CN103183519B - 形成陶瓷基体复合材料的方法和陶瓷基体复合材料元件 - Google Patents

形成陶瓷基体复合材料的方法和陶瓷基体复合材料元件 Download PDF

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CN103183519B
CN103183519B CN201210433804.1A CN201210433804A CN103183519B CN 103183519 B CN103183519 B CN 103183519B CN 201210433804 A CN201210433804 A CN 201210433804A CN 103183519 B CN103183519 B CN 103183519B
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matrix composite
ceramic matrix
barrier layer
cavity
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P.德迪戈
J.张
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General Electric Co PLC
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Abstract

本发明涉及并提供了一种形成陶瓷基体复合材料元件的方法，其包括提供具有腔体的成型陶瓷构件，用陶瓷泡沫填充所述腔体的至少一部分。将所述陶瓷泡沫沉积至阻挡层上，从而覆盖所述腔体的至少一个内部通道。所述方法包括加工所述成型陶瓷构件和陶瓷泡沫以获得陶瓷基体复合材料元件。本发明还提供了一种形成陶瓷基体复合材料叶片和陶瓷基体复合材料元件的方法。

Description

形成陶瓷基体复合材料的方法和陶瓷基体复合材料元件
关于联邦资助研究的声明
本发明在由能源部授予的合同号DE-FC26-05NT42643下利用政府支持而进行。政府对本发明具有一定权利。
技术领域
本发明总体上涉及用于发电的燃气轮机，更具体地涉及形成包括涡轮叶片的陶瓷基体复合材料元件的方法和用于燃气轮机的陶瓷基体复合材料元件。
背景技术
已提出碳化硅(SiC)基陶瓷基体复合材料(CMC)作为用于燃气涡轮发动机的某些元件(如涡轮叶片和导叶)的材料。已知多种方法用于制造SiC基CMC元件，包括Silicomp、熔体渗透(MI)、化学气相渗透(CVI)、聚合物膨胀热解(PIP)，和氧化物/氧化物过程。尽管这些制造技术彼此显著不同，但每一种制造技术涉及使用手工涂敷和工具或模头，以通过包括在各种加工阶段施加热量的方法制备近终型部件。
正如由更常规的超合金材料所形成的涡轮叶片和导叶，CMC叶片和导叶主要装备有腔体和冷却通道以降低重量、降低离心荷载，并降低元件的运行温度。这些特征通常使用可移动且不重复使用的工具的组合而在CMC元件中形成。
目前CMC元件中形成内部通道或腔体的制造方法使用需要在烧尽循环期间从内部通道被“熔融”出或去除的材料。形成具有腔体的CMC元件包括多个步骤，所述多个步骤包括使用预成型体。首先，将多个陶瓷层片以预定模式铺叠在心轴或模具上，以提供元件的所需最终形状或近终型以及所需的机械性质，所述多个陶瓷层片中的一些可包括增强材料，或用基体预浸渍。所述心轴一般选自诸如锡、乙烯基或其他可熔融材料的材料。所铺叠的层片可用基体材料(如SiC)预浸渍(pre-preg)，或者在铺叠层片之后用基体浸渍。在CMC预成型体的致密化之前，通过烧尽循环去除所述心轴。在烧尽循环中，CMC预成型体被倒置，心轴形成材料(如锡、乙烯基或其他可熔融材料)被熔融出而通过预成型体CMC的开放尖端，从而留下开放尖端区域。
在烧尽循环之后，由于复合材料的挥发性物质的烧化，CMC预成型叶片非常脆性。在用于燃气轮机中之前，CMC预成型体的开放尖端区域需要封盖或关闭。在已知方法中，为了关闭CMC预成型体的开放尖端区域，将尖端盖插入脆性开放尖端区域。尖端盖可以以具有多个层片(一般20-50个层片)的CMC层合部件的形式成型，并成形为开放尖端区域以填充CMC预成型体的开放尖端区域。通过将CMC层片切削至所需形状并以所需几何形状铺叠所述层片来形成CMC层合尖端盖是时间密集和劳动密集的。将具有多个层片的CMC层合物置于开放尖端区域中也产生挑战。另外，由于CMC层合物和预成型叶片在致密化之前为脆性的，因此这些元件可能在组装期间易于损坏。
因此，不遭受如上缺点的形成陶瓷基体复合材料元件的方法和用于燃气轮机的陶瓷基体复合材料元件是本领域中期望的。
发明内容
范围与原始要求保护的本发明相同的某些实施例总结如下。这些实施例不旨在限制所要求保护的本发明的范围，相反，这些实施例仅旨在提供本发明的可能形式的简要总结。实际上，本发明可涵盖可与如下所述的实施例类似或不同的多种形式。
根据本公开的一个示例性实施例，提供了一种形成陶瓷基体复合材料元件的方法。所述方法包括提供具有腔体的成型陶瓷构件。所述方法包括用陶瓷泡沫填充所述腔体的至少一部分。所述方法包括加工所述成型陶瓷构件和陶瓷泡沫以获得陶瓷基体复合材料元件。
根据本公开的另一示例性实施例，提供了一种形成陶瓷基体复合材料叶片的方法。所述方法包括提供经部分固化的陶瓷基体复合材料叶片壳，其中所述陶瓷基体复合材料叶片壳具有腔体，且所述陶瓷基体复合材料叶片壳具有至少一个内部通道。所述方法包括在所述陶瓷基体复合材料叶片壳的腔体中邻近所述至少一个内部通道施用阻挡层。所述方法包括用陶瓷泡沫填充所述腔体的至少一部分，所述陶瓷泡沫被施用至所述阻挡层，并可操作以形成尖端构件。所述方法包括加工所述经部分固化的陶瓷基体复合材料叶片壳和尖端构件，以形成陶瓷基体复合材料叶片。
根据本公开的另一示例性实施例，提供了一种陶瓷基体复合材料元件。所述元件包括具有腔体的成型陶瓷构件。将阻挡层施用至所述成型构件的腔体，并将陶瓷泡沫施用至所述阻挡层，从而填充所述腔体。加工包括陶瓷泡沫的成型陶瓷构件以形成陶瓷基体复合材料元件。
根据与以举例的方式说明本发明的原理的附图结合的如下优选实施例的更详细的描述，本发明的其他特征和优点将显而易见。
附图说明
图1为本发明的陶瓷基体复合材料元件的透视图。
图2为在图1的方向2-2上的截面图，其显示了本发明的陶瓷基体复合材料元件中的腔体。
图3为本发明的陶瓷基体复合材料的尖端的示意性部分透明的透视图。
图4为在图1的方向4-4上的截面图，其包括在用本发明的陶瓷基体复合材料元件的陶瓷泡沫填充之前的腔体。
图5为图4的陶瓷基体复合材料元件的示意图，其包括用本发明的陶瓷泡沫填充的腔体。
图6为本发明的形成陶瓷基体复合材料元件的方法的流程图。
只要有可能，将在整个附图中使用相同的附图标记以表示相同的部分。
具体实施方式
提供了克服现有技术中缺点的一种形成陶瓷基体复合材料(CMC)元件的经济可行的方法、一种形成CMC叶片的方法和一种CMC元件。根据本发明公开的CMC元件使形成CMC元件中的另外的手工涂敷步骤减到最少，或者去除了形成CMC元件中的另外的手工涂敷步骤。本发明公开的实施例的一个优点包括一种方法，所述方法避免了耗时的层片切割，并铺叠层合层片以关闭CMC元件(如涡轮叶片)中的内部通道。另一优点是，使用本发明公开的方法，无需铺叠工具来形成CMC元件。又一优点是，本发明公开的方法不需要多个层片的组装和另外的制造步骤来形成用于密封CMC元件的内部通道的“尖端盖”层合物部件。另一优点是，本发明公开的方法和CMC元件避免了存在于目前铺叠和“尖端盖”层合物部件方法中的间隙配合问题。另一优点是，本发明公开的方法在CMC预成型体为其最脆性的状态时不需要复杂的组装。又一优点是，目前的方法不需要在CMC元件的刚性化之后另外的机械加工。
本发明的一个或多个特定实施例将如下描述。为了提供这些实施例的简明描述，实际实施的所有特征可能不在说明书中描述。应了解在任何这种实际实施的开发中，如同在任何工程或设计项目中一样，必须进行许多实施相关的决定以实现开发者的特定目标，如符合系统相关和商业相关的限制，一个实施与另一个实施的特定目标可能不同。此外，应了解这种开发努力可能是复杂且耗时的，但对于具有本公开的益处的本领域技术人员而言仍然是设计、装配和制造的常规任务。
当介绍本发明的各个实施例的要素时，冠词“一”、“所述”旨在意指存在一个或多个要素。术语“包含”、“包括”和“具有”旨在为包括的，并意指存在除了所列要素之外的另外的要素。
用于发电的系统包括但不限于燃气轮机、蒸汽轮机和其他涡轮机组件。在某些应用中，其中包括涡轮机械(例如涡轮机、压缩机和泵)和其他机械装置的发电系统可包括暴露于严重磨损条件的元件。例如，某些发电系统元件，如叶片、外壳、转子叶轮、轴、保护罩、喷嘴等，可能在高热和高旋转环境中运行。这些元件使用陶瓷基体复合材料制得，且这些元件也可包括冷却通道。本发明公开提供了一种更经济且劳动密集较低的方法来形成包括冷却通道的CMC元件。本发明公开的一个示例性实施例在图1-5中示为涡轮叶片，但本发明公开不限于所示结构。
图1为燃气轮机的陶瓷基体复合材料(CMC)元件10的透视图。在一个实施例中，元件10为(但不限于)燃气轮机发动机元件，包括燃烧器元件、高压涡轮机导叶和叶片，和其他热段元件，例如但不限于陶瓷箱保护罩和喷嘴应用。为了说明的目的，图1-5的CMC元件10为涡轮叶片20。元件10包括具有尖端部分32(参见3和4)的成型陶瓷构件90，所述尖端部分32包括陶瓷泡沫80(参见图5)。在燃气轮机中的CMC构件10的运行期间，陶瓷泡沫80保持就位，并“封盖”或关闭CMC构件10的开放内部通道50(参见图2、4和5)。陶瓷泡沫80由经受CMC固化过程的材料形成，并变成最终CMC元件10的一部分。
图1示出了CMC元件10，如涡轮叶片20或涡轮机导叶，在该说明中为涡轮叶片20。涡轮叶片20优选由陶瓷基体复合材料(CMC)材料形成。用于CMC元件10的材料包括但不限于氧化物基CMC，如氧化铝、多铝红柱石、氮化硼、碳化硼、塞隆(硅、铝、氧和氮)、金属间化合物，和它们的组合。用于CMC元件10的材料的一个合适的例子为(但不限于)AN-720(氧化物-氧化物基)，其可得自加利福尼亚州圣迭戈的COI陶瓷公司(COI Ceramics，Inc.，San Diego，California)。涡轮叶片20包括翼型22，热废气流导向所述翼型22。涡轮叶片20通过楔形榫头24安装至涡轮盘(未显示)，所述楔形榫头24从翼型22向下延伸，并将狭槽接合于涡轮盘上。平台26从翼型22结合至楔形榫头24处的区域侧面向外延伸。涡轮叶片20包括沿着翼型22的内部延伸的至少一个内部通道50(参见图2)。在发电系统运行期间，冷却空气流引导通过内部通道50以降低翼型22的温度。
如图1所示，使用铺叠技术构造CMC涡轮叶片20，以形成成型陶瓷元件90的近终型预成型体(参见图4和5)。使用任何合适的铺叠技术铺叠成型陶瓷元件90，以获得元件10所需的形状和几何形状。用于形成具有至少一个内部通道50的元件10的大多数铺叠技术包括提供多个层片，并将其设置于心轴或其他模具上。在一些实施例中，在成型陶瓷元件90已被熔体渗透之后，将心轴(未显示)从成型陶瓷元件90“熔融”或过滤出。在铺叠成型陶瓷元件90中，必须留下开口以允许心轴被熔融出成型陶瓷元件90，从而产生至少一个内部通道50(参见图2)。在元件运行之前和在致密化之前，开放通道/开口必须被“封盖”或关闭。目前，使用多个层片(一般25-50个层片)以形成陶瓷层合部件或封盖，在致密化和最终熔体渗透之前将所述陶瓷层合部件或封盖置于叶片的开放尖端中。
图2为在图1的方向2-2上截取的叶片尖端30的截面图，其显示了成型陶瓷元件90的内部通道50。多个芯部缠绕层片62和叶片层片60(为清楚起见仅显示一些)围绕并形成成型陶瓷元件90的内部通道50。
如图3-5所示，叶片壳102为成型陶瓷元件90的一个示意性实施例；然而，成型陶瓷元件90的该示意性实施例是为了说明的目的，不应被如此狭义解释。成型陶瓷元件90为任何预成型CMC元件，例如但不限于叶片、保护罩和喷嘴。
参见图3，阻挡层40邻近涡轮叶片20的内部通道50设置或者覆盖涡轮叶片20的内部通道50，从而在成型陶瓷元件90中形成腔体70。阻挡层40选自与成型陶瓷元件90和陶瓷泡沫80可热相容的材料。用于阻挡层40的材料的合适的例子包括但不限于陶瓷基体层片，如氧化物和非氧化物陶瓷和CMC，例如但不限于硼、氮化物、多铝红柱石、氧化铝、氮化硼、碳化硼、塞隆(硅、铝、氧和氮)、金属间化合物，和它们的组合。阻挡层40封堵了内部通道50，并与成型陶瓷元件90组合产生腔体70，所述腔体70用作接收陶瓷泡沫80(参见图5)的模具72。如果陶瓷泡沫80被直接施用至具有内部通道50或中空芯部的成型陶瓷元件90的叶片尖端，则陶瓷泡沫80将填充内部通道50。阻挡层40提供了接收陶瓷泡沫的模具72，并防止陶瓷泡沫填充内部通道50。阻挡层40可为平坦的或波状的。如图3所示，波状阻挡层40包括多个波峰44。阻挡层40也包括至少一个片构件42。片构件42可操作以附接至用作模具72的腔体70。阻挡层40的片构件42的几何形状为任何合适的几何形状，所述合适的几何形状提供足够的表面积以允许片构件42附接或粘附至腔体70或模具72，从而在用陶瓷泡沫80填充腔体70之前或在用陶瓷泡沫80填充腔体70期间防止阻挡层40移动。如图3所示，四个片构件42附接至模具72。在可选择的实施例中，需要至少一个片构件42，且可使用任何数量的片构件42以将阻挡层40附接至模具72。
现在转向图4，更清楚显示了在成型陶瓷元件90中形成的腔体70和模具72。成型陶瓷元件90包括围绕内部通道50的多个芯部缠绕层片62和围绕芯部缠绕层片62和内部通道50的叶片层片60。在该实施例中，阻挡层40邻近芯部缠绕层片62和叶片层片60设置，并覆盖内部通道50。阻挡层40配合芯部缠绕层片62和叶片层片60以形成模具72。一般而言，阻挡层40片构件42附接至模具72或腔体70。如图4所示，片构件42附接至芯部缠绕层片62。
如图4和5所示，腔体70和模具72填充有陶瓷泡沫80。陶瓷泡沫80施用至阻挡层40，并填充成型元件90中的腔体70和模具72。陶瓷泡沫80选自包括如下的材料：氧化铝、多铝红柱石、二氧化硅、氧化锆、锆石、硅、碳、硅硼和它们的组合。使用任何已知的使用技术使用陶瓷泡沫80，例如但不限于沉积和喷雾技术。在陶瓷泡沫80充分填充腔体70之后，通过渗透来进一步加工成型元件90和陶瓷泡沫80以获得最终CMC元件10。
渗透方法包括任何合适的渗透方法，例如但不限于熔体渗透(MI)以完成CMC元件10的构造。使用芯吸、浇口(gating)或其他合适的方法将硅硼材料，如四硼化物(SiB4)、六硼化硅(SiB6)或它们的组合熔融至包括陶瓷泡沫80的成型元件90中。在MI过程期间，硅硼材料通过毛细管吸收而被吸收至存在于成型元件90和陶瓷泡沫80中的所有碳腔体中。在熔体渗透之后，任选地将陶瓷基体复合材料元件10机械加工至所需的尺寸和规格。最终CMC元件10任选地用热阻挡涂层或腐蚀阻挡涂层涂布，以在运行期间提供另外的保护。
形成陶瓷基体复合材料元件10的方法600示于图6中。方法600包括提供具有腔体70的成型陶瓷元件90，步骤601(参见图4)。如图4所示，腔体70可作为模具72操作。还如图4所示，成型陶瓷元件90可包括至少一个内部通道50。使用任何合适的方法构造成型陶瓷元件90，包括使用心轴的手工涂敷方法。成型陶瓷元件90的预成型体经受使用硅硼或其他合适材料的初始渗透。接着，热压处理所述预成型体。然后使用任何合适的方法去除所述心轴，例如但不限于过滤，和挥发性有机物的烧尽。在去除心轴之后，剩余成型陶瓷元件90。在具有内部通道50的实施例中，在填充步骤(步骤603)之前，将阻挡层40施用至邻近成型陶瓷元件90的模具72的至少一个内部通道50。方法600包括用陶瓷泡沫80填充作为模具72操作的腔体70的至少一部分，步骤603(参见图5)。如图5所示，在一个实施例中，陶瓷泡沫80沉积于阻挡层40上，从而覆盖成型陶瓷基体构件90的腔体70。方法600包括加工成型陶瓷元件90和陶瓷泡沫80，以获得陶瓷基体复合材料元件10，步骤605(参见图1)。加工步骤(步骤605)包括渗透成型陶瓷元件90和陶瓷泡沫80以获得陶瓷基体复合材料元件10。可使用任何合适的材料用于渗透，但一个合适的例子包括硅硼材料。可使用任何合适的渗透方法，如熔体渗透。在所述渗透步骤之前，所述加工步骤(步骤605)还包括从陶瓷泡沫80中蒸发树脂的步骤。在所述加工步骤(步骤605)之后，将陶瓷基体复合材料元件10任选地机械加工至所需的尺寸和规格。
尽管参照优选实施例描述了本发明，但本领域技术人员应了解，在不偏离本发明的范围下，可进行各种改变，且等同物可替代本发明的元件。另外，在不偏离本发明的实质范围下，可进行许多修改以使特定的情况或材料适合本发明的教导。因此，本发明不旨在局限于作为进行本发明的预期最佳模式而公开的特定实施例，而本发明将包括落入所附权利要求书的范围内的所有实施例。

Claims (17)

1.一种形成陶瓷基体复合材料元件的方法，其包括：
提供具有腔体的成型陶瓷构件；用陶瓷泡沫填充所述腔体的至少一部分；以及
加工所述成型陶瓷构件和陶瓷泡沫以获得陶瓷基体复合材料元件；
所述成型陶瓷构件包括至少一个内部通道，所述至少一个内部通道具有所述阻挡层，所述阻挡层邻近所述成型陶瓷构件的腔体施用在所述至少一个内部通道上。
2.根据权利要求1所述的方法，其特征在于，所述加工步骤包括渗透所述成型陶瓷构件和陶瓷泡沫以获得陶瓷基体复合材料元件。
3.根据权利要求2所述的方法，其特征在于，所述渗透步骤包括用硅硼材料渗透。
4.根据权利要求1所述的方法，其特征在于，所述阻挡层包括至少一个片构件，其中所述片构件附接至所述成型陶瓷构件的模具。
5.根据权利要求1所述的方法，其特征在于，所述阻挡层包括波状几何形状。
6.根据权利要求1所述的方法，其在加工步骤之后还包括机械加工所述陶瓷基体复合材料元件的步骤。
7.根据权利要求1所述的方法，其特征在于，所述陶瓷泡沫包括选自氧化铝、多铝红柱石、二氧化硅、氧化锆、锆石、碳化硅、硅硼和它们的组合的材料。
8.一种形成陶瓷基体复合材料叶片的方法，其包括：
提供经部分固化的陶瓷基体复合材料叶片壳，其中所述陶瓷基体复合材料叶片壳具有腔体，且所述陶瓷基体复合材料叶片壳具有至少一个内部通道；
在所述陶瓷基体复合材料叶片壳的腔体中邻近所述至少一个内部通道施用阻挡层；
用陶瓷泡沫填充所述腔体的至少一部分，所述陶瓷泡沫被施用至所述阻挡层，以形成尖端构件；以及
加工所述经部分固化的陶瓷基体复合材料叶片壳和尖端构件，以形成陶瓷基体复合材料叶片。
9.根据权利要求8所述的方法，其特征在于，所述加工步骤包括渗透所述经部分固化的陶瓷基体复合材料叶片壳和尖端构件陶瓷泡沫，以获得所述陶瓷基体复合材料叶片。
10.根据权利要求8所述的方法，其特征在于，所述阻挡层包括至少一个片构件，其中所述片构件附接至所述陶瓷基体复合材料叶片壳的模具。
11.根据权利要求8所述的方法，其特征在于，所述阻挡层具有波状几何形状。
12.根据权利要求8所述的方法，其在加工步骤之后还包括机械加工所述陶瓷基体复合材料元件的步骤。
13.根据权利要求8所述的方法，其特征在于，所述陶瓷泡沫包括选自氧化铝、多铝红柱石、二氧化硅、氧化锆、锆石、碳化硅、硅硼和它们的组合的材料。
14.一种陶瓷基体复合材料元件，其包括：
具有腔体的成型陶瓷构件；
施用至所述成型陶瓷构件的腔体的阻挡层；以及
施用至所述阻挡层并填充所述腔体的陶瓷泡沫，其中，所述成型陶瓷构件包括至少一个内部通道，所述至少一个内部通道具有所述阻挡层，所述阻挡层邻近所述成型陶瓷构件的腔体施用在所述至少一个内部通道上；
其中加工包括所述陶瓷泡沫的成型陶瓷构件以形成陶瓷基体复合材料元件。
15.根据权利要求14所述的陶瓷基体复合材料元件，其特征在于，所述元件选自叶片、护罩和喷嘴。
16.根据权利要求14所述的陶瓷基体复合材料元件，其特征在于，所述阻挡层包括至少一个片构件，其中所述片构件附接至所述成型陶瓷构件的腔体。
17.根据权利要求14所述的陶瓷基体复合材料元件，其特征在于，所述阻挡层具有波状几何形状。
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