature was 70～90 ℃, the measured junction temperature of chip of spraying heat loss through radiation coating of the present invention had reduced by 3 ℃ than the junction temperature of chip that does not spray heat loss through radiation coating of the present invention on the scatterer of LED light fixture.
Embodiment two
At first weighing Resins, epoxy 30%, aminoresin 10%, butylacetate 12%, propyl carbinol 4%, dimethylbenzene 4%, far infrared ceramic powder 25%, silicon carbide 9%, cerium oxide 3% mix stirring with above-mentioned each component, and stirring velocity is 2000r/min.Add HX-3200 flow agent 0.5%, HX-4021 dispersion agent 0.6% while stirring, HX-301 anti-settling agent 1.2%, EFKA – 2021 defoamers 0.7%.Regulate stirring velocity then to 3500r/min, stir 45min after, grinding machine for grinding 2 hours, grinding rate was 3000r/min.Then churning time is 30min in stirrer, and stirring velocity is 2000r/min.Regulate suitable viscosity at last, filter, packing with 300 order filtering nets.
Test result: when the led chip junction temperature was 70～90 ℃, the measured junction temperature of chip of spraying heat loss through radiation coating of the present invention had reduced by 3 ℃ than the junction temperature of chip that does not spray heat loss through radiation coating of the present invention on the scatterer of LED light fixture.
Embodiment three
At first weighing Resins, epoxy 40%, aminoresin 14%, butylacetate 9%, propyl carbinol 3%, far infrared ceramic powder 20%, silicon carbide 10%, cerium oxide 1% mix stirring with above-mentioned each component, and stirring velocity is 2000r/min.Add HX-3200 flow agent 0.5%, HX-4021 dispersion agent 0.5% while stirring, HX-301 anti-settling agent 1.5%, EFKA – 2021 defoamers 0.5%.Regulate stirring velocity then to 3500r/min, stir 45min after, grinding machine for grinding 2 hours, grinding rate was 3000r/min.Then churning time is 30min in stirrer, and stirring velocity is 2000r/min.Regulate suitable viscosity at last, filter, packing with 300 order filtering nets.
Test result: when the led chip junction temperature was 70～90 ℃, the measured junction temperature of chip of spraying heat loss through radiation coating of the present invention had reduced by 4 ℃ than the junction temperature of chip that does not spray heat loss through radiation coating of the present invention on the scatterer of LED light fixture.
Embodiment four
At first weighing Resins, epoxy 45%, aminoresin 15%, butylacetate 12%, propyl carbinol 4%, far infrared ceramic powder 15%, silicon carbide 4%, cerium oxide 2% mix stirring with above-mentioned each component, and stirring velocity is 2000r/min.Add HX-3200 flow agent 0.5%, HX-4021 dispersion agent 0.6% while stirring, HX-301 anti-settling agent 1.2%, EFKA – 2021 defoamers 0.7%.Regulate stirring velocity then to 3500r/min, stir 45min after, grinding machine for grinding 2 hours, grinding rate was 3000r/min.Then churning time is 30min in stirrer, and stirring velocity is 2000r/min.Regulate suitable viscosity at last, filter, packing with 300 order filtering nets.
Test result: when the led chip junction temperature was 70～90 ℃, the measured junction temperature of chip of spraying heat loss through radiation coating of the present invention had reduced by 3 ℃ than the junction temperature of chip that does not spray heat loss through radiation coating of the present invention on the scatterer of LED light fixture.
Embodiment five
At first weighing Resins, epoxy 55%, aminoresin 15%, butylacetate 9%, propyl carbinol 3%, far infrared ceramic powder 12%, silicon carbide 2%, cerium oxide 1% mix stirring with above-mentioned each component, and stirring velocity is 2000r/min.Add HX-3200 flow agent 0.7%, HX-4021 dispersion agent 1.0% while stirring, HX-301 anti-settling agent 0.5%, EFKA – 2021 defoamers 0.8%.Regulate stirring velocity then to 3500r/min, stir 45min after, grinding machine for grinding 2 hours, grinding rate was 3000r/min.Then churning time is 30min in stirrer, and stirring velocity is 2000r/min.Regulate suitable viscosity at last, filter, packing with 300 order filtering nets.
Test result: when the led chip junction temperature was 70～90 ℃, the measured junction temperature of chip of spraying heat loss through radiation coating of the present invention had reduced by 2 ℃ than the junction temperature of chip that does not spray heat loss through radiation coating of the present invention on the scatterer of LED light fixture.
The foregoing description only is used to illustrate technical solution of the present invention, is not limited to protection scope of the present invention.
Claims (8)
1. heat loss through radiation coating that reduces the led chip junction temperature, it is characterized in that, comprising: weight percent is respectively: 30～70% macromolecule resin, 5～40% solvent, 10～30% far infrared ceramic powder, 5～20% silicon carbide, 0.5～3% cerium oxide and 1～5% auxiliary agent.
2. the heat loss through radiation coating of reduction led chip junction temperature according to claim 1, it is characterized in that, described far infrared ceramic powder is to be mixed by metal oxide and nonmetal oxide, by the liquid-phase coprecipitation prepared, its particle diameter is the 5-80 nanometer, and emission wavelength is 2～18 μ m under the normal temperature.
3. the heat loss through radiation coating of reduction led chip junction temperature according to claim 1 is characterized in that, described macromolecule resin is Resins, epoxy, acrylic resin, urethane resin or silicone resin one or more components wherein.
4. the heat loss through radiation coating of reduction led chip junction temperature according to claim 1 is characterized in that, described solvent is two or more the collocation wherein of dimethylbenzene, pimelinketone, propyl carbinol, Virahol, butylacetate, propyl acetate.
5. the heat loss through radiation coating of reduction led chip junction temperature according to claim 1 is characterized in that, described silicon carbide is six sides or rhombohedral α-SiC, and particle diameter is in 10 nanometers to 80 micron.
6. the heat loss through radiation coating of reduction led chip junction temperature according to claim 1 is characterized in that, described cerium oxide is the nanometer grade powder of 99.9%～99.99% high-purity content, particle diameter in 5 nanometers to 80 nanometers.
7. the heat loss through radiation coating of reduction led chip junction temperature according to claim 1 is characterized in that, described auxiliary agent is selected from two or more the collocation in flow agent, dispersion agent, anti-settling agent, defoamer, the auxiliary rheological agents.
8. the preparation method of the heat loss through radiation coating of reduction led chip junction temperature according to claim 1, its step is, at normal temperature RT is that 23 ± 2 ℃, humidity RH are under 55% environment, at first load weighted macromolecule resin, solvent, far infrared ceramic powder, silicon carbide, cerium oxide are mixed and stir, stirring velocity 2000r/min adds auxiliary agent while stirring; Regulate stirring velocity then to 3500r/min, stir 45min after, grinding machine for grinding 2 hours, grinding rate was 3000r/min, then churning time is 30min in stirrer, stirring velocity 2000r/min; Regulate suitable viscosity at last, filter, packing with 300 order filtering nets.
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