CN103090585A - Thermoelectric cooling device suitable for photoelectric device with curved-surface shape - Google Patents
Thermoelectric cooling device suitable for photoelectric device with curved-surface shape Download PDFInfo
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- CN103090585A CN103090585A CN2012105635007A CN201210563500A CN103090585A CN 103090585 A CN103090585 A CN 103090585A CN 2012105635007 A CN2012105635007 A CN 2012105635007A CN 201210563500 A CN201210563500 A CN 201210563500A CN 103090585 A CN103090585 A CN 103090585A
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- photoelectric device
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- thermoelectric cooling
- curved profile
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Abstract
The invention relates to a thermoelectric cooling device suitable for a photoelectric device with a curved-surface shape. The thermoelectric cooling device comprises a heat exchanger, multiple cooling units and two adapters, wherein the adapters are covered on a cooled photoelectric device, mutually buckled, and made of high heat conductivity materials, inner surfaces of the two mutually-buckled adapters are matched with the curve-surface shape of the cooled photoelectric device, and four outer side faces are rectangle surfaces. The cooling units are formed by series connection of single-stage semiconductor coolers or multi-stage semiconductor coolers. A cold end of the heat exchanger comprises four heat dissipation plates, and the four heat dissipation plates are fixedly connected to form a frame shape and arranged on the outer sides of the two mutually-buckled adapters. A pair of the adapters is added between the heat exchanger and the cooled photoelectric device, and as long as the inner surfaces of the adapters are matched with the outer side of the photoelectric device with the curved-surface shape, the thermoelectric cooling device can meet cooling requirements for photoelectric devices with different curved-surface shapes in various use occasions and is high in cooling efficiency.
Description
Technical field
The present invention relates to a kind of semiconductor thermoelectric refrigeration system, relate in particular to a kind of semiconductor thermoelectric refrigeration system that is applicable to the curved profile photoelectric device.
Background technology
Because semiconductor cooling device possesses friction, volume is little, quality is light, movement-less part, reliability are high, can realize the accurate function of controlling of closed loop thermal, can be widely used in dual-use field, ground and the aerospace fields such as Aero-Space, weaponry, precision instrument, medicine equipment, be particularly useful for realizing the refrigeration demand of photoelectric device such as CCD, high power laser, light emitting diode, image intensifier etc.Due to the restriction of production technology, semiconductor cooler cold junction and hot junction are the plane, are suitable for the device that chill surface is the plane is freezed.And along with the development of photoelectric device technology, the photoelectric device that many on-plane surfaces or irregular surface have occurred, as gleam image intensifier, laser diode etc., these devices need to freeze to satisfy the task user demand equally, also will adapt to simultaneously task totally to demands such as weight, power consumption, vibrations.Therefore, be necessary to research and develop a kind of refrigerating plant for curved surface packaging appearance photoelectric device.
Summary of the invention
For solving the technical problem that present chill surface is the corresponding refrigerating plant of photoelectric device shortage of on-plane surface or irregular surface, the invention provides a kind of thermoelectric cooling unit that is applicable to the curved profile photoelectric device.
Technical solution of the present invention is as follows:
A kind of thermoelectric cooling unit that is applicable to the curved profile photoelectric device comprises heat exchanger, a plurality of refrigeration unit, and its special character is:
Also comprise two adapters 2 that relatively fasten that are coated on cooled photoelectric device; The material of described adapter is high thermal conductivity material;
The curved profile of described two adapter inner surfaces that relatively fasten and cooled photoelectric device is suitable, and its four lateral surfaces are square surface;
Described refrigeration unit is that single-stage semiconductor cooler or Multi-Stage Semiconductor Cooler are in series;
Described heat exchanger cold junction comprises four heat sinks; Described four heat sinks are fixed into shaped as frame and are positioned at two adapter outsides that relatively fasten;
The quantity of described refrigeration unit is at least four, and described four heat sinks are pressed on the cold junction of a plurality of semiconductor refrigeratings unit four lateral surfaces of two adapters that relatively fasten, and the hot junction and heat sink applying of semiconductor refrigerating unit.
Above-mentioned four heat sinks are oppositely arranged and adopt fastener locking in twos.
Also comprise the heat filling or heat conduction rubber cushion or the heat-conducting metal paper tinsel that are arranged between adapter and cooled photoelectric device.
Also comprise the heat filling or heat conduction rubber cushion or the heat-conducting metal paper tinsel that are arranged between semiconductor cooler hot junction and heat sink.
Also comprise the heat-conducting silicon rubber that is arranged between adapter and semiconductor cooler cold junction.
Above-mentioned heat exchanger hot junction is the logical liquid formula structure of flat, rib-type or center via hole.
Fastening by fastener and cooled photoelectric device between above-mentioned two adapters.
The material of above-mentioned adapter comprises red copper, aluminium alloy, magnadure, graphite composite material.
Beneficial effect of the present invention:
1, the present invention adds a pair of adapter between heat exchanger and cooled photoelectric device, as long as inner surface and the curved profile photoelectric device lateral surface of adapter are complementary, just can satisfy different curve profile photoelectric device in the refrigeration demand of various use occasions, refrigerating efficiency is high, can realize accurate refrigeration, applicable to multiple use occasions such as space, ground, Various Seasonal, installation, dismounting, easy to maintenance, replaceability, maintenanceability, compatible good.
2, the present invention adopts the thermoelectric cooling mode, vibration and the noise problem of having avoided the conventional mechanical refrigeration modes to bring, and the huge problem of volume and weight.
3, the mode that the present invention adopts that adapter and adapter clip fasten, heat sink and heat sink are fixedly clamped, both guaranteed the validity and the adequacy that fix to clamp, the problem that the leakage heat that also having avoided directly is connected the cold and hot end of refrigerator in the past brings increases has effectively improved refrigerating efficiency.
4, heat exchanger of the present invention comprises four blocks of heat sinks, and the hot junction that heat sink is close to semiconductor cooler arranges, and heat sink vertically steps up semiconductor cooler from the four sides in twos, and two blocks of heat sinks that are parallel to each other are locked with securing member.Heat sink has refrigerator in heat radiation and fixedly steps up to act on, and is conducive to realize assembling, dismounting and the replacing of semiconductor cooler, adapter, heat exchanger assembly, simple operation, easy to maintenance.
5, the present invention is except the cold junction adapter, and semiconductor cooler and heat exchanger all can according to the difference of refrigeration object and cryogenic temperature, refrigerating capacity and environment for use, carry out adaptive change.As under the AEROSPACE APPLICATION environment, the heat exchanger radiating end can coordinate with heat pipe, radiation refrigerator, with the hot junction heat dissipation to the cosmic space.In the ground experiment chamber or the outdoor test occasion, hot end heat exchanger can be made into rib-type, the logical liquid formula of center via hole etc., by air-cooled or liquid cooling mode with the hot junction heat dissipation to low temperature environment.
Description of drawings
Fig. 1 is that the present invention and outer surface are the assembly drawing of the cooled photoelectric device on the face of cylinder.
The specific embodiment
As shown in Figure 1, cooled photoelectric device is cylindrical, and its end face is that transparent surface can not add refrigerator, refrigerator can only be fixed on the face of cylinder and freeze.But existing refrigerator can only freeze to the device that chill surface is the plane.
For this reason, the present invention has added a pair of adapter between refrigerator and cooled photoelectric device, adapter is wrapped on cooled photoelectric device from both sides, and the chill surface of its inner surface and cooled photoelectric device is suitable, and its outer surface is that plane and refrigerator cold end surface are suitable.Fastening by fastener and cooled photoelectric device between adapter.
Be vibration and the noise problem of avoiding the conventional mechanical refrigeration modes to bring, and the huge problem of volume and weight, the refrigerator that the present invention selects is semiconductor cooler.
Have 30 refrigeration units in figure, each refrigeration unit is made of the series connection of two-stage semiconductor cooler device.
At refrigeration unit arranged outside heat exchanger, heat exchanger comprises four blocks of heat sinks, and the hot junction that heat sink is close to the outer semiconductor refrigerator arranges, and heat sink vertically clamps semiconductor cooler from the four sides in twos, and two blocks of heat sinks that parallel are locked with securing member.
Semiconductor cooler and heat exchanger all can according to the difference of refrigeration object and cryogenic temperature, refrigerating capacity and environment for use, carry out adaptive change.
Semiconductor cooler can adopt single-stage, secondary or plural serial stage or parallel connection, and AL can be adopted in its surface
2O
3ALN PeO etc. multiple ceramic surface or metal surface such as Cu the semiconductor cooling device on the surface such as Al.
Under the AEROSPACE APPLICATION environment, the heat exchanger radiating end can coordinate with heat pipe, radiation refrigerator, with the hot junction heat dissipation to the cosmic space.In the ground experiment chamber or the outdoor test occasion, hot end heat exchanger can be made into rib-type, the logical liquid formula of center via hole etc., by air-cooled or liquid cooling mode with the hot junction heat dissipation to low temperature environment.
Heat filling or heat conduction rubber cushion or heat-conducting metal paper tinsel can be set between adapter and cooled photoelectric device.Between adapter and semiconductor cooler cold junction, heat-conducting silicon rubber can be set.Heat filling or heat conduction rubber cushion or heat-conducting metal paper tinsel can be set between semiconductor cooler hot junction and heat exchanger.
The material of adapter can be selected red copper, aluminium alloy, graphite composite material etc.
The material of heat sink satisfy structural strength and rigidity higher in, its requirement to thermal conductivity is also higher, on the one hand can be fixed clamping to the semiconductor cooler that is parallel to each other, and also satisfies simultaneously the demand of heat radiation.
Claims (8)
1. a thermoelectric cooling unit that is applicable to the curved profile photoelectric device, comprise heat exchanger, a plurality of refrigeration unit, it is characterized in that:
Also comprise two adapters that relatively fasten that are coated on cooled photoelectric device; The material of described adapter is high thermal conductivity material;
The curved profile of described two adapter inner surfaces that relatively fasten and cooled photoelectric device is suitable, and its four lateral surfaces are square surface;
Described refrigeration unit is that single-stage semiconductor cooler or Multi-Stage Semiconductor Cooler are in series;
Described heat exchanger cold junction comprises four heat sinks; Described four heat sinks are fixed into shaped as frame and are positioned at two adapter outsides that relatively fasten;
The quantity of described refrigeration unit is at least four, and described four heat sinks are pressed on the cold junction of a plurality of semiconductor refrigeratings unit four lateral surfaces of two adapters that relatively fasten, and the hot junction and heat sink applying of semiconductor refrigerating unit.
2. the thermoelectric cooling unit that is applicable to the curved profile photoelectric device according to claim 1 is characterized in that: described four heat sinks are oppositely arranged and adopt fastener locking in twos.
3. the thermoelectric cooling unit that is applicable to the curved profile photoelectric device according to claim 1 and 2, is characterized in that: also comprise the heat filling or heat conduction rubber cushion or the heat-conducting metal paper tinsel that are arranged between adapter and cooled photoelectric device.
4. the thermoelectric cooling unit that is applicable to the curved profile photoelectric device according to claim 3, is characterized in that: also comprise the heat filling or heat conduction rubber cushion or the heat-conducting metal paper tinsel that are arranged between semiconductor cooler hot junction and heat sink.
5. the thermoelectric cooling unit that is applicable to the curved profile photoelectric device according to claim 4, is characterized in that: also comprise the heat-conducting silicon rubber that is arranged between adapter and semiconductor cooler cold junction.
6. the thermoelectric cooling unit that is applicable to the curved profile photoelectric device according to claim 5 is characterized in that: described heat exchanger hot junction is flat, rib-type or the logical liquid formula structure of center via hole.
7. the thermoelectric cooling unit that is applicable to the curved profile photoelectric device according to claim 6, is characterized in that: fastening by fastener and cooled photoelectric device between described two adapters.
8. the thermoelectric cooling unit that is applicable to the curved profile photoelectric device according to claim 7, it is characterized in that: the material of described adapter comprises red copper, aluminium alloy, magnadure, graphite composite material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105635007A CN103090585A (en) | 2012-12-21 | 2012-12-21 | Thermoelectric cooling device suitable for photoelectric device with curved-surface shape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105635007A CN103090585A (en) | 2012-12-21 | 2012-12-21 | Thermoelectric cooling device suitable for photoelectric device with curved-surface shape |
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| Publication Number | Publication Date |
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| CN103090585A true CN103090585A (en) | 2013-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012105635007A Pending CN103090585A (en) | 2012-12-21 | 2012-12-21 | Thermoelectric cooling device suitable for photoelectric device with curved-surface shape |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4134685A1 (en) * | 1991-10-21 | 1993-04-22 | Univ Dresden Tech | Peltier cooling module for curved surfaces - has N and P conductivity cooling limbs in parallel rows between flexible carrier and cover plate strips |
| JP2004153128A (en) * | 2002-10-31 | 2004-05-27 | Matsushita Refrig Co Ltd | Thermoelectric module |
| CN1711449A (en) * | 2002-12-02 | 2005-12-21 | 派尔技术有限公司 | Integrated thermoelectric module |
| CN2779623Y (en) * | 2005-02-04 | 2006-05-10 | 林昌亮 | Refrigeration chip structure for facilitating installation of curved surface |
| CN203132200U (en) * | 2012-12-21 | 2013-08-14 | 中国科学院西安光学精密机械研究所 | Thermoelectric cooling device applicable to curved-shape optoelectronic device |
-
2012
- 2012-12-21 CN CN2012105635007A patent/CN103090585A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4134685A1 (en) * | 1991-10-21 | 1993-04-22 | Univ Dresden Tech | Peltier cooling module for curved surfaces - has N and P conductivity cooling limbs in parallel rows between flexible carrier and cover plate strips |
| JP2004153128A (en) * | 2002-10-31 | 2004-05-27 | Matsushita Refrig Co Ltd | Thermoelectric module |
| CN1711449A (en) * | 2002-12-02 | 2005-12-21 | 派尔技术有限公司 | Integrated thermoelectric module |
| CN2779623Y (en) * | 2005-02-04 | 2006-05-10 | 林昌亮 | Refrigeration chip structure for facilitating installation of curved surface |
| CN203132200U (en) * | 2012-12-21 | 2013-08-14 | 中国科学院西安光学精密机械研究所 | Thermoelectric cooling device applicable to curved-shape optoelectronic device |
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Application publication date: 20130508 |