CN103123896A - 非感光性聚酰亚胺钝化层的制备方法 - Google Patents
非感光性聚酰亚胺钝化层的制备方法 Download PDFInfo
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- CN103123896A CN103123896A CN2011103668088A CN201110366808A CN103123896A CN 103123896 A CN103123896 A CN 103123896A CN 2011103668088 A CN2011103668088 A CN 2011103668088A CN 201110366808 A CN201110366808 A CN 201110366808A CN 103123896 A CN103123896 A CN 103123896A
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105607357A (zh) * | 2016-01-06 | 2016-05-25 | 京东方科技集团股份有限公司 | 一种阵列基板、其制作方法及显示装置 |
CN111162007A (zh) * | 2018-11-08 | 2020-05-15 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其制造方法 |
CN111326082A (zh) * | 2020-04-14 | 2020-06-23 | Tcl华星光电技术有限公司 | 背板单元及其制造方法、显示装置 |
CN111856888A (zh) * | 2020-07-03 | 2020-10-30 | 儒芯微电子材料(上海)有限公司 | 一种增强密集图形光刻分辨率的方法 |
US11526079B2 (en) | 2020-04-14 | 2022-12-13 | Tcl China Star Optoelectronics Technology Co., Ltd. | Backplane unit and its manufacturing method and display device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5112763A (en) * | 1988-11-01 | 1992-05-12 | Hewlett-Packard Company | Process for forming a Schottky barrier gate |
US6815324B2 (en) * | 2001-02-15 | 2004-11-09 | Megic Corporation | Reliable metal bumps on top of I/O pads after removal of test probe marks |
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- 2011-11-18 CN CN201110366808.8A patent/CN103123896B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5112763A (en) * | 1988-11-01 | 1992-05-12 | Hewlett-Packard Company | Process for forming a Schottky barrier gate |
US6815324B2 (en) * | 2001-02-15 | 2004-11-09 | Megic Corporation | Reliable metal bumps on top of I/O pads after removal of test probe marks |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105607357A (zh) * | 2016-01-06 | 2016-05-25 | 京东方科技集团股份有限公司 | 一种阵列基板、其制作方法及显示装置 |
CN105607357B (zh) * | 2016-01-06 | 2018-12-18 | 京东方科技集团股份有限公司 | 一种阵列基板、其制作方法及显示装置 |
CN111162007A (zh) * | 2018-11-08 | 2020-05-15 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其制造方法 |
CN111162007B (zh) * | 2018-11-08 | 2022-04-12 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其制造方法 |
CN111326082A (zh) * | 2020-04-14 | 2020-06-23 | Tcl华星光电技术有限公司 | 背板单元及其制造方法、显示装置 |
US11526079B2 (en) | 2020-04-14 | 2022-12-13 | Tcl China Star Optoelectronics Technology Co., Ltd. | Backplane unit and its manufacturing method and display device |
CN111856888A (zh) * | 2020-07-03 | 2020-10-30 | 儒芯微电子材料(上海)有限公司 | 一种增强密集图形光刻分辨率的方法 |
CN111856888B (zh) * | 2020-07-03 | 2023-06-23 | 儒芯微电子材料(上海)有限公司 | 一种增强密集图形光刻分辨率的方法 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140109 |
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