CN106298639A - A kind of micropore metal interstitital texture and fill method - Google Patents
A kind of micropore metal interstitital texture and fill method Download PDFInfo
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- CN106298639A CN106298639A CN201510323889.1A CN201510323889A CN106298639A CN 106298639 A CN106298639 A CN 106298639A CN 201510323889 A CN201510323889 A CN 201510323889A CN 106298639 A CN106298639 A CN 106298639A
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- micropore
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76882—Reflowing or applying of pressure to better fill the contact hole
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Abstract
The present invention provides a kind of micropore metal interstitital texture and fill method, and described method includes: provide a liquid metal groove horizontal positioned is formed by stacking thereon sandwich structure by nozzle piece, filler piece and cover plate；Wherein, nozzle piece lower surface is close to the upper surface of liquid metal, is provided with the first gap between nozzle piece and filler piece, is provided with the second gap between filler piece and cover plate；Described filler piece has filling micropore, described nozzle piece is provided with corresponding nozzle bore structure vertical with described filling micropore；By adjusting air pressure inside P of described sandwich structure1And the surface pressure P of described liquid metal2, it is achieved the metal filled and cutting of described filling micropore.Filling speed of the present invention is exceedingly fast, and accuracy is high, good cutting effect, and can realize the filling of different pore size micropore simultaneously.The present invention is possible not only to realize the filling of through hole, it is also possible to realize the filling of blind hole；Meanwhile, fill micropore can infiltrate with liquid metal to be filled, it is also possible to do not infiltrate.
Description
Technical field
The invention belongs to micro-manufacture processing technique field, relate to a kind of micropore metal filling technique, particularly relate to a kind of micropore gold
Belong to interstitital texture and fill method.
Background technology
Electricity mutual connection is used to realize the mode of the transmission of the signal of telecommunication between chip chamber and chip and substrate, is the core of encapsulation
Ingredient.In existing encapsulation technology, electrical connection is main is bonded (wire-bonding) and flip chip bonding (flip-chip) by gold thread.
Wire-bonding is by being bonded on the electrode needing to carry out being electrically interconnected real respectively by tiny gold thread (about 25 microns thick) two ends
Existing.Flip-chip is otherwise known as controlled collapse chip connection (C4), and the method is by directly making on electrode
Salient point, it is common that stannum ball, then realizes and the connection of counter electrode on substrate by the way of stannum ball refluxes.Along with electronic device
Development, above two electrical connection form particularly Wire-bonding the most gradually can not meet higher system in package (SiP)
Integrated level and the requirement of less encapsulation volume.
The novel electric connection technology having significant impact to Advanced Packaging risen therewith is TSV (Through-silicon via)
Silicon through hole technology, it is the vertical electric connection technology penetrating substrate (particularly silicon chip).TSV almost can substitute for all envelopes
The place of the Wire-Bonding in dress, improves the electric property of all kinds chip package, including being greatly improved integrated level, and contracting
Little chip size, particularly encapsulates (System-in-Packaging, SiP) at system collection, wafer level packaging (Wafer-Level
Packaging WLP) and three-dimensional perpendicular stacked package (3D Packaging) these Advanced Packagings among.
The application of through hole interconnection is quite varied, covers from ASIC, Memory, IC to various kinds of sensors part such as MEMS
With optical sensor etc..In addition as silicon keyset, ceramic three-dimensional stacked module is required for being applied to through hole interconnection technique.
The manufacture of TSV includes the manufacture of through hole, the deposition of insulating barrier, the filling of through hole and follow-up CMP
(CMP) techniques such as (RDL) and is again connected up.In these techniques, the filling of through hole is that technical difficulty is maximum, and cost is the highest
One.According to actual application, the aperture of through hole is from tens microns to hundreds of micron, for the metal of such bulk
Filling, existing major technique is based on copper electroplating principle, by first carrying out the attachment of Seed Layer on through-hole wall, the most again
The mode of electro-coppering realizes on the seed layer.In addition, other TSV technology is also in constantly research.As based on low-resistance rate
The Silex Via of silicon is then to go out columnar silicon body as transmitting medium by the silicon chip silicon deep etching in low-resistance rate.It is additionally based on
The TSV technology of Wire-bonding and magnetic package technique is the most under study for action.Both technology are respectively by placing gold in through-holes
Belong to lead-in wire or nickel pin is used as conducting medium.The most conventional filling mode is realized by plating, particularly copper plating,
If for size several microns can also be realized by CVD.But either plating or CVD, because speed
Slowly, want to realize size the most relatively difficult through hole filling or the blind hole filling of tens to hundreds of micron.
Summary of the invention
The shortcoming of prior art in view of the above, it is an object of the invention to provide a kind of micropore metal interstitital texture and filling side
Method, for solving in prior art, in the micro through hole of tens to hundreds of micron or blind hole, filler metal speed is slow and fills yield rate
Low problem.
For achieving the above object and other relevant purposes, the present invention provides a kind of micropore metal fill method, comprises the steps:
Thering is provided a liquid metal groove, on described liquid metal groove, horizontal positioned is the most successively by nozzle piece, filler piece and lid
The sandwich structure that sheet is formed by stacking；Wherein, described nozzle piece lower surface is close to the upper surface of liquid metal, described nozzle in groove
It is provided with the first gap between sheet and described filler piece, between described filler piece and described cover plate, is provided with the second gap；Described filler piece
In there is filling micropore, described nozzle piece is provided with corresponding nozzle bore structure vertical with described filling micropore；
Adjust air pressure inside P of described sandwich structure1And the surface pressure P of described liquid metal2, make the draught head of the two reach
First preset value, so that the liquid metal in described liquid metal groove is sucked described filling micropore by described nozzle bore structure, complete
Become the metal filled of described filling micropore；
Adjust air pressure inside P of described sandwich structure further1And the surface pressure P of described liquid metal2, make the air pressure of the two
Difference reaches the second preset value, to be disconnected at described nozzle bore structure by liquid metal.
Alternatively, after liquid metal disconnects at described nozzle bore structure, adjust the air pressure inside of described sandwich structure further
P1And the surface pressure P of described liquid metal2, the draught head making the two is 0, and makes the two rise to atmospheric value, then takes
Go out described filler piece.
Alternatively, the surface pressure P of described liquid metal is adjusted by changing the air pressure in the second annular seal space2；Described second close
Described liquid metal groove sidewall or bottom are run through in envelope chamber, and stretch in described liquid metal, by the air pressure in described second annular seal space
It is transferred to described liquid metal surface；Described second annular seal space does not connects with described first gap, the second gap.
Alternatively, the part that described second annular seal space stretches into described liquid metal includes corrugated tube.
Alternatively, described is changed by the pipeline being located in described second annular seal space cavity wall and the valve of being located on described pipeline
Air pressure in two annular seal spaces.
Alternatively, air pressure inside P of described sandwich structure is adjusted by changing the air pressure in the first annular seal space1；Described first
Annular seal space connects with at least one in described first gap and the second gap.
Alternatively, described is changed by the pipeline being located in described first annular seal space cavity wall and the valve of being located on described pipeline
Air pressure in one annular seal space.
Alternatively, described filling micropore is through hole or blind hole.
Alternatively, the height in described second gap is 0.
Alternatively, form described first gap by being located at the first bulge-structure of described nozzle piece upper surface, or by institute
State and place the first packing ring between nozzle piece and described filler piece and form described first gap；By being located at the of described cover plate lower surface
Two bulge-structures form described second gap, or form institute by placing the second packing ring between described nozzle piece and described cover plate
State the second gap.
Alternatively, described first gap vertical height less than 8 microns, the vertical height in described second gap is less than 8 microns.
Alternatively, described nozzle bore structure includes being divided into upper and lower two parts, and wherein, top is divided into and penetrates described nozzle piece upper surface
Nozzle bore, bottom is divided into the through hole penetrating described nozzle piece lower surface, and described nozzle bore lower end is with described through hole upper end even
Logical.
Alternatively, when described nozzle bore and described filling micropore are cylindrical hole, meet the radius of described nozzle bore less than described
Filling the diameter of micropore, the depth-width ratio of described nozzle bore is more than π.
Alternatively, the upper dimension of described through hole is consistent with lower dimension；Or the size of described through hole the most gradually increases
Greatly.
Alternatively, a corresponding nozzle bore of through hole；Or a corresponding nozzle bore array of through hole, described nozzle bore
Array is made up of the nozzle bore that at least two is discrete.
Alternatively, the sidewall of described nozzle bore structure and the sidewall of described filling micropore all do not infiltrate with liquid metal to be filled；
Or the sidewall of described nozzle bore structure does not infiltrates with liquid metal to be filled, the sidewall of described filling micropore and liquid to be filled
Metal infiltrates.
Alternatively, if having dry-packing micropore in described filler piece, and at least two sizes filling micropore are different.
Alternatively, the pore diameter range of described filling micropore is 1～1000 micron.
Alternatively, described liquid metal is elemental metals or alloy.
The present invention also provides for another kind of micropore metal fill method, comprises the steps:
There is provided a liquid metal groove, horizontal positioned nozzle piece and filler piece successively on described liquid metal groove；Wherein, described spray
Mouth sheet lower surface is close to the upper surface of liquid metal in groove, is provided with the first gap between described nozzle piece and described filler piece；Described
Having filling micropore in filler piece, described filling micropore is blind hole；Described nozzle piece is provided with vertical corresponding with described filling micropore
Nozzle bore structure；
Adjust the air pressure in described first gap and the surface pressure of described liquid metal, make the draught head of the two reach first and preset
Value, with by the liquid metal in described liquid metal groove by described nozzle bore structure suction described filling micropore, complete described in fill out
Fill the metal filled of micropore；
Adjust further the air pressure in described first gap and the surface pressure of described liquid metal, make the draught head of the two reach the
Two preset values, to disconnect liquid metal at described nozzle bore structure.
The present invention also provides for a kind of micropore metal interstitital texture, and described micropore metal interstitital texture includes:
Cover plate and nozzle piece, for being clipped in the middle by filler piece, formed and be followed successively by nozzle piece, filler piece and cover plate from bottom to top
Sandwich structure；When carrying out metal filled, described sandwich structure is placed horizontally on liquid metal groove, and described nozzle piece
Lower surface is close to the upper surface of liquid metal in groove, has the first gap, described filling between described nozzle piece and described filler piece
There is between sheet and described cover plate the second gap；
Nozzle bore structure, is located in described nozzle piece and runs through described nozzle piece；Described nozzle bore structure be located at described filler piece
In filling micropore the most corresponding；
First annular seal space, connects with at least one in described first gap and the second gap, is used for adjusting described sandwich structure
Air pressure inside P1；
Second annular seal space, runs through described liquid metal groove sidewall or bottom, and stretches in described liquid metal, for by described the
Air pressure transmission in two annular seal spaces is handed to described liquid metal surface；Described second annular seal space not with described first gap, the second gap
Connection.
Alternatively, the part that described second annular seal space stretches into described liquid metal includes corrugated tube.
Alternatively, the cavity wall of described first annular seal space and the second annular seal space is equipped with pipeline, and described pipeline is provided with valve.
Alternatively, described filling micropore is through hole or blind hole.
Alternatively, when described filling micropore is blind hole, the height in described second gap is 0.
Alternatively, described nozzle piece upper surface is provided with the first bulge-structure for forming described first gap, or described nozzle
Sheet upper surface is provided with the first packing ring for forming described first gap；Described cover plate lower surface is provided with for being formed between described second
Second bulge-structure of gap, or described cover plate lower surface is provided with the second packing ring for forming described second gap.
Alternatively, described nozzle bore structure includes being divided into upper and lower two parts, and wherein, top is divided into and penetrates described nozzle piece upper surface
Nozzle bore, bottom is divided into the through hole penetrating described nozzle piece lower surface, and described nozzle bore lower end is with described through hole upper end even
Logical.
Alternatively, the sidewall of described nozzle bore structure and the sidewall of described filling micropore all do not infiltrate with liquid metal to be filled；
Or the sidewall of described nozzle bore structure does not infiltrates with liquid metal to be filled, the sidewall of described filling micropore and liquid to be filled
Metal infiltrates.
The present invention also provides for another kind of micropore metal interstitital texture, and described micropore metal interstitital texture includes:
Nozzle piece, is used for carrying filler piece；When carrying out metal filled, described nozzle piece is placed horizontally on liquid metal groove,
Described nozzle piece lower surface is close to the upper surface of liquid metal in groove, has first between described nozzle piece and described filler piece
Gap；
Nozzle bore structure, is located in described nozzle piece and runs through described nozzle piece；Described nozzle bore structure be located at described filler piece
In filling micropore the most corresponding；Described filling micropore is blind hole；
First annular seal space, connects with described first gap, for adjusting the air pressure inside in described first gap；
Second annular seal space, runs through described liquid metal groove sidewall or bottom, and stretches in described liquid metal, for by described the
Air pressure transmission in two annular seal spaces is handed to described liquid metal surface；Described second annular seal space does not connects with described first gap.
As it has been described above, the micropore metal interstitital texture of the present invention and fill method, have the advantages that the micropore of the present invention
Metal fill structures and fill method are by adjusting air pressure inside P of described sandwich structure1And the surface pressure of described liquid metal
P2, make the draught head of the two reach the first preset value, thus by the liquid metal in described liquid metal groove by described nozzle bore
Structure sucks described filling micropore, completes the metal filled of described filling micropore；Adjust described sandwich structure subsequently further
Air pressure inside P1And the surface pressure P of described liquid metal2, make the draught head of the two reach the second preset value, utilize the folder of liquid bridge
Disconnected effect realizes the controlled micro-cutting of liquid metal and the liquid metal groove being filled in micropore and cuts, thus suction cut with micro-cutting together with complete
Become whole filling process.Filling speed of the present invention is exceedingly fast, and accuracy height, good cutting effect, process are simple and pollution-free, and
The filling of different pore size micropore can be realized simultaneously.Owing to micropore metal interstitital texture and the fill method of the present invention can adjust institute simultaneously
State air pressure inside P of sandwich structure1And the surface pressure P of described liquid metal2, bigger pressure reduction can be realized, be possible not only to reality
The filling of existing through hole, it is also possible to realize the filling of blind hole；Meanwhile, fill micropore can infiltrate with liquid metal to be filled, also
Can not infiltrate.Micropore metal interstitital texture of the present invention and fill method are applicable not only to the filling of micropore in through-hole interconnection, simultaneously
It is applicable to any technical field needing to carry out micropore filling.
Accompanying drawing explanation
Fig. 1 is shown as in the micropore metal fill method of the present invention being placed horizontally at sandwich structure the signal on liquid metal groove
Figure.
Fig. 2 is shown as in the micropore metal fill method of the present invention air pressure inside P by the first annular seal space sandwich structure1, logical
Cross the surface pressure P of the second annular seal space regulation liquid metal2Schematic diagram.
Fig. 3 is shown as the micropore metal fill method of the present invention in another embodiment through in the first annular seal space sandwich structure
Portion air pressure P1, by the surface pressure P of the second annular seal space regulation liquid metal2Schematic diagram.
Fig. 4 is shown as in the micropore metal fill method of the present invention being formed between first, second by first, second bulge-structure
The schematic diagram of gap.
Fig. 5 is shown as in the micropore metal fill method of the present invention forming first, second gap by first, second packing ring
Schematic diagram.
Fig. 6 is shown as the schematic diagram of nozzle bore structure in the micropore metal fill method of the present invention.
Fig. 7 is shown as the schematic diagram of the micropore metal fill method nozzle bore structure in another embodiment of the present invention.
Fig. 8～Fig. 9 is shown as the corresponding nozzle bore of a through hole of nozzle bore structure in the micropore metal fill method of the present invention
The schematic diagram of array.
Figure 10 a is shown as the schematic diagram before filling process starts in the micropore metal fill method of the present invention.
Figure 10 b is shown as the schematic diagram of filling process in the micropore metal fill method of the present invention.
Figure 10 c is shown as the schematic diagram of cutting process in the micropore metal fill method of the present invention.
Figure 10 d is shown as the schematic diagram in the micropore metal fill method of the present invention after cutting process.
Figure 11 is shown as dimensionless fracture pressure value σ and the nozzle of liquid bridge in nozzle bore in the micropore metal fill method of the present invention
The relation of the depth-width ratio (highly h and the ratio of radius r) in hole.
Figure 12 be shown as the micropore metal fill method of the present invention whole during P2、P1Variation relation with Δ P.
Figure 13 is shown as in the micropore metal fill method of the present invention realizing the schematic diagram that silicon through hole is filled.
Figure 14 a～14b is shown as the upper surface SEM figure of metal column after silicon through hole is filled.
Figure 14 c～14d is shown as the lower surface SEM figure of metal column after silicon through hole is filled.
Figure 14 e～14g is shown as the cross section SEM figure of metal column after silicon through hole is filled.
Figure 15 is shown as in the micropore metal fill method of the present invention realizing the schematic diagram that silicon blind hole is filled.
Figure 16 a is shown as the schematic diagram after silicon blind hole is filled.
Figure 16 b is shown as the cross section SEM figure after silicon blind hole is filled.
Figure 17 is shown as in the micropore metal fill method of the present invention realizing the schematic diagram that the through hole of ceramic substrate band metal level is filled.
Figure 18 is shown as the schematic diagram after the through hole filling of ceramic substrate band metal level.
Element numbers explanation
P1The air pressure inside of sandwich structure
P2The surface pressure of liquid metal
V1, V2 valve
1 liquid metal groove
2 liquid metals
3 nozzle pieces
4 filler pieces
5 cover plates
6 first gaps
7 second gaps
8 fill micropore
9 nozzle bore structures
10 first annular seal spaces
11 second annular seal spaces
12,13 pipelines
14 sandwich structures
At the bottom of 15 chambeies
16 side walls
17 chamber lids
18 glands
19 sealing rings
20,22 corrugated tubes
21 heat insulation loop assemblies
23 first bulge-structures
24 second bulge-structures
25 first packing rings
26 second packing rings
27 nozzle bores
28 through holes
29 silicon dioxide insulating layers
30 silicon nitride dielectric layers
31 metal levels
Detailed description of the invention
Below by way of specific instantiation, embodiments of the present invention being described, those skilled in the art can be by disclosed by this specification
Content understand other advantages and effect of the present invention easily.The present invention can also be added by the most different detailed description of the invention
To implement or application, the every details in this specification can also be based on different viewpoints and application, in the essence without departing from the present invention
Various modification or change is carried out under god.
Refer to Fig. 1 to Figure 18.It should be noted that the diagram provided in the present embodiment illustrates the present invention the most in a schematic way
Basic conception, the most graphic in component count time only display with relevant assembly in the present invention rather than is implemented according to reality, shape
And size drafting, during its actual enforcement, the kenel of each assembly, quantity and ratio can be a kind of random change, and its assembly layout
Kenel is likely to increasingly complex.
The present invention provides a kind of micropore metal fill method, comprises the steps:
As it is shown in figure 1, first provide a liquid metal groove 1, on described liquid metal groove 1, horizontal positioned is the most successively
The sandwich structure being formed by stacking by nozzle piece 3, filler piece 4 and cover plate 5；Wherein, described nozzle piece 3 lower surface is close to groove
The upper surface of interior liquid metal 2, is provided with the first gap 6, described filler piece 4 between described nozzle piece 3 and described filler piece 4
And it is provided with the second gap 7 between described cover plate 5；Described filler piece 4 has filling micropore 8, described nozzle piece 3 is provided with
The described vertical corresponding nozzle bore structure 9 of filling micropore 8；
Then air pressure inside P of described sandwich structure is adjusted1And the surface pressure P of described liquid metal2, make the draught head of the two
Reach the first preset value, with by the liquid metal 2 in described liquid metal groove 1 by described nozzle bore structure 9 suck described in fill out
Fill micropore 8, complete the metal filled of described filling micropore 8.
Further adjust air pressure inside P of described sandwich structure1And the surface pressure P of described liquid metal 22, make the two
Draught head reaches the second preset value, to be disconnected at described nozzle bore structure 9 by liquid metal 2.
Concrete, the surface pressure P of described liquid metal 2 is adjusted by changing the air pressure in the second annular seal space2；Described second
Annular seal space runs through described liquid metal groove 1 sidewall or bottom, and stretches in described liquid metal 2, by described second annular seal space
Air pressure transmission be handed to described liquid metal surface；Described second annular seal space does not connects with the 6, second gap 7, described first gap.
As example, as in figure 2 it is shown, described second annular seal space 11 runs through bottom described liquid metal groove 1, and stretch into described liquid
In state metal 2.
Particularly, the part that described second annular seal space 11 stretches into described liquid metal 2 includes corrugated tube 22.Corrugated tube refers to use
The tubular elastomeric sensing element that collapsible wrinkle sheet connects into along folding retractable direction.Corrugated tube is widely used in instrument and meter,
It is mainly used for the measuring cell as pressure measuring instruments, converts pressure into displacement or power.Corrugated tube tube wall is relatively thin, sensitive
Spending higher, measurement scope is that tens of handkerchief is to tens of MPas.Its opening is fixed, and sealed end is in free state, and utilizes auxiliary
The helical spring helped or reed increase elasticity.Extend along tube length direction under the effect of internal pressure during work, make movable end
Produce the displacement becoming certain relation with pressure.
Concrete, by the pipeline 13 being located in described second annular seal space 11 cavity wall and be located at the valve V2 on described pipeline 13
Change the air pressure P in described second annular seal space 112(being also the air pressure inside of sandwich structure) simultaneously.
Same, air pressure inside P of described sandwich structure can be adjusted by changing the air pressure in the first annular seal space1；Described
One annular seal space connects with at least one in described first gap and the second gap.
As example, as in figure 2 it is shown, described first annular seal space 10 includes 15, side wall 16, chamber lid 17 and gland 18 at the bottom of chamber,
Described chamber lid 17 is provided with sealing ring 19 with the junction of chamber sidewall, and described gland 18 is by corrugated tube 20 with described chamber lid 17 even
Connect, and described gland 18 presses in the upper surface of described sandwich structure 14.At the bottom of described chamber, 15 are provided with a heat insulation loop assembly
21, described liquid metal groove 1 is positioned on described heat insulation loop assembly 21.At the bottom of described chamber 15, side wall 16, chamber lid 17, ripple
Pipe 20, gland 18, sandwich structure 14, liquid metal groove 1 sidewall and described heat insulation loop assembly 21 surround described first and seal
Chamber 10, bottom described corrugated tube 20, liquid metal groove 1, at the bottom of heat insulation loop assembly 21 and described chamber, 15 surround described second and seal
Chamber 11, described first annular seal space 10 does not connects mutually with described second annular seal space 11.Described heat insulation loop assembly 21 can include adding
Hot portion, is used for heating described liquid metal groove 1, and in making groove, metal is in a liquid state.
Concrete, can be by the pipeline 12 being located in described first annular seal space 10 cavity wall and be located at the valve on described pipeline 12
V1 changes the air pressure P in described first annular seal space 101(being also the surface pressure of liquid metal) simultaneously.
Certainly, in other embodiments, described first annular seal space and described second annular seal space can also be other form, if full
Air pressure in described first annular seal space of foot keeps consistent with the air pressure in described sandwich structure, can seal by changing described first
The air pressure of intracavity adjusts the air pressure in described sandwich structure, and the air pressure in described second annular seal space can be transferred to liquid metal table
Face, can adjust the air pressure of liquid metal surface by changing the air pressure in described second annular seal space, and described first annular seal space with
Second annular seal space does not connects, and should too not limit the scope of the invention.As it is shown on figure 3, it is close to be shown as first
Envelope chamber the 10, second annular seal space 11 is structural representation during another kind of form.Under this situation, described first annular seal space 10 only encloses
Living the top of liquid metal groove 1, therefore, in another embodiment, described corrugated tube 22 can also be from described liquid metal groove 1
Sidewall stretches in described liquid metal 2 (being unillustrated).
Owing to, in the present invention, air pressure inside P of sandwich structure can be adjusted simultaneously1And the surface pressure P of liquid metal2, can reach
Bigger draught head, therefore, the present invention is applicable not only to the filling of through hole, is also applied for the filling of blind hole.Further, when described
When filling micropore 8 is blind hole, it is also possible to need not described cover plate 5 (because blind hole top is to close) itself.
Concrete, as shown in Figure 4, described first can be formed by being located at the first bulge-structure 23 of described nozzle piece 3 upper surface
Gap 6, forms described second gap 7 by being located at the second bulge-structure 24 of described cover plate 5 lower surface.
As it is shown in figure 5, in another embodiment, it is possible to by placing first between described nozzle piece 3 and described filler piece 4
Packing ring 25 forms described first gap 6；Formed by placing the second packing ring 26 between described nozzle piece 4 and described cover plate 5
Described second gap 7.
The vertical height in the 6, second gap 7, described first gap needs sufficiently large to ensure that gas inside passes through, the most again
Sufficiently small to prevent liquid metal to be inhaled in gap.Preferably, described first gap vertical height less than 8 microns, institute
State the vertical height in the second gap less than 8 microns.
Concrete, as shown in Figure 6, described nozzle bore structure 9 includes being divided into upper and lower two parts, and wherein, top is divided into and penetrates institute
Stating the nozzle bore 27 of nozzle piece upper surface, bottom is divided into the through hole 28 penetrating described nozzle piece lower surface, described nozzle bore 27
Lower end connects with described through hole 28 upper end.
Particularly, when described nozzle bore 27 and described filling micropore 8 are cylindrical hole, described nozzle bore 27 is preferably met
Aperture (radius r) less than the half (r < R/2) in aperture (radius R) of described filling micropore 8, described nozzle bore 27
Depth-width ratio is more than π.Certainly, in other embodiments, described nozzle bore can also be other shapes, such as square hole, hyperbolic string holes
Deng, its dimensional requirement should too can not limit the scope of the invention according to Theoretical Calculation optimization.
The effect of described through hole 28 is can be made significantly thicker to meet nozzle piece 3, and the size of described through hole 28 is more than institute
State nozzle bore 27, to accommodate more liquid metal 2.In the present embodiment, the size of described through hole 28 the most gradually increases
Greatly, as shown in Figure 6, the longitudinal section of described through hole 28 is trapezoidal.As it is shown in fig. 7, in another embodiment, described in run through
The upper part size in hole 28 can also be consistent with lower dimension.
It addition, in the present embodiment, a corresponding nozzle bore 27 of through hole 28.As can be seen from figures 8 and 9, real at another
Execute in example, through hole 28 can also a corresponding nozzle bore array, described nozzle bore array is by the discrete nozzle of at least two
Hole 27 forms.
Concrete, the sidewall of described nozzle bore structure 9 and the sidewall of described filling micropore 8 can all with liquid metal to be filled not
Infiltration；Or, the sidewall of described nozzle bore structure 9 does not infiltrates with liquid metal to be filled, the sidewall of described filling micropore 8
With liquid metal infiltration to be filled.
The micropore metal interstitital texture of the present invention and fill method are applicable to the filling micropore that pore diameter range is at 1～1000 micron, for
The filling micropore of 50～200 micron pore size, the micropore metal interstitital texture of the present invention and the advantage of fill method are particularly evident.
The theoretical foundation of the present invention is as follows: set air pressure in sandwich structure as P1, the surface pressure of liquid metal is P2.Due to
The size in nozzle bore, filling hole and gap all only has micron level, and gravity is permissible to the effect of the liquid metal of micron-scale
Ignore.Simultaneously as the size of liquid metal groove is relatively big, the pressure of liquid metal internal can also be ignored.Metal
The pressure acting on each surface that shape in nozzle bore, filling hole and gap is subject to by it is determined.
Before filling process starts, P1=P2, Δ P=P2-P1=0.Metal bath surface is level, as shown in Figure 10 a.
Filling process: first pass through reduction P1Mode increase Δ P.Assume that nozzle bore and filling micropore are cylindrical hole, when
During Δ P ＞ 2 γ/r, liquid metal will suck in the micropore of press-in filling in other words by nozzle bore structure, as shown in fig. lob.
Wherein r is the radius of nozzle bore, and γ is the surface tension of liquid metal.If at P1In the case of being evacuated, Δ P
Also it is less than 2 γ/r, then can be by increasing P2Mode continue to increase Δ P, to reach to suck liquid alloy to fill hole
Condition.
Cutting process: after liquid metal sucks/be pressed into filling micropore by nozzle arrangements, insert the liquid metal filled in micropore
Pass through what nozzle arrangements was also connected to liquid metal groove.If filling micropore is nonwettable with liquid metal, then need dimension
Holding liquid metal pressure in filling hole is 2 γ/R, and wherein R is the radius filling micropore.Meanwhile, liquid metal exists
Forming constant pressure liquid bridge in nozzle, the pressure maintaining this liquid bridge is σ γ/r, wherein σ=PFracture/ (γ/r), for nondimensional fracture pressure
Power.The relation of the depth-width ratio (highly h and the ratio of radius r) of σ and nozzle bore is as shown in figure 11.Then pass through reduction P2Side
Low delta p drops in formula.If 2 γ/R ＞ σ γ/r, then along with the reduction of Δ P, the liquid metal filled in micropore can be opened by surface
Power retracts liquid metal groove.But in turn, if σ is γ/r ＞ 2 γ/R, then constant pressure liquid bridge can rupture in nozzle, meanwhile,
The liquid metal filled in micropore will not be pulled, thus the liquid metal realizing filling in micropore is cut with the controlled of liquid metal groove
Cut, as shown in Figure 10 c and 10d.
The fracture in nozzle bore of the liquid bridge cannot be observed from the external world, therefore P2Dropped to vacuum, with P always1Unanimously, thus Δ P
Also zero is reduced to.Last P2And P1The most slowly go back up to atmospheric pressure.Figure 12 give whole during P2、P1Change with Δ P
Relation.
The fracture in each nozzle of the constant pressure liquid bridge is completely self-contained, will not interact.Therefore, different hole can be filled simultaneously
The filling micropore in footpath, if having dry-packing micropore in the most described filler piece, and at least two sizes filling micropore are different.
Fill and in cutting-off process, P2、P1Value calculate determine with the parameter filling micropore of minimum-value aperture.In the present invention, fill
Liquid metal can be elemental metals, it is also possible to for alloy.
Sandwich structure because being made up of cover plate, filler piece and nozzle piece can ensure that upper and lower surface holds in whole filling process
The pressure being subject to is the same, because of without producing the problem crushed by slice, thin piece caused because of pressure differential.This also can protect simultaneously
Demonstrate,prove this technology and can extend to the substrate of arbitrary dimension.
By filler piece before sandwich sheet takes out, need first to allow the liquid alloy cooling and solidifying filled in hole.
In another embodiment, if filling micropore deposited on sidewalls has can infiltrate with liquid metal (either reacts infiltration still
Do not react infiltration) material, said process still sets up, and filling in the case of micropore can infiltrate with liquid metal, spray
The requirement of nozzle aperture can be relaxed, i.e. the radius r of nozzle bore might not meet the condition less than the half filling pore radius R,
Meanwhile, the depth-width ratio of nozzle bore can also be relaxed, perhaps can be less than π times.
In another embodiment, if fill is the nonwettable blind hole of sidewall, whole process ibid, simply works as P1Vacuum pumping
Time, alloy can't be inhaled in blind hole, only by P2The mode of pressurization could produce enough pressure differentials by liquid metal
In press-in blind hole.Remaining step is constant.Further, when described filling micropore is blind hole, the vertical height in described second gap can
Thinking 0, described filler piece upper surface is close to by the most described cover plate.Certainly, due to described blind hole upper end closed, it is also possible to need not
Described cover plate, in this case, can be complete by adjusting the surface pressure of the air pressure in described first gap and described liquid metal
Become the metal filled of blind hole and cutting.
The present invention also provides for a kind of micropore metal interstitital texture, and as shown in Figures 1 and 2, described micropore metal interstitital texture includes:
Cover plate 5 and nozzle piece 3, for being clipped in the middle by filler piece 4, formed and be followed successively by nozzle piece 2, filler piece 3 from bottom to top
And the sandwich structure 14 of cover plate 4；When carrying out metal filled, described sandwich structure 14 is placed horizontally at liquid metal groove 1
On, and described nozzle piece 3 lower surface is close to the upper surface of liquid metal 2 in groove, described nozzle piece 3 and described filler piece 4 it
Between there is the first gap 6, there is between described filler piece 4 and described cover plate 5 second gap 7；
Nozzle bore structure 9, is located in described nozzle piece 3 and runs through described nozzle piece 3；Described nozzle bore structure 9 be located at described
Filling micropore 8 in filler piece 4 is vertical corresponding；
First annular seal space 10, connects with at least one in described first gap 6 and the second gap 7, is used for adjusting described Sanming City
Control air pressure inside P of structure 141；
Second annular seal space 11, runs through described liquid metal groove 1 sidewall or bottom, and stretches in described liquid metal 2, and being used for will
Air pressure transmission in described second annular seal space 11 is handed to described liquid metal 2 surface；Described second annular seal space 11 is not with described first
The 6, second gap 7, gap connects.
Concrete, the part that described second annular seal space 11 stretches into described liquid metal 2 includes corrugated tube 22.Described first seals
It is equipped with pipeline in the cavity wall of chamber 10 and the second annular seal space 11, and described pipeline is provided with valve.
The micropore metal interstitital texture of the present invention is applicable not only to the filling of through hole, applies also for the filling of blind hole.When described filling
When micropore 8 is blind hole, the height in described second gap can be 0, or need not described cover plate.Need not described cover plate
When, described first annular seal space connects with described first gap, for adjusting the air pressure inside in described first gap
As shown in Figures 4 and 5, described nozzle piece 3 upper surface is provided with the first bulge-structure for forming described first gap 6
23 or first packing ring 25；Described cover plate 5 lower surface is provided with the second bulge-structure 24 or for forming described second gap 7
Two packing rings 26.
As shown in figs. 6-9, described nozzle bore structure 9 includes being divided into upper and lower two parts, and wherein, top is divided into and penetrates described spray
The nozzle bore 27 of mouth sheet upper surface, bottom is divided into the through hole 28 penetrating described nozzle piece lower surface, described nozzle bore 27 lower end
Connect with described through hole 29 upper end.
Particularly, the sidewall of described nozzle bore structure 9 does not infiltrates with liquid metal to be filled；And the sidewall of described filling micropore
Both can not infiltrate with liquid metal to be filled, it is also possible to infiltration.
Below by specific embodiment and accompanying drawing, the present invention is described in detail.
Embodiment one: realize silicon through hole and fill.
As shown in figure 13, described cover plate 5 is the sheet glass of band salient point, and the height of salient point is less than 5 microns.So at described cover plate
The second gap 7 is formed between 5 and filler piece 4.Salient point directly can be made in the lower surface of described cover plate 5 by the way of etching.Institute
Stating filler piece 4 is silicon chip, and described filling micropore 8 sidewall is silicon dioxide insulating layer 29, does not infiltrates with liquid metal.Described spray
Mouth sheet 3 is also silicon chip, and wherein the top of nozzle bore structure is divided into an elongated micropore, and diameter about 25 microns, bottom is divided into
The diamond opening etched by KOH.Liquid metal is the ashbury metal melted.Figure 14 a-14f is the experimental result filled, its
In, Figure 14 a～14b is shown as the upper surface SEM figure of metal column after silicon through hole is filled, and Figure 14 c～14d is shown as silicon through hole and fills
The lower surface SEM figure of rear metal column, Figure 14 e～14f is shown as the cross section SEM figure of metal column after silicon through hole is filled.It is visible,
The micropore metal interstitital texture of the present invention and fill method can reach good silicon through hole filling effect.
It is pointed out that in the present embodiment, the aperture filling micropore in described filler piece is the most consistent.In another embodiment,
Each aperture filling micropore can also be inconsistent, refers to Figure 14 g, is shown as having multiple different pore size and fills the filling of micropore
Cross section SEM after sheet is filled schemes.
Embodiment two: realize the filling of silicon blind hole
As shown in Figure 15 and Figure 16 a～Figure 16 b, described cover plate 5 is sheet glass or the silicon chip of band salient point.Due to fill it is
Blind hole, the height in described second gap 7 can be 0, the most described cover plate 5 can also not have salient point, it is not required that packing ring.
It is of course also possible to directly need not described cover plate.Described filler piece 4 is silicon chip, and filling micropore 8 therein is blind hole, side, hole
Wall is silicon nitride dielectric layer 30, does not infiltrates with liquid metal to be filled.Described nozzle piece 3 is also silicon chip, wherein nozzle bore knot
The top of structure 9 is divided into an elongated micropore, diameter about 25 microns.Described nozzle piece 3 upper surface has salient point, and height is 5
Microns.Between nozzle piece and filler piece, so form the first gap 6.The bottom of nozzle is divided into and being etched by KOH
Diamond opening.Liquid metal is the ashbury metal melted.Figure 16 a is shown as the schematic cross-section after silicon blind hole is filled, and Figure 16 b shows
It is shown as the cross section SEM figure after silicon blind hole is filled.
Embodiment three: for filling the through hole of the band metal level of ceramic substrate.
As shown in FIG. 17 and 18, described cover plate 5 is the sheet glass of band salient point, the height of salient point < 5 microns.Salient point directly leads to
The mode of over etching is made in the lower surface of cover plate.Described filler piece 4 is potsherd, and described filling micropore 8 deposited on sidewalls has number
The metal level 31 that micron is thick, this metal level 31 can react infiltration with liquid metal to be filled.Described nozzle piece 3 is silicon
Sheet, wherein the top of nozzle bore structure 8 is divided into an elongated micropore, diameter about 25 microns.The lower part of nozzle bore structure
For the diamond opening etched by KOH.Liquid metal is the ashbury metal melted.Effect after filling out is as shown in figure 18.
In sum, the micropore metal interstitital texture of the present invention and fill method are by adjusting the air pressure inside of described sandwich structure
P1And the surface pressure P of described liquid metal2, make the draught head of the two reach the first preset value, thus by described liquid metal groove
In liquid metal by described nozzle bore structure suck described filling micropore, complete the metal filled of described filling micropore；Subsequently
Adjust air pressure inside P of described sandwich structure further1And the surface pressure P of described liquid metal2, make the draught head of the two reach
To the second preset value, the pinchoff effect of liquid bridge is utilized to realize the controlled micro-cutting of liquid metal and the liquid metal groove being filled in micropore
Cut, thus suck cut with micro-cutting together with complete whole filling process.Filling speed of the present invention is exceedingly fast, and accuracy is high, cutting effect
Good, and the filling of different pore size micropore can be realized simultaneously.Owing to micropore metal interstitital texture and the fill method of the present invention can be simultaneously
Adjust air pressure inside P of described sandwich structure1And the surface pressure P of described liquid metal2, bigger pressure reduction can be realized, not only
The filling of through hole can be realized, it is also possible to realize the filling of blind hole；Meanwhile, fill micropore can soak with liquid metal to be filled
Profit, it is also possible to do not infiltrate.So, the present invention effectively overcomes various shortcoming of the prior art and has high industrial utilization.
The principle of above-described embodiment only illustrative present invention and effect thereof, not for limiting the present invention.Any it is familiar with this skill
Above-described embodiment all can be modified under the spirit and the scope of the present invention or change by the personage of art.Therefore, such as
All that in art, tool usually intellectual is completed under without departing from disclosed spirit and technological thought etc.
Effect is modified or changes, and must be contained by the claim of the present invention.
Claims (29)
1. a micropore metal fill method, it is characterised in that comprise the steps:
One liquid metal groove is provided, on described liquid metal groove horizontal positioned the most successively by nozzle piece, filler piece and
The sandwich structure that cover plate is formed by stacking；Wherein, described nozzle piece lower surface is close to the upper surface of liquid metal in groove, described
It is provided with the first gap between nozzle piece and described filler piece, between described filler piece and described cover plate, is provided with the second gap；Described
Filler piece has filling micropore, described nozzle piece is provided with corresponding nozzle bore structure vertical with described filling micropore；
Adjust air pressure inside P of described sandwich structure1And the surface pressure P of described liquid metal2, make the draught head of the two
Reach the first preset value, micro-so that the liquid metal in described liquid metal groove is sucked described filling by described nozzle bore structure
Hole, completes the metal filled of described filling micropore；
Adjust air pressure inside P of described sandwich structure further1And the surface pressure P of described liquid metal2, make the two
Draught head reaches the second preset value, to be disconnected at described nozzle bore structure by liquid metal.
Micropore metal fill method the most according to claim 1, it is characterised in that: liquid metal is disconnected at described nozzle bore structure
After opening, adjust air pressure inside P of described sandwich structure further1And the surface pressure P of described liquid metal2, make the two
Draught head be 0, and make the two rise to atmospheric value, then take out described filler piece.
Micropore metal fill method the most according to claim 1, it is characterised in that: come by changing the air pressure in the second annular seal space
Adjust the surface pressure P of described liquid metal2；Described second annular seal space runs through described liquid metal groove sidewall or bottom, and stretches
Enter in described liquid metal, the air pressure transmission in described second annular seal space is handed to described liquid metal surface；Described second seals
Chamber does not connects with described first gap, the second gap.
Micropore metal fill method the most according to claim 3, it is characterised in that: described second annular seal space stretches into described liquid gold
The part belonged to includes corrugated tube.
Micropore metal fill method the most according to claim 3, it is characterised in that: by being located in described second annular seal space cavity wall
Pipeline and the valve be located on described pipeline to change the air pressure in described second annular seal space.
Micropore metal fill method the most according to claim 1, it is characterised in that: come by changing the air pressure in the first annular seal space
Adjust air pressure inside P of described sandwich structure1；In described first annular seal space and described first gap and the second gap at least
One connection.
Micropore metal fill method the most according to claim 6, it is characterised in that: by being located in described first annular seal space cavity wall
Pipeline and the valve be located on described pipeline to change the air pressure in described first annular seal space.
Micropore metal fill method the most according to claim 1, it is characterised in that: described filling micropore is through hole or blind hole.
Micropore metal fill method the most according to claim 8, it is characterised in that: when described filling micropore is blind hole, described
The height in the second gap is 0.
Micropore metal fill method the most according to claim 1, it is characterised in that: by being located at described nozzle piece upper surface
First bulge-structure forms described first gap, or by placing the first packing ring between described nozzle piece and described filler piece
Form described first gap；Described second gap is formed by being located at the second bulge-structure of described cover plate lower surface, or logical
Cross and between described nozzle piece and described cover plate, place the second packing ring form described second gap.
11. micropore metal fill methods according to claim 1, it is characterised in that: described first gap vertical height little
In 8 microns, the vertical height in described second gap is less than 8 microns.
12. micropore metal fill methods according to claim 1, it is characterised in that: described nozzle bore structure includes being divided into up and down
Two parts, wherein, top is divided into the nozzle bore penetrating described nozzle piece upper surface, and bottom is divided into and penetrates described nozzle piece following table
The through hole in face, described nozzle bore lower end connects with described through hole upper end.
13. micropore metal fill methods according to claim 12, it is characterised in that: when described nozzle bore and described filling micropore
When being cylindrical hole, meet the aperture half less than described filling micropore size of described nozzle bore, the high width of described nozzle bore
Ratio is more than π.
14. micropore metal fill methods according to claim 12, it is characterised in that: the upper part size of described through hole with under
Portion's consistent size；Or the size of described through hole is gradually increased from top to bottom.
15. micropore metal fill methods according to claim 12, it is characterised in that: a corresponding nozzle bore of through hole；
Or a corresponding nozzle bore array of through hole, described nozzle bore array is made up of the nozzle bore that at least two is discrete.
16. micropore metal fill methods according to claim 1, it is characterised in that: the sidewall of described nozzle bore structure and described
The sidewall filling micropore does not all infiltrate with liquid metal to be filled；Or the sidewall of described nozzle bore structure and liquid to be filled
Metal does not infiltrates, and the sidewall of described filling micropore infiltrates with liquid metal to be filled.
17. micropore metal fill methods according to claim 1, it is characterised in that: if it is micro-to have dry-packing in described filler piece
Hole, and at least two sizes filling micropore are different.
18. micropore metal fill methods according to claim 1, it is characterised in that: the pore diameter range of described filling micropore is
1～1000 micron.
19. micropore metal fill methods according to claim 1, it is characterised in that: described liquid metal is elemental metals or conjunction
Gold.
20. 1 kinds of micropore metal fill methods, it is characterised in that comprise the steps:
There is provided a liquid metal groove, horizontal positioned nozzle piece and filler piece successively on described liquid metal groove；Wherein, described
Nozzle piece lower surface is close to the upper surface of liquid metal in groove, is provided with the first gap between described nozzle piece and described filler piece；
Having filling micropore in described filler piece, described filling micropore is blind hole；Described nozzle piece is provided with and hangs down with described filling micropore
Straight corresponding nozzle bore structure；
Adjust the air pressure in described first gap and the surface pressure of described liquid metal, make the draught head of the two reach first pre-
If value, so that the liquid metal in described liquid metal groove is sucked described filling micropore by described nozzle bore structure, complete institute
State and fill the metal filled of micropore；
Adjust the air pressure in described first gap and the surface pressure of described liquid metal further, make the draught head of the two reach
Second preset value, to disconnect liquid metal at described nozzle bore structure.
21. 1 kinds of micropore metal interstitital textures, it is characterised in that described micropore metal interstitital texture includes:
Cover plate and nozzle piece, for being clipped in the middle by filler piece, formed and be followed successively by nozzle piece, filler piece and cover plate from bottom to top
Sandwich structure；When carrying out metal filled, described sandwich structure is placed horizontally on liquid metal groove, and described spray
Mouth sheet lower surface is close to the upper surface of liquid metal in groove, has the first gap, institute between described nozzle piece and described filler piece
State and there is between filler piece and described cover plate the second gap；
Nozzle bore structure, is located in described nozzle piece and runs through described nozzle piece；Described nozzle bore structure be located at described filling
Filling micropore in sheet is the most corresponding；
First annular seal space, connects with at least one in described first gap and the second gap, is used for adjusting described sandwich knot
Air pressure inside P of structure1；
Second annular seal space, runs through described liquid metal groove sidewall or bottom, and stretches in described liquid metal, for by described
Air pressure transmission in second annular seal space is handed to described liquid metal surface；Described second annular seal space not with described first gap, second
Gap connects.
22. micropore metal interstitital textures according to claim 21, it is characterised in that: described second annular seal space stretches into described liquid
The part of metal includes corrugated tube.
23. micropore metal interstitital textures according to claim 21, it is characterised in that: described first annular seal space and the second annular seal space
Cavity wall on be equipped with pipeline, and described pipeline is provided with valve.
24. micropore metal interstitital textures according to claim 21, it is characterised in that: described filling micropore is through hole or blind hole.
25. micropore metal interstitital textures according to claim 24, it is characterised in that: when described filling micropore is blind hole, institute
The height stating the second gap is 0.
26. micropore metal interstitital textures according to claim 21, it is characterised in that: described nozzle piece upper surface is provided with for shape
Become first bulge-structure in described first gap, or described nozzle piece upper surface be provided with for form described first gap
One packing ring；Described cover plate lower surface is provided with the second bulge-structure for forming described second gap, or described cover plate lower surface
It is provided with the second packing ring for forming described second gap.
27. micropore metal interstitital textures according to claim 21, it is characterised in that: described nozzle bore structure includes being divided into up and down
Two parts, wherein, top is divided into the nozzle bore penetrating described nozzle piece upper surface, and bottom is divided into and penetrates described nozzle piece following table
The through hole in face, described nozzle bore lower end connects with described through hole upper end.
28. micropore metal interstitital textures according to claim 21, it is characterised in that: the sidewall of described nozzle bore structure and described
The sidewall filling micropore does not all infiltrate with liquid metal to be filled；Or the sidewall of described nozzle bore structure and liquid to be filled
Metal does not infiltrates, and the sidewall of described filling micropore infiltrates with liquid metal to be filled.
29. 1 kinds of micropore metal interstitital textures, it is characterised in that described micropore metal interstitital texture includes:
Nozzle piece, is used for carrying filler piece；When carrying out metal filled, described nozzle piece is placed horizontally on liquid metal groove,
And described nozzle piece lower surface is close to the upper surface of liquid metal in groove, between described nozzle piece and described filler piece, have first
Gap；
Nozzle bore structure, is located in described nozzle piece and runs through described nozzle piece；Described nozzle bore structure be located at described filling
Filling micropore in sheet is the most corresponding；Described filling micropore is blind hole；
First annular seal space, connects with described first gap, for adjusting the air pressure inside in described first gap；
Second annular seal space, runs through described liquid metal groove sidewall or bottom, and stretches in described liquid metal, for by described
Air pressure transmission in second annular seal space is handed to described liquid metal surface；Described second annular seal space does not connects with described first gap.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109994425A (en) * | 2019-04-04 | 2019-07-09 | 上海迈铸半导体科技有限公司 | Fill preparation method, filling substrate and the micropore interconnection structure preparation method of substrate |
| WO2020199236A1 (en) * | 2019-04-03 | 2020-10-08 | 上海迈铸半导体科技有限公司 | Metal deposition method combining microelectromachinery and casting |
| CN112331613A (en) * | 2020-11-25 | 2021-02-05 | 哈尔滨工业大学 | Method for rapidly filling liquid metal to TSV (through silicon Via) based on ultrasonic-pressure composite process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103107129A (en) * | 2013-02-28 | 2013-05-15 | 中国科学院上海微系统与信息技术研究所 | Micropore metal filling structure and method |
| JP2013201163A (en) * | 2012-03-23 | 2013-10-03 | Sumitomo Precision Prod Co Ltd | Metal filling apparatus and metal filling method |
| GB2502319A (en) * | 2012-05-24 | 2013-11-27 | Imp Innovations Ltd | Filling vias during TSV fabrication |
-
2015
- 2015-06-12 CN CN201510323889.1A patent/CN106298639B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013201163A (en) * | 2012-03-23 | 2013-10-03 | Sumitomo Precision Prod Co Ltd | Metal filling apparatus and metal filling method |
| GB2502319A (en) * | 2012-05-24 | 2013-11-27 | Imp Innovations Ltd | Filling vias during TSV fabrication |
| CN103107129A (en) * | 2013-02-28 | 2013-05-15 | 中国科学院上海微系统与信息技术研究所 | Micropore metal filling structure and method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020199236A1 (en) * | 2019-04-03 | 2020-10-08 | 上海迈铸半导体科技有限公司 | Metal deposition method combining microelectromachinery and casting |
| CN109994425A (en) * | 2019-04-04 | 2019-07-09 | 上海迈铸半导体科技有限公司 | Fill preparation method, filling substrate and the micropore interconnection structure preparation method of substrate |
| CN112331613A (en) * | 2020-11-25 | 2021-02-05 | 哈尔滨工业大学 | Method for rapidly filling liquid metal to TSV (through silicon Via) based on ultrasonic-pressure composite process |
| CN112331613B (en) * | 2020-11-25 | 2023-03-14 | 哈尔滨工业大学 | Method for rapidly filling liquid metal to TSV (through silicon Via) based on ultrasonic-pressure composite process |
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Effective date of registration: 20190717 Address after: Room J3408, 912 Yecheng Road, Jiading Industrial Zone, Shanghai, 201822 Patentee after: Shanghai Mai casting Semiconductor Technology Co., Ltd. Address before: 200050 Changning Road, Shanghai, No. 865, No. Co-patentee before: Huzhou Zhongwei Technology Co., Ltd. Patentee before: Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences |