CN103180391B - 可由光交联的高透明硅酮树脂混合物 - Google Patents
可由光交联的高透明硅酮树脂混合物 Download PDFInfo
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- CN103180391B CN103180391B CN201180050715.2A CN201180050715A CN103180391B CN 103180391 B CN103180391 B CN 103180391B CN 201180050715 A CN201180050715 A CN 201180050715A CN 103180391 B CN103180391 B CN 103180391B
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- silicone resin
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- 229920002050 silicone resin Polymers 0.000 title claims abstract description 48
- 239000000203 mixture Substances 0.000 title claims abstract description 41
- 238000004132 cross linking Methods 0.000 title description 8
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 17
- 239000003054 catalyst Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 9
- 239000000835 fiber Substances 0.000 claims abstract description 8
- 125000005375 organosiloxane group Chemical group 0.000 claims abstract description 8
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 claims abstract description 4
- 150000003961 organosilicon compounds Chemical class 0.000 claims description 13
- 125000004432 carbon atom Chemical group C* 0.000 claims description 9
- 125000001931 aliphatic group Chemical group 0.000 claims description 6
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims description 6
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 6
- 239000004215 Carbon black (E152) Substances 0.000 claims description 5
- 229930195733 hydrocarbon Natural products 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 125000005515 organic divalent group Chemical group 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 229930195734 saturated hydrocarbon Natural products 0.000 claims description 2
- -1 carbon atom halogen Chemical class 0.000 abstract description 21
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 5
- 229920001296 polysiloxane Polymers 0.000 abstract description 5
- 229910052799 carbon Inorganic materials 0.000 abstract description 3
- 150000001875 compounds Chemical class 0.000 abstract description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 abstract description 2
- 229910004283 SiO 4 Inorganic materials 0.000 abstract 1
- 150000001721 carbon Chemical group 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 230000002186 photoactivation Effects 0.000 abstract 1
- 229920002554 vinyl polymer Polymers 0.000 description 11
- 238000009472 formulation Methods 0.000 description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 238000001125 extrusion Methods 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 229910020388 SiO1/2 Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 238000006459 hydrosilylation reaction Methods 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
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- 125000004122 cyclic group Chemical group 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 239000004594 Masterbatch (MB) Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
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- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 125000006017 1-propenyl group Chemical group 0.000 description 1
- 125000006043 5-hexenyl group Chemical group 0.000 description 1
- DODHYCGLWKOXCD-UHFFFAOYSA-N C[Pt](C1(C=CC=C1)C)(C)C Chemical compound C[Pt](C1(C=CC=C1)C)(C)C DODHYCGLWKOXCD-UHFFFAOYSA-N 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
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- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910003849 O-Si Inorganic materials 0.000 description 1
- 229910003872 O—Si Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910018557 Si O Inorganic materials 0.000 description 1
- 229910020485 SiO4/2 Inorganic materials 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
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- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004188 dichlorophenyl group Chemical group 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
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- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
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- 150000008282 halocarbons Chemical class 0.000 description 1
- 150000002367 halogens Chemical group 0.000 description 1
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- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
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- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002868 norbornyl group Chemical group C12(CCC(CC1)C2)* 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
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- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
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- 230000008719 thickening Effects 0.000 description 1
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Classifications
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- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/14—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the particular extruding conditions, e.g. in a modified atmosphere or by using vibration
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- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01F—CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS; APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBON FILAMENTS
- D01F6/00—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof
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- D01F6/76—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof from homopolycondensation products from other polycondensation products
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- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
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- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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Abstract
本发明涉及在光作用下可交联的硅酮树脂混合物,包含(A)由通式I、II、III和IV的单元组成的有机硅氧烷树脂,R3SiO1/2(I)、R2SiO2/2(II)、RSiO3/2(III)、SiO4/2(IV),其中R是具有1-40个碳原子可选地卤素取代的饱和烃基基团,或R是-OH,其条件是:至少20mol%的单元是选自通式III和IV的单元,至少两个基团R是具有1-10个碳原子的烯基基团,并且不超过2wt.%的基团R是-OH基团,(B)每个分子包含至少两个烯基基团并且具有200至10,000个甲硅烷氧基单元的最长链的链长度的聚有机硅氧烷,(C)每个分子包含至少两个SiH官能团的有机硅化合物,以及(D)可由具有200至500nm的光激活的铂族催化剂。本发明进一步涉及用于由所述硅酮树脂混合物生产硅酮树脂纤维的方法。
Description
技术领域
本发明涉及在光的影响下可交联的并且具有高初始强度的硅酮树脂混合物,并且涉及用于由所述硅酮树脂混合物生产硅酮树脂纤维的方法。
背景技术
为了在较大距离上超快速传输电子数据,越来越多地使用光纤。对于光学纯度的要求非常高,由于每个单个颗粒导致的散射损失在传送距离上累积,从而导致较大的损失和可能的错误数据。为了由硅酮树脂生产相应地要求高透明度的光纤,迄今为止没有合适的挤出工艺,由于透明、无填充剂、硅酮树脂加强的硅酮树脂制剂没有足够的初始强度(生坯强度)以实现使用常规挤出工艺的连续生产过程。
由硅酮树脂制成的管材或纤维是通过挤出生产的。这涉及在连续工艺中通过成形模具将可交联的制剂挤出然后在高于200℃的温度下在加热通道中将其硬化。为了确保在较高的交联温度下管材不折断并保持其几何结构,为此目的,需要具有较高生坯强度的硅酮树脂制剂。通过相应地具有典型地5000的链长度的高粘度HTV硅酮树脂聚合物同时添加精细粉碎的硅石(HDK)实现了较高的生坯强度。在此HDK具有另外的增稠作用并且为了获得用于形状保持和热硬化的足够的生坯强度是必然需要的。
WO2009/027133描述了用于挤出模制品的可光激活的硅酮树脂混合物。这些硅酮树脂混合物包含具有大于3000链长度的超高粘度硅酮树脂聚合物,从而与HDK填充剂结合实现具有大于10的高门尼粘度的足够的生坯强度。所描述的制剂不能用于生产高透明度硅酮树脂模制品,由于填充剂散射损失过高。
发明内容
本发明提供了在光的影响下可交联的硅酮树脂混合物,包含
(A)由通式I、II、III和IV的单元形成的有机硅氧烷树脂
R3SiO1/2 (I),
R2SiO2/2 (II),
RSiO3/2 (III),
SiO4/2 (IV),
其中,
R代表可选地由卤素取代并且具有1-40个碳原子的饱和烃基基团,或-OH,
其条件是:
至少20mol%的单元是选自通式III和IV的单元,
至少两个R基团是具有1-10个碳原子的烯基基团,以及
按重量计至多2%的R基团是-OH基团,
(B)每个分子包含至少两个烯基基团并且具有200至10000个甲硅烷氧基单元的最长链的链长度的聚有机硅氧烷,
(C)每个分子包含至少两个SiH官能团的有机硅化合物,以及
(D)可由200至500nm的光激活的来自铂族的催化剂。
硅酮树脂混合物具有足够的初始强度(生坯强度),由此可以挤出较长的硅酮树脂纤维并且随后在低温下用光固化。同时,硅酮树脂混合物具有使它们适用于光纤的优异的透明度。
烃基基团R可以是卤素取代的、直链的、环状的、支链的、芳香族的、饱和的或不饱和的。
未取代的R基团的实例是烷基基团,如甲基、乙基、正丙基、异丙基、正丁基、异丁基、叔丁基、正戊基、异戊基、新戊基、叔戊基基团、己基基团如正己基基团、庚基基团如正庚基基团、辛基基团如正辛基基团和异辛基基团如2,2,4-三甲基戊基基团、壬基基团如正壬基基团、癸基基团如正癸基基团;环烷基基团如环戊基、环己基、4-乙基环己基、环庚基基团、降冰片基基团和甲基环己基基团;芳基基团如苯基、联苯基、萘基基团;烷芳基基团如邻-、间-、对甲苯基基团和乙基苯基基团;芳烷基基团如苄基基团和α-以及β-苯乙基基团。
取代的烃基基团作为R基团的实例是卤代烃,如氯甲基、3-氯丙基、3-溴丙基、3,3,3-三氟丙基和5,5,5,4,4,3,3-六氟戊基基团,以及氯苯基、二氯苯基和三氟甲苯基基团。
烃基基团R优选具有1至6个碳原子,特别优选烷基基团和苯基基团。优选的卤素取代基是氟和氯。特别优选的单价烃基基团R是甲基、乙基、苯基。
烯基基团R适合使用有机硅化合物(C)的SiH官能团的加成反应。通常,使用具有2至6个碳原子的烯基基团,如乙烯基、烯丙基、甲代烯丙基、1-丙烯基、5-己烯基、乙炔基、丁二烯基、己二烯基、环戊烯基、环戊二烯基、环己烯基,优选乙烯基和烯丙基。
有机硅氧烷树脂(A)优选包含至少30mol%、特别地至少40mol%、并且优选至多80mol%、特别地至多70mol%的通式III和IV的单元。
有机硅氧烷树脂(A)优选包含至少80mol%、优选至少95mol%以及特别地至少97mol%的通式I和IV的单元的MQ硅酮树脂(MQ)。通式I相对于通式IV的单元的平均比率优选至少0.25,特别地至少0.5以及优选2,更优选至多1.5。
优选按重量计至多1%,特别地按重量计至多0.5%的R基团是OH基团。
优选至少0.1mol%,更优选至少0.5mol%,特别地至少2mol%,以及优选至多20mol%,特别地至多10mol%的R基团是具有1-10个碳原子的烯基基团。
有机硅氧烷树脂(A)的平均分子量Mn优选至少200g/mol,特别地至少1000g/mol,且优选至多100000g/mol,特别地至多20000g/mol。
包含烯基基团的聚有机硅氧烷(B)的组合物优选地对应于平均通式V
R1xR2ySiO(4-x-y)/2 (V)
其中,
R1是单价的、可选地卤素-或氰基取代的C1-C10烃基基团,可选地经由有机二价基团键连至硅并且包含脂肪族碳-碳重键,
R2是单价的、可选地卤素-或氰基取代的、SiC-键连的C1-C10烃基基团,不含脂肪族碳-碳重键,
x是非负数,使得每个分子中存在至少两个R1基团,并且
y是非负数,使得(x+y)在从1.9至2.2的范围内,优选1.99至2.05。
优选地,聚有机硅氧烷(B)的最长链的链长度是至少300,并且至多200至7000个甲硅烷氧基单元。
上文已经列出了针对R基团的实例和优选的烯基基团R1。特别优选的烯基基团R1是乙烯基和烯丙基。
R1基团可以键连于聚合物链中的任何位置,特别地键连至末端硅原子。
上文已经列出了针对R基团的未取代的和取代的R2基团的实例。
R2优选具有1至6个碳原子。特别地优选甲基和苯基。
组分(B)也可以是不同聚有机硅氧烷的混合物,所述聚有机硅氧烷包含烯基基团并且,例如在烯基基团含量、烯基基团性质或结构上不同。
包含烯基基团的聚有机硅氧烷(B)的结构可以是直链的、环状的、或者支链的。导致支链聚有机硅氧烷的三-和/或四官能性单元的含量通常非常低,优选至多1mol%,特别地至多0.1mol%。
特别优选使用包含乙烯基基团的聚二甲基硅氧烷,其分子符合通式VI
(ViMe2SiO1/2)2(ViMeSiO)p(Me2SiO)q (VI)
其中非负整数p和q满足以下关系:p≥0,200<(p+q)<10000,优选500<(p+q)<2000,并且p:(p+q)<0.2,优选<0.02,特别地<0.001。
在25℃下聚有机硅氧烷(B)的粘度优选为0.5至100000Pa·s,特别地1至2000Pa·s。
经由其烯基基团R1可以键连至聚合物链中的硅的有机二价基团优选为二价C1-C10烃基基团。
对于按重量计每100份的有机硅氧烷树脂(A),硅酮树脂混合物优选地包含按重量计至少10份,更优选按重量计至少25份,特别地按重量计至少40份,并且优选按重量计至多90份,更优选按重量计至多80份,特别地按重量计至多70份的聚有机硅氧烷(B)。
每个分子包含至少两个SiH官能团的有机硅化合物(C)优选具有平均通式VII的组合物
HaR3 bSiO(4-a-b)/2 (VII)
其中
R3是单价的、可选地卤素-或氰基取代的、SiC-键连的C1-C18烃基基团,不含脂肪族碳-碳重键,并且
a和b是非负整数,
其条件是0.5<(a+b)<3.0并且0<a<2,而且每个分子存在至少两个硅键连的氢原子。
R3的实例是针对R和R2指定的基团。R3优选具有1至6个碳原子。特别优选甲基和苯基。
优选使用每个分子包含三个或更多SiH键的有机硅化合物(C)。在使用每个分子仅具有两个SiH键的有机硅化合物(C)的情况下,建议使用每个分子具有至少三个烯基基团的聚有机硅氧烷(B)。
单独地基于直接键连至硅原子的氢原子,有机硅化合物(C)的氢含量优选在按重量计从0.002%至1.7%的氢的范围内,优选按重量计从0.1%至1.7%的氢。
有机硅化合物(C)优选每个分子包含至少三个并且至多600个硅原子。优选使用每个分子包含4至200个硅原子的有机硅化合物(C)。
有机硅化合物(C)的结构可以是直链的、支链的、环状的或网状的。
特别优选的有机硅化合物(C)是通式VIII的直链聚有机硅氧烷
(HR4 2SiO1/2)c(R4 3SiO1/2)d(HR4SiO2/2)e(R4 2SiO2/2)f (VIII)
其中
R4是如对于R3定义的并且
非负整数c、d、e和f满足以下关系:(c+d)=2,(c+e)>2,5<(e+f)<200并且1<e/(e+f)<0.1。
SiH-官能化的有机硅化合物(C)优选以这样的量存在于可交联的硅酮树脂混合物中,即SiH基团相对于烯基基团的摩尔比是0.5至5,特别地1.0至3.0。
使用的催化剂(D)可以是来自铂族的所有已知的催化剂,其催化在加成-交联硅酮树脂材料的交联过程中进行的氢化硅烷化反应并且可由200至500nm的光激活。
催化剂(D)包含铂、铑、钯、钌和铱中的至少一种金属或一种化合物,优选铂。
特别合适的催化剂(D)是铂的环戊二烯配合物(络合物)。特别优选的催化剂(C)是MeCp(PtMe3)。
能够以任何所需的形式使用催化剂(D),例如包括包含氢化硅烷化催化剂的微胶囊,或有机聚硅氧烷颗粒的形式,如在EP-A-1006147中描述的。
氢化硅烷化催化剂(D)的含量优先选择,使得硅酮树脂混合物具有0.1-200ppm,优选0.5-40ppm的铂族金属含量。
硅酮树脂混合物是透明的并且优选包含按重量计不超过2%,更优选按重量计不超过0.5%并且特别地按重量计不超过0.01%的具有大于50nm直径的光散射填充剂。
硅酮树脂混合物可以包含按重量计可达70%比例,优选按重量计0.0001%至40%的另外添加剂,作为成分(E)。例如,这些添加剂可以是除了聚有机硅氧烷(A)、(B)和(C)之外的树脂质聚有机硅氧烷、分散助剂、溶剂、附着力促进剂(adhesion promoter,增粘剂)、染料、增塑剂、有机聚合物和热稳定剂。此外,触变性组分能够以成分(E)的形式存在。
此外,式HSi(CH3)2-[O-Si(CH3)2]w-H的硅氧烷还能够以链增长剂的形式存在,其中w代表1至1000的值。
另外地可能存在用于控制硅酮树脂混合物的处理时间、开始反应温度和交联速率的添加剂(E)。在交联材料领域,这些抑制剂和稳定剂是众所周知的。
此外,还可能加入改进压缩形变的添加剂。此外,还可能加入非乙烯基官能化的聚双有机硅氧烷。
硅酮树脂混合物优选具有至少100Pas,更优选至少500Pas,特别地至少1000Pas,优选至多500000Pas,特别地至多10000Pas的粘度[D=0.5l/s/25℃]。
通过上文列出的组分以任何顺序混合来影响硅酮树脂混合物的混合。
本发明还提供了用于生产硅酮树脂纤维的方法,其中将上述硅酮树脂混合物连续地通过冲模挤出到传送带上并活化,并使用具有200-500nm,特别地250-350nm波长的紫外光源进行硬化。
在用光活化中剂量优选至少0.1J/cm2,更优选至少0.5J/cm2,并且优选至多20J/cm2,更优选至多10J/cm2。
在传送带的末端,高透明度的硅酮树脂纤维可以直接地除去或可选地通过加热进行固化,例如通过加热通道。
优选在至少0℃下,更优选至少10℃下,特别地至少15℃下,并且优选在至多50℃下,更优选至多35℃下,特别地至多25℃下进行挤出。
使用光活化挤出的硅酮树脂混合物优选耗时至少1秒,更优选至少5秒,并且优选至多500秒,更优选至多100秒。
氢化硅烷化反应的开始反应使硅酮树脂混合物的交联开始。
优选在至少10℃下,更优选至少20℃下,并且优选在至多60℃下,更优选至多40℃下,特别地至多30℃下进行固化。
如果将通过光的影响不能固化的硅酮树脂用于代替硅酮树脂混合物,在从室温至用于固化所要求的目标温度的加热期间混合物的粘度将降低,并且将蠕变。连续生产具有均匀几何形状的纤维将是不可能的。
在上述式中的所有上述符号每一个都是彼此独立定义的。在所有的式中,硅原子是四价的。
在随后的实施例中,除非另有说明,在每种情况下,所有陈述的量和百分比是基于重量的,所有压力是0.10MPa(绝对压力)并且所有温度是20℃。
具体实施方式
实施例1至6中使用的原材料的描述
MQ硅酮树脂:
乙烯基-官能化的MQ硅酮树脂粉末MQ树脂804,由M、M乙烯基、和Q结构单元形成,其可以如下描述:
分子量:MW5300g/ml,Mn2400g/mol
乙烯基含量:70mmol的乙烯基/100g
M乙烯基/M/Q=0.09:0.72:1
乙烯基聚硅氧烷:
这些是具有不同的粘度/链长度DP(Si-O单元)的乙烯基二甲基硅氧烷基-封端的二甲基聚硅氧烷,其已经通过常规方法制备。
乙烯基聚合物1: 1020mPas,DP=183
乙烯基聚合物2: 20100mPas,DP=615
乙烯基聚合物3: 503200mPas,DP=1830
乙烯基聚合物4: 28×106mPas,DP=6550
SiH交联剂:
SiH交联剂V100是三甲基甲硅烷基-封端的二甲基/甲基氢共聚硅氧烷并且具有9mm2/s的粘度和按重量计1.12%的H含量。
催化剂母料(masterbatch,母体混合物):
紫外光可激活的铂催化剂是三甲基(甲基环戊二烯基)铂,溶解在具有1000mPas粘度的乙烯基封端的聚二甲基硅氧烷中,铂浓度300ppm。
HDK:
SKS300(Wacker Chemie AG),具有300m2/g的BET表面积的六甲基二硅氮烷-疏水化的气相二氧化硅(煅制二氧化硅)。
挤出和交联的描述:
在具有大于500nm波长的光下,在合适的混合器或捏和机中混合配制品(配料)从而给出均匀混合物,并且在25℃下通过具有2mm直径的冲模以单组份配制品(配料)形式挤出到覆盖铝箔的传送带上。以100cm/60秒的速度操作传送带。
挤出到传送带上的硅酮树脂混合物,在25℃下,通过悬挂在传送带上方的紫外光源进行交联。紫外光源(UVASPOT2000,来自)装备有发射在250-400nm波长范围内紫外光的F辐射体。在通过紫外光交联之后,将硅酮树脂挤出物卷起作为连续的挤出物。
表1包含以下实施例:
实施例1-4是发明性的;使用了具有不同粘度/链长度的乙烯基聚合物。
实施例5是非发明性的;在没有MQ硅酮树脂的情况下,由于其转为液体,该材料不可加工。
实施例6是非发明性的;实施例类似于WO2009/027133A2;使用HDK没有透明度。
表1
*非发明性的。
Claims (4)
1.一种在光的影响下可交联的透明的硅酮树脂混合物,包含
(A)由通式I、II、III和IV的单元形成的有机硅氧烷树脂
其中
R代表可选地由卤素取代的并且具有1-40个碳原子的饱和烃基基团、或-OH,
其条件是:
至少20mol%的所述单元是选自所述通式III和IV的单元,
至少两个所述R基团是具有1-10个碳原子的烯基基团以及
按重量计至多2%的所述R基团是-OH基团,
(B)每个分子包含至少两个烯基基团并且具有200至10000个甲硅烷氧基单元的最长链的链长度的聚有机硅氧烷,
(C)每个分子包含至少两个SiH官能团的有机硅化合物,以及
(D)可由200至500nm的光激活的催化剂MeCp(PtMe3);
对于按重量计每100份的所述有机硅氧烷树脂(A),所述硅酮树脂混合物包含按重量计至少10份并且按重量计至多90份的所述聚有机硅氧烷(B)。
2.根据权利要求1所述的硅酮树脂混合物,其中,所述聚有机硅氧烷(B)对应于平均通式V
R1 xR2 ySiO(4-x-y)/2 (V)
其中,
R1是单价的、可选地卤素-或氰基-取代的C1-C10烃基基团,可选地经由有机二价基团键连至硅并且包含脂肪族碳-碳重键,
R2是单价的、可选地卤素-或氰基取代的、SiC-键连的C1-C10烃基基团,不含脂肪族碳-碳重键,
x是非负数,使得每个分子中存在至少两个R1基团,并且
y是非负数,使得(x+y)在从1.9至2.2的范围内。
3.根据权利要求1所述的硅酮树脂混合物,其中所述有机硅化合物(C)具有平均通式VII的组成
HaR3 bSiO(4-a-b)/2 (VII)
其中
R3是单价的、可选地卤素-或氰基取代的、SiC-键连的C1-C18烃基基团,不含脂肪族碳-碳重键,并且
a和b是非负整数,
其条件是0.5<(a+b)<3.0并且0<a<2,而且每个分子存在至少两个硅键连的氢原子。
4.一种用于生产硅酮树脂纤维的方法,其中,将根据权利要求1至3中任一项所述的上述硅酮树脂混合物连续地通过冲模挤出到传送带上并用具有200-500nm波长的紫外光源活化和硬化。
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SG11201500630UA (en) * | 2012-08-14 | 2015-04-29 | Saint Gobain Performance Plast | Apparatus and method for making a silicone article |
KR101591185B1 (ko) * | 2013-06-19 | 2016-02-02 | 주식회사 엘지화학 | 경화성 조성물 |
TWI633157B (zh) | 2013-10-18 | 2018-08-21 | Shin-Etsu Chemical Co., Ltd. | 紫外線硬化性有機聚矽氧烷組成物及版材之製造方法 |
JP6217590B2 (ja) * | 2013-11-05 | 2017-10-25 | 信越化学工業株式会社 | 紫外線硬化性接着性オルガノポリシロキサン組成物 |
DE102014222685A1 (de) | 2014-11-06 | 2016-05-12 | Wacker Chemie Ag | Verfahren zur Herstellung von Siliconelastomerteilen |
CN105778515A (zh) * | 2014-12-26 | 2016-07-20 | 广东生益科技股份有限公司 | 一种无卤无磷硅树脂组合物以及使用它的预浸料、层压板、覆铜板以及印制电路板 |
KR101969257B1 (ko) | 2015-11-09 | 2019-04-15 | 와커 헤미 아게 | 탄도학적 방법에 의해 엘라스토머 성형품을 제조하기 위한 실리콘 조성물 |
KR102072037B1 (ko) | 2015-11-26 | 2020-01-31 | 와커 헤미 아게 | 탄도학적 생성 방법에 의해 엘라스토머 성형품을 제조하기 위한 고점도 실리콘 조성물 |
WO2017108071A1 (de) | 2015-12-21 | 2017-06-29 | Wacker Chemie Ag | Verfahren und vorrichtung zur herstellung eines objekts unter einsatz einer 3d-druckvorrichtung |
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US20190217545A1 (en) | 2016-07-20 | 2019-07-18 | Wacker Chemie Ag | 3d printer and method for producing objects |
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