CN103137604A - 一种穿过硅片接触孔的电阻测试结构及测试方法 - Google Patents
一种穿过硅片接触孔的电阻测试结构及测试方法 Download PDFInfo
- Publication number
- CN103137604A CN103137604A CN2011103884335A CN201110388433A CN103137604A CN 103137604 A CN103137604 A CN 103137604A CN 2011103884335 A CN2011103884335 A CN 2011103884335A CN 201110388433 A CN201110388433 A CN 201110388433A CN 103137604 A CN103137604 A CN 103137604A
- Authority
- CN
- China
- Prior art keywords
- holes
- groups
- hole
- resistance
- silicon chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011103884335A CN103137604A (zh) | 2011-11-29 | 2011-11-29 | 一种穿过硅片接触孔的电阻测试结构及测试方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011103884335A CN103137604A (zh) | 2011-11-29 | 2011-11-29 | 一种穿过硅片接触孔的电阻测试结构及测试方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103137604A true CN103137604A (zh) | 2013-06-05 |
Family
ID=48497211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011103884335A Pending CN103137604A (zh) | 2011-11-29 | 2011-11-29 | 一种穿过硅片接触孔的电阻测试结构及测试方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103137604A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107919291A (zh) * | 2016-10-09 | 2018-04-17 | 中芯国际集成电路制造(上海)有限公司 | 一种硅通孔测试结构及其测试方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6362638B1 (en) * | 1999-09-01 | 2002-03-26 | Agere Systems Guardian Corp. | Stacked via Kelvin resistance test structure for measuring contact anomalies in multi-level metal integrated circuit technologies |
US20100207648A1 (en) * | 2009-02-17 | 2010-08-19 | International Business Machines Corporation | Contact Resistance Test Structure and Method Suitable for Three-Dimensional Integrated Circuits |
CN102200554A (zh) * | 2011-03-30 | 2011-09-28 | 上海北京大学微电子研究院 | 电阻测试结构及测试方法 |
-
2011
- 2011-11-29 CN CN2011103884335A patent/CN103137604A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6362638B1 (en) * | 1999-09-01 | 2002-03-26 | Agere Systems Guardian Corp. | Stacked via Kelvin resistance test structure for measuring contact anomalies in multi-level metal integrated circuit technologies |
US20100207648A1 (en) * | 2009-02-17 | 2010-08-19 | International Business Machines Corporation | Contact Resistance Test Structure and Method Suitable for Three-Dimensional Integrated Circuits |
CN102200554A (zh) * | 2011-03-30 | 2011-09-28 | 上海北京大学微电子研究院 | 电阻测试结构及测试方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107919291A (zh) * | 2016-10-09 | 2018-04-17 | 中芯国际集成电路制造(上海)有限公司 | 一种硅通孔测试结构及其测试方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106920795B (zh) | 存储器结构及其制备方法、存储器的测试方法 | |
US9557376B2 (en) | Apparatuses and methods for die seal crack detection | |
US7355201B2 (en) | Test structure for measuring electrical and dimensional characteristics | |
TWI401780B (zh) | 可測試直通矽晶穿孔的結構及方法 | |
CN203133171U (zh) | 用于对电子电路的晶片进行测试的测试装置 | |
CN106935524A (zh) | 探针卡和晶圆测试系统及晶圆测试方法 | |
US7998853B1 (en) | Semiconductor device with through substrate vias | |
CN104658940A (zh) | 一种鳍式场效晶体管电学特性的测量结构 | |
CN102890195B (zh) | 测试与衬底同型的有源区上接触孔电阻的方法 | |
US7573278B2 (en) | Semiconductor device | |
CN103346142A (zh) | 测试键结构及监测刻蚀工艺中接触孔刻蚀量的方法 | |
CN103137604A (zh) | 一种穿过硅片接触孔的电阻测试结构及测试方法 | |
CN103137606A (zh) | 电阻测试结构及方法 | |
CN104733438B (zh) | 一种晶圆允收测试结构 | |
CN101788642B (zh) | 测量金属通孔电阻的集成电路测试器件及其制造方法 | |
CN106601645B (zh) | 一种测试结构及其布设方法 | |
CN101750563B (zh) | 半导体器件中通孔或接触孔短路检测结构 | |
KR101482683B1 (ko) | 단선 및 단락 테스트 구조를 갖는 3차원 집적 회로 및 이의 테스트 방법 | |
CN103630825B (zh) | 芯片测试电路及其形成方法 | |
US10613116B2 (en) | Kelvin connection with positional accuracy | |
CN104282661B (zh) | 集成电路中可靠性分析的测试结构及其测试方法 | |
CN106057696A (zh) | 基于光电分离的二极管光电测试方法 | |
CN109116112A (zh) | 一种导通电阻测试结构及方法 | |
CN104157584B (zh) | 深通孔电阻的测试结构及测试方法 | |
CN101819940B (zh) | 测试晶片的方法及测试结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140110 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20140110 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Applicant before: Shanghai Huahong NEC Electronics Co., Ltd. |
|
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130605 |
|
RJ01 | Rejection of invention patent application after publication |