CN203173117U - Multiple-stage water cooling type semiconductor refrigerating air conditioner transport case - Google Patents
Multiple-stage water cooling type semiconductor refrigerating air conditioner transport case Download PDFInfo
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- CN203173117U CN203173117U CN 201320110708 CN201320110708U CN203173117U CN 203173117 U CN203173117 U CN 203173117U CN 201320110708 CN201320110708 CN 201320110708 CN 201320110708 U CN201320110708 U CN 201320110708U CN 203173117 U CN203173117 U CN 203173117U
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Abstract
The utility model discloses a multiple-stage water cooling type semiconductor refrigerating air conditioner transport case. A first-stage cooling radiator (1), a first-stage cooling water pump (7) and a first-stage semiconductor refrigerator (4) are connected through a first-stage cooling water pipe (5). A first-stage cooling fan (2) is installed on the first-stage cooling radiator (1). A first-stage compensation cooling water tank (3) is connected with the first-stage cooling radiator (1) through a pipeline. First-stage cooling water (6) is filled in a first-stage radiating circuit. A refrigerating radiator (8), a refrigerating water pump (14) and the first-stage semiconductor refrigerator (4) are connected through a refrigerating water pipe (13). Cooling water (12) is filled in a refrigerating circuit. The refrigerating radiator (8) is arranged in the transport case (9). The multiple-stage water cooling type semiconductor refrigerating air conditioner transport case comprises water cooling type semiconductor refrigerating air conditioner transport cases of the first stage, the second stage, the third stage and more stages and is used for carrying refrigerating equipment along with the transport case, transporting live fish and fries without water and keeping the live fish and the fries alive and transporting biochemical preparations.
Description
Technical field
The present invention relates to the refrigeration air-conditioner carrying case, be specifically related to multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case.
Background technology
When the refrigeration air-conditioner carrying case is used the mechanical type air conditioner refrigerating; mechanical refrigerant compression is confidential carries with carrying case; because refrigerating compressor is heavier and volume is bigger; have the weak point that is not easy to carry with case the refrigerating apparatus transportation, and the vibration noise of refrigerating compressor influences waterless keep-alive transport of living fish, fry under the dormant state.
Summary of the invention
The object of the invention is: a kind of multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case is provided; alleviate weight and the vibration noise of refrigerating apparatus in the refrigeration air-conditioner carrying case; reduce the volume of refrigerating apparatus, be used for carrying refrigerating apparatus waterless keep-alive transport of living fish, fry and transportation biochemical preparation with case.
In the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case of the present utility model, multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case has one-level, secondary, three grades and multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case more.
In the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case of the present utility model, one-level water cooled semiconductor refrigerating air-conditioning carrying case has a semiconductor cooler, secondary water cooled semiconductor refrigerating air-conditioning carrying case has two semiconductor coolers, three grades of water cooled semiconductor refrigerating air-conditioning carrying cases have three semiconductor coolers, and by that analogy, more multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case has more semiconductor coolers, and the progression of multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case is identical with the quantity of semiconductor cooler.
In the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case of the present utility model, the semiconductor cooler of one-level water cooled semiconductor refrigerating air-conditioning carrying case is called first order semiconductor cooler, two semiconductor coolers of secondary water cooled semiconductor refrigerating air-conditioning carrying case are called first order semiconductor cooler and second stage semiconductor cooler, three semiconductor coolers of three grades of water cooled semiconductor refrigerating air-conditioning carrying cases are called the first order, the second stage and third stage semiconductor cooler, and by that analogy, obtain the name of each semiconductor cooler in the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case more.
Technical solution of the present utility model: freeze with semiconductor chilling plate, water is heat transfer medium, after being delivered to cooling radiator, distributes the heat in the semiconductor chilling plate hot junction of first order semiconductor cooler, simultaneously, the cold junction of the semiconductor chilling plate of first order semiconductor cooler also is medium with water, absorb the heat in the semiconductor chilling plate hot junction of second stage semiconductor cooler, the cold junction of the semiconductor chilling plate of second stage semiconductor cooler also is medium with water, absorb the heat in the semiconductor chilling plate hot junction of third stage semiconductor cooler, by that analogy, the cold junction of the semiconductor chilling plate of afterbody semiconductor cooler is medium with water, by the heat in the refrigeration and heat radiator absorption carrying case,, make the carrying case refrigeration air-conditioner.
In the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case of the present utility model, one-level water cooled semiconductor refrigerating air-conditioning carrying case comprises first order cooling radiator, first order cooling fan, first order compensation coolant storage tank, first order semiconductor cooler, first order cooling water pipe, first order cooling water expansion tank, first order cooling water pump, refrigeration and heat radiator, carrying case, the compensation refrigeration water tank, chilled water, refrigeration water pipe and refrigeration water pump, wherein, first order cooling radiator, first order cooling fan, first order compensation coolant storage tank, first order semiconductor cooler, first order cooling water pipe, first order cooling water expansion tank and first order cooling water pump are formed first order cooling system, refrigeration and heat radiator, carrying case, the compensation refrigeration water tank, chilled water, refrigeration water pipe and refrigeration water pump are formed refrigeration system, first order cooling radiator, first order cooling water pump, first order semiconductor cooler links to each other by first order cooling water pipe, first order cooling fan is contained on the first order cooling radiator, first order compensation coolant storage tank links to each other with first order cooling radiator by pipeline, first order compensation coolant storage tank, first order cooling radiator, first order cooling water pipe, first order cooling water pump, in the first order heat-radiation loop that first order semiconductor cooler forms first order cooling water expansion tank is housed, refrigeration and heat radiator, the refrigeration water pump, first order semiconductor cooler links to each other by the refrigeration water pipe, the compensation refrigeration water tank links to each other with the refrigeration water pipe, the compensation refrigeration water tank, refrigeration and heat radiator, the refrigeration water pipe, the refrigeration water pump, in the refrigerating circuit that first order semiconductor cooler forms chilled water is housed, refrigeration and heat radiator is contained in the carrying case, and carrying case is insulation can.
In the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case of the present utility model, secondary water cooled semiconductor refrigerating air-conditioning carrying case is to increase second stage cooling system to form between first order cooling system and refrigeration system, second stage cooling system comprises second stage compensation coolant storage tank, second stage semiconductor cooler, second stage cooling water pump, second stage cooling water expansion tank and second stage cooling water pipe, second stage semiconductor cooler, second stage cooling water pump links to each other with first order semiconductor cooler by second stage cooling water pipe, second stage compensation coolant storage tank links to each other with second stage cooling water pipe, second stage compensation coolant storage tank, second stage semiconductor cooler, second stage cooling water pump, second stage cooling water pipe, second stage cooling water expansion tank is housed, second stage semiconductor cooler in the second stage heat-radiation loop that first order semiconductor cooler forms, refrigeration and heat radiator, the refrigeration water pump, link to each other by the refrigeration water pipe.
In the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case of the present utility model, three grades of water cooled semiconductor refrigerating air-conditioning carrying cases are to increase third stage cooling system to form between second stage cooling system and refrigeration system, third stage cooling system comprises third stage compensation coolant storage tank, third stage semiconductor cooler, third stage cooling water pump, third stage cooling water expansion tank and third stage cooling water pipe, third stage semiconductor cooler, third stage cooling water pump links to each other with second stage semiconductor cooler by third stage cooling water pipe, third stage compensation coolant storage tank links to each other with third stage cooling water pipe, third stage compensation coolant storage tank, third stage semiconductor cooler, third stage cooling water pump, third stage cooling water pipe, third stage cooling water expansion tank is housed, third stage semiconductor cooler in the third stage heat-radiation loop that second stage semiconductor cooler forms, refrigeration and heat radiator, the refrigeration water pump, link to each other by the refrigeration water pipe.
In the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case of the present utility model, more the constructive method of multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case is to increase the one-level cooling system to form between previous stage cooling system and refrigeration system, secondary water cooled semiconductor refrigerating air-conditioning carrying case is to increase second stage cooling system to form between first order cooling system and refrigeration system, three grades of water cooled semiconductor refrigerating air-conditioning carrying cases are to increase third stage cooling system to form between second stage cooling system and refrigeration system, and by that analogy, constitute more multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case.
In the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case of the present utility model, first order semiconductor cooler comprises radiator-water box, L type adapter plate, the bolt of fixing plate assembly, the water tank bolt assembly, the water of radiation case lid, U-shaped adapter plate, lagging jacket, semiconductor chilling plate, refrigeration water tank, the chilled water case lid, semiconductor chilling plate cold, the hot junction is close to respectively on refrigeration water tank and the radiator-water box, lagging jacket wraps on the outside face of refrigeration water tank, U-shaped adapter plate connects by the bolt of fixing plate assembly with L type adapter plate, the two ends of refrigeration water tank and radiator-water box by the water tank bolt assembly respectively with the chilled water case lid, the water of radiation case lid connects, seal with sealant between refrigeration water tank and the chilled water case lid, seal with sealant between radiator-water box and the water of radiation case lid, first order cooling water expansion tank is housed in the radiator-water box, chilled water is housed in the refrigeration water tank.
In the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case of the present utility model, the structure of semiconductor coolers at different levels is identical or similar, first order semiconductor cooler is identical or similar with the structure of second stage semiconductor cooler, second stage semiconductor cooler is identical or similar with the structure of third stage semiconductor cooler, and by that analogy, obtain the structure of semiconductor coolers at different levels in the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case more.
In the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case of the present utility model, the water of radiation case lid of first order semiconductor cooler connects with first order cooling water pipe, the water of radiation case lid of second stage semiconductor cooler connects with second stage cooling water pipe, the water of radiation case lid of third stage semiconductor cooler connects with third stage cooling water pipe, and by that analogy, obtain the connection structure of semiconductor coolers at different levels in the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case more, the chilled water case lid of afterbody semiconductor cooler connects with the refrigeration water pipe.
In the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case of the present utility model, each electricity consumption device and corresponding control circuit thereof are by storage battery or the power supply of other power equipment supply.
The beneficial effects of the utility model:
1. the mechanical refrigerating compressor of weight ratio of semiconductor cooler in light weight in the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case, volume is little, is convenient to carry the refrigerating apparatus transportation with case.
2. the coefficient of thermal conductivity of water is big, make the refrigerating efficiency of multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case and refrigerating efficiency and the refrigeration air-conditioner ability height of refrigeration air-conditioner energy force rate air cooling type semiconductor refrigerating air-conditioning, temperature in the carrying case is low, the progression of cooling system is more many, temperature in the carrying case is more low, and the requirement of carrying case to low temperature is content with very little.
3. in the waterless keep-alive transport of living fish; live fish is in dormant state; the transportation environment that needs peace and quiet; multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case does not have the vibration noise of mechanical refrigeration compressors; be conducive to waterless keep-alive transport of living fish, fry under the dormant state, this also is that the refrigerated air-conditioning system of present mechanical refrigeration compressors is irreplaceable.
4. the structure of semiconductor coolers at different levels is identical or similar, is convenient to the manufacturing of multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case.
Description of drawings
Fig. 1 is one-level water cooled semiconductor refrigerating air-conditioning carrying case.
Fig. 2 is secondary water cooled semiconductor refrigerating air-conditioning carrying case.
Fig. 3 is three grades of water cooled semiconductor refrigerating air-conditioning carrying cases.
Fig. 4 is the front view of first order semiconductor cooler.
Fig. 5 is the left view of Fig. 4.
Fig. 6 is the birds-eye view of Fig. 4.
Among the figure: 1 first order cooling radiator; 2 first order cooling fans; 3 first order compensation coolant storage tank; 4 first order semiconductor coolers; 5 first order cooling water pipes; 6 first order cooling water expansion tanks; 7 first order cooling water pumps; 8 refrigeration and heat radiators; 9 carrying cases; 10 biochemical preparations; 11 compensation refrigeration water tank; 12 chilled water; 13 refrigeration water pipes; 14 refrigeration water pumps; 15 second stage compensation coolant storage tank; 16 fishes; 17 second stage semiconductor coolers; 18 second stage cooling water pumps; 19 second stage cooling water expansion tanks; 20 second stage cooling water pipes; 21 third stage compensation coolant storage tank; 22 third stage semiconductor coolers; 23 third stage cooling water pumps; 24 third stage cooling water expansion tanks; 25 third stage cooling water pipes; 26 radiator-water boxs; 27L type adapter plate; 28 bolt of fixing plate assemblies; 29 water tank bolt assemblies; 30 water of radiation case lids; 31U type adapter plate; 32 lagging jacket; 33 semiconductor chilling plates; 34 refrigeration water tank; 35 chilled water case lids.
The specific embodiment
Multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case is shown in Fig. 1～6.
Embodiment 1: one-level water cooled semiconductor refrigerating air-conditioning carrying case.
One-level water cooled semiconductor refrigerating air-conditioning carrying case comprises first order cooling radiator 1, first order cooling fan 2, first order compensation coolant storage tank 3, first order semiconductor cooler 4, first order cooling water pipe 5, first order cooling water expansion tank 6, first order cooling water pump 7, refrigeration and heat radiator 8, carrying case 9, compensation refrigeration water tank 11, chilled water 12, refrigeration water pipe 13 and refrigeration water pump 14, wherein, first order cooling radiator 1, first order cooling fan 2, first order compensation coolant storage tank 3, first order semiconductor cooler 4, first order cooling water pipe 5, first order cooling water expansion tank 6 and first order cooling water pump 7 are formed first order cooling system, refrigeration and heat radiator 8, carrying case 9, compensation refrigeration water tank 11, chilled water 12, refrigeration water pipe 13 and refrigeration water pump 14 are formed refrigeration system; First order cooling radiator 1, first order cooling water pump 7, first order semiconductor cooler 4 links to each other by first order cooling water pipe 5, first order cooling fan 2 is contained on the first order cooling radiator 1, first order cooling fan 2 is used for the heat radiation of first order cooling radiator 1, first order compensation coolant storage tank 3 links to each other with first order cooling radiator 1 by pipeline, first order compensation coolant storage tank 3 is used for the first order cooling water expansion tank 6 of compensation first order cooling system, first order compensation coolant storage tank 3, first order cooling radiator 1, first order cooling water pipe 5, first order cooling water pump 7, in the first order heat-radiation loop that first order semiconductor cooler 4 forms first order cooling water expansion tank 6 is housed, refrigeration and heat radiator 8, refrigeration water pump 14, first order semiconductor cooler 4 links to each other by refrigeration water pipe 13, compensation refrigeration water tank 11 links to each other with refrigeration water pipe 13, compensation refrigeration water tank 11 is used for compensation refrigeration system chilled water 12, compensation refrigeration water tank 11, refrigeration and heat radiator 8, refrigeration water pipe 13, refrigeration water pump 14, in the refrigerating circuit that first order semiconductor cooler 4 forms chilled water 12 is housed, refrigeration and heat radiator 8 is contained in the carrying case 9, carrying case 9 is insulation can, and refrigeration and heat radiator 8 is used for absorbing the heat of carrying case 9; First order cooling water expansion tank 6 and chilled water 12 are the medium that heat is transmitted; One-level water cooled semiconductor refrigerating air-conditioning carrying case is used for low temperature transportation biochemical preparation 10, places biochemical preparation 10 in the carrying case 9.
Embodiment 2: secondary water cooled semiconductor refrigerating air-conditioning carrying case.
Secondary water cooled semiconductor refrigerating air-conditioning carrying case comprises first order cooling radiator 1, first order cooling fan 2, first order compensation coolant storage tank 3, first order semiconductor cooler 4, first order cooling water pipe 5, first order cooling water expansion tank 6, first order cooling water pump 7, refrigeration and heat radiator 8, carrying case 9, compensation refrigeration water tank 11, chilled water 12, refrigeration water pipe 13, refrigeration water pump 14, second stage compensation coolant storage tank 15, second stage semiconductor cooler 17, second stage cooling water pump 18, second stage cooling water expansion tank 19 and second stage cooling water pipe 20; Secondary water cooled semiconductor refrigerating air-conditioning carrying case is to increase second stage cooling system to form between first order cooling system and refrigeration system, second stage cooling system is used for improving refrigeration intensity, second stage cooling system comprises second stage compensation coolant storage tank 15, second stage semiconductor cooler 17, second stage cooling water pump 18, second stage cooling water expansion tank 19 and second stage cooling water pipe 20, second stage semiconductor cooler 17, second stage cooling water pump 18 links to each other with first order semiconductor cooler 4 by second stage cooling water pipe 20, second stage compensation coolant storage tank 15 links to each other with second stage cooling water pipe 20, second stage compensation coolant storage tank 15, second stage semiconductor cooler 17, second stage cooling water pump 18, second stage cooling water pipe 20, second stage cooling water expansion tank 19 is housed, second stage semiconductor cooler 17 in the second stage heat-radiation loop that first order semiconductor cooler 4 forms, refrigeration and heat radiator 8, refrigeration water pump 14, link to each other by refrigeration water pipe 13; Secondary water cooled semiconductor refrigerating air-conditioning carrying case is used for waterless keep-alive transport of living fish, fry, and fish 16 is arranged in the carrying case 9.
3: three grades of water cooled semiconductor refrigeratings of embodiment air-conditioning carrying case.
In the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case of the present utility model, three grades of water cooled semiconductor refrigerating air-conditioning carrying cases comprise first order cooling radiator 1, first order cooling fan 2, first order compensation coolant storage tank 3, first order semiconductor cooler 4, first order cooling water pipe 5, first order cooling water expansion tank 6, first order cooling water pump 7, refrigeration and heat radiator 8, carrying case 9, compensation refrigeration water tank 11, chilled water 12, refrigeration water pipe 13, refrigeration water pump 14, second stage compensation coolant storage tank 15, second stage semiconductor cooler 17, second stage cooling water pump 18, second stage cooling water expansion tank 19, second stage cooling water pipe 20, third stage compensation coolant storage tank 21, third stage semiconductor cooler 22, third stage cooling water pump 23, third stage cooling water expansion tank 24 and third stage cooling water pipe 25; Three grades of water cooled semiconductor refrigerating air-conditioning carrying cases are to increase third stage cooling system to form between second stage cooling system and refrigeration system, third stage cooling system is used for further improving refrigeration intensity, third stage cooling system comprises third stage compensation coolant storage tank 21, third stage semiconductor cooler 22, third stage cooling water pump 23, third stage cooling water expansion tank 24 and third stage cooling water pipe 25, third stage semiconductor cooler 22, third stage cooling water pump 23 links to each other with second stage semiconductor cooler 17 by third stage cooling water pipe 25, third stage compensation coolant storage tank 21 links to each other with third stage cooling water pipe 25, third stage compensation coolant storage tank 21, third stage semiconductor cooler 22, third stage cooling water pump 23, third stage cooling water pipe 25, third stage cooling water expansion tank 24 is housed, third stage semiconductor cooler 22 in the third stage heat-radiation loop that second stage semiconductor cooler 17 forms, refrigeration and heat radiator 8, refrigeration water pump 14, link to each other by refrigeration water pipe 13; Three grades of water cooled semiconductor refrigerating air-conditioning carrying cases are used for more low temperature transportation biochemical preparation 10, and placing in the carrying case 9 needs the more biochemical preparation 10 of low temperature transportation, as enzyme preparation, freeze dried vaccine.
In multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case, more the constructive method of multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case is to increase the one-level cooling system to form between previous stage cooling system and refrigeration system, secondary water cooled semiconductor refrigerating air-conditioning carrying case is to increase second stage cooling system to form between first order cooling system and refrigeration system, three grades of water cooled semiconductor refrigerating air-conditioning carrying cases are to increase third stage cooling system to form between second stage cooling system and refrigeration system, and by that analogy, adopt the multistage cooling system method of combination in order, constitute more multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case.
In multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case, first order semiconductor cooler 4 comprises radiator-water box 26; L type adapter plate 27; Bolt of fixing plate assembly 28; Water tank bolt assembly 29; Water of radiation case lid 30; U-shaped adapter plate 31; Lagging jacket 32; Semiconductor chilling plate 33; Refrigeration water tank 34; Chilled water case lid 35; After semiconductor chilling plate 33 energisings, an end of semiconductor chilling plate 33 is cold and the other end is warm, is used for refrigeration; The cool and heat ends of semiconductor chilling plate 33 is close to respectively on the refrigeration water tank 34 and radiator-water box 26 of aluminum alloy, refrigeration water tank 34 is in refrigerating circuit, be used for receiving the cold of semiconductor chilling plate 33 cold junctions, radiator-water box 26 is used for receiving the heat in semiconductor chilling plate 33 hot junctions on heat-radiation loop; Lagging jacket 32 wraps on the outside face of refrigeration water tank 34, is used for the insulation of refrigeration water tank 34; U-shaped adapter plate 31 and L type adapter plate 27 connect by bolt of fixing plate assembly 28, are used for semiconductor chilling plate 33, lagging jacket 32, refrigeration water tank 34, radiator-water box 26 are fixed together; The two ends of refrigeration water tank 34 and radiator-water box 26 connect with chilled water case lid 35, water of radiation case lid 30 respectively by water tank bolt assembly 29, seal with sealant between refrigeration water tank 34 and the chilled water case lid 35, with the sealant sealing, prevent from leaking between radiator-water box 26 and the water of radiation case lid 30; Radiator-water box 26 first order cooling water expansion tanks 6 are equipped with chilled water 12 in the refrigeration water tank 34.
In multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case, the structure of semiconductor coolers at different levels is identical or similar, first order semiconductor cooler 4 is identical or similar with the structure of second stage semiconductor cooler 17, second stage semiconductor cooler 17 is identical or similar with the structure of third stage semiconductor cooler 22, and by that analogy, obtain the structure of semiconductor coolers at different levels in the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case more.
In multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case, the water of radiation case lid 30 of first order semiconductor cooler 4 connects with first order cooling water pipe 5, the water of radiation case lid of second stage semiconductor cooler 17 connects with second stage cooling water pipe 20, the water of radiation case lid of third stage semiconductor cooler 22 connects with third stage cooling water pipe 25, and by that analogy, obtain the connection structure of semiconductor coolers at different levels in the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case more, the chilled water case lid of afterbody semiconductor cooler connects with refrigeration water pipe 13.
In multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case, each electricity consumption device and corresponding control circuit thereof are by storage battery or the power supply of other power equipment supply.
The principle of work of multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case: after the energising of multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case, one end cold-peace other end heat of semiconductor chilling plate 33, refrigeration water pump 14 makes the chilled water 12 in the refrigerating circuit circulate along the direction of arrow among the figure, chilled water 12 flows through refrigeration water tank 34, the heat of chilled water 12 in the cold junction absorption refrigeration water tank 34 of semiconductor chilling plate 33, make chilled water 12 coolings in the refrigeration water tank 34, chilled water 12 flows through refrigeration and heat radiator 8 through refrigeration water pipe 13 in the refrigeration water tank 34 after the cooling, the heat that chilled water 12 in the refrigeration and heat radiator 8 absorbs in the carrying case 9, make the interior cooling of casing of carrying case 9, also make biochemical preparation 10 or fish 16 coolings in the carrying case 9; The quantity of the semiconductor chilling plate 33 by control participation work realizes refrigeration air-conditioner in the casing of carrying case 9; In first order cooling system, first order cooling water pump 7 makes the first order cooling water expansion tank 6 in the first order cooling system circulate along the direction of arrow among the figure, first order cooling water expansion tank 6 flows through the radiator-water box 26 of first order cooling system, the hot junction of semiconductor chilling plate 33 is with the first order cooling water expansion tank 6 in the heat transferred radiator-water box 26, first order cooling water expansion tank 6 in the radiator-water box 26 flows through first order cooling radiator 1 through first order cooling water pipe 5, with heat transferred first order cooling radiator 1, the distinguished and admirable first order cooling radiator 1 of crossing of first order cooling fan 2, distribute the heat of the first order cooling water expansion tank 6 in the first order cooling radiator 1, thereby the refrigeration work that guarantees the semiconductor chilling plate 33 in the first order semiconductor cooler 4 is normal; In the cooling system of the second stage, second stage cooling water pump 18 makes the second stage cooling water expansion tank 19 in the cooling system of the second stage circulate along the direction of arrow among the figure, second stage cooling water expansion tank 19 flows through the radiator-water box of second stage cooling system, the hot junction of semiconductor chilling plate is with the second stage cooling water expansion tank 19 in the heat transferred radiator-water box, second stage cooling water expansion tank 19 in the radiator-water box flows through the refrigeration water tank 34 of first order semiconductor cooler 4 through second stage cooling water pipe 20, the cold junction of the semiconductor chilling plate 33 of first order semiconductor cooler 4 absorbs the heat of the refrigeration water tank 34 of first order semiconductor cooler 4, thereby the refrigeration work that guarantees the semiconductor chilling plate 33 in the first order semiconductor cooler 4 is normal, simultaneously, make the temperature of second stage cooling water expansion tank 19 be lower than the temperature of first order cooling water expansion tank 6; The principle of work of third stage cooling system is identical with the principle of work of second stage cooling system, and by that analogy, principle of work greater than the cooling systems at different levels of secondary is identical, and reduce the temperature of cooling water expansion tank in the cooling systems at different levels step by step, making at last has very low temperature in the carrying case 9, realize the refrigeration air-conditioner of multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case.
When first order semiconductor cooler 4 uses the semiconductor chilling plate of 8 TEC1-12708; be under 25 ℃ at ambient air temperature; through test; temperature in the refrigeration water tank 34 of first order semiconductor cooler 4 can reach 3～4 ℃; temperature in the refrigeration water tank of second stage semiconductor cooler 17 is lower; through waterless keep-alive transport of living fish, fry and the test of transportation biochemical preparation, multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case can satisfy waterless keep-alive transport of living fish, fry and transportation biochemical preparation to the requirement of low temperature in the casing.
In embodiment 1, one-level water cooled semiconductor refrigerating air-conditioning carrying case also can the waterless keep-alive transport of living fish, fry; In embodiment 2, secondary water cooled semiconductor refrigerating air-conditioning carrying case also can transport biochemical preparation; In embodiment 3, three grades of water cooled semiconductor refrigerating air-conditioning carrying cases also can the waterless keep-alive transport of living fish, fry; Carrying case 9 is transportation biochemical preparation or waterless keep-alive transport of living fish, fry, depends on biochemical preparation, live fish and fry to the requirement of temperature in the carrying case 9, and embodiment should not be construed as the restriction to technical solution.
Claims (7)
1. multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case, it is characterized in that: multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case has one-level, secondary, three grades and multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case more, and the progression of multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case is identical with the quantity of semiconductor cooler.
2. multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case according to claim 1, it is characterized in that: one-level water cooled semiconductor refrigerating air-conditioning carrying case comprises first order cooling radiator (1), first order cooling fan (2), first order compensation coolant storage tank (3), first order semiconductor cooler (4), first order cooling water pipe (5), first order cooling water expansion tank (6), first order cooling water pump (7), refrigeration and heat radiator (8), carrying case (9), compensation refrigeration water tank (11), chilled water (12), refrigeration water pipe (13) and refrigeration water pump (14), wherein, first order cooling radiator (1), first order cooling fan (2), first order compensation coolant storage tank (3), first order semiconductor cooler (4), first order cooling water pipe (5), first order cooling water expansion tank (6) and first order cooling water pump (7) are formed first order cooling system, refrigeration and heat radiator (8), carrying case (9), compensation refrigeration water tank (11), chilled water (12), refrigeration water pipe (13) and refrigeration water pump (14) are formed refrigeration system, first order cooling radiator (1), first order cooling water pump (7), first order semiconductor cooler (4) links to each other by first order cooling water pipe (5), first order cooling fan (2) is contained on the first order cooling radiator (1), first order compensation coolant storage tank (3) links to each other with first order cooling radiator (1) by pipeline, first order compensation coolant storage tank (3), first order cooling radiator (1), first order cooling water pipe (5), first order cooling water pump (7), in the first order heat-radiation loop that first order semiconductor cooler (4) forms first order cooling water expansion tank (6) is housed, refrigeration and heat radiator (8), refrigeration water pump (14), first order semiconductor cooler (4) links to each other by refrigeration water pipe (13), compensation refrigeration water tank (11) links to each other with refrigeration water pipe (13), compensation refrigeration water tank (11), refrigeration and heat radiator (8), refrigeration water pipe (13), refrigeration water pump (14), in the refrigerating circuit that first order semiconductor cooler (4) forms chilled water (12) is housed, refrigeration and heat radiator (8) is contained in the carrying case (9), and carrying case (9) is insulation can.
3. multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case according to claim 1, it is characterized in that: secondary water cooled semiconductor refrigerating air-conditioning carrying case is to increase second stage cooling system to form between first order cooling system and refrigeration system, second stage cooling system comprises second stage compensation coolant storage tank (15), second stage semiconductor cooler (17), second stage cooling water pump (18), second stage cooling water expansion tank (19) and second stage cooling water pipe (20), second stage semiconductor cooler (17), second stage cooling water pump (18) links to each other with first order semiconductor cooler (4) by second stage cooling water pipe (20), second stage compensation coolant storage tank (15) links to each other with second stage cooling water pipe (20), second stage compensation coolant storage tank (15), second stage semiconductor cooler (17), second stage cooling water pump (18), second stage cooling water pipe (20), second stage cooling water expansion tank (19) is housed, second stage semiconductor cooler (17) in the second stage heat-radiation loop that first order semiconductor cooler (4) forms, refrigeration and heat radiator (8), refrigeration water pump (14), link to each other by refrigeration water pipe (13).
4. multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case according to claim 1, it is characterized in that: three grades of water cooled semiconductor refrigerating air-conditioning carrying cases are to increase third stage cooling system to form between second stage cooling system and refrigeration system, third stage cooling system comprises third stage compensation coolant storage tank (21), third stage semiconductor cooler (22), third stage cooling water pump (23), third stage cooling water expansion tank (24) and third stage cooling water pipe (25), third stage semiconductor cooler (22), third stage cooling water pump (23) links to each other with second stage semiconductor cooler (17) by third stage cooling water pipe (25), third stage compensation coolant storage tank (21) links to each other with third stage cooling water pipe (25), third stage compensation coolant storage tank (21), third stage semiconductor cooler (22), third stage cooling water pump (23), third stage cooling water pipe (25), third stage cooling water expansion tank (24) is housed, third stage semiconductor cooler (22) in the third stage heat-radiation loop that second stage semiconductor cooler (17) forms, refrigeration and heat radiator (8), refrigeration water pump (14), link to each other by refrigeration water pipe (13).
5. multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case according to claim 1, it is characterized in that: more the constructive method of multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case is to increase the one-level cooling system to form between previous stage cooling system and refrigeration system, secondary water cooled semiconductor refrigerating air-conditioning carrying case is to increase second stage cooling system to form between first order cooling system and refrigeration system, three grades of water cooled semiconductor refrigerating air-conditioning carrying cases are to increase third stage cooling system to form between second stage cooling system and refrigeration system, and by that analogy, constitute more multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case.
6. according to any described multi-level water cooling formula of claim semiconductor refrigerating air-conditioning carrying case in claim 1, claim 3, claim 4, the claim 5, it is characterized in that: the structure of semiconductor coolers at different levels is identical, first order semiconductor cooler (4) is identical with the structure of second stage semiconductor cooler (17), second stage semiconductor cooler (17) is identical with the structure of third stage semiconductor cooler (22), and by that analogy, obtain the structure of semiconductor coolers at different levels in the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case more.
7. according to claim 1 or the described multi-level water cooling formula of claim 5 semiconductor refrigerating air-conditioning carrying case, it is characterized in that: the water of radiation case lid (30) of first order semiconductor cooler (4) connects with first order cooling water pipe (5), the water of radiation case lid of second stage semiconductor cooler (17) connects with second stage cooling water pipe (20), the water of radiation case lid of third stage semiconductor cooler (22) connects with third stage cooling water pipe (25), and by that analogy, obtain the connection structure of semiconductor coolers at different levels in the multi-level water cooling formula semiconductor refrigerating air-conditioning carrying case more, the chilled water case lid of afterbody semiconductor cooler connects with refrigeration water pipe (13).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320110708 CN203173117U (en) | 2013-02-28 | 2013-02-28 | Multiple-stage water cooling type semiconductor refrigerating air conditioner transport case |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201320110708 CN203173117U (en) | 2013-02-28 | 2013-02-28 | Multiple-stage water cooling type semiconductor refrigerating air conditioner transport case |
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| CN203173117U true CN203173117U (en) | 2013-09-04 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105432546A (en) * | 2014-08-22 | 2016-03-30 | 淮阴工学院 | Waterless keep-alive carrier vehicle for live fishes and having bionic environment |
| CN106931573A (en) * | 2017-03-16 | 2017-07-07 | 北京工业大学 | Modular portable semiconductor air conditioner |
| CN108633221A (en) * | 2018-03-22 | 2018-10-09 | 江苏兆胜特种空调有限公司 | High-power electronic device multi-state liquid cooling source |
| CN109229926A (en) * | 2018-07-11 | 2019-01-18 | 深圳市安思科电子科技有限公司 | A kind of fat acquisition bottle with anti-metamorphic function |
-
2013
- 2013-02-28 CN CN 201320110708 patent/CN203173117U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105432546A (en) * | 2014-08-22 | 2016-03-30 | 淮阴工学院 | Waterless keep-alive carrier vehicle for live fishes and having bionic environment |
| CN105432546B (en) * | 2014-08-22 | 2018-03-02 | 淮阴工学院 | Live fish anhydrous On Transportaion of Live car with biomimetic environment |
| CN106931573A (en) * | 2017-03-16 | 2017-07-07 | 北京工业大学 | Modular portable semiconductor air conditioner |
| CN108633221A (en) * | 2018-03-22 | 2018-10-09 | 江苏兆胜特种空调有限公司 | High-power electronic device multi-state liquid cooling source |
| CN109229926A (en) * | 2018-07-11 | 2019-01-18 | 深圳市安思科电子科技有限公司 | A kind of fat acquisition bottle with anti-metamorphic function |
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