CN103170729B - 激光处理装置及其控制方法 - Google Patents
激光处理装置及其控制方法 Download PDFInfo
- Publication number
- CN103170729B CN103170729B CN201210559128.2A CN201210559128A CN103170729B CN 103170729 B CN103170729 B CN 103170729B CN 201210559128 A CN201210559128 A CN 201210559128A CN 103170729 B CN103170729 B CN 103170729B
- Authority
- CN
- China
- Prior art keywords
- platform
- substrate
- sidepiece
- oxygen
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2011-0138701 | 2011-12-20 | ||
KR1020110138701A KR101389005B1 (ko) | 2011-12-20 | 2011-12-20 | 레이저 가공장치 및 그 제어방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103170729A CN103170729A (zh) | 2013-06-26 |
CN103170729B true CN103170729B (zh) | 2015-08-05 |
Family
ID=48631154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210559128.2A Active CN103170729B (zh) | 2011-12-20 | 2012-12-20 | 激光处理装置及其控制方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5827941B2 (zh) |
KR (1) | KR101389005B1 (zh) |
CN (1) | CN103170729B (zh) |
TW (1) | TWI527120B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105722634B (zh) * | 2013-11-12 | 2018-07-10 | 麦格纳国际公司 | 用于高输出的激光修整的系统和方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1591816A (zh) * | 2003-09-05 | 2005-03-09 | 大日本网目版制造株式会社 | 基板处理装置及基板处理方法 |
TW201026619A (en) * | 2008-10-17 | 2010-07-16 | Linkstar Japan Co Ltd | Method of cutting mother glass substrate for display panel and substrate of brittle material, and method of manufacturing display |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003340666A (ja) * | 2002-05-27 | 2003-12-02 | Dainippon Screen Mfg Co Ltd | 吸着テーブルとこれを用いた処理装置 |
KR100514392B1 (ko) * | 2003-04-26 | 2005-09-13 | 주식회사 한택 | 반도체 기판의 처리 생산성을 향상시키기 위한 반도체제조 장치 및 이를 이용한 반도체 제조 방법 |
JP2006140230A (ja) * | 2004-11-10 | 2006-06-01 | Sumitomo Heavy Ind Ltd | レーザ照射装置及びレーザ照射方法 |
JP2006344675A (ja) * | 2005-06-07 | 2006-12-21 | Dainippon Printing Co Ltd | 基板の位置決め方法及び装置 |
JP2008294100A (ja) * | 2007-05-23 | 2008-12-04 | Japan Steel Works Ltd:The | 基板保持装置 |
JP5280825B2 (ja) * | 2008-12-17 | 2013-09-04 | 株式会社リンクスタージャパン | 基板テーブルおよびそれを用いたレーザ加工装置 |
-
2011
- 2011-12-20 KR KR1020110138701A patent/KR101389005B1/ko active IP Right Grant
-
2012
- 2012-12-19 TW TW101148247A patent/TWI527120B/zh active
- 2012-12-19 JP JP2012276995A patent/JP5827941B2/ja active Active
- 2012-12-20 CN CN201210559128.2A patent/CN103170729B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1591816A (zh) * | 2003-09-05 | 2005-03-09 | 大日本网目版制造株式会社 | 基板处理装置及基板处理方法 |
TW201026619A (en) * | 2008-10-17 | 2010-07-16 | Linkstar Japan Co Ltd | Method of cutting mother glass substrate for display panel and substrate of brittle material, and method of manufacturing display |
Also Published As
Publication number | Publication date |
---|---|
TWI527120B (zh) | 2016-03-21 |
KR101389005B1 (ko) | 2014-04-28 |
CN103170729A (zh) | 2013-06-26 |
TW201334077A (zh) | 2013-08-16 |
KR20130071290A (ko) | 2013-06-28 |
JP5827941B2 (ja) | 2015-12-02 |
JP2013131753A (ja) | 2013-07-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG DISPLAY CO., LTD. Effective date: 20131010 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20131010 Address after: Gyeonggi Do, South Korea Applicant after: Ap Cells Inc. Applicant after: Samsung Display Co., Ltd. Address before: South Korea Gyeonggi Do City China Applicant before: Ap Cells Inc. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171019 Address after: Gyeonggi Do city of East China South Beach east beach all 8 road 15-5 Co-patentee after: Samsung Display Co., Ltd. Patentee after: Ap Cells Inc. Address before: Gyeonggi Do, South Korea Co-patentee before: Samsung Display Co., Ltd. Patentee before: Ap Cells Inc. |