CN106298639B - A kind of micropore metal interstitital texture and fill method - Google Patents
A kind of micropore metal interstitital texture and fill method Download PDFInfo
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- CN106298639B CN106298639B CN201510323889.1A CN201510323889A CN106298639B CN 106298639 B CN106298639 B CN 106298639B CN 201510323889 A CN201510323889 A CN 201510323889A CN 106298639 B CN106298639 B CN 106298639B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76882—Reflowing or applying of pressure to better fill the contact hole
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Abstract
The present invention provides a kind of micropore metal interstitital texture and fill method, which comprises provides a liquid metal slot and the on it horizontal positioned sandwich structure being formed by stacking by nozzle piece, filler piece and cover plate；Wherein, the upper surface of liquid metal is close in nozzle piece lower surface, and the first gap is equipped between nozzle piece and filler piece, and the second gap is equipped between filler piece and cover plate；There is filling micropore in the filler piece, be equipped with corresponding nozzle pore structure vertical with the filling micropore in the nozzle piece；By adjusting the air pressure inside P of the sandwich structure1And the surface pressure P of the liquid metal2, realize the metal filling and cutting of the filling micropore.Filling speed of the present invention is exceedingly fast, accuracy height, good cutting effect, and the filling of different pore size micropore can be achieved at the same time.The filling of through-hole not only may be implemented in the present invention, can also realize the filling of blind hole；Meanwhile filling micropore can be infiltrated with liquid metal to be filled, can not also be infiltrated.
Description
Technical field
The invention belongs to micro manufacturing processing technique fields, are related to a kind of micropore metal filling technique, more particularly to one kind
Micropore metal interstitital texture and fill method.
Background technique
Electric mutual connection is for realizing the mode of the transmission of the electric signal between chip chamber and chip and substrate, is encapsulation
Core component.In existing encapsulation technology, electrical connection is main to pass through gold thread bonding (wire-bonding) and flip chip bonding
(flip-chip).Wire-bonding by tiny gold thread (about 25 microns thick) both ends by being bonded in needs respectively and carrying out electricity
It is realized on the electrode of interconnection.Flip-chip is otherwise known as controlled collapse chip connection (C4), should
Method by directly production salient point, usually tin ball on the electrode, then realized in such a way that tin ball flows back with it is right on substrate
Answer the connection of electrode.With the development of electronic device, above two electrical connection form especially Wire-bonding is gradually not
It is able to satisfy the requirement of higher system in package (SiP) integrated level and smaller encapsulation volume.
The novel electric connection technology for having significant impact to Advanced Packaging risen therewith is TSV (Through-
Silicon via) through silicon via technology is the vertical electric connection technology for penetrating substrate (especially silicon chip).TSV almost can be with
Instead of the place of the Wire-Bonding in all encapsulation, the electric property of all kinds chip package is improved, including is mentioned significantly
High integration reduces chip size, especially encapsulates (System-in-Packaging, SiP) in system collection, wafer level packaging
(Wafer-Level Packaging-WLP) and three-dimensional perpendicular stacked package (3D Packaging) these Advanced Packagings it
In.
The application field of through-hole interconnection is very extensive, covers from ASIC, Memory, IC to various kinds of sensors part such as MEMS
With optical sensor etc..Furthermore it as silicon pinboard, requires to be applied to through-hole interconnection technique in the three-dimensional stacked module of ceramics.
The manufacture of TSV includes the manufacture of through-hole, and the deposition of insulating layer, the filling of through-hole and subsequent chemical machinery are flat
Integralization (CMP) and it is routed techniques such as (RDL) again.In these processes, the filling of through-hole is technical difficulty maximum, and cost is highest
One.According to actual application, the metal of such bulk is filled out from tens microns to several hundred microns etc. in the aperture of through-hole
It fills, existing major technique, by carrying out the attachment of seed layer first on through-hole wall, is then existed again based on copper electroplating principle
Seed layer powers on copper-plated mode and realizes.In addition to this, other TSV technologies are also in continuous research.Such as it is based on low-resistance rate silicon
Silex Via be then by using silicon deep etching to go out columnar silicon body as transmitting medium in the silicon wafer of low-resistance rate.It is additionally based on
The TSV technology of Wire-bonding and magnetic package technique is also under study for action.Both technologies pass through respectively places in through-holes
Metal lead wire or nickel needle are as conducting medium.Currently used filling mode is realized by being electroplated, especially copper
Plating, if can also be realized by CVD for size at several microns.But either plating or CVD because fast
Degree is slow, wants to realize that size is all relatively difficult in tens Dao several hundred microns through-hole filling or blind hole filling.
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of micropore metal interstitital texture and
Fill method, for solving to fill metal speeds slowly in tens micro through hole or blind hole to several hundred microns in the prior art and fill out
Fill the low problem of yield rate.
In order to achieve the above objects and other related objects, the present invention provides a kind of micropore metal fill method, including as follows
Step:
One liquid metal slot is provided, is horizontally arranged on the liquid metal slot from bottom to top successively by nozzle piece, filling
The sandwich structure that piece and cover plate are formed by stacking；Wherein, the upper surface of liquid metal in slot, institute are close in the nozzle piece lower surface
It states and is equipped with the first gap between nozzle piece and the filler piece, the second gap is equipped between the filler piece and the cover plate；Institute
Stating in filler piece has filling micropore, is equipped with corresponding nozzle pore structure vertical with the filling micropore in the nozzle piece；
Adjust the air pressure inside P of the sandwich structure1And the surface pressure P of the liquid metal2, make the air pressure of the two
Difference reaches the first preset value, and the liquid metal in the liquid metal slot is sucked the filling by the nozzle pore structure
Micropore completes the metal filling of the filling micropore；
Further adjust the air pressure inside P of the sandwich structure1And the surface pressure P of the liquid metal2Both, make
Draught head reach the second preset value, liquid metal is disconnected at the nozzle pore structure.
Optionally, after liquid metal disconnects at the nozzle pore structure, the interior of the sandwich structure is further adjusted
Portion's air pressure P1And the surface pressure P of the liquid metal2, make the draught head 0 of the two, and the two is made to rise to atmospheric value, so
After take out the filler piece.
Optionally, the surface pressure P of the liquid metal is adjusted by changing the air pressure in the second seal chamber2；It is described
Second seal chamber runs through the liquid metal groove sidewall or bottom, and protrudes into the liquid metal, by second seal chamber
Interior air pressure is transferred to the liquid metal surface；Second seal chamber is not connected to first gap, the second gap.
Optionally, the part that second seal chamber protrudes into the liquid metal includes bellows.
Optionally, changed by the pipeline in the second seal chamber cavity wall and the valve on the pipeline
Air pressure in second seal chamber.
Optionally, the air pressure inside P of the sandwich structure is adjusted by changing the air pressure in first annular seal space1；Institute
At least one of first annular seal space and first gap and the second gap is stated to be connected to.
Optionally, changed by the pipeline in the first annular seal space cavity wall and the valve on the pipeline
Air pressure in the first annular seal space.
Optionally, the filling micropore is through-hole or blind hole.
Optionally, the height in second gap is 0.
Optionally, first gap, Huo Zhetong are formed by being set to the first bulge-structure of the nozzle piece upper surface
It crosses and places the first washer between the nozzle piece and the filler piece and form first gap；By being set under the cover plate
Second bulge-structure on surface forms second gap, or by placing second between the nozzle piece and the cover plate
Washer forms second gap.
Optionally, the vertical height in first gap is less than 8 microns, and the vertical height in second gap is less than 8
Micron.
Optionally, the nozzle pore structure includes being divide into upper part and lower part, wherein top, which is divided into, to be penetrated on the nozzle piece
The nozzle bore on surface, lower part are divided into the through hole for penetrating the nozzle piece lower surface, the nozzle bore lower end and the through hole
Upper end connection.
Optionally, when the nozzle bore and the filling micropore are cylindrical hole, the radius for meeting the nozzle bore is small
In the diameter of the filling micropore, the depth-width ratio of the nozzle bore is greater than π.
Optionally, the upper dimension of the through hole is consistent with lower dimension；Or the size of the through hole is from top to bottom
It is gradually increased.
Optionally, the corresponding nozzle bore of a through hole；Or the corresponding nozzle hole array of a through hole, the spray
Nozzle aperture array is made of at least two discrete nozzle bores.
Optionally, the side wall of the nozzle pore structure and it is described filling micropore side wall with liquid metal to be filled not
Infiltration；Or the side wall of the nozzle pore structure is not infiltrated with liquid metal to be filled, it is described filling micropore side wall with wait fill out
The liquid metal infiltration filled.
Optionally, if having dry-packing micropore in the filler piece, and at least there are two the mutual not phases of the size of filling micropore
Together.
Optionally, the pore diameter range of the filling micropore is 1~1000 micron.
Optionally, the liquid metal is elemental metals or alloy.
The present invention also provides another micropore metal fill methods, include the following steps:
One liquid metal slot is provided, nozzle piece and filler piece are successively horizontally arranged on the liquid metal slot；Wherein, institute
The upper surface that liquid metal in slot is close in nozzle piece lower surface is stated, is equipped between first between the nozzle piece and the filler piece
Gap；There is filling micropore, the filling micropore is blind hole in the filler piece；It is equipped with and the filling micropore in the nozzle piece
Vertical corresponding nozzle pore structure；
The air pressure in first gap and the surface pressure of the liquid metal are adjusted, the draught head both made reaches the
Liquid metal in the liquid metal slot is sucked the filling micropore by the nozzle pore structure by one preset value, complete
At the metal filling of the filling micropore；
The air pressure in first gap and the surface pressure of the liquid metal are further adjusted, the draught head of the two is made
Reach the second preset value, liquid metal is disconnected at the nozzle pore structure.
The present invention also provides a kind of micropore metal interstitital texture, the micropore metal interstitital texture includes:
Cover plate and nozzle piece, for filler piece to be clipped in the middle, formation is followed successively by nozzle piece, filler piece and lid from bottom to top
The sandwich structure of piece；When carrying out metal filling, the sandwich structure is placed horizontally on liquid metal slot, and the spray
The upper surface of liquid metal in slot is close in mouth piece lower surface, has the first gap, institute between the nozzle piece and the filler piece
Stating has the second gap between filler piece and the cover plate；
Nozzle pore structure is set in the nozzle piece and runs through the nozzle piece；The nozzle pore structure be set to it is described
Filling micropore in filler piece vertically corresponds to；
First annular seal space is connected to, for adjusting described Sanming City at least one of first gap and the second gap
Control the air pressure inside P of structure1；
Second seal chamber runs through the liquid metal groove sidewall or bottom, and protrudes into the liquid metal, is used for institute
It states the air pressure in the second seal chamber and is transferred to the liquid metal surface；Second seal chamber not with first gap,
The connection of two gaps.
Optionally, the part that second seal chamber protrudes into the liquid metal includes bellows.
Optionally, it is equipped with pipeline in the first annular seal space and the cavity wall of the second seal chamber, and the pipeline is equipped with
Valve.
Optionally, the filling micropore is through-hole or blind hole.
Optionally, when the filling micropore is blind hole, the height in second gap is 0.
Optionally, the nozzle piece upper surface is equipped with the first bulge-structure for being used to form first gap, Huo Zhesuo
It states nozzle piece upper surface and is equipped with the first washer for being used to form first gap；The cover plate lower surface is equipped with and is used to form institute
The second bulge-structure or the cover plate lower surface for stating the second gap are equipped with the second packing ring for being used to form second gap.
Optionally, the nozzle pore structure includes being divide into upper part and lower part, wherein top, which is divided into, to be penetrated on the nozzle piece
The nozzle bore on surface, lower part are divided into the through hole for penetrating the nozzle piece lower surface, the nozzle bore lower end and the through hole
Upper end connection.
Optionally, the side wall of the nozzle pore structure and it is described filling micropore side wall with liquid metal to be filled not
Infiltration；Or the side wall of the nozzle pore structure is not infiltrated with liquid metal to be filled, it is described filling micropore side wall with wait fill out
The liquid metal infiltration filled.
The present invention also provides another micropore metal interstitital texture, the micropore metal interstitital texture includes:
Nozzle piece, for carrying filler piece；When carrying out metal filling, the nozzle piece is placed horizontally at liquid metal slot
On,
The upper surface of liquid metal in slot is close in the nozzle piece lower surface, has between the nozzle piece and the filler piece
There is the first gap；
Nozzle pore structure is set in the nozzle piece and runs through the nozzle piece；The nozzle pore structure be set to it is described
Filling micropore in filler piece vertically corresponds to；The filling micropore is blind hole；
First annular seal space is connected to first gap, for adjusting the air pressure inside in first gap；
Second seal chamber runs through the liquid metal groove sidewall or bottom, and protrudes into the liquid metal, is used for institute
It states the air pressure in the second seal chamber and is transferred to the liquid metal surface；Second seal chamber does not connect with first gap
It is logical.
As described above, micropore metal interstitital texture of the invention and fill method, have the advantages that of the invention
Micropore metal interstitital texture and fill method by adjusting the sandwich structure air pressure inside P1And the liquid metal
Surface pressure P2, so that the draught head of the two is reached the first preset value, so that the liquid metal in the liquid metal slot be passed through
The nozzle pore structure sucks the filling micropore, completes the metal filling of the filling micropore；Then further described in adjustment
The air pressure inside P of sandwich structure1And the surface pressure P of the liquid metal2, so that the draught head of the two is reached the second preset value,
Controllable micro- cutting that the liquid metal and liquid metal slot that are filled in micropore are realized using the pinchoff effect of liquid bridge, to suck
Entire filling process is completed together with micro- cutting.Filling speed of the present invention is exceedingly fast, and accuracy height, good cutting effect, process are simple
And it is pollution-free, and the filling of different pore size micropore can be achieved at the same time.Due to micropore metal interstitital texture of the invention and filling
Method can adjust the air pressure inside P of the sandwich structure simultaneously1And the surface pressure P of the liquid metal2, it can be achieved that bigger
Pressure difference, the filling of through-hole not only may be implemented, can also realize the filling of blind hole；Meanwhile filling micropore and liquid to be filled
State metal can infiltrate, and can not also infiltrate.It is mutual that micropore metal interstitital texture of the present invention and fill method are applicable not only to through-hole
The filling of micropore in even, while being suitable for any required technical field for carrying out micropore filling.
Detailed description of the invention
Fig. 1 is shown as that sandwich structure being placed horizontally on liquid metal slot in micropore metal fill method of the invention
Schematic diagram.
Fig. 2 is shown as passing through the air pressure inside of first annular seal space sandwich structure in micropore metal fill method of the invention
P1, the surface pressure P of liquid metal is adjusted by the second seal chamber2Schematic diagram.
Fig. 3 is shown as micropore metal fill method of the invention in another embodiment through first annular seal space sandwich knot
The air pressure inside P of structure1, the surface pressure P of liquid metal is adjusted by the second seal chamber2Schematic diagram.
Fig. 4 is shown as forming first, by the first, second bulge-structure in micropore metal fill method of the invention
The schematic diagram in two gaps.
Fig. 5 is shown as being formed between first, second in micropore metal fill method of the invention by the first, second washer
The schematic diagram of gap.
Fig. 6 is shown as the schematic diagram of nozzle pore structure in micropore metal fill method of the invention.
Fig. 7 is shown as the schematic diagram of micropore metal fill method of the invention nozzle pore structure in another embodiment.
Fig. 8~Fig. 9 is shown as a through hole corresponding one for nozzle pore structure in micropore metal fill method of the invention
The schematic diagram of a nozzle hole array.
Figure 10 a is shown as the schematic diagram before filling process starts in micropore metal fill method of the invention.
Figure 10 b is shown as the schematic diagram of filling process in micropore metal fill method of the invention.
Figure 10 c is shown as the schematic diagram of cutting process in micropore metal fill method of the invention.
Figure 10 d is shown as the schematic diagram in micropore metal fill method of the invention after cutting process.
Figure 11 be shown as in micropore metal fill method of the invention in nozzle bore the dimensionless fracture pressure value σ of liquid bridge with
The relationship of the depth-width ratio (ratio of height h and radius r) of nozzle bore.
Figure 12 is shown as P in micropore metal fill method whole process of the invention2、P1With the variation relation of Δ P.
Figure 13 is shown as realizing the schematic diagram of through silicon via filling in micropore metal fill method of the invention.
Figure 14 a~14b is shown as the upper surface SEM figure of metal column after through silicon via filling.
Figure 14 c~14d is shown as the lower surface SEM figure of metal column after through silicon via filling.
Figure 14 e~14g is shown as the section SEM figure of metal column after through silicon via filling.
Figure 15 is shown as realizing the schematic diagram of silicon blind hole filling in micropore metal fill method of the invention.
Figure 16 a is shown as the filled schematic diagram of silicon blind hole.
Figure 16 b is shown as the filled section SEM figure of silicon blind hole.
Figure 17 is shown as realizing through-hole filling of the ceramic substrate with metal layer in micropore metal fill method of the invention
Schematic diagram.
Figure 18 is shown as the filled schematic diagram of through-hole of the ceramic substrate with metal layer.
Component label instructions
P1The air pressure inside of sandwich structure
P2The surface pressure of liquid metal
V1, V2 valve
1 liquid metal slot
2 liquid metals
3 nozzle pieces
4 filler pieces
5 cover plates
6 first gaps
7 second gaps
8 filling micropores
9 nozzle pore structures
10 first annular seal spaces
11 second seal chambers
12,13 pipelines
14 sandwich structures
15 bottom of chamber
16 side walls
17 chamber lids
18 glands
19 sealing rings
20,22 bellowss
21 heat-insulated ring assemblies
23 first bulge-structures
24 second bulge-structures
25 first washers
26 second packing rings
27 nozzle bores
28 through holes
29 silicon dioxide insulating layers
30 silicon nitride dielectric layers
31 metal layers
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Other advantages and efficacy of the present invention can be easily understood for disclosed content.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from
Various modifications or alterations are carried out under spirit of the invention.
Fig. 1 is please referred to Figure 18.It should be noted that diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of invention, only shown in schema then with related component in the present invention rather than package count when according to actual implementation
Mesh, shape and size are drawn, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind, and its
Assembly layout kenel may also be increasingly complex.
The present invention provides a kind of micropore metal fill method, includes the following steps:
As shown in Figure 1, provide a liquid metal slot 1 first, be horizontally arranged on the liquid metal slot 1 from bottom to top according to
The secondary sandwich structure being formed by stacking by nozzle piece 3, filler piece 4 and cover plate 5；Wherein, 3 lower surface of nozzle piece is close in slot
The upper surface of liquid metal 2, between the nozzle piece 3 and the filler piece 4 be equipped with the first gap 6, the filler piece 4 with it is described
The second gap 7 is equipped between cover plate 5；There is filling micropore 8 in the filler piece 4, be equipped with and the filling in the nozzle piece 3
The vertical corresponding nozzle pore structure 9 of micropore 8；
Then the air pressure inside P of the sandwich structure is adjusted1And the surface pressure P of the liquid metal2Both, make
Draught head reaches the first preset value, and the liquid metal 2 in the liquid metal slot 1 is sucked by the nozzle pore structure 9
The filling micropore 8 completes the metal filling of the filling micropore 8.
Further adjust the air pressure inside P of the sandwich structure1And the surface pressure P of the liquid metal 22, make two
The draught head of person reaches the second preset value, and liquid metal 2 is disconnected at the nozzle pore structure 9.
Specifically, adjusting the surface pressure P of the liquid metal 2 by changing the air pressure in the second seal chamber2；It is described
Second seal chamber runs through 1 side wall of liquid metal slot or bottom, and protrudes into the liquid metal 2, and described second is sealed
Intracavitary air pressure is transferred to the liquid metal surface；Second seal chamber does not connect with first gap 6, the second gap 7
It is logical.
As an example, as shown in Fig. 2, second seal chamber 11 runs through 1 bottom of liquid metal slot, and protrude into described
In liquid metal 2.
Particularly, it includes bellows 22 that second seal chamber 11, which protrudes into the part of the liquid metal 2,.Bellows refers to
The tubular elastomeric sensing element connected into foldable wrinkle piece along folding retractable direction.Bellows is in instrument and meter using wide
It is general, it is mainly used for the measuring cell as pressure measuring instruments, converts pressure into displacement or power.Ripple tube wall is relatively thin,
Sensitivity is higher, and measurement range is tens of pas to tens of megapascal.Its open end is fixed, and sealed end is in free state, and benefit
Increase elasticity with the helical spring or reed of auxiliary.It extends, makes along tube length direction under the action of internal pressure when work
Movable end generate and pressure at certain relationship displacement.
Specifically, the pipeline 13 by being set in 11 cavity wall of the second seal chamber and the valve on the pipeline 13
V2 changes the air pressure P in second seal chamber 112(while being also the air pressure inside of sandwich structure).
Likewise, the air pressure inside P of the sandwich structure can be adjusted by changing the air pressure in first annular seal space1；
At least one of the first annular seal space and first gap and second gap are connected to.
As an example, as shown in Fig. 2, the first annular seal space 10 include bottom of chamber 15, side wall 16, chamber lid 17 and gland 18,
The junction of the chamber lid 17 and chamber side wall is equipped with sealing ring 19, and the gland 18 is connected by bellows 20 and the chamber lid 17
It connects, and the gland 18 is pressed in the upper surface of the sandwich structure 14.The bottom of chamber 15 is equipped with a heat-insulated ring assemblies 21,
The liquid metal slot 1 is placed on the heat-insulated ring assemblies 21.The bottom of chamber 15, side wall 16, chamber lid 17, bellows 20, pressure
Lid 18, sandwich structure 14,1 side wall of liquid metal slot and the heat-insulated ring assemblies 21 surround the first annular seal space 10, described
Bellows 20,1 bottom of liquid metal slot, heat-insulated ring assemblies 21 and the bottom of chamber 15 surround second seal chamber 11, and described
One seal chamber 10 is not connected to mutually with second seal chamber 11.It may include heating part in the heat-insulated ring assemblies 21, for heating
The liquid metal slot 1, makes metal in slot be in a liquid state.
Specifically, can the pipeline 12 by being set in 10 cavity wall of first annular seal space and the valve on the pipeline 12
Door V1 changes the air pressure P in the first annular seal space 101(while being also the surface pressure of liquid metal).
Certainly, in other embodiments, the first annular seal space and second seal chamber may be other forms, only
The air pressure met in the first annular seal space is consistent with the air pressure in the sandwich structure, can be by changing described the
Air pressure in one seal chamber adjusts the air pressure in the sandwich structure, and the air pressure in second seal chamber can be transferred to liquid
State metal surface, can adjust the air pressure of liquid metal surface by changing the air pressure in second seal chamber, and described the
One seal chamber is not connected to the second seal chamber, should not excessively be limited the scope of the invention herein.As shown in figure 3, aobvious
It is shown as first annular seal space 10, structural schematic diagram when the second seal chamber 11 is another form.Under the situation, first sealing
Chamber 10 only surrounds the top of liquid metal slot 1, and therefore, in another embodiment, the bellows 22 can also be from the liquid
1 side wall of metallic channel is protruded into the liquid metal 2 and (is unillustrated).
Since the air pressure inside P of sandwich structure can be adjusted simultaneously in the present invention1And the surface pressure P of liquid metal2, can
Reach bigger draught head, therefore, the present invention is applicable not only to the filling of through-hole, is also applied for the filling of blind hole.Also, work as institute
When to state filling micropore 8 be blind hole, it is also not necessary to the cover plate 5 (because blind hole top itself are closed).
Specifically, as shown in figure 4, can be formed by the first bulge-structure 23 set on 3 upper surface of nozzle piece described
First gap 6, the second bulge-structure 24 by being set to 5 lower surface of cover plate form second gap 7.
As shown in figure 5, in another embodiment, it can also be by placing between the nozzle piece 3 and the filler piece 4
One washer 25 forms first gap 6；It is formed by placing second packing ring 26 between the nozzle piece 4 and the cover plate 5
Second gap 7.
First gap 6, the vertical height needs in the second gap 7 are sufficiently large to guarantee that gas inside passes through, simultaneously
It is sufficiently small to prevent liquid metal to be inhaled into gap again.Preferably, the vertical height in first gap is micro- less than 8
Rice, the vertical height in second gap is less than 8 microns.
Specifically, as shown in fig. 6, the nozzle pore structure 9 includes being divide into upper part and lower part, wherein top, which is divided into, to be penetrated
The nozzle bore 27 of the nozzle piece upper surface, lower part are divided into the through hole 28 for penetrating the nozzle piece lower surface, the nozzle bore
27 lower ends are connected to 28 upper end of through hole.
Particularly, when the nozzle bore 27 and the filling micropore 8 are cylindrical hole, preferably meet the nozzle bore
(radius r) is less than the half (r < R/2) in the aperture (radius R) of the filling micropore 8, and the height of the nozzle bore 27 is wide in 27 aperture
Than being greater than π.Certainly, in other embodiments, the nozzle bore may be other shapes, such as square hole, hyperbolic string holes, ruler
Very little requirement can optimize according to theoretical calculation, should not excessively limit the scope of the invention herein.
The effect of the through hole 28 is to meet nozzle piece 3 and can be made significantly thicker, and the size of the through hole 28 is big
In the nozzle bore 27, to accommodate more liquid metals 2.In the present embodiment, the size of the through hole 28 from top to bottom by
It is cumulative big, as shown in fig. 6, the longitudinal section of the through hole 28 is trapezoidal.As shown in fig. 7, in another embodiment, it is described to run through
The upper portion size in hole 28 can also be consistent with lower dimension.
In addition, in the present embodiment, the corresponding nozzle bore 27 of a through hole 28.As can be seen from figures 8 and 9, in another reality
It applies in example, a through hole 28 can also correspond to a nozzle hole array, and the nozzle hole array is by least two discrete sprays
Nozzle aperture 27 forms.
Specifically, the side wall of the side wall of the nozzle pore structure 9 and the filling micropore 8 can be golden with liquid to be filled
Category does not infiltrate；Alternatively, the side wall of the nozzle pore structure 9 is not infiltrated with liquid metal to be filled, the side of the filling micropore 8
Wall and liquid metal to be filled infiltrate.
It is micro- in 1~1000 micron of filling that micropore metal interstitital texture of the invention and fill method are suitable for pore diameter range
Hole, for the filling micropore of 50~200 micron pore sizes, the advantage of micropore metal interstitital texture of the invention and fill method is especially
Obviously.
Theoretical foundation of the invention is as follows: setting the air pressure in sandwich structure as P1, the surface pressure of liquid metal is P2。
Since the size of nozzle bore, filling hole and gap all only has micron level, effect of the gravity to the liquid metal of micron-scale
It can be ignored.Simultaneously as the size of liquid metal slot is larger, the pressure of liquid metal internal also be can be ignored.
Shape of the metal in nozzle bore, filling hole and gap is determined by the pressure for acting on each surface that it is subject to.
Before filling process starts, P1=P2, Δ P=P2-P1=0.Metal bath surface is horizontality, as shown in Figure 10 a.
Filling process: first by reducing P1Mode increase Δ P.Assuming that nozzle bore and filling micropore are cylindrical hole,
As 2 γ of Δ P >/r, liquid metal will be sucked by nozzle pore structure in the micropore of indentation filling in other words, such as Figure 10 b institute
Show.Wherein r is the radius of nozzle bore, and γ is the surface tension of liquid metal.If in P1In the case where being evacuated,
Δ P is also less than 2 γ/r, then can be by increasing P2Mode continue growing Δ P, with reach by liquid alloy suck fill
The condition in hole.
Cutting process: the liquid after liquid metal fills micropore by nozzle arrangements sucking/indentation, in filling filling micropore
What state metal and liquid metal slot were also connected to by nozzle arrangements.If fill micropore with liquid metal be it is nonwettable, that
It needs to maintain pressure of the liquid metal in filling hole to be 2 γ/R, wherein R is the radius for filling micropore.At the same time, liquid
Metal forms constant pressure liquid bridge in nozzle, and maintaining the pressure of the liquid bridge is σ γ/r, wherein σ=PFracture/ (γ/r) is nondimensional
Fracture pressure.The relationship of the depth-width ratio (ratio of height h and radius r) of σ and nozzle bore is as shown in figure 11.Then by reducing P2
Mode low delta p drops.If 2 γ/R > σ γ/r, with the reduction of Δ P, the liquid metal filled in micropore can be by table
Face tension retracts liquid metal slot.But in turn, if 2 γ of σ γ/r >/R, constant pressure liquid bridge can be broken in nozzle, together
When, the liquid metal filled in micropore will not be pulled, to realize the liquid metal and liquid metal slot in filling micropore
Controllable cutting, as shown in Figure 10 c and 10d.
Fracture of the liquid bridge in nozzle bore can not be observed from the external world, therefore P2Vacuum is dropped to always, with P1Unanimously, from
And Δ P is also reduced to zero.Last P2And P1Atmospheric pressure is slowly gone back up to together.Figure 12 gives P in whole process2、P1With Δ P's
Variation relation.
Fracture of the constant pressure liquid bridge in each nozzle is completely independent, and will not be interacted.Therefore, it can fill simultaneously not
With the filling micropore in aperture, if there is dry-packing micropore, and at least there are two the size of filling micropore is mutual in that is, described filler piece
It is not identical.In filling and cutting-off process, P2、P1Value determination is calculated with the parameter of the filling micropore of minimum-value aperture.The present invention
In, the liquid metal of filling can be elemental metals, or alloy.
Because the sandwich structure being made of cover plate, filler piece and nozzle piece can guarantee up and down in entire filling process
The pressure that two sides is born be it is the same, because without leads to the problem of because of caused by pressure difference by the crushing of piece.This is also same
When can guarantee that the technology can extend to the substrate of arbitrary dimension.
Before taking out filler piece from sandwich piece, need that the liquid alloy in filling hole is first allowed to cool and solidify.
In another embodiment, it (is either reacted if being deposited with to infiltrate with liquid metal on filling micropore side wall
Infiltration is not still reacted in infiltration) material, the above process still sets up, and can infiltrate in filling micropore and liquid metal
In the case of, the requirement of nozzle bore can relax, i.e. the radius r of nozzle bore, which might not have to meet, is less than filling pore radius R's
The condition of half, meanwhile, the depth-width ratio of nozzle bore can also relax, and perhaps can be less than π times.
In another embodiment, if filling is the nonwettable blind hole of side wall, whole process is same as above, and only works as P1Pumping is
When vacuum, alloy can't be inhaled into blind hole, only by P2The mode of pressurization could generate enough pressure differences for liquid
State metal is pressed into blind hole.Remaining step is constant.Also, the filling micropore be blind hole when, second gap it is vertical
Height can be 0, i.e., the described cover plate is close to the filler piece upper surface.It certainly, can also not due to the blind hole upper end closed
The cover plate is needed, in this case, by adjusting the surface pressure of air pressure and the liquid metal in first gap
The metal filling and cutting of blind hole can be completed.
The present invention also provides a kind of micropore metal interstitital textures, as shown in Figures 1 and 2, the micropore metal interstitital texture
Include:
Cover plate 5 and nozzle piece 3, for filler piece 4 to be clipped in the middle, formation is followed successively by nozzle piece 2, filler piece from bottom to top
3 and cover plate 4 sandwich structure 14；When carrying out metal filling, the sandwich structure 14 is placed horizontally at liquid metal slot 1
On, and the upper surface of liquid metal 2 in slot is close in 3 lower surface of the nozzle piece, between the nozzle piece 3 and the filler piece 4
With the first gap 6, there is the second gap 7 between the filler piece 4 and the cover plate 5；
Nozzle pore structure 9 is set in the nozzle piece 3 and runs through the nozzle piece 3；The nozzle pore structure 9 be set to
Filling micropore 8 in the filler piece 4 is vertically corresponding；
First annular seal space 10 is connected to at least one of first gap 6 and the second gap 7, described for adjusting
The air pressure inside P of sandwich structure 141；
Second seal chamber 11 runs through 1 side wall of liquid metal slot or bottom, and protrudes into the liquid metal 2, is used for
Air pressure in second seal chamber 11 is transferred to 2 surface of liquid metal；Second seal chamber 11 is not with described
One gap 6, the connection of the second gap 7.
Specifically, the part that second seal chamber 11 protrudes into the liquid metal 2 includes bellows 22.Described first is close
Pipeline is equipped in the cavity wall of envelope chamber 10 and the second seal chamber 11, and the pipeline is equipped with valve.
Micropore metal interstitital texture of the invention is applicable not only to the filling of through-hole, applies also for the filling of blind hole.Work as institute
When to state filling micropore 8 be blind hole, the height in second gap can be 0, or not need the cover plate.Described in not needing
In the case of cover plate, the first annular seal space is connected to first gap, for adjusting the air pressure inside in first gap
As shown in Figures 4 and 5,3 upper surface of nozzle piece is equipped with the first protrusion knot for being used to form first gap 6
Structure 23 or the first washer 25；5 lower surface of cover plate is equipped with the second bulge-structure 24 or for being used to form second gap 7
Two washers 26.
As shown in figs. 6-9, the nozzle pore structure 9 includes being divide into upper part and lower part, wherein top, which is divided into, penetrates institute
The nozzle bore 27 of nozzle piece upper surface is stated, lower part is divided into the through hole 28 for penetrating the nozzle piece lower surface, the nozzle bore 27
Lower end is connected to 29 upper end of through hole.
Particularly, the side wall with liquid metal to be filled of the nozzle pore structure 9 do not infiltrate；And the filling micropore
Side wall can not both have been infiltrated with liquid metal to be filled, can also be infiltrated.
Below by specific embodiment and attached drawing, the present invention is described in detail.
Embodiment one: through silicon via filling is realized.
As shown in figure 13, the cover plate 5 is the sheet glass with salient point, and the height of salient point is less than 5 microns.In this way in the lid
The second gap 7 is formed between piece 5 and filler piece 4.Salient point can directly be made in the lower surface of the cover plate 5 by way of etching.
The filler piece 4 is silicon wafer, and 8 side wall of filling micropore is silicon dioxide insulating layer 29, is not infiltrated with liquid metal.The spray
Mouth piece 3 is also silicon wafer, and wherein the top of nozzle pore structure is divided into an elongated micropore, and about 25 microns of diameter, lower part is divided into
The diamond opening etched by KOH.Liquid metal is the tin alloy melted.Figure 14 a-14f is the experimental result of filling,
In, Figure 14 a~14b is shown as the upper surface SEM figure of metal column after through silicon via filling, and Figure 14 c~14d is shown as through silicon via filling
The lower surface SEM figure of metal column afterwards, Figure 14 e~14f are shown as the section SEM figure of metal column after through silicon via filling.As it can be seen that this hair
Bright micropore metal interstitital texture and fill method can reach good through silicon via filling effect.
It should be pointed out that the aperture of the filling micropore in the filler piece is consistent in the present embodiment.In another implementation
In example, each aperture for filling micropore can also be inconsistent, please refers to Figure 14 g, is shown as having multiple and different aperture filling micropores
Filler piece filled section SEM figure.
Embodiment two: the filling of silicon blind hole is realized
As shown in Figure 15 and Figure 16 a~Figure 16 b, the cover plate 5 is sheet glass or silicon wafer with salient point.Due to what is filled
For blind hole, the height in second gap 7 can be 0, i.e., can also not have salient point on the described cover plate 5, also not need washer.When
So, the cover plate can also not be needed directly.The filler piece 4 is silicon wafer, and filling micropore 8 therein is blind hole, and hole side wall is
Silicon nitride dielectric layer 30 is not infiltrated with liquid metal to be filled.The nozzle piece 3 is also silicon wafer, wherein nozzle pore structure 9
Top is divided into an elongated micropore, about 25 microns of diameter.There is salient point in 3 upper surface of nozzle piece, is highly 5 microns of left sides
It is right.The first gap 6 is formed in this way between nozzle piece and filler piece.The lower part of nozzle is divided into is opened by the diamond shape that KOH is etched
Mouthful.Liquid metal is the tin alloy melted.Figure 16 a is shown as the filled schematic cross-section of silicon blind hole, and it is blind that Figure 16 b is shown as silicon
The filled section SEM figure in hole.
Embodiment three: for filling the through-hole with metal layer of ceramic substrate.
As shown in FIG. 17 and 18, the cover plate 5 is the sheet glass with salient point, height < 5 micron of salient point.Salient point is direct
The lower surface of cover plate is made in by way of etching.The filler piece 4 is potsherd, and 8 deposited on sidewalls of filling micropore has
The metal layer 31 of several microns thick, the metal layer 31 can react infiltration with liquid metal to be filled.The nozzle piece 3 is silicon
Piece, wherein the top of nozzle pore structure 8 is divided into an elongated micropore, about 25 microns of diameter.The lower part of nozzle pore structure
For the diamond opening etched by KOH.Liquid metal is the tin alloy melted.Effect after filling out is as shown in figure 18.
In conclusion micropore metal interstitital texture and fill method of the invention are by adjusting in the sandwich structure
Portion's air pressure P1And the surface pressure P of the liquid metal2, so that the draught head of the two is reached the first preset value, thus by the liquid
Liquid metal in metallic channel sucks the filling micropore by the nozzle pore structure, and the metal for completing the filling micropore is filled out
It fills；Then further adjust the air pressure inside P of the sandwich structure1And the surface pressure P of the liquid metal2Both, make
Draught head reaches the second preset value, and the liquid metal and liquid metal slot being filled in micropore are realized using the pinchoff effect of liquid bridge
Controllable micro- cutting, thus sucking and it is micro- cutting complete entire filling process together.Filling speed of the present invention is exceedingly fast, accuracy
High, good cutting effect, and the filling of different pore size micropore can be achieved at the same time.Due to micropore metal interstitital texture of the invention and fill out
The air pressure inside P of the sandwich structure can be adjusted simultaneously by filling method1And the surface pressure P of the liquid metal2, it can be achieved that more
The filling of through-hole not only may be implemented in big pressure difference, can also realize the filling of blind hole；Meanwhile filling micropore and to be filled
Liquid metal can infiltrate, and can not also infiltrate.So the present invention effectively overcomes various shortcoming in the prior art and has height
Spend value of industrial utilization.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (28)
1. a kind of micropore metal fill method, which comprises the steps of:
One liquid metal slot is provided, on the liquid metal slot be horizontally arranged from bottom to top successively by nozzle piece, filler piece and
The sandwich structure that cover plate is formed by stacking；Wherein, the upper surface of liquid metal in slot, the spray are close in the nozzle piece lower surface
It is equipped with the first gap between mouth piece and the filler piece, the second gap is equipped between the filler piece and the cover plate；It is described to fill out
Filling in piece has filling micropore, is equipped with corresponding nozzle pore structure vertical with the filling micropore in the nozzle piece；
Adjust the air pressure inside P of the sandwich structure1And the surface pressure P of the liquid metal2, reach the draught head of the two
It is to the first preset value, the liquid metal in the liquid metal slot is micro- by the nozzle pore structure sucking filling
The metal filling of the filling micropore is completed in hole；
Further adjust the air pressure inside P of the sandwich structure1And the surface pressure P of the liquid metal2, make the gas of the two
Pressure difference reaches the second preset value, and liquid metal is disconnected at the nozzle pore structure；
Wherein, the surface pressure P2 of the liquid metal is adjusted by changing the air pressure in the second seal chamber；Described second is close
It seals chamber and runs through the liquid metal groove sidewall or bottom, and protrude into the liquid metal, by the gas in second seal chamber
Pressure is transferred to the liquid metal surface；Second seal chamber is not connected to first gap, the second gap.
2. micropore metal fill method according to claim 1, it is characterised in that: liquid metal is in the nozzle pore structure
After place disconnects, the air pressure inside P of the sandwich structure is further adjusted1And the surface pressure P of the liquid metal2Both, make
Draught head be 0, and both make to rise to atmospheric value, then take out the filler piece.
3. micropore metal fill method according to claim 1, it is characterised in that: second seal chamber protrudes into the liquid
The part of state metal includes bellows.
4. micropore metal fill method according to claim 1, it is characterised in that: by being set to the second seal chamber chamber
Pipeline on wall and the valve on the pipeline change the air pressure in second seal chamber.
5. micropore metal fill method according to claim 1, it is characterised in that: by changing the gas in first annular seal space
It presses to adjust the air pressure inside P of the sandwich structure1；In the first annular seal space and first gap and the second gap
At least one connection.
6. micropore metal fill method according to claim 5, it is characterised in that: by being set to the first annular seal space chamber
Pipeline on wall and the valve on the pipeline change the air pressure in the first annular seal space.
7. micropore metal fill method according to claim 1, it is characterised in that: the filling micropore is through-hole or blind
Hole.
8. micropore metal fill method according to claim 7, it is characterised in that: when the filling micropore is blind hole,
The height in second gap is 0.
9. micropore metal fill method according to claim 1, it is characterised in that: by being set to the nozzle piece upper surface
The first bulge-structure form first gap, or pass through and place the first pad between the nozzle piece and the filler piece
Circle forms first gap；The second bulge-structure by being set to the cover plate lower surface forms second gap, or
Second gap is formed by placing second packing ring between the nozzle piece and the cover plate.
10. micropore metal fill method according to claim 1, it is characterised in that: the vertical height in first gap
Degree is less than 8 microns, and the vertical height in second gap is less than 8 microns.
11. micropore metal fill method according to claim 1, it is characterised in that: the nozzle pore structure includes being divided into
Upper and lower two parts, wherein top is divided into the nozzle bore for penetrating the nozzle piece upper surface, and lower part, which is divided into, to be penetrated under the nozzle piece
The through hole on surface, the nozzle bore lower end are connected to the through hole upper end.
12. micropore metal fill method according to claim 11, it is characterised in that: when the nozzle bore and the filling
When micropore is cylindrical hole, the aperture for meeting the nozzle bore is less than the half of the filling micropore size, the nozzle bore
Depth-width ratio is greater than π.
13. micropore metal fill method according to claim 11, it is characterised in that: the upper portion size of the through hole
It is consistent with lower dimension；Or the size of the through hole is gradually increased from top to bottom.
14. micropore metal fill method according to claim 11, it is characterised in that: the corresponding nozzle of a through hole
Hole；Or the corresponding nozzle hole array of a through hole, the nozzle hole array are made of at least two discrete nozzle bores.
15. micropore metal fill method according to claim 1, it is characterised in that: the side wall of the nozzle pore structure and
The side wall of the filling micropore is not infiltrated with liquid metal to be filled；Or the side wall of the nozzle pore structure and to be filled
Liquid metal does not infiltrate, and the side wall and liquid metal to be filled of the filling micropore infiltrate.
16. micropore metal fill method according to claim 1, it is characterised in that: have several fill out in the filler piece
Micropore is filled, and at least there are two the size of filling micropore is different.
17. micropore metal fill method according to claim 1, it is characterised in that: the pore diameter range of the filling micropore
It is 1~1000 micron.
18. micropore metal fill method according to claim 1, it is characterised in that: the liquid metal is elemental metals
Or alloy.
19. a kind of micropore metal fill method, which comprises the steps of:
One liquid metal slot is provided, nozzle piece and filler piece are successively horizontally arranged on the liquid metal slot；Wherein, the spray
The upper surface of liquid metal in slot is close in mouth piece lower surface, and the first gap is equipped between the nozzle piece and the filler piece；Institute
Stating in filler piece has filling micropore, and the filling micropore is blind hole；It is equipped in the nozzle piece vertical with the filling micropore
Corresponding nozzle pore structure；
The air pressure in first gap and the surface pressure of the liquid metal are adjusted, so that the draught head of the two is reached first pre-
If value, the liquid metal in the liquid metal slot is sucked into the filling micropore by the nozzle pore structure, completes institute
State the metal filling of filling micropore；
The air pressure in first gap and the surface pressure of the liquid metal are further adjusted, the draught head of the two is reached
Second preset value disconnects liquid metal at the nozzle pore structure；
Wherein, the surface pressure P of the liquid metal is adjusted by changing the air pressure in the second seal chamber2；Second sealing
Chamber runs through the liquid metal groove sidewall or bottom, and protrudes into the liquid metal, by the air pressure in second seal chamber
It is transferred to the liquid metal surface；Second seal chamber is not connected to first gap.
20. a kind of micropore metal interstitital texture, which is characterized in that the micropore metal interstitital texture includes:
Cover plate and nozzle piece, for filler piece to be clipped in the middle, formation is followed successively by nozzle piece, filler piece and cover plate from bottom to top
Sandwich structure；When carrying out metal filling, the sandwich structure is placed horizontally on liquid metal slot, and the nozzle piece
The upper surface of liquid metal in slot is close in lower surface, has the first gap between the nozzle piece and the filler piece, described to fill out
Filling has the second gap between piece and the cover plate；
Nozzle pore structure is set in the nozzle piece and runs through the nozzle piece；The nozzle pore structure be set to the filling
Filling micropore in piece vertically corresponds to；
First annular seal space is connected to, for adjusting the sandwich knot at least one of first gap and the second gap
The air pressure inside P of structure1；
Second seal chamber runs through the liquid metal groove sidewall or bottom, and protrudes into the liquid metal, for by described the
Air pressure in two seal chambers is transferred to the liquid metal surface；Second seal chamber is not between first gap, second
Gap connection.
21. micropore metal interstitital texture according to claim 20, it is characterised in that: second seal chamber protrudes into described
The part of liquid metal includes bellows.
22. micropore metal interstitital texture according to claim 20, it is characterised in that: the first annular seal space and second close
It seals in the cavity wall of chamber and is equipped with pipeline, and the pipeline is equipped with valve.
23. micropore metal interstitital texture according to claim 20, it is characterised in that: the filling micropore is through-hole or blind
Hole.
24. micropore metal interstitital texture according to claim 23, it is characterised in that: when the filling micropore is blind hole
When, the height in second gap is 0.
25. micropore metal interstitital texture according to claim 20, it is characterised in that: the nozzle piece upper surface, which is equipped with, to be used
It is equipped in the first bulge-structure or the nozzle piece upper surface for forming first gap and is used to form first gap
The first washer；The cover plate lower surface is equipped with and is used to form under second bulge-structure or the cover plate in second gap
Surface is equipped with the second packing ring for being used to form second gap.
26. micropore metal interstitital texture according to claim 20, it is characterised in that: the nozzle pore structure includes being divided into
Upper and lower two parts, wherein top is divided into the nozzle bore for penetrating the nozzle piece upper surface, and lower part, which is divided into, to be penetrated under the nozzle piece
The through hole on surface, the nozzle bore lower end are connected to the through hole upper end.
27. micropore metal interstitital texture according to claim 20, it is characterised in that: the side wall of the nozzle pore structure and
The side wall of the filling micropore is not infiltrated with liquid metal to be filled；Or the side wall of the nozzle pore structure and to be filled
Liquid metal does not infiltrate, and the side wall and liquid metal to be filled of the filling micropore infiltrate.
28. a kind of micropore metal interstitital texture, which is characterized in that the micropore metal interstitital texture includes:
Nozzle piece, for carrying filler piece；When carrying out metal filling, the nozzle piece is placed horizontally on liquid metal slot,
And the upper surface of liquid metal in slot is close in the nozzle piece lower surface, has first between the nozzle piece and the filler piece
Gap；
Nozzle pore structure is set in the nozzle piece and runs through the nozzle piece；The nozzle pore structure be set to the filling
Filling micropore in piece vertically corresponds to；The filling micropore is blind hole；
First annular seal space is connected to first gap, for adjusting the air pressure inside in first gap；
Second seal chamber runs through the liquid metal groove sidewall or bottom, and protrudes into the liquid metal, for by described the
Air pressure in two seal chambers is transferred to the liquid metal surface；Second seal chamber is not connected to first gap.
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| CN109994425B (en) * | 2019-04-04 | 2021-07-30 | 上海迈铸半导体科技有限公司 | Preparation method of filling substrate, filling substrate and preparation method of micropore interconnection structure |
| CN112331613B (en) * | 2020-11-25 | 2023-03-14 | 哈尔滨工业大学 | Method for rapidly filling liquid metal to TSV (through silicon Via) based on ultrasonic-pressure composite process |
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| CN103107129A (en) * | 2013-02-28 | 2013-05-15 | 中国科学院上海微系统与信息技术研究所 | Micropore metal filling structure and method |
| JP2013201163A (en) * | 2012-03-23 | 2013-10-03 | Sumitomo Precision Prod Co Ltd | Metal filling apparatus and metal filling method |
| GB2502319A (en) * | 2012-05-24 | 2013-11-27 | Imp Innovations Ltd | Filling vias during TSV fabrication |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2013201163A (en) * | 2012-03-23 | 2013-10-03 | Sumitomo Precision Prod Co Ltd | Metal filling apparatus and metal filling method |
| GB2502319A (en) * | 2012-05-24 | 2013-11-27 | Imp Innovations Ltd | Filling vias during TSV fabrication |
| CN103107129A (en) * | 2013-02-28 | 2013-05-15 | 中国科学院上海微系统与信息技术研究所 | Micropore metal filling structure and method |
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