CN103091997B - Gluing method of wedge-shaped plate group and fixture - Google Patents
Gluing method of wedge-shaped plate group and fixture Download PDFInfo
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- CN103091997B CN103091997B CN201210368913.XA CN201210368913A CN103091997B CN 103091997 B CN103091997 B CN 103091997B CN 201210368913 A CN201210368913 A CN 201210368913A CN 103091997 B CN103091997 B CN 103091997B
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Abstract
The invention discloses a gluing method of a wedge-shaped plate group and a fixture. The gluing method of the wedge-shaped plate group comprises the following steps of: (1) building an ultra-clean working chamber and an ultra-clean working table; (2) dipping anti-static optical glass wiping cloth into alcohol for wiping coated wedge-shaped plates meeting the requirements on the ultra-clean working table; (3) aligning a first wedge-shaped plate and a second wedge-shaped plate to form the wedge-shaped plate group; (4) gluing the wedge-shaped plate in a semi-cured manner; (5) initially carrying out curing measurement; (6) finally, carrying out the curing measurement; and (7) packaging the glued wedge-shaped plate group, so that the glued wedge-shaped plate group is entirely cured. According to the gluing method of the wedge-shaped plate group disclosed by the invention, the reject rate is reduced, the high-quality requirements of the glued wedge-shaped plate group are met, and the photo-etching requirement is met.
Description
Technical field
The present invention relates to litho machine, particularly a kind of gluing method and fixture of the wedge group for litho machine, this wedge group gummed is mainly used in optical diffraction and separates, and this directly has influence on silicon chip in litho machine to position grating auto-alignment to achievement.
Background technology
At present American-European countries's gummed (40 to 60) x (40 to 60) mm material be Xiao Te BK7(to process aperture be N=1, △ N=0.3, central area is N=0.2 as shown in Figure 1, △ N=0.1; After plated film, glue together, after gummed, aperture requires as N=1, △ N=0.3), central area can arrive N=0.2 after having glued together, the requirement of △ N=0.1, and bondline thickness is controlled at 15 μ m, glue area spreads specific region, and the final diffusion area of glue to be controlled at diameter be between 8--12mm; After but the wedge group of domestic enterprise's gummed has been glued together, central area aperture is N=2～2.5, and △ N=1～1.5 can not meet the requirement of 90nm litho machine far away.
Summary of the invention
The object of the present invention is to provide a kind of gluing method of the wedge group for litho machine, overcome the blockade to this technology of China abroad, meet the design needs of domestic 90nm litho machine, even if (40～60) x (40～60) mm material is Xiao Te BK7(, to process aperture be N=1, △ N=0.3, the N=0.2 of central area, △ N=0.1; After plated film, glue together, after gummed, aperture requires as N=1, △ N=0.3) central area can arrive N=0.5 after having glued together, the requirement of △ N=0.5, and can control thickness and the area of glue, make it to meet the requirements.
Technical solution of the present invention is:
1, for the gluing method of the wedge group of litho machine, its feature is, the method comprises the following steps:
1. set up ultra-clean operating room and superclean bench, indoor temperature is 20～26 DEG C ± 0.1 DEG C, and humidity is 50～70%, and normal atmosphere is depressed and on superclean bench, carried out gummed work;
2. at superclean bench, staff brings antistatic gloves and mouth mask, to the clapboard after stand-by plated film with measuring on Zygo VeriFire Aspheric interferometer, satisfactory plated film clapboard is dipped in to upper alcohol by electrostatic prevention optical glass cleaning wiping cloth and carry out wiping, in wiping process, clapboard is placed under the light of 100w and carefully watches surface dirt, until without the visible dust of human eye, wiping is complete, the good clapboard of wiping is placed in glassware, prevents from again polluting;
3. the first fast clapboard is placed on wedge cementing jig, kept to the side by the benchmark pasting on described wedge cementing jig in the both sides of the first fast clapboard, guarantee cemented surface and become level upward, then adopt point gum machine and be 0.1～0.2Mpa at air pressure, control time is controlled glue amount point glue at 1.5～3.5s to gummed region (dash area as shown in Figure 5), again the cemented surface of the second clapboard is placed on the cemented surface of the first clapboard lightly, the opposite of keeping to the side at two benchmark applies certain force to described clapboard, forms wedge group;
4. open ultraviolet source glue point (according to actual point glue position) is carried out to 20～50s exposure wait 5～10 minutes, obtain semi-curing glue jib and cotter plate group;
5. primary solidification is measured:
Described wedge group is taken on Zygo VeriFire Aspheric interferometer and measured together with wedge cementing jig, check the front face shape of wedge group, when pictograph closes designing requirement, enter step 6. face to face; When shape does not meet designing requirement, enter step 7. face to face;
6. unload the keep to the side application of force on opposite of reference edge, wait for after 5 minutes, the wedge group that upset is described, recycling Zygo VeriFire Aspheric interferometer carries out reverse side surface shape measurement, in the time that reverse side face shape does not meet designing requirement, enters step 7.; In the time that reverse side face shape meets the requirements, wedge group primary solidification is qualified, enters step 8.;
7. described wedge group unloads after described wedge cementing jig, and by methylene chloride immersion or alcohol-pickled for described wedge group, 2. the semi-curing glue jib and cotter plate group that dismounting is described, enter step;
8. final solidifying measured:
With described ultraviolet source, the wedge group that primary solidification is qualified is irradiated to twice again, each 120 seconds, be spaced apart 3～5 minutes, wedge group is placed in constant temperature oven together with clapboard pedestal, after 22～26 hours, again measure, in the time that the face of measurement shape does not meet designing requirement, enter step 9., in the time that the face of measurement pictograph closes designing requirement, wedge group is finally solidified and is glued together successfully, is called the wedge group of having glued together, and enters step 10.;
9. (carry out element separation with methylene chloride, bonding part must be immersed in solvent, and a common night is just separable to adopt existing technique to split wedge group.) enter step 2.;
10. the wedge group of having glued together is packed, packaged wedge group is placed in constant temperature oven more than five days, make it completely curing, stand-by after solidifying completely.
Described plated film clapboard aperture standard-required: N=1, △ N=0.3, central area N=0.2, △ N=0.1.
After described gummed, the aperture standard-required of wedge group is: N=1, △ N=0.3, the aperture N=0.5 of central area, △ N=0.5.
It is the point gum machine of OPAS ZERO 580 that described control rubber quality point glue adopts model, and point gum machine air pressure jumps to 0.1--0.2Mpa, and the time is controlled at 1.5--3.5s.
Above-mentioned gluing method, utilizes a kind of fixture of the clapboard group for litho machine, and this fixture comprises clamp body base, and the surrounding of this clamp body base is respectively equipped with wedge benchmark and keeps to the side, and the outside, adjacent both sides of this clamp body base is also respectively equipped with spring and register pin.
Described spring is used for providing little force.
For a fixture for the clapboard group of litho machine, its feature is, this fixture comprises clamp body base, and the surrounding of this clamp body base is respectively equipped with wedge benchmark and keeps to the side, and the outside, adjacent both sides of this clamp body base is also respectively equipped with spring and register pin.
Compared with prior art, the invention has the beneficial effects as follows:
In the middle of general gummed process, be difficult to determine glue thickness and glue area, and glue thickness and area directly affect final requirement, and in the middle of gummed, can not there be large foreign material to be mixed in gummed region, in the time that having foreign material to enter, gummed region can produce the effect of foreign material drainage, broken ring cement ratio is compared with regular shape, also likely because foreign material guiding function makes glue enter non-gummed regional effect and uses.
1, the invention solves following problem:
★ is ensuring under the prerequisite of enough gummed power, and the thickness of glue is met the requirements;
★ is ensuring under the prerequisite of enough gummed power, and the diffusion area of glue is met the requirements;
★ as much as possible makes the pollution-free or inclusion-free of clapboard cemented surface;
★ measures aperture under semi-cured state, has reduced scrappage, and the wedge group of gummed meets high-quality requirement.
2,, through the wedge group of the inventive method gummed, can guarantee that the wedge group of gummed meets photoetching requirement completely.
Brief description of the drawings
Fig. 1 is the schematic diagram of the impact of worker-house temperature on gummed part bonding quality, wherein, (a) is the distortion that ambient temperature produces higher than optical cement part temperature, is (b) distortion that ambient temperature produces lower than optical cement part temperature.
Fig. 2 is that wedge is placed in the practical view on wedge cementing jig.
Fig. 3 a is the front view to the wedge application of force.
Fig. 3 b is the vertical view to the wedge application of force.
Fig. 4 is the schematic diagram that makes cemented surface level.
Fig. 5 is gummed area schematic.
Fig. 6 is the structural representation of clapboard fixture in the present invention.
In figure: 1-the first clapboard, 2-the second clapboard, 3-cemented surface, 4-clamp body base, 5-wedge benchmark keep to the side, 7-spring, 8-register pin.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described, but should not limit the scope of the invention with this.
In order to prevent from gluing together the solution of the impact of residing worker-house temperature and humidity on gummed
Clean indoor temperature is 20～26 DEG C ± 0.1 DEG C, and humidity is 50～70%, and normal atmosphere is depressed and carried out;
1, as much as possible make the pollution-free or inclusion-free of clapboard cemented surface;
Solution
Wiping need to be more than at least ten thousand grades the clean bench of (plant laboratory meets the requirements) in toilet
While inside completing wiping, bring antistatic gloves and mouth mask, dip in upper alcohol wipe by electrostatic prevention specialty optical glass cleaning wiping cloth, in wiping process, clapboard is placed under the light of 100w and carefully watches surface dirt, until be difficult to find out dust, wiping is complete, and the good clapboard of wiping is placed in specific glassware, prevents from again polluting.
2, about the solution of gummed area and thickness
The amount of glue need to be with professional point gum machine control, and this point gum machine is the point gum machine of being controlled glue quantity by air pressure and time, and accessory and ultraviolet source inventory are as follows:
In the time operating, carry out the control of glue area with the clapboard scrapped (collapse when punching limit or edge collapse limit but angle thickness changes very little); Entered test repeatedly grope to reach a conclusion for: jump to 0.1～0.2Mpa with above-mentioned point gum machine air pressure, time is controlled at 1.5～3.5s(and determines according to the thickness of different wedges and size), under the effect without other pressure, (by himself pressure) can ensure size and the bondline thickness of gum spot.In ensureing bondline thickness, should consider that cemented surface should be surface level, for the fixture face that makes this planar horizontal carrying wedge should be contrary with wedge angle, cause the following Fig. 4 that cancels out each other:
Cause due to external cause that in order to eliminate the reasons such as vibrations cause glue thickness area change, the opposite of keeping to the side at benchmark should apply the following Fig. 3 of little force.
3, under semi-cured state, measure aperture, to reduce scrappage
For being changed, final aperture meets the requirements, the method that we adopt online Zygo VeriFire Aspheric interferometer to measure, and curing process should be divided into primary solidification and final two steps of solidifying.
Primary solidification
When glue spots drips to position, wedge presses with keeping to the side, start with ultraviolet source: Xlite 300 is transferred to suitable gear two optical fiber or single fiber glue point is carried out to suitable exposure (approximately 20～50s), wait for 5～10 minutes, take on Zygo VeriFire Aspheric interferometer and measure together with fixture, check this face face type, as meet the other side's requirement, at this moment should unload the keep to the side little force on opposite of reference edge, wait for after 5 minutes, reversion clapboard is measured one side in addition, undesirable in the time of the face of measurement, after gummed, aperture is greater than (N=1, △ N=0.3), at this moment the wedge group of methylene chloride immersion or alcohol-pickled detachable semi-solid preparation for releasable clamp, all meet the requirements when measuring two faces, after gummed, aperture is less than (N=1, △ N=0.3), enters final solidifying.
When completing after measurement all meets the requirements, primary solidification can finally solidify, final solidifying can be used ultraviolet source above-mentioned, wedge group is irradiated twice again, each 120 seconds, be spaced apart 3～5 minutes, after this process completes, the wedge group of having glued together is placed in constant temperature oven together with clapboard pedestal, after about 24 hours, again measure, glue together so successfully if met the requirements, if aperture is greater than requirement, use so specific technique (grasping) to split wedge group, gummed is until complete gummed again.After completing wedge group gummed, the wedge group that packaging glue together is placed on allows it is completely curing in constant temperature oven about one week (release slowly of this section of time stress, aperture majority is tending towards improving, n variation range is about 0.05 aperture).
Claims (3)
1. for a gluing method for the clapboard group of litho machine, it is characterized in that, the method comprises the following steps:
1. set up ultra-clean operating room and superclean bench, indoor temperature is 20～26 DEG C ± 0.1 DEG C, and humidity is that 50～70% normal atmospheres are depressed and on superclean bench, carried out gummed work;
2. at superclean bench, staff brings antistatic gloves and mouth mask, to stand-by plated film clapboard with measuring on Zygo VeriFire Aspheric interferometer, satisfactory plated film clapboard is dipped in to upper alcohol by electrostatic prevention optical glass cleaning wiping cloth and carry out wiping, in wiping process, clapboard is placed under the light of 100w and carefully watches surface dirt, until without the visible dust of human eye, wiping is complete, the good clapboard of wiping is placed in glassware, prevents from again polluting;
3. from described glassware, taking out a clapboard is called the first clapboard (1) and is placed on wedge cementing jig, the both sides that make the first clapboard are by pasting wedge benchmark on described wedge cementing jig keep to the side (5), guarantee cemented surface (3) and become level upward, then adopt point gum machine and be 0.1～0.2Mpa at air pressure, control time is controlled glue amount point glue at 1.5～3.5s to gummed region, from described glassware, take out a clapboard and be called the second clapboard (2), again the cemented surface of the second clapboard (2) is placed on the cemented surface of the first clapboard lightly, the opposite of keeping to the side at two benchmark applies certain force to described clapboard, form wedge group,
4. open ultraviolet source, with two optical fiber or single fiber, glue point is carried out to 20～50s and expose, wait for 5～10 minutes, obtain semi-curing glue jib and cotter plate group;
5. primary solidification is measured:
Described wedge group is taken on Zygo VeriFire Aspheric interferometer and measured together with wedge cementing jig, check the front face shape of wedge group, when pictograph closes designing requirement, enter step 6. face to face; When shape does not meet designing requirement, enter step 7. face to face;
6. unload the keep to the side application of force on opposite of reference edge, wait for after 5 minutes, the wedge group that upset is described, recycling Zygo VeriFire Aspheric interferometer carries out reverse side surface shape measurement, in the time that reverse side face shape does not meet designing requirement, enters step 7.; In the time that reverse side face shape meets the requirements, wedge group primary solidification is qualified, enters step 8.;
7. described wedge group is unloaded after described wedge cementing jig, by methylene chloride or alcohol-pickled described wedge group, 2. the semi-curing glue jib and cotter plate group that dismounting is described, enter step;
8. final solidifying measured:
With described ultraviolet source, the wedge group that primary solidification is qualified is irradiated to twice again, each 120 seconds, be spaced apart 3～5 minutes, wedge group is placed in constant temperature oven together with clapboard pedestal, after 22～26 hours, again measure, in the time that the face of measurement shape does not meet designing requirement, enter step 9., in the time that the face of measurement pictograph closes designing requirement, wedge group is finally solidified and is glued together successfully, is called the wedge group of having glued together, and enters step 10.;
9. adopt existing technique to split wedge group, enter step 2.;
10. the wedge group of having glued together is packed, packaged wedge group is placed in constant temperature oven more than five days, make it completely curing, stand-by after solidifying completely.
2. the gluing method of wedge group according to claim 1, is characterized in that described plated film clapboard aperture standard-required: N=1, △ N=0.3, central area N=0.2, △ N=0.1.
3. the gluing method of wedge group according to claim 1, after the gummed described in it is characterized in that, the aperture standard-required of wedge group is: N=1, △ N=0.3, the aperture N=0.5 of central area, △ N=0.5.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210368913.XA CN103091997B (en) | 2012-09-27 | 2012-09-27 | Gluing method of wedge-shaped plate group and fixture |
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| CN201210368913.XA CN103091997B (en) | 2012-09-27 | 2012-09-27 | Gluing method of wedge-shaped plate group and fixture |
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| CN103091997B true CN103091997B (en) | 2014-08-20 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103624480A (en) * | 2013-12-02 | 2014-03-12 | 上海现代先进超精密制造中心有限公司 | Punching method for wedge-shaped plate of photoetching machine |
| CN107084661B (en) * | 2017-05-11 | 2023-04-11 | 中国科学院西安光学精密机械研究所 | Structural adhesive curing stress testing device and testing method |
| CN109538771A (en) * | 2018-12-21 | 2019-03-29 | 苏州华英光电仪器有限公司 | A kind of double-sided coating butterfly plate component |
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| CN1804694A (en) * | 2006-01-11 | 2006-07-19 | 深圳市科创数字显示技术有限公司 | Making method for liquid crystal LCOS and laminating apparatus therefor |
| CN201449516U (en) * | 2009-08-20 | 2010-05-05 | 常州银河电器有限公司 | Mould for silicon slice dual-surface lithography |
| CN102098019A (en) * | 2008-12-25 | 2011-06-15 | 日本碍子株式会社 | Composite substrate and method for forming metal pattern |
| CN102687257A (en) * | 2009-11-13 | 2012-09-19 | 日立化成工业株式会社 | Semiconductor device, method for manufacturing semiconductor device, and semiconductor wafer provided with adhesive layer |
| CN202837811U (en) * | 2012-09-27 | 2013-03-27 | 上海现代先进超精密制造中心有限公司 | Gluing fixture used for wedge-shaped plate set of photoetching machine |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006198725A (en) * | 2005-01-20 | 2006-08-03 | Fuji Photo Film Co Ltd | Clamping device and image forming device |
| CN101741006A (en) * | 2008-11-26 | 2010-06-16 | 深圳世纪晶源光子技术有限公司 | Placement clamp of semiconductor laser array chip and chip placement method |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1804694A (en) * | 2006-01-11 | 2006-07-19 | 深圳市科创数字显示技术有限公司 | Making method for liquid crystal LCOS and laminating apparatus therefor |
| CN102098019A (en) * | 2008-12-25 | 2011-06-15 | 日本碍子株式会社 | Composite substrate and method for forming metal pattern |
| CN201449516U (en) * | 2009-08-20 | 2010-05-05 | 常州银河电器有限公司 | Mould for silicon slice dual-surface lithography |
| CN102687257A (en) * | 2009-11-13 | 2012-09-19 | 日立化成工业株式会社 | Semiconductor device, method for manufacturing semiconductor device, and semiconductor wafer provided with adhesive layer |
| CN202837811U (en) * | 2012-09-27 | 2013-03-27 | 上海现代先进超精密制造中心有限公司 | Gluing fixture used for wedge-shaped plate set of photoetching machine |
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