CN103107129B - Micropore metal filling structure and method - Google Patents
Micropore metal filling structure and method Download PDFInfo
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- CN103107129B CN103107129B CN201310064231.4A CN201310064231A CN103107129B CN 103107129 B CN103107129 B CN 103107129B CN 201310064231 A CN201310064231 A CN 201310064231A CN 103107129 B CN103107129 B CN 103107129B
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Abstract
The invention provides a micropore metal filling structure and a method. The filling structure comprises a sealing cavity and a sandwich structure. The sealing cavity comprises an air inlet and an air outlet. A space for containing a liquid metal groove is encircled by the sealing cavity. The sandwich structure comprises a blocking piece, a filling base piece and a nozzle piece, wherein the blocking piece, the filling base piece and the nozzle piece are sequentially stacked from top to bottom. A filling micropore is formed in the filling base piece. A nozzle hole corresponding to the filling micropore vertically is formed in the nozzle piece. A first gap is reserved between the blocking piece and the filling base piece. A second gap is reserved between the filling base piece and the nozzle piece. The radius of the narrowest position of the nozzle hole is more than a half smaller than that of the filling micropore. The side wall of the sandwich structure is embedded in the sealing cavity. The lower surface of the nozzle piece is tightly attached to the upper surface of the liquid metal groove when metal is filled in the filling micropore. According to the micropore metal filling structure and the method, the metal in the liquid metal groove is sucked to the micrometer-grade filling micropore by utilizing pressure difference, the metal filled in the micrometer and the liquid metal groove are cut off in the nozzle hole according to surface tension principle, and therefore filling speed is fast, filling time is short, and filling precision is high.
Description
Technical field
The invention belongs to micro-manufacture processing technique field, relate to a kind of micropore filling technology, particularly relate to a kind of micropore metal interstitital texture and method.
Background technology
Electricity mutual connection is used to realize the mode by the transmission of chip chamber and the signal of telecommunication between chip and substrate, is the core component of encapsulation.In existing encapsulation technology, be electrically connected mainly through gold thread bonding (wire-bonding) and flip chip bonding (flip-chip).Wire-bonding realizes by being bonded in respectively at tiny gold thread (about 25 microns thick) two ends on the electrode that needs to carry out electrical interconnection.Flip-chip is otherwise known as controlled collapse chip connection (C4), and the method by directly making salient point on electrode, and normally tin ball, the mode then refluxed by tin ball realizes the connection with counter electrode on substrate.
Along with the development of electronic device, above-mentioned two kinds of electrical connection forms particularly Wire-bonding can not meet higher system in package (SiP) integrated level and the requirement of less encapsulation volume gradually.What rise has the novel electric connection technology of significant impact to be TSV (Through-silicon via) silicon through hole technology to Advanced Packaging thereupon, and it is the vertical electric connection technology penetrating substrate (particularly silicon chip).TSV almost can replace the place of the Wire-Bonding in all encapsulation, improve the electric property of all kinds chip package, comprise and greatly improve integrated level, reduce chip size, particularly at system collection encapsulation (System-in-Packaging, SiP), among wafer level packaging (Wafer-Level Packaging – WLP) and three-dimensional perpendicular stacked package (3D Packaging) these Advanced Packagings.
The manufacture of TSV includes the manufacture of through hole, the deposition of insulating barrier, the filling of through hole and follow-up CMP (CMP) and the techniques such as (RDL) that connects up again.In these techniques, the filling of through hole is that technical difficulty is maximum, one that cost is the highest.According to the application of reality, the aperture of through hole from tens microns to hundreds of micron not etc., metal filled for bulk like this, existing major technique is based on copper electroplating principle, by first carrying out the attachment of Seed Layer on through-hole wall, and then the mode of electro-coppering on the seed layer realizes.In addition, other TSV technology is also in constantly studying.As being then go out columnar silicon body as transmitting medium by the silicon chip silicon deep etching in low-resistance rate based on the Silex Via of low-resistance rate silicon.In addition based on Wire-bonding and magnetic packaging technology TSV technology also under study for action.These two kinds of technology are respectively by placing metal lead wire in through-holes or nickel pin is used as conducting medium.At present conventional filling mode realizes by electroplating, particularly copper plating, if for size several microns also can be realized by CVD.But no matter be plating or CVD, because speed is slow, want to realize size all more difficult to the filling of hundreds of micron tens.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of micropore metal interstitital texture and method, for solving the problem that in prior art, filling speed is slow and filling rate of finished products is low in tens micropores to hundreds of micron.
For achieving the above object and other relevant objects, the invention provides a kind of micropore metal interstitital texture and method; Described micropore metal interstitital texture comprises annular seal space, sandwich structure; Described annular seal space comprises air inlet/outlet; Described sandwich structure comprises and superposes barrier sheet from top to bottom successively, fills substrate and nozzle piece; Described filling substrate is clipped between described barrier sheet and nozzle piece; Described filling substrate is provided with filling micropore; Described nozzle piece is provided with corresponding nozzle bore vertical with described filling micropore; The first gap is provided with between described barrier sheet and filling substrate; The second gap is provided with between described filling substrate and nozzle piece; The radius at the described narrow place of nozzle Kongzui is less than more than 1/2 of the radius of described filling micropore; Described sandwich structure is horizontally set in described space, and the sidewall of sandwich structure is all embedded in described annular seal space; The lower surface of described nozzle piece in order to be close to the upper surface of a liquid metal groove when metal filled; Air pressure in described annular seal space and described first gap, fill micropore, the second gap and nozzle bore air pressure all identical.
Preferably, vertical at least one nozzle bore corresponding of each described filling micropore.
Preferably, described annular seal space comprises at the bottom of exterior seal ring, inner seal ring, seal cover, sealing; The height of described exterior seal ring is greater than the height of described inner seal ring; The bottom of described exterior seal ring is connected with the outward flange at the bottom of described sealing, and the bottom of described inner seal ring is connected with the inward flange at the bottom of described sealing; The outward flange of described seal cover is connected with the top of described exterior seal ring, and the inward flange of seal cover is fixedly connected with the top of described sandwich structure; The top of described inner seal ring is fixedly connected with the bottom of described sandwich structure; Confined space is formed at the bottom of described exterior seal ring, seal cover, sandwich structure, liquid metal groove, inner seal ring and sealing.
Preferably, described annular seal space comprise at the bottom of exterior seal ring, inner seal ring, sealing frame, sealing, gland; The height of described exterior seal ring is greater than the height of described inner seal ring; The bottom of described exterior seal ring is connected with the outward flange at the bottom of described sealing, and the bottom of described inner seal ring is connected with the inward flange at the bottom of described sealing; The bottom margin of described sealing frame is connected with the top of described exterior seal ring, and the top of sealing frame is connected with the edges close of described gland by butterfly bellows; Described gland presses the upper surface at described sandwich structure; The top of described inner seal ring is fixedly connected with the bottom of described sandwich structure; Confined space is formed at the bottom of described exterior seal ring, sealing frame, butterfly bellows, gland, sandwich structure, liquid metal groove, inner seal ring and sealing.
Preferably, described annular seal space comprise at the bottom of exterior seal ring, sealing frame, sealing, gland, the first butterfly bellows, the second butterfly bellows; The bottom of described exterior seal ring is connected with the outward flange at the bottom of described sealing; The bottom margin of described sealing frame is connected with the top of described exterior seal ring, and the top of sealing frame is connected with the edges close of described gland by described first butterfly bellows; Described gland presses the upper surface at described sandwich structure; Described sandwich structure presses the upper surface in described liquid metal groove; The side of described liquid metal groove is connected with the inward flange at the bottom of described sealing by described second butterfly bellows; Described exterior seal ring, sealing frame, the first butterfly bellows, gland, sandwich structure, liquid metal groove, the second butterfly bellows and the sealing end, form confined space.
Preferably, the lower surface of described barrier sheet is provided with the first bulge-structure, and described first bulge-structure makes to form described first gap between described barrier sheet and described filling substrate; The upper surface of described nozzle piece is provided with the second bulge-structure, and described second bulge-structure makes to form described second gap between described nozzle piece and described filling substrate.
Preferably, the lower surface of described barrier sheet is provided with the first packing ring, and described first packing ring makes to form described first gap between described barrier sheet and described filling substrate; The upper surface of described nozzle piece is provided with the second packing ring, and described second packing ring makes to form described second gap between described nozzle piece and described filling substrate.
Preferably, the vertical height in described first gap and the second gap is 1 ~ 20 micron.
Preferably, the section shape of described nozzle bore is that trapezoidal, arch is or/and hyperbola; When the degree of depth of described nozzle bore does not reach the thickness of described nozzle piece, described nozzle bore is communicated with a through hole and penetrates described nozzle piece.
Described micropore metal fill method comprises: utilize draught head to be undertaken in the micropore of filling by the liquid metal inspiration needs in liquid metal groove, and the liquid metal in the liquid metal in the described micropore of ining succession and described liquid metal groove cuts off by the surface tension of recycling liquid metal.
Preferably, the liquid metal inspiration in liquid metal groove needs the specific implementation process of carrying out in the micropore of filling to comprise by the described draught head that utilizes: superpose barrier sheet from top to bottom successively, fill substrate and nozzle piece formation sandwich structure; Described filling substrate is clipped between described barrier sheet and nozzle piece; Described filling substrate is provided with filling micropore; Described nozzle piece is provided with corresponding nozzle bore vertical with described filling micropore; The first gap is provided with between described barrier sheet and filling substrate; The second gap is provided with between described filling substrate and nozzle piece; The radius at the described narrow place of nozzle Kongzui is less than more than 1/2 of the radius of described filling micropore; The upper surface of described liquid metal groove is close to the lower surface of described nozzle piece; Reduce the air pressure inside of described sandwich structure to the first atmospheric pressure value being less than external atmosphere pressure, form tension force upwards, the liquid metal now in described liquid metal groove is filled in described micropore through described nozzle bore under the effect of tension force upwards.
Preferably, the specific implementation process that liquid metal in liquid metal in the described micropore of ining succession and described liquid metal groove cuts off comprises by the described surface tension of liquid metal that utilizes: the air pressure inside raising described sandwich structure is to being less than external atmosphere pressure and being greater than the second atmospheric pressure value of described first atmospheric pressure value, pressure differential between described external atmosphere pressure and the second atmospheric pressure value cannot maintain the continuity of liquid metal in described nozzle bore and described liquid metal is broken at described nozzle bore, and is back in described liquid metal groove.
Preferably, the section shape of described nozzle bore is that trapezoidal, convex shape, arch are or/and hyperbola.
Preferably, not being inhaled into described first gap and the second gap when the vertical height in described first gap and the second gap is all inhaled into micropore with liquid metal for principle is arranged; The vertical height in described first gap and the second gap is 1 ~ 20 micron.
Preferably, vertical at least one nozzle bore corresponding of each described filling micropore.
As mentioned above, micropore metal interstitital texture of the present invention and method, have following beneficial effect:
The present invention utilizes pressure differential to suck in the micropore of micron level by the liquid metal in liquid metal groove, according to surface tension principle, the metal be filled in micropore and liquid metal groove are cut off again, filling speed is exceedingly fast, required time is extremely short, and accuracy is high, good cutting effect, is easy to realize, efficient and practical.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of micropore metal interstitital texture of the present invention.
Fig. 2 a is a kind of structural representation of sandwich structure of the present invention.
Fig. 2 b is the another kind of structural representation of sandwich structure of the present invention.
Fig. 3 a is the structural representation of the vertical corresponding nozzle bore of a filling micropore of the present invention.
Fig. 3 b is the structural representation of a vertical corresponding multiple nozzle bore of filling micropore of the present invention.
Fig. 3 c ~ Fig. 3 f is the cross-sectional view of nozzle bore of the present invention.
Fig. 3 g is the cross-sectional view of a corresponding multiple nozzle bore of filling micropore of the present invention.
Fig. 4 is the structural representation of the micropore metal interstitital texture described in the embodiment of the present invention two.
Fig. 5 is the structural representation of the micropore metal interstitital texture described in the embodiment of the present invention three.
Fig. 6 is the structural representation of the micropore metal interstitital texture described in the embodiment of the present invention four.
Fig. 7 a ~ Fig. 7 d is the schematic flow sheet of micropore metal fill method of the present invention.
Fig. 8 is the structural representation of the filling substrate after filling.
Element numbers explanation
100 annular seal spaces
101,407,509,609 air inlet/outlets
200,405,507,607 sandwich structures
201,701 barrier sheets
202,702 fill substrate
203,703 nozzle pieces
204,704 first gaps
205,705 second gaps
206,706 fill micropore
207,707 nozzle bores
208 first bulge-structures
209 second bulge-structures
210 first packing rings
211 second packing rings
300,406,508,608,708 liquid metal grooves
400 spaces
401,501,601 exterior seal rings
402,502, inner seal ring
403 seal covers
404,504, the 603 sealing ends
503,602 sealing frames
505,604 glands
506 butterfly bellowss
605 first butterfly bellowss
606 second butterfly bellowss
Embodiment
Below by way of specific instantiation, embodiments of the present invention are described, those skilled in the art the content disclosed by this specification can understand other advantages of the present invention and effect easily.The present invention can also be implemented or be applied by embodiments different in addition, and the every details in this specification also can based on different viewpoints and application, carries out various modification or change not deviating under spirit of the present invention.
Refer to accompanying drawing.It should be noted that, the diagram provided in the present embodiment only illustrates basic conception of the present invention in a schematic way, then only the assembly relevant with the present invention is shown in graphic but not component count, shape and size when implementing according to reality is drawn, it is actual when implementing, and the kenel of each assembly, quantity and ratio can be a kind of change arbitrarily, and its assembly layout kenel also may be more complicated.
The present invention relates to a kind of technology of filling for micropore metal, be mainly used in MEMS (micro electro mechanical system) (MEMS), the filling that the TSV electrical interconnection in the encapsulation such as photoelectric device manufactures, belong to micro-manufacture processing and microelectronics Packaging field.The present invention proposes a kind of filling technique based on liquid air pressure pinch off principle completely newly, solves the TSV (tens microns to hundreds of micron) manufacturing large aperture and high-aspect-ratio and fills problem.But the invention is not restricted to TSV fill, it is also applicable to any technical field needing to carry out micropore filling.The present invention utilizes the mobility of liquid metal to realize the filling of micropore, and its key point utilizes the surface tension of liquid as main actuating force to cut off the metal after filling and metallic channel.
Below in conjunction with embodiment and accompanying drawing, the present invention is described in detail.
Embodiment one
The present embodiment provides a kind of micropore metal interstitital texture, and as shown in Figure 1, this interstitital texture comprises: annular seal space 100, sandwich structure 200.
Described annular seal space 100 comprises air inlet/outlet 101; Described annular seal space 100 can be surrounded by the space 400 holding liquid metal groove 300.
Described sandwich structure 200 comprises the barrier sheet 201, filling substrate 202 and the nozzle piece 203 that superpose successively from top to bottom; Described filling substrate 202 is clipped between described barrier sheet 201 and nozzle piece 203.Described filling substrate 202 is provided with fills micropore 206; Described nozzle piece 203 is provided with corresponding nozzle bore 207 vertical with described filling micropore 206; The first gap 204 is provided with between described barrier sheet 201 and filling substrate 202; The second gap 205 is provided with between described filling substrate 202 and nozzle piece 203.The radius at the narrowest place of described nozzle bore 207 must be less than more than 1/2 of the radius of described filling micropore 206, and being specifically less than degree can be obtained by software simulation.
Further, as shown in Figure 2 a, the lower surface of described barrier sheet 201 is provided with the first bulge-structure 208, and described first bulge-structure 208 makes to form described first gap 204 between described barrier sheet 201 and described filling substrate 202; The upper surface of described nozzle piece 203 is provided with the second bulge-structure 209, and described second bulge-structure 209 makes to form described second gap 205 between described nozzle piece 203 and described filling substrate 202.
Or described first bulge-structure 208 and the second bulge-structure 209 are substituted by packing ring, as shown in Figure 2 b, the lower surface of described barrier sheet 201 is provided with the first packing ring 210, and described first packing ring 210 makes to form described first gap 204 between described barrier sheet 201 and described filling substrate 202; The upper surface of described nozzle piece 203 is provided with the second packing ring 211, and described second packing ring 211 makes to form described second gap 205 between described nozzle piece 203 and described filling substrate 202.
Further, be not inhaled in described first gap 204 and the second gap 205 as principle is arranged when the vertical height in described first gap 204 and the second gap 205 is all inhaled into fills micropore with liquid metal.Described first gap 204 is identical with the vertical height in the second gap 205, this vertical height needs enough large to ensure that gas can pass through inside, simultaneously also enough little of to prevent liquid metal to be inhaled in gap, generally can at 10 microns, as as described in the vertical height in the first gap 204 and the second gap 205 be 1 ~ 20 micron, also can be preferably 8,9,10,11 or 12 microns.
Described sandwich structure 200 is horizontally set in described space 400, and the sidewall of sandwich structure 200 is all embedded in described annular seal space 100, namely the sidewall of described barrier sheet 201, filling substrate 202 and nozzle piece 203 is all embedded in described annular seal space 100.The lower surface of described nozzle piece 203 in order to be close to the upper surface of described liquid metal groove 300 when metal filled; Liquid metal and nozzle piece 203 are completely nonwettable, and the upper surface of liquid metal covers all nozzle bores 203.Air pressure in described annular seal space 100 and described first gap 204, the air pressure of filling micropore 206, second gap 205 and nozzle bore 207 are all identical.
As shown in Figure 3 a, the vertical corresponding nozzle bore 207 of micropore 206 is filled for one.Wherein, r/R<0.5, r represent the radius at the narrowest place of nozzle bore 207, and R represents the radius of filling micropore 206; In δ <R-r, Fig. 3 a, radius is the distance areas of the axle center deviation of the region representation permission nozzle bore 207 of δ.
As shown in Figure 3 b, the vertical corresponding multiple nozzle bore 207 of micropore 206 is filled for one.Such as nozzle bore 207 vertically corresponds to one in the mode of hexagonal array and fills micropore 206.Relative to the man-to-man form shown in Fig. 3 a, such arrangement can greatly reduce the requirement of alignment precision.In order to ensure where no matter be in, always there is a nozzle bore to be complete correspond to filling micropore, lower relation of plane must be met:
L<=2cos (π/6) (R-r)=>L<=1.73 (R-r), wherein R is the radius of filling micropore, r is nozzle bore radius, and L lines up the distance in hexagonal nozzle bore between any two nozzle bore hole hearts.L only meets this relation, and within the specific limits, each filling micropore always has a nozzle bore to be complete vertically correspond to guarantee.
Gray area in Fig. 3 b is the region of permissible variation, can greatly reduce the requirement to perpendicular alignmnet precision relative to Fig. 3 a.
In the present invention, vertical at least one nozzle bore 207 corresponding of each described filling micropore 206.Vertical correspondence of the present invention refers to that the filling axis of micropore and the axis of described nozzle bore are in a vertical line.As shown in Fig. 3 c ~ Fig. 3 f, the section shape of described nozzle bore 207 is can be rectangle, arch, trapezoidal, hyperbola etc.When the section shape of described nozzle bore 207 is for being rectangle, the radius of described nozzle bore 207 needs more than 1/2 of the radius being less than described filling micropore 206.When the degree of depth of described nozzle bore does not reach the thickness of described nozzle piece, described nozzle bore can be communicated with a through hole to reach the object penetrating described nozzle piece.
The course of work of the micropore metal interstitital texture described in the present embodiment is:
Reduce the air pressure inside of described annular seal space 100 to the first atmospheric pressure value being less than external atmosphere pressure, now described first gap 204, the air pressure of filling micropore 206, second gap 205 and nozzle bore 207 are all down to first atmospheric pressure value identical with the air pressure in described annular seal space 100, in this case, fill in micropore 206 nozzle bore 207 tension force all formed upwards, the liquid metal now in described liquid metal groove 300 is filled in described filling micropore 206 through described nozzle bore 207 under the effect of tension force upwards;
The air pressure inside raising described annular seal space 100 is gradually to being less than external atmosphere pressure and being greater than the second atmospheric pressure value of described first atmospheric pressure value, now described first gap 204, fill micropore 206, the air pressure of the second gap 205 and nozzle bore 207 is all increased to second atmospheric pressure value identical with the air pressure in described annular seal space 100, in this case, draught head between the second atmospheric pressure value in external atmosphere pressure and annular seal space cannot maintain the continuity of liquid metal in described nozzle bore, the surface tension of liquid metal is by the liquid metal pinch off in nozzle bore, described liquid metal is broken at described nozzle bore 207, and be back in described liquid metal groove 300.
Embodiment two
The present embodiment provides a kind of micropore metal interstitital texture, and the difference of itself and embodiment one is, the structure of described annular seal space is different, and as shown in Figure 4, described annular seal space comprises exterior seal ring 401, inner seal ring 402, seal cover 403, the sealing end 404; The height of described exterior seal ring 401 is greater than the height of described inner seal ring 402; The bottom of described exterior seal ring 401 with at the bottom of described sealing 404 outward flange be connected, the bottom of described inner seal ring 402 with at the bottom of described sealing 404 inward flange be connected; The outward flange of described seal cover 403 is connected with the top of described exterior seal ring 401, and the inward flange of seal cover 403 is fixedly connected with the top of described sandwich structure 405; The top of described inner seal ring 402 is fixedly connected with the bottom of described sandwich structure 405; The upper surface of described liquid metal groove 406 is close to the lower surface of described sandwich structure 405.Described exterior seal ring 401, seal cover 403, sandwich structure 405, liquid metal groove 406, inner seal ring 402 and the sealing end 404, form confined space; At the bottom of described sealing, 404 are provided with air inlet/outlet 407.
Embodiment three
The present embodiment provides a kind of micropore metal interstitital texture, the difference of itself and embodiment one, two is, the structure of described annular seal space is different, and as shown in Figure 5, described annular seal space comprises exterior seal ring 501, inner seal ring 502, sealing frame 503, the sealing end 504, gland 505; The height of described exterior seal ring 501 is greater than the height of described inner seal ring 502; The bottom of described exterior seal ring 501 with at the bottom of described sealing 504 outward flange be connected, the bottom of described inner seal ring 502 with at the bottom of described sealing 504 inward flange be connected; The bottom margin of described sealing frame 503 is connected with the top of described exterior seal ring 501, and the top of sealing frame 503 is connected with the edges close of described gland 505 by butterfly bellows 506; Described gland 505 presses the upper surface at described sandwich structure 507; The top of described inner seal ring 502 is fixedly connected with the bottom of described sandwich structure 507; The upper surface of described liquid metal groove 508 is close to the lower surface of described sandwich structure 507.Described exterior seal ring 501, sealing frame 503, butterfly bellows 506, gland 505, sandwich structure 507, liquid metal groove 508, inner seal ring 502 and the sealing end 504, form confined space.At the bottom of described sealing, 504 are provided with air inlet/outlet 509.
Embodiment four
The present embodiment provides a kind of micropore metal interstitital texture, the difference of itself and embodiment one, two, three is, the structure of described annular seal space is different, as shown in Figure 6, preferably, described annular seal space comprises exterior seal ring 601, sealing frame 602, the sealing end 603, gland 604, first butterfly bellows 605, second butterfly bellows 606; The bottom of described exterior seal ring 601 with at the bottom of described sealing 603 outward flange be connected; The bottom margin of described sealing frame 602 is connected with the top of described exterior seal ring 601, and the top of sealing frame 602 is connected with the edges close of described gland 604 by described first butterfly bellows 605; Described gland 604 presses the upper surface at described sandwich structure 607; Described sandwich structure 607 presses the upper surface in described liquid metal groove 608; The side of described liquid metal groove 608 by described second butterfly bellows 606 with at the bottom of described sealing 603 inward flange be connected; Described exterior seal ring 601, sealing frame 602, first butterfly bellows 605, gland 604, sandwich structure 607, liquid metal groove 608, second butterfly bellows 606 and the sealing end 603, form confined space.At the bottom of described sealing, 603 are provided with air inlet/outlet 609.
Embodiment five
The present embodiment provides a kind of micropore metal fill method, as shown in Fig. 7 a ~ Fig. 7 d, the main implementation procedure of the method comprises: utilize draught head to be undertaken in the micropore of filling by the liquid metal inspiration needs in liquid metal groove, and the liquid metal in the liquid metal in the described micropore of ining succession and described liquid metal groove cuts off by the surface tension of recycling liquid metal.
Further, the liquid metal inspiration in liquid metal groove needs the process of carrying out in the micropore of filling referred to as filling process by the described draught head that utilizes, and specifically comprises:
Superpose barrier sheet 701, filling substrate 702 and nozzle piece 703 from top to bottom successively and form sandwich structure; Described filling substrate folder 702 is between described barrier sheet 701 and nozzle piece 703; Described filling substrate 702 is provided with fills micropore 706; Described nozzle piece 703 is provided with corresponding nozzle bore 707 vertical with described filling micropore 706; The first gap 704 is provided with between described barrier sheet 701 and filling substrate 702; The second gap 705 is provided with between described filling substrate 702 and nozzle piece 703; The radius at the described narrow place of nozzle Kongzui is less than 1/2 of the radius of described filling micropore.Wherein, not being inhaled into described first gap and the second gap when the vertical height in described first gap 704 and the second gap 705 is all inhaled into micropore with liquid metal for principle is arranged; Described first gap is identical with the vertical height in the second gap, this vertical height needs enough large to ensure that gas can pass through inside, simultaneously also enough little of to prevent liquid metal to be inhaled in gap, generally can at 10 microns, as as described in the vertical height in the first gap and the second gap be 1 ~ 20 micron, also can be preferably 8,9,10,11 or 12 microns.
The upper surface of described liquid metal groove 708 is close to the lower surface of described nozzle piece 703; Liquid metal and nozzle piece are completely nonwettable, and the upper surface of liquid metal covers all nozzle bores.
Reduce the air pressure inside of described sandwich structure to the first atmospheric pressure value being less than external atmosphere pressure, in described filling micropore and nozzle bore, form tension force upwards, the liquid metal now in described liquid metal groove is filled in described micropore through described nozzle bore under the effect of tension force upwards.
The principle that realizes of filling process is: suppose that nozzle bore and filler opening are all axial symmetry cylindric (as Fig. 3 c), and the surface tension of liquid metal is isotropic.Because nozzle bore, the size in filler opening and gap all only has micron level, and the effect of gravity to the liquid metal of micron-scale is negligible.Because the size of metallic channel is comparatively large, the pressure of liquid metal internal is also negligible.Metal is at nozzle bore, and the pressure acting on each surface that the shape in filler opening and gap is subject to by it determined.
Suppose that again extraneous air pressure is Po, the air pressure of sandwich structure inside is Pi, and draught head Po-Pi is between the two P
diff.This wherein ambient pressure Po be constant, realize the process of whole filling and cutting by controlling the air pressure Pi of sandwich structure inside.When Pi reduces to P
diffduring >2 γ/r, the liquid metal made in liquid metal groove is filled in micropore by nozzle bore press-in by external environment and inner draught head, and wherein, γ is the surface tension coefficient of liquid metal, and r is the radius of nozzle bore.Because the gap of sandwich structure is enough little, and because the surface of liquid metal to barrier sheet, filling substrate and nozzle piece is all completely nonwettable, so draught head can not be pressed into liquid metal in the first gap and the second gap.And barrier sheet also prevents metal to be forced out the outside of filling micropore.Because the top and bottom of the confined space formed are made up of barrier sheet and nozzle piece respectively, the external air pressure that these two faces are born is equal, so sandwich structure will cause deformation even to be ruptured because bearing pressure differential.
Further, the described process utilizing the surface tension of liquid metal to be cut off by the liquid metal in the liquid metal in the described micropore of ining succession and described liquid metal groove, referred to as cutting-off process, specifically comprises:
The air pressure inside Pi raising described sandwich structure is to being less than external atmosphere pressure and being greater than the second atmospheric pressure value P of described first atmospheric pressure value
breaktime, the second atmospheric pressure value P in described Po and cavity
breakbetween draught head P
diffcannot maintain the continuity of liquid metal in described nozzle bore makes described liquid metal break at described nozzle bore.Upper metal after disconnection in nozzle bore is back in filler opening, and lower return is in described liquid metal groove.
The principle that realizes of cutting-off process is: suck the liquid metal of filling in micropore and still connected together by nozzle bore and metallic channel, they is cut off being realized by the sandwich structure air pressure inside Pi that slowly gos up.Liquid metal is filling the shape in micropore and nozzle bore by P
diffjointly determine with surface tension effects.P
diffliquid metal is expanded, and surface tension then makes liquid metal shrink.
Along with the rising of Pi, P
diffcan reduce.In filling micropore, because the two ends of capillary effect liquid metal post can become round gradually, work as P
diffwhen reaching γ/2R, wherein R is the radius of filling micropore, and metal column two ends can form semicircle.Continue to raise Pi, P
difffurther reduction, surface tension can push back metal from filler opening.In nozzle bore, work as P
diffwhen being greater than γ/r, liquid metal can be close on the wall of nozzle bore; When draught head just in time reaches γ/r, the pressure of liquid metal to nozzle hole wall reduces to zero; When draught head be reduced to be less than γ/r time, have again two kinds of situations according to the depth-width ratio of nozzle bore (ratio of height and diameter).If the depth-width ratio of nozzle bore is greater than about 1.5, as long as draught head is less than γ/r, the metal in nozzle bore can break at once; If the depth-width ratio of nozzle bore is less than about 1.5, so draught head must continue to drop to certain value and just can break, and the value of the required draught head that specifically breaks is relevant with the size of nozzle bore, and this value can be crossed software simulation and obtain.
According to above analysis, by design filler opening and the size of nozzle bore, can accomplish that Pi is before going back up to metal pushed back required air pressure from filler opening, metal first interrupts at nozzle bore, and such metal column will be stayed in filler opening.
In cutting process, each fills between micropore is separate, and the filling situation between them can not influence each other.
Liquid metal solidification in filling micropore to be filled, the structure of the filling substrate after filling as shown in Figure 8.Liquid metal groove (as molten tin bath) in the present invention, nozzle piece and barrier sheet can be reused.
In the present invention, vertical at least one nozzle bore corresponding of each described filling micropore, and the requirement of situation to alignment precision of the situation of the vertical corresponding multiple nozzle bore of an each described filling micropore corresponding nozzle bore more vertical than each filling micropore is lower.
The implementation structure of micropore metal fill method of the present invention includes but not limited to several micropore metal interstitital texture of the present invention.
The principle that realizes of micropore metal interstitital texture of the present invention and method is: the liquid metal inspiration in liquid metal groove needed to carry out in the micropore of filling by draught head, then utilize metallic surface tension force the liquid metal of ining succession and metallic channel to be cut off.When the size of liquid is in micron level, the surface tension of liquid will be far longer than gravity, so gravity is negligible, namely at micro-meter scale, the behavior of liquid is ordered about by surface tension and outer gauge pressure.
The present invention utilizes pressure differential to suck in the micropore of micron level by the liquid metal in liquid metal groove, according to surface tension principle, the metal be filled in micropore and liquid metal groove are cut off again, filling speed is exceedingly fast, required time is extremely short, and accuracy is high, good cutting effect, is easy to realize, efficient and practical.
In sum, the present invention effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as have in art usually know the knowledgeable do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.
Claims (13)
1. a micropore metal interstitital texture, is characterized in that, described micropore metal interstitital texture comprises:
Annular seal space, comprises air inlet/outlet; Described annular seal space is surrounded by the space holding liquid metal groove;
Sandwich structure, comprises and superposes barrier sheet, filling substrate and nozzle piece from top to bottom successively; Described filling substrate is clipped between described barrier sheet and nozzle piece; Described filling substrate is provided with filling micropore; Described nozzle piece is provided with corresponding nozzle bore vertical with described filling micropore; The first gap is provided with between described barrier sheet and filling substrate; The second gap is provided with between described filling substrate and nozzle piece; The radius at the described narrow place of nozzle Kongzui is less than more than 1/2 of the radius of described filling micropore;
Described sandwich structure is horizontally set in described space, and the sidewall of sandwich structure is all embedded in described annular seal space; The lower surface of described nozzle piece in order to be close to the upper surface of a liquid metal groove when metal filled; Air pressure in described annular seal space and described first gap, fill micropore, the second gap and nozzle bore air pressure all identical.
2. micropore metal interstitital texture according to claim 1, is characterized in that: vertical at least one nozzle bore corresponding of each described filling micropore.
3. micropore metal interstitital texture according to claim 1, is characterized in that: described annular seal space comprises at the bottom of exterior seal ring, inner seal ring, seal cover, sealing; The height of described exterior seal ring is greater than the height of described inner seal ring; The bottom of described exterior seal ring is connected with the outward flange at the bottom of described sealing, and the bottom of described inner seal ring is connected with the inward flange at the bottom of described sealing; The outward flange of described seal cover is connected with the top of described exterior seal ring, and the inward flange of seal cover is fixedly connected with the top of described sandwich structure; The top of described inner seal ring is fixedly connected with the bottom of described sandwich structure; Confined space is formed at the bottom of described exterior seal ring, seal cover, sandwich structure, liquid metal groove, inner seal ring and sealing.
4. micropore metal interstitital texture according to claim 1, is characterized in that: described annular seal space comprises at the bottom of exterior seal ring, inner seal ring, sealing frame, sealing, gland; The height of described exterior seal ring is greater than the height of described inner seal ring; The bottom of described exterior seal ring is connected with the outward flange at the bottom of described sealing, and the bottom of described inner seal ring is connected with the inward flange at the bottom of described sealing; The bottom margin of described sealing frame is connected with the top of described exterior seal ring, and the top of sealing frame is connected with the edges close of described gland by butterfly bellows; Described gland presses the upper surface at described sandwich structure; The top of described inner seal ring is fixedly connected with the bottom of described sandwich structure; Confined space is formed at the bottom of described exterior seal ring, sealing frame, butterfly bellows, gland, sandwich structure, liquid metal groove, inner seal ring and sealing.
5. micropore metal interstitital texture according to claim 1, is characterized in that: described annular seal space comprises at the bottom of exterior seal ring, sealing frame, sealing, gland, the first butterfly bellows, the second butterfly bellows; The bottom of described exterior seal ring is connected with the outward flange at the bottom of described sealing; The bottom margin of described sealing frame is connected with the top of described exterior seal ring, and the top of sealing frame is connected with the edges close of described gland by described first butterfly bellows; Described gland presses the upper surface at described sandwich structure; Described sandwich structure presses the upper surface in described liquid metal groove; The side of described liquid metal groove is connected with the inward flange at the bottom of described sealing by described second butterfly bellows; Described exterior seal ring, sealing frame, the first butterfly bellows, gland, sandwich structure, liquid metal groove, the second butterfly bellows and the sealing end, form confined space.
6. micropore metal interstitital texture according to claim 1, is characterized in that: the lower surface of described barrier sheet is provided with the first bulge-structure, and described first bulge-structure makes to form described first gap between described barrier sheet and described filling substrate; The upper surface of described nozzle piece is provided with the second bulge-structure, and described second bulge-structure makes to form described second gap between described nozzle piece and described filling substrate.
7. micropore metal interstitital texture according to claim 1, is characterized in that: the lower surface of described barrier sheet is provided with the first packing ring, and described first packing ring makes to form described first gap between described barrier sheet and described filling substrate; The upper surface of described nozzle piece is provided with the second packing ring, and described second packing ring makes to form described second gap between described nozzle piece and described filling substrate.
8. the micropore metal interstitital texture according to claim 6 or 7, is characterized in that: the vertical height in described first gap and the second gap is 1 ~ 20 micron.
9. micropore metal interstitital texture according to claim 1, is characterized in that: the section shape of described nozzle bore is that trapezoidal, arch is or/and hyperbola; When the degree of depth of described nozzle bore does not reach the thickness of described nozzle piece, described nozzle bore is communicated with a through hole and penetrates described nozzle piece.
10. a micropore metal fill method, it is characterized in that, described micropore metal fill method comprises: utilize draught head to be undertaken in the micropore of filling by the liquid metal inspiration needs in liquid metal groove, and the liquid metal in the liquid metal in the described micropore of ining succession and described liquid metal groove cuts off by the surface tension of recycling liquid metal;
Liquid metal inspiration in liquid metal groove needs the specific implementation process of carrying out in the micropore of filling to comprise by the described draught head that utilizes: superpose barrier sheet from top to bottom successively, fill substrate and nozzle piece formation sandwich structure; Described filling substrate is clipped between described barrier sheet and nozzle piece; Described filling substrate is provided with filling micropore; Described nozzle piece is provided with corresponding nozzle bore vertical with described filling micropore; The first gap is provided with between described barrier sheet and filling substrate; The second gap is provided with between described filling substrate and nozzle piece; The radius at the described narrow place of nozzle Kongzui is less than more than 1/2 of the radius of described filling micropore; The upper surface of described liquid metal groove is close to the lower surface of described nozzle piece; Reduce the air pressure inside of described sandwich structure to the first atmospheric pressure value being less than external atmosphere pressure, form tension force upwards, the liquid metal now in described liquid metal groove is filled in described micropore through described nozzle bore under the effect of tension force upwards;
The specific implementation process that liquid metal in liquid metal in the described micropore of ining succession and described liquid metal groove cuts off comprises by the described surface tension of liquid metal that utilizes: the air pressure inside raising described sandwich structure is to being less than external atmosphere pressure and being greater than the second atmospheric pressure value of described first atmospheric pressure value, draught head between described external atmosphere pressure and the second atmospheric pressure value cannot maintain the continuity of liquid metal in described nozzle bore and described liquid metal is broken at described nozzle bore, and is back in described liquid metal groove.
11. micropore metal fill methods according to claim 10, is characterized in that: the section shape of described nozzle bore is that trapezoidal, arch is or/and hyperbola.
12. micropore metal fill methods according to claim 10, is characterized in that: not being inhaled into described first gap and the second gap when the vertical height in described first gap and the second gap is all inhaled into micropore with liquid metal for principle is arranged; Described first gap is identical with the vertical height in the second gap, and is 1 ~ 20 micron.
13. micropore metal fill method according to claim 10, is characterized in that: vertical at least one nozzle bore corresponding of each described filling micropore.
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| CN106298639B (en) * | 2015-06-12 | 2019-04-30 | 中国科学院上海微系统与信息技术研究所 | A kind of micropore metal interstitital texture and fill method |
| CN106882763B (en) * | 2015-12-16 | 2018-11-16 | 上海迈铸半导体科技有限公司 | A kind of micropore filling equipment |
| CN107527861A (en) * | 2016-06-21 | 2017-12-29 | 中国科学院上海微系统与信息技术研究所 | A kind of nozzle chip architecture, equipment and the fill method metal filled for microcavity |
| CN115377021A (en) * | 2022-08-29 | 2022-11-22 | 北京超材信息科技有限公司 | Electronic device module packaging structure and manufacturing method |
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| KR101021222B1 (en) * | 2010-01-28 | 2011-03-11 | 한국생산기술연구원 | Wafer through via hole filling apparatus and filling method using the same |
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