CN103208906B - 母线以及电子设备 - Google Patents

母线以及电子设备 Download PDF

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Publication number
CN103208906B
CN103208906B CN201210543996.1A CN201210543996A CN103208906B CN 103208906 B CN103208906 B CN 103208906B CN 201210543996 A CN201210543996 A CN 201210543996A CN 103208906 B CN103208906 B CN 103208906B
Authority
CN
China
Prior art keywords
hole
bus bar
busbar body
trunk
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210543996.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN103208906A (zh
Inventor
池泽辉
菅正树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Publication of CN103208906A publication Critical patent/CN103208906A/zh
Application granted granted Critical
Publication of CN103208906B publication Critical patent/CN103208906B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B37/00—Nuts or like thread-engaging members
    • F16B37/04—Devices for fastening nuts to surfaces, e.g. sheets, plates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Connection Or Junction Boxes (AREA)
  • Insulating Bodies (AREA)
CN201210543996.1A 2012-01-16 2012-12-14 母线以及电子设备 Active CN103208906B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012006406A JP5831239B2 (ja) 2012-01-16 2012-01-16 バスバー及び電子機器
JP2012-006406 2012-01-16

Publications (2)

Publication Number Publication Date
CN103208906A CN103208906A (zh) 2013-07-17
CN103208906B true CN103208906B (zh) 2015-12-23

Family

ID=47458666

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210543996.1A Active CN103208906B (zh) 2012-01-16 2012-12-14 母线以及电子设备

Country Status (4)

Country Link
US (1) US9181971B2 (enExample)
EP (1) EP2615895B1 (enExample)
JP (1) JP5831239B2 (enExample)
CN (1) CN103208906B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5469270B1 (ja) * 2013-04-22 2014-04-16 三菱電機株式会社 電子機器
JP6322935B2 (ja) * 2013-09-13 2018-05-16 株式会社豊田自動織機 回路装置
JP6076277B2 (ja) * 2014-02-21 2017-02-08 三菱電機株式会社 電力変換装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5065283A (en) * 1990-06-12 1991-11-12 Mitsubishi Denki Kabushiki Kaisha Printed circuit board with busbar interconnections
US6327157B1 (en) * 1999-09-27 2001-12-04 Hewlett-Packard Company High-current power bus system
EP1677389A1 (en) * 2004-12-27 2006-07-05 Danaher Motion Stockholm AB Power terminal and a unit comprising such power terminal
US7835153B2 (en) * 2008-12-30 2010-11-16 Oracle America, Inc. Heat sink mount for providing non-rigid support of overhanging portions of heat sink

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546408A (en) * 1983-05-16 1985-10-08 Illinois Tool Works Inc. Electrically insulated heat sink assemblies and insulators used therein
JP2698278B2 (ja) 1992-01-31 1998-01-19 三洋電機株式会社 混成集積回路装置
DE19954421A1 (de) 1999-11-12 2001-05-31 Lohmann Therapie Syst Lts Filmförmige Zubereitung zur biphasigen Freisetzung pharmakologisch wirksamer oder anderer Substanzen
EP1489657A4 (en) * 2002-02-06 2011-06-29 Ibiden Co Ltd SEMICONDUCTOR CHIP MOUNTING PLATE, METHOD FOR THE PRODUCTION THEREOF AND SEMICONDUCTOR MODULE
JP2003264919A (ja) 2002-03-08 2003-09-19 Tdk Corp 電源用配線装置及びその製造方法
JP3969403B2 (ja) 2004-06-08 2007-09-05 株式会社デンソー 電子部品実装構造
JP2006074921A (ja) 2004-09-02 2006-03-16 Auto Network Gijutsu Kenkyusho:Kk 電気接続箱
JP4551166B2 (ja) * 2004-09-13 2010-09-22 矢崎総業株式会社 機器直付けコネクタ
TWI339789B (en) * 2006-09-29 2011-04-01 Delta Electronics Inc Device and heat sink
JP4882933B2 (ja) 2007-09-13 2012-02-22 株式会社デンソー 電子部品バスバー接合構造
JP2009071071A (ja) 2007-09-13 2009-04-02 Denso Corp 電子回路部品実装構造及びその製造方法
JP2010103371A (ja) 2008-10-24 2010-05-06 Keihin Corp 電子制御装置
JP4935883B2 (ja) 2009-11-27 2012-05-23 株式会社デンソー バスバーアッセンブリ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5065283A (en) * 1990-06-12 1991-11-12 Mitsubishi Denki Kabushiki Kaisha Printed circuit board with busbar interconnections
US6327157B1 (en) * 1999-09-27 2001-12-04 Hewlett-Packard Company High-current power bus system
EP1677389A1 (en) * 2004-12-27 2006-07-05 Danaher Motion Stockholm AB Power terminal and a unit comprising such power terminal
US7835153B2 (en) * 2008-12-30 2010-11-16 Oracle America, Inc. Heat sink mount for providing non-rigid support of overhanging portions of heat sink

Also Published As

Publication number Publication date
EP2615895B1 (en) 2020-02-26
CN103208906A (zh) 2013-07-17
EP2615895A3 (en) 2015-09-30
EP2615895A2 (en) 2013-07-17
JP2013146165A (ja) 2013-07-25
US20130182376A1 (en) 2013-07-18
JP5831239B2 (ja) 2015-12-09
US9181971B2 (en) 2015-11-10

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