CN103155050A - 各向异性导电膜 - Google Patents
各向异性导电膜 Download PDFInfo
- Publication number
- CN103155050A CN103155050A CN2010800694065A CN201080069406A CN103155050A CN 103155050 A CN103155050 A CN 103155050A CN 2010800694065 A CN2010800694065 A CN 2010800694065A CN 201080069406 A CN201080069406 A CN 201080069406A CN 103155050 A CN103155050 A CN 103155050A
- Authority
- CN
- China
- Prior art keywords
- conductive film
- insulating barrier
- anisotropic conductive
- conductive layer
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Insulated Conductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims (25)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20100098506 | 2010-10-08 | ||
KR10-2010-0098506 | 2010-10-08 | ||
PCT/KR2010/009587 WO2012046923A1 (ko) | 2010-10-08 | 2010-12-30 | 이방성 도전 필름 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103155050A true CN103155050A (zh) | 2013-06-12 |
CN103155050B CN103155050B (zh) | 2017-05-03 |
Family
ID=45927898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080069406.5A Active CN103155050B (zh) | 2010-10-08 | 2010-12-30 | 各向异性导电膜 |
Country Status (4)
Country | Link |
---|---|
KR (2) | KR20120036721A (zh) |
CN (1) | CN103155050B (zh) |
TW (1) | TWI539471B (zh) |
WO (1) | WO2012046923A1 (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105225729A (zh) * | 2015-08-26 | 2016-01-06 | 京东方科技集团股份有限公司 | 各向异性导电膜、及覆晶薄膜与柔性电路板的邦定方法 |
CN105706183A (zh) * | 2013-10-29 | 2016-06-22 | 三星Sdi株式会社 | 各向异性导电膜及利用其的半导体装置 |
CN105940564A (zh) * | 2014-02-04 | 2016-09-14 | 迪睿合株式会社 | 各向异性导电膜及其制造方法 |
CN107075265A (zh) * | 2014-07-31 | 2017-08-18 | 拓自达电线株式会社 | 导电性组成物及含有该组成物的导电片 |
US10090075B2 (en) | 2014-11-20 | 2018-10-02 | Samsung Sdi Co., Ltd. | Display device connected by anisotropic conductive film |
CN110537125A (zh) * | 2017-03-03 | 2019-12-03 | 日东电工株式会社 | 光波导芯形成用感光性环氧树脂组合物、感光性薄膜、光电混载基板、光波导及其制造方法 |
CN111234718A (zh) * | 2020-01-19 | 2020-06-05 | 京东方科技集团股份有限公司 | 导电胶结构、显示装置及绑定方法 |
CN112423463A (zh) * | 2019-08-23 | 2021-02-26 | 鹏鼎控股(深圳)股份有限公司 | 多层电路板及其制作方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101479658B1 (ko) * | 2011-11-18 | 2015-01-06 | 제일모직 주식회사 | 가압착 공정성이 개선된 이방성 도전 필름 |
KR101597726B1 (ko) * | 2013-04-29 | 2016-02-25 | 제일모직주식회사 | 이방성 도전 필름 및 이를 이용한 디스플레이 장치 |
KR101659128B1 (ko) * | 2013-09-30 | 2016-09-22 | 제일모직주식회사 | 이방성 도전 필름 및 이를 이용한 반도체 장치 |
JP6261386B2 (ja) * | 2014-03-04 | 2018-01-17 | デクセリアルズ株式会社 | 多層型熱伝導性シート、多層型熱伝導性シートの製造方法 |
JP6661969B2 (ja) * | 2014-10-28 | 2020-03-11 | デクセリアルズ株式会社 | 異方性導電フィルム及び接続構造体 |
CN107210287B (zh) * | 2015-01-13 | 2020-04-14 | 迪睿合株式会社 | 多层基板 |
KR101893248B1 (ko) * | 2015-11-26 | 2018-10-04 | 삼성에스디아이 주식회사 | 이방 도전성 필름 및 이를 이용한 접속 구조체 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009170898A (ja) * | 2007-12-17 | 2009-07-30 | Hitachi Chem Co Ltd | 回路接続材料及び回路部材の接続構造 |
KR20100073595A (ko) * | 2008-12-23 | 2010-07-01 | 주식회사 효성 | 복층 구조 이방 도전성 접착제 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3449948B2 (ja) * | 1998-10-13 | 2003-09-22 | 住友ベークライト株式会社 | 異方導電性接着剤の製造方法及びその方法により製造された接着剤を用いて製作された電子機器 |
JP2004111162A (ja) * | 2002-09-17 | 2004-04-08 | Sekisui Chem Co Ltd | 被覆導電性微粒子の製造方法及び被覆導電性微粒子 |
JP2005146043A (ja) * | 2003-11-12 | 2005-06-09 | Sumitomo Electric Ind Ltd | 異方導電性接着剤 |
KR100662176B1 (ko) * | 2004-12-30 | 2006-12-27 | 제일모직주식회사 | 이방성 도전 필름용 조성물 |
-
2010
- 2010-12-30 CN CN201080069406.5A patent/CN103155050B/zh active Active
- 2010-12-30 KR KR1020100138817A patent/KR20120036721A/ko active Application Filing
- 2010-12-30 WO PCT/KR2010/009587 patent/WO2012046923A1/ko active Application Filing
-
2011
- 2011-04-11 TW TW100112426A patent/TWI539471B/zh active
-
2014
- 2014-06-25 KR KR1020140078464A patent/KR101748004B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009170898A (ja) * | 2007-12-17 | 2009-07-30 | Hitachi Chem Co Ltd | 回路接続材料及び回路部材の接続構造 |
KR20100073595A (ko) * | 2008-12-23 | 2010-07-01 | 주식회사 효성 | 복층 구조 이방 도전성 접착제 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105706183A (zh) * | 2013-10-29 | 2016-06-22 | 三星Sdi株式会社 | 各向异性导电膜及利用其的半导体装置 |
CN105940564A (zh) * | 2014-02-04 | 2016-09-14 | 迪睿合株式会社 | 各向异性导电膜及其制造方法 |
CN105940564B (zh) * | 2014-02-04 | 2020-03-24 | 迪睿合株式会社 | 各向异性导电膜及其制造方法 |
CN107075265A (zh) * | 2014-07-31 | 2017-08-18 | 拓自达电线株式会社 | 导电性组成物及含有该组成物的导电片 |
US10090075B2 (en) | 2014-11-20 | 2018-10-02 | Samsung Sdi Co., Ltd. | Display device connected by anisotropic conductive film |
CN105225729A (zh) * | 2015-08-26 | 2016-01-06 | 京东方科技集团股份有限公司 | 各向异性导电膜、及覆晶薄膜与柔性电路板的邦定方法 |
CN105225729B (zh) * | 2015-08-26 | 2017-02-22 | 京东方科技集团股份有限公司 | 各向异性导电膜、及覆晶薄膜与柔性电路板的邦定方法 |
CN110537125A (zh) * | 2017-03-03 | 2019-12-03 | 日东电工株式会社 | 光波导芯形成用感光性环氧树脂组合物、感光性薄膜、光电混载基板、光波导及其制造方法 |
CN110537125B (zh) * | 2017-03-03 | 2021-05-28 | 日东电工株式会社 | 光波导芯形成用感光性环氧树脂组合物、感光性薄膜、光电混载基板、光波导及其制造方法 |
CN112423463A (zh) * | 2019-08-23 | 2021-02-26 | 鹏鼎控股(深圳)股份有限公司 | 多层电路板及其制作方法 |
CN111234718A (zh) * | 2020-01-19 | 2020-06-05 | 京东方科技集团股份有限公司 | 导电胶结构、显示装置及绑定方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20140090585A (ko) | 2014-07-17 |
CN103155050B (zh) | 2017-05-03 |
TWI539471B (zh) | 2016-06-21 |
WO2012046923A1 (ko) | 2012-04-12 |
KR20120036721A (ko) | 2012-04-18 |
KR101748004B1 (ko) | 2017-06-16 |
TW201216301A (en) | 2012-04-16 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191127 Address after: Han Guojingjidao Patentee after: Samsung SDI Co.,Ltd. Address before: Han Guoqingshangbeidao Patentee before: CHEIL INDUSTRIES Inc. Effective date of registration: 20191127 Address after: Seoul, South Kerean Patentee after: GUKTOH CHEMICAL Co.,Ltd. Address before: Han Guojingjidao Patentee before: Samsung SDI Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220913 Address after: Gyeonggi Do, South Korea Patentee after: Guo Dujianduansucai Address before: Seoul, South Kerean Patentee before: GUKTOH CHEMICAL Co.,Ltd. |