CN101672460A - LED substrate radiation structure and LED lamp tube having same - Google Patents
LED substrate radiation structure and LED lamp tube having same Download PDFInfo
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- CN101672460A CN101672460A CN200810149566A CN200810149566A CN101672460A CN 101672460 A CN101672460 A CN 101672460A CN 200810149566 A CN200810149566 A CN 200810149566A CN 200810149566 A CN200810149566 A CN 200810149566A CN 101672460 A CN101672460 A CN 101672460A
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- led
- heat radiation
- base plate
- radiation structure
- plate heat
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Abstract
The invention relates to an LED substrate radiation structure, which comprises an LED substrate distributed with two or more welding spot, wherein the welding spots of the LED substrate are covered bya coating layer containing nano powder and an adhesive. The invention relates to an LED lamp tube having the LED substrate radiation structure. The LED substrate with the coating layer is accommodated in the LED lamp tube, wherein the high radiation rate, high temperature resistance, insulation and other properties of the coating layer can accelerate the removal of the heat of the LED substrate;and in addition, the coating layer can increase the contact area between the welding spots and the air to amplify the radiation area of the LED substrate to accelerate heat removal.
Description
Technical field
The present invention refers to the base plate heat radiation structure of a kind of light emitting diode (LED) fluorescent tube especially relevant for a kind of radiator structure of substrate.
Background technology
At present, light emitting diode (LED, Light Emitting Diode) because have low power consuming, power saving, long service life, characteristics such as volume is little, reaction is fast, so replace conventional bulb gradually and be applied in the various light-emitting devices, be one of them as the LED fluorescent tube.
The frame mode that LED is applied to general fluorescent tube as shown in Figure 1, be equiped with circuit board 20a in the light-transmitting tube body 10a, be laid with two or more LED lamps 30a on the circuit board 20a, what two ends of light-transmitting tube body 10a were arranged with metal connects sleeve 40a, and be provided with conducting terminal 401a on the sleeve 40a connecting, the LED fluorescent tube is inserted in lamp socket by both sides conducting terminal 401a, makes its turn-on power and makes LED lamp 30a luminous.
In the above-mentioned LED fluorescent tube, though only the little electric weight of need can be luminous for this LED lamp 30a, yet, its produced simultaneously high heat also can cause this circuit board 20a to produce high temperataure phenomena, if can't be effectively loss in time for the high heat on this circuit board 20a, to make the electronic building brick Yin Gaore on this circuit board 20a and damage, cause maintenance and use cost to increase.
Summary of the invention
In view of this, one object of the present invention is to provide a kind of LED base plate heat radiation structure that quickens to get rid of heat.
Another object of the present invention is to provide a kind of can effectively promote radiating efficiency, increase the LED LED fluorescent tube that comprises the LED base plate heat radiation structure in service life.
For achieving the above object, the invention provides a kind of LED base plate heat radiation structure of LED fluorescent tube, comprise the LED substrate that is laid with two or more solder joints, this LED substrate is covered with coating layer on this solder joint, and this coating layer comprises nanometer powder and binding agent.
For achieving the above object, the present invention also provides a kind of LED fluorescent tube of the LED of comprising base plate heat radiation structure, comprising: the LED substrate, and have shadow surface and radiating surface and be laid with two or more solder joints, this shadow surface is provided with two or more LED lamps; Coating layer is coated on this solder joint, and this coating layer comprises nanometer powder and binding agent; And body, being installed with this LED substrate, this body and arranged on left and right sides is respectively equipped with two or more louvres on the tube wall of the radiating surface of relative this LED substrate.
LED base plate heat radiation structure of the present invention has characteristics such as high emissivity (high radiativity), heatproof and insulation by the coating layer of LED substrate, is beneficial to quicken to get rid of the heat that this LED substrate is produced.
LED base plate heat radiation structure of the present invention can increase the area that the solder joint surface contacts with air by the coating layer of LED substrate, is beneficial to the area of dissipation of increasing LED substrate and heat extraction.
LED base plate heat radiation structure of the present invention, coating layer by the LED substrate has water proofing property, when externally aqueous vapor is attached to this LED substrate surface, the circuit that can prevent this LED substrate produces short circuit, have characteristics such as anti-oxidant, anti-strong acid and highly basic in addition, can increase the service life of durability, prolongation LED substrate.
The LED fluorescent tube that comprises the LED base plate heat radiation structure of the present invention, can reach the hot gas in the quick discharge LED fluorescent tube and effectively promote the effect of radiating efficiency, and then keep the luminous efficiency of LED lamp, the service life of increase LED, to reduce maintenance and use cost, promote practicality and convenience.
Description of drawings
Fig. 1 is the sectional view of known LED fluorescent tube;
Fig. 2 is the stereogram of LED base plate heat radiation structure of the present invention;
Fig. 3 is the partial section of LED base plate heat radiation structure of the present invention;
Fig. 4 is the stereogram that the present invention includes the LED fluorescent tube of LED base plate heat radiation structure;
Fig. 5 is the use schematic diagram that the present invention includes the LED fluorescent tube of LED base plate heat radiation structure.
Description of reference numerals
10a light-transmitting tube body 20a circuit board
The 401a conducting terminal
1LED fluorescent tube 10LED substrate
101 shadow surfaces, 102 radiating surfaces
11 circuit, 12 solder joints
22 conductive connecting pins, 23 transmissive mirror
30 coating layers, 40 bodys
41 louvres, 42 conducting terminals
50 lamp sockets, 51 sockets
The specific embodiment
Relevant detailed description of the present invention and technology contents, conjunction with figs. is described as follows, however appended accompanying drawing only is used to provide reference and explanation, is not to be used for the present invention is limited.
Please refer to Fig. 2, be the stereogram of LED base plate heat radiation structure of the present invention; The invention provides a kind of LED base plate heat radiation structure, comprise LED substrate 10, this LED substrate 10 has shadow surface 101 and radiating surface 102, two or more LED lamps 20 are electrically connected and are spaced on the shadow surface 101 that is arranged at this LED substrate 10 with this LED substrate 10, on the other hand, be laid with circuit 11 and two or more solder joints 12 on this radiating surface 102 of this LED substrate 10, and this LED substrate 10 is covered with the coating layer 30 that comprises nanometer powder and binding agent on these solder joints 12.
This coating layer 30 comprises 70%～80% weight nanometer powder and 10%～20% weight binding agent, and wherein, this nanometer powder can be the heat radiation nano powder, and it is nanoclay, nano silicon and the far infrared ceramic powder end (ZrSiO of high emissivity
4, Al
2O
3, TiO
2, (Ce, La, Nd) PO
4The mixed sintering thing) one of them or three's mixture, add a little solvent (about 10%～15% weight) and hybrid adhesive, this binding agent is a polyimide resin, polymethyl methacrylate (PMMA, Poly MethylMethacrylate) resin or polynary ester resin, because this binding agent has high hear resistance (〉=250 ℃) and radiation resistance, be difficult for fusing, flame resistance is good, shock-resistant, characteristic such as the good and linear expansion coefficient of abrasion performance and dielectric property is less, mix this heat radiation nanometer powder and form coating layer 30 (preferred values of its thickness is 10～30 microns) by this binding agent, because of this coating layer 30 is the nanoscale heat radiation coating, can improve the heat emissivity coefficient on these LED substrate 10 surfaces and have high cooling efficiency, also has water proofing property simultaneously, when externally aqueous vapor is attached to these LED substrate 10 surfaces, the circuit 11 that can prevent this LED substrate 10 produces short circuit phenomenon, taken into account the temperature tolerance of this coating layer 30, intensity, durability and attractive in appearance, required to meet.
Perhaps, this nanometer powder can be boron nitride powder, add the remover (about 10%～20% weight) that water-based or oiliness are disperseed, and mixing forms another kind of coating layer 30 (preferred values of its thickness is 10～25 microns) as the binding agent in the above-mentioned structure, owing to this boron nitride powder is that inorganic powder has superior tack and chemical-resistant stability, also be splendid insulating heat-conduction material simultaneously, mix high temperature resistant, free of contamination binding agent, make coating layer 30 have high heat radiation, high radiativity, high temperature resistant and strong alkali-acid resistance, not only insulation again can be anti-oxidant; Therefore, when above-mentioned wherein a kind of coating layer 30 being coated on these solder joints 12 of this LED substrate 10, can make these LED substrate 10 surfaces have high cooling efficiency, and can increase these solder joints 12 and be beneficial to quick heat radiating, be a kind of splendid substrate heat sink material with the contact area of air.
Please refer to Fig. 3, be used for the partial section of the LED base plate heat radiation structure of LED fluorescent tube for the present invention; The LED lamp 20 that is set firmly on the shadow surface 101 of this LED substrate 10 includes the transmissive mirror 23 that luminescent grain 21, two or more conductive connecting pins 22 and involution coat this luminescent grain 21 and this conductive connecting pin 22, these conductive connecting pins 22 wear this LED substrate 10, and be formed with two or more solder joints 12 on the opposite side of this LED substrate 10 (radiating surface 102), wherein, be coated with coating layer 30 on these solder joints 12.
Please refer to 4 figure, Fig. 5, for the schematic perspective view of the LED fluorescent tube that the present invention includes the LED base plate heat radiation structure and use schematic diagram; This LED fluorescent tube 1 comprises by the body that plastics constituted 40 with light transmission, this LED substrate 10 has shadow surface 101 and radiating surface 102 and is laid with two or more solder joints 12, on this solder joint 12, be coated with coating layer 30, this LED substrate 10 is located in this body 40,40 two ends of this body convex with conducting terminal 42, finish the LED fluorescent tube 1 with this LED base plate heat radiation structure in view of the above; In addition, in the present embodiment, these body 40 and arranged on left and right sides are respectively equipped with two or more louvres 41 on the tube wall of the radiating surface 102 of relative this LED substrate 10, during actual enforcement, these body 40 centres also can be provided with two or more louvres 41 on the tube wall of the radiating surface 102 of relative this LED substrate 10.
This LED fluorescent tube 1 is installed in the lamp socket 50, be provided with socket 51 in this lamp socket 50, the conducting terminal 42 at these body 40 two ends is inserted in respectively in this socket 51 and makes its turn-on power, make the LED lamp 20 of the shadow surface 101 of being located at LED substrate 10 luminous, after using a period of time, the heat that this LED lamp 20 produced is from radiating surface 102 loss of LED substrate 10 and compile in the body 40, owing to be coated with coating layer 30 on these solder joints 12, this coating layer 30 can make the rate of irradiation of heat accelerate, and can increase the heat radiation significantly of these solder joints 12 with the contact area of air, with apace with the heat loss of this LED substrate 10 in this body 40, at this moment, extraneous air enters in the body 40 from the louvre 41 of body 40 1 sides, absorb the heat in the body 40 and prolonging body 40 inwalls and flow, air after being heated is gone out from louvre 41 loss of body 40 opposite sides again, and then takes away the heat in the body 40; In addition, when also being provided with louvre 41 in the middle of this body 40, extraneous air can enter the heat that absorbs in the body 40 in the body 40 from the louvre 41 in the middle of the body 40, and the air after being heated is gone out from louvre 41 loss of body 40 both sides again.
Therefore, LED base plate heat radiation structure of the present invention and comprise the LED fluorescent tube of this structure has characteristics such as high emissivity (high radiativity), heatproof and insulation by this coating layer 30, can quicken to get rid of the heat that this LED substrate 10 is produced; Can increase the solder joint 12 surperficial areas that contact with air of this LED substrate 10 in addition by this coating layer 30, quicken heat extraction with the area of dissipation that enlarges this LED substrate 10, in addition, because this coating layer 30 has characteristics such as waterproof, anti-oxidant, anti-strong acid and highly basic, increase durability, prolong the service life of LED substrate 10, so can increase convenience and practicality in the use.
The above is preferred embodiment of the present invention only, is not in order to limiting claim of the present invention, and other uses the equivalence of patent spirit of the present invention to change, and all should belong to claim of the present invention.
Claims (20)
1, a kind of LED base plate heat radiation structure is characterized in that, comprises the LED substrate that is laid with two or more solder joints, and this LED substrate is coated with coating layer on this solder joint, and this coating layer comprises nanometer powder and binding agent.
2, LED base plate heat radiation structure as claimed in claim 1 is characterized in that, described nanometer powder is the heat radiation nanometer powder, and it is nanoclay, nano silicon and far infrared ceramic powder end one of them or three's a mixture.
3, LED base plate heat radiation structure as claimed in claim 2 is characterized in that, described coating layer comprises 70%～80% weight nanometer powder, 10%～20% weight binding agent and 10%～15% weight solvent.
4, LED base plate heat radiation structure as claimed in claim 2 is characterized in that, the thickness of described coating layer is 10～30 microns.
5, LED base plate heat radiation structure as claimed in claim 1 is characterized in that, described nanometer powder is a boron nitride powder.
6, LED base plate heat radiation structure as claimed in claim 5 is characterized in that, described coating layer comprises 70%～80% weight nanometer powder, 10%～20% weight binding agent and 10%～20% weight remover.
7, LED base plate heat radiation structure as claimed in claim 5 is characterized in that, the thickness of described coating layer is 10～25 microns.
8, LED base plate heat radiation structure as claimed in claim 1 is characterized in that, described binding agent is a polyimide resin.
9, LED base plate heat radiation structure as claimed in claim 1 is characterized in that, described binding agent is a plexiglass.
10, LED base plate heat radiation structure as claimed in claim 1 is characterized in that, described binding agent is polynary ester resin.
11, a kind of LED fluorescent tube that comprises the LED base plate heat radiation structure is characterized in that, comprising:
The LED substrate has shadow surface and radiating surface and is laid with two or more solder joints, and this shadow surface is provided with two or more LED lamps;
Coating layer is coated on this solder joint, and this coating layer comprises nanometer powder and binding agent; And
Body has been installed with this LED substrate, and left and right two sides of this body are respectively equipped with two or more louvres on the tube wall of the radiating surface of relative this LED substrate.
12, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 11 is characterized in that, described nanometer powder is the heat radiation nanometer powder, and it is nanoclay, nano silicon and far infrared ceramic powder end one of them or three's a mixture.
13, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 12 is characterized in that, described coating layer comprises 70%～80% weight nanometer powder, 10%～20% weight binding agent and 10%～15% weight solvent.
14, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 12 is characterized in that, the thickness of described coating layer is 10～30 microns.
15, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 11 is characterized in that, described nanometer powder is a boron nitride powder.
16, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 15 is characterized in that, described coating layer comprises 70%～80% weight nanometer powder, 10%～20% weight binding agent and 10%～20% weight remover.
17, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 15 is characterized in that, the thickness of described coating layer is 10～25 microns.
18, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 11 is characterized in that, described binding agent is a polyimide resin.
19, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 11 is characterized in that, described binding agent is a plexiglass.
20, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 11 is characterized in that, described binding agent is polynary ester resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810149566A CN101672460A (en) | 2008-09-12 | 2008-09-12 | LED substrate radiation structure and LED lamp tube having same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810149566A CN101672460A (en) | 2008-09-12 | 2008-09-12 | LED substrate radiation structure and LED lamp tube having same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101672460A true CN101672460A (en) | 2010-03-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810149566A Pending CN101672460A (en) | 2008-09-12 | 2008-09-12 | LED substrate radiation structure and LED lamp tube having same |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103214910A (en) * | 2013-04-03 | 2013-07-24 | 上海三思电子工程有限公司 | Radiation heat dissipation coating for reducing light-emitting diode (LED) chip junction temperature and preparation method thereof |
| CN103604671A (en) * | 2013-11-18 | 2014-02-26 | 内蒙古科技大学 | Sample treatment method for preventing adhesion between sample and pressure head in thermal simulated test machine compression test |
| CN104046218A (en) * | 2014-06-17 | 2014-09-17 | 无锡卡秀堡辉涂料有限公司 | Heat radiation coating for 3C (Computer, Communication and Consumption) electronic products and preparation method thereof |
| CN104074597A (en) * | 2013-03-25 | 2014-10-01 | 叶俊德 | Heat dissipating device with nanometer heat dissipating coating layer and heat dissipating method |
| CN104508184A (en) * | 2012-07-20 | 2015-04-08 | 日立化成株式会社 | Silver-sulfidation-preventing material and method for forming silver-sulfidation-preventing film, and method for producing light-emitting device and light-emitting device |
| WO2016123789A1 (en) * | 2015-02-06 | 2016-08-11 | 远东科技大学 | Heat-conducting radiation substrate and reflective radiation heat-dissipating light-emitting part |
| CN106098897A (en) * | 2016-06-28 | 2016-11-09 | 郭舒洋 | A kind of method that high-heat-dispersion LED substrate is prepared in discarded straight chain silica gel modification |
-
2008
- 2008-09-12 CN CN200810149566A patent/CN101672460A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104508184A (en) * | 2012-07-20 | 2015-04-08 | 日立化成株式会社 | Silver-sulfidation-preventing material and method for forming silver-sulfidation-preventing film, and method for producing light-emitting device and light-emitting device |
| CN104074597A (en) * | 2013-03-25 | 2014-10-01 | 叶俊德 | Heat dissipating device with nanometer heat dissipating coating layer and heat dissipating method |
| CN103214910A (en) * | 2013-04-03 | 2013-07-24 | 上海三思电子工程有限公司 | Radiation heat dissipation coating for reducing light-emitting diode (LED) chip junction temperature and preparation method thereof |
| CN103604671A (en) * | 2013-11-18 | 2014-02-26 | 内蒙古科技大学 | Sample treatment method for preventing adhesion between sample and pressure head in thermal simulated test machine compression test |
| CN103604671B (en) * | 2013-11-18 | 2015-07-22 | 内蒙古科技大学 | Sample treatment method for preventing adhesion between sample and pressure head in thermal simulated test machine compression test |
| CN104046218A (en) * | 2014-06-17 | 2014-09-17 | 无锡卡秀堡辉涂料有限公司 | Heat radiation coating for 3C (Computer, Communication and Consumption) electronic products and preparation method thereof |
| WO2016123789A1 (en) * | 2015-02-06 | 2016-08-11 | 远东科技大学 | Heat-conducting radiation substrate and reflective radiation heat-dissipating light-emitting part |
| CN106098897A (en) * | 2016-06-28 | 2016-11-09 | 郭舒洋 | A kind of method that high-heat-dispersion LED substrate is prepared in discarded straight chain silica gel modification |
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Owner name: BEICHUAN HOLDINGS CO., LTD. Free format text: FORMER OWNER: GOLDEN SUN NEWS TECHNIQUES CO., LTD. Effective date: 20130207 Free format text: FORMER OWNER: ZHENTONG ENERGY TECHNOLOGY CO., LTD. Effective date: 20130207 |
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Effective date of registration: 20130207 Address after: Delaware Applicant after: North, holding limited liability company Address before: Chinese Taiwan Taipei County Road No. 60, Xiang five shares of five power Applicant before: Golden Sun News Techniques Co., Ltd. Applicant before: Zhentong Energy Technology Co., Ltd. |
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Application publication date: 20100317 |