CN103087646A - Thermally conductive adhesive tape and manufacturing process thereof - Google Patents
Thermally conductive adhesive tape and manufacturing process thereof Download PDFInfo
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- CN103087646A CN103087646A CN2013100418959A CN201310041895A CN103087646A CN 103087646 A CN103087646 A CN 103087646A CN 2013100418959 A CN2013100418959 A CN 2013100418959A CN 201310041895 A CN201310041895 A CN 201310041895A CN 103087646 A CN103087646 A CN 103087646A
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- adhesive tape
- heat conduction
- conduction adhesive
- release film
- heat
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Abstract
The invention provides a thermally conductive adhesive tape and a manufacturing process thereof. The thermally conductive adhesive tape comprises a release film and an adhesive coated on one side of the release film. The adhesive comprises the components of: 50-80% of unctuous acrylic glue, 10-30% of a thermally conductive filling material, and 10-20% of a retardant filling material. With the manufacturing process provided by the invention, the prepared adhesive tape has the characteristics such as low cost and good thermal conduction property.
Description
Technical field
The present invention relates to a kind of heat conduction adhesive tape and manufacture craft, relate in particular to a kind of heat conductivility good heat conduction adhesive tape and manufacture craft thereof.
Background technology
The development of science and technology and the market requirement make electron device to the future development of miniaturization, lightweight, compact construction, operation high efficiency, make like this its radiating effect become the key of complete machine miniaturization Design.Stable as to move for guaranteeing electron device or equipment, needing derive the heat that produces timely.Thereby quality, thermal conductivity, the strength and stability of heat radiation material are had higher requirement.So the heat conduction adhesive tape arises at the historic moment, it is supreme that it is used for electron device, guarantees the normal operation of whole electron device in order to timely derivation heat.
The heat conduction adhesive tape majority of used in electronic industry is external import at present, on the high side, though domestic have fewer companies at research and development production heat conduction adhesive tape, but because of technology not mature enough, the product of producing is high expensive not only, and do not compare same kind of products at abroad on performance, it is too low that it is mainly manifested in thermal conductivity, the generally requirement that on physical property, some index is just reached foot or do not reached electronic industry.Heat conductivility does not reach certain requirement.
For defects, be badly in need of invention a kind of brand-new heat conduction adhesive tape and manufacture craft thereof and solve the deficiencies in the prior art.
Summary of the invention
The object of the present invention is to provide a kind of heat conduction adhesive tape and manufacture craft thereof, this heat conduction adhesive tape and manufacture craft cost thereof are low, and the heat conduction adhesive tape heat conductivility of making is good.
For realizing aforementioned purpose, the present invention adopts following technical scheme:
A kind of heat conduction adhesive tape, the tackiness agent that comprises release film and be coated on release film one side, described tackiness agent comprises following component:
Oiliness acrylic acid glue 50%-80%;
Heat conductive filler 10%-30%;
Fire-retardant filler 10%-20%.
As a further improvement on the present invention, the release of described release film is 1:2 ~ 1:5 than scope.
As a further improvement on the present invention, the thickness of described release film is 0.075mm ~ 0.14mm.
As a further improvement on the present invention, described oiliness vinylformic acid glue solid content is 50% ~ 65%, and viscosity is 4000 ~ 12000CP.
As a further improvement on the present invention, when the dried glue thickness of described heat conduction adhesive tape was 0.025mm, clinging power was greater than 500g/25mm, thermal conductivity is not less than 2.10W/m-k, when the dried glue thickness of heat conduction adhesive tape was 0.100mm, clinging power was greater than 1300g/25mm, and thermal conductivity is not less than 1.65W/m-k.
As a further improvement on the present invention, described heat conductive filler is one or more in aluminium nitride, boron nitride, silicon nitride, titanium nitride, silicon carbide, titanium carbide, zirconium boride 99.5004323A8ure and aluminum oxide.
As a further improvement on the present invention, the particle diameter of described heat conductive filler is nano level.
As a further improvement on the present invention, described fire-retardant filler is halogen-free organophosphorous compound fire retardant, phosphorous-nitrogen system bittern-free fire retardant.
A kind of manufacture craft of heat conduction adhesive tape specifically comprises the following steps:
A, release film detect: the off-type force on test release film two sides, the release film that to select release ratio be 1:3;
B, join glue: oiliness vinylformic acid glue mixes with heat conductive filler through grinding, stirs 3 ~ 5min, then adds the fire-retardant filler through grinding, then stirs 5 ~ 8min;
C, gluing: the adhesive coated for preparing in step b on the larger one side of release film off-type force, then by device control gluing thickness and ridity, during coating, is heated the identical time in seven sections different temperature release film, and total time is 3 ~ 5min;
D, test: the heat-conducting glue that heat treated is completed is brought into the line parameter test.
As a further improvement on the present invention, described seven sections different temperature are: 40 ~ 70 ℃ of first paragraphs, 70 ~ 100 ℃, the 3rd section 80 ~ 100 ℃, the 4th section 90 ~ 115 ℃, the 5th section 95 ~ 120 ℃, the 6th section 95 ~ 115 ℃, the 7th section 80 ~ 100 ℃ of second segments.
The present invention compared with prior art has following beneficial effect:
The invention provides a kind of heat conduction adhesive tape and manufacture craft thereof, good by the adhesive tape heat conductivility that manufacture craft is produced, clinging power is strong, and manufacture craft is easy, provides cost savings.
Embodiment
The present invention will be further elaborated below by embodiment:
Present embodiment provides a kind of heat conduction adhesive tape, the tackiness agent that comprises release film and be coated on release film one side, and described tackiness agent comprises following component:
Oiliness acrylic acid glue 50%-80%;
Heat conductive filler 10%-30%;
Fire-retardant filler 10%-20%.
The release thickness that is the described release film of 1:2 ~ 1:5 than scope of described release film is 0.075mm ~ 0.14mm.Described oiliness vinylformic acid glue solid content is 50% ~ 65%, and viscosity is 4000 ~ 12000CP.When the dried glue thickness of described heat conduction adhesive tape was 0.025mm, clinging power was greater than 500g/25mm, and thermal conductivity is not less than 2.10W/m-k, and when the dried glue thickness of heat conduction adhesive tape was 0.100mm, clinging power was greater than 1300g/25mm, and thermal conductivity is not less than 1.65W/m-k.Described heat conductive filler is one or more in aluminium nitride, boron nitride, silicon nitride, titanium nitride, silicon carbide, titanium carbide, zirconium boride 99.5004323A8ure and aluminum oxide.The particle diameter of described heat conductive filler is nano level.Described fire-retardant filler is halogen-free organophosphorous compound fire retardant, phosphorous-nitrogen system bittern-free fire retardant.
Present embodiment also provides a kind of manufacture craft of heat conduction adhesive tape, specifically comprises the following steps:
A, release film detect: the off-type force on test separate-type paper two sides, the release film that to select release ratio be 1:3;
B, join glue: oiliness vinylformic acid glue mixes with heat conductive filler through grinding, stirs 3 ~ 5min, then adds the fire-retardant filler through grinding, then stirs 5 ~ 8min;
C, gluing: the adhesive coated for preparing in step b on the larger one side of release film off-type force, then by device control gluing thickness and ridity, during coating, is heated the identical time in seven sections different temperature release film, and total time is 3 ~ 5min;
D, test: the heat-conducting glue that heat treated is completed is brought into the line parameter test.
Wherein, described seven sections different temperature are: 40 ~ 70 ℃ of first paragraphs, 70 ~ 100 ℃, the 3rd section 80 ~ 100 ℃, the 4th section 90 ~ 115 ℃, the 5th section 95 ~ 120 ℃, the 6th section 95 ~ 115 ℃, the 7th section 80 ~ 100 ℃ of second segments.
Further embody beneficial effect of the present invention below by several groups of experimental datas.
From above table, can very clearly see, when the dried glue thickness of heat conduction adhesive tape of the present invention is 0.025mm, clinging power is greater than 500g/25mm, thermal conductivity is not less than 2.10W/m-k, when the dried glue thickness of heat conduction adhesive tape was 0.100mm, clinging power was greater than 1300g/25mm, and thermal conductivity is not less than 1.65W/m-k.In addition, in the present invention, the manufacture craft of heat conduction adhesive tape is easy, provides cost savings.
Although be the example purpose, the preferred embodiment of the present invention is disclosed, but those of ordinary skill in the art will recognize, in the situation that do not break away from by the disclosed scope and spirit of the present invention of appending claims, various improvement, increase and replacement are possible.
Claims (10)
1. heat conduction adhesive tape is characterized in that: the tackiness agent that described heat conduction adhesive tape comprises release film and is coated on release film one side, and described tackiness agent comprises following component:
Oiliness acrylic acid glue 50%-80%;
Heat conductive filler 10%-30%;
Fire-retardant filler 10%-20%.
2. heat conduction adhesive tape according to claim 1, it is characterized in that: the release of described release film is 1:2 ~ 1:5 than scope.
3. heat conduction adhesive tape according to claim 2, it is characterized in that: the thickness of described release film is 0.075mm ~ 0.14mm.
4. heat conduction adhesive tape according to claim 1, it is characterized in that: described oiliness vinylformic acid glue solid content is 50% ~ 65%, and viscosity is 4000 ~ 12000CP.
5. heat conduction adhesive tape according to claim 4, it is characterized in that: when the dried glue thickness of described heat conduction adhesive tape is 0.025mm, clinging power is greater than 500g/25mm, thermal conductivity is not less than 2.10W/m-k, when the dried glue thickness of heat conduction adhesive tape is 0.100mm, clinging power is greater than 1300g/25mm, and thermal conductivity is not less than 1.65W/m-k.
6. heat conduction adhesive tape according to claim 1, it is characterized in that: described heat conductive filler is one or more in aluminium nitride, boron nitride, silicon nitride, titanium nitride, silicon carbide, titanium carbide, zirconium boride 99.5004323A8ure and aluminum oxide.
7. heat conduction adhesive tape according to claim 6, it is characterized in that: the particle diameter of described heat conductive filler is nano level.
8. heat conduction adhesive tape according to claim 1, it is characterized in that: described fire-retardant filler is one or more in halogen-free organophosphorous compound fire retardant, phosphorous-nitrogen system bittern-free fire retardant.
9. the manufacture craft of a heat conduction adhesive tape as described in any one in claim 1 to 8 is characterized in that: specifically comprise the following steps:
A, release film detect: the off-type force on test release film two sides, the release film that to select release ratio be 1:3;
B, join glue: oiliness vinylformic acid glue mixes with heat conductive filler through grinding, stirs 3 ~ 5min, then adds the fire-retardant filler through grinding, then stirs 5 ~ 8min;
C, gluing: the adhesive coated for preparing in step b on the larger one side of release film off-type force, then by device control gluing thickness and ridity, during coating, is heated the identical time in seven sections different temperature release film, and total time is 3 ~ 5min;
D, test: the heat-conducting glue that heat treated is completed is brought into the line parameter test.
10. the manufacture craft of heat conduction adhesive tape according to claim 9, it is characterized in that: described seven sections different temperature are: 40 ~ 70 ℃ of first paragraphs, 70 ~ 100 ℃, the 3rd section 80 ~ 100 ℃, the 4th section 90 ~ 115 ℃, the 5th section 95 ~ 120 ℃, the 6th section 95 ~ 115 ℃, the 7th section 80 ~ 100 ℃ of second segments.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310041895.9A CN103087646B (en) | 2013-02-01 | 2013-02-01 | Heat conduction adhesive tape and manufacture craft thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310041895.9A CN103087646B (en) | 2013-02-01 | 2013-02-01 | Heat conduction adhesive tape and manufacture craft thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103087646A true CN103087646A (en) | 2013-05-08 |
| CN103087646B CN103087646B (en) | 2016-01-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310041895.9A Expired - Fee Related CN103087646B (en) | 2013-02-01 | 2013-02-01 | Heat conduction adhesive tape and manufacture craft thereof |
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| CN (1) | CN103087646B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105885094A (en) * | 2016-06-29 | 2016-08-24 | 海信集团有限公司 | Heat dissipation composition as well as preparation method and application thereof |
| CN106118541A (en) * | 2016-06-29 | 2016-11-16 | 海信集团有限公司 | A kind of glue and preparation method thereof and containing the adhesive tape of this glue and components and parts |
| CN108003818A (en) * | 2017-12-14 | 2018-05-08 | 深圳市德镒盟电子有限公司 | Low halogen fire retardant pressure sensitive glue of a kind of heat conduction and preparation method thereof |
| CN117186792A (en) * | 2023-09-12 | 2023-12-08 | 惠州市帕克威乐新材料有限公司 | Flame-retardant adhesive heat-conducting adhesive film and preparation method thereof |
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| JP2004307747A (en) * | 2003-04-10 | 2004-11-04 | Sliontec Corp | Flame-retardant adhesive tape |
| CN1916098A (en) * | 2005-08-15 | 2007-02-21 | 上海化工研究院 | Flame resisting agent with no halogen in series of crylic acid in use for pressure sensitive adhesive tape, and prepartion method |
| CN102260466A (en) * | 2011-06-14 | 2011-11-30 | 中山金利宝胶粘制品有限公司 | Insulation heat-conducting double-sided adhesive tape and preparation method thereof |
| CN102321444A (en) * | 2011-05-30 | 2012-01-18 | 天津安品有机硅材料有限公司 | Thermal conductivity acrylic pressure sensitive glue composition and vinylformic acid heat conduction paster |
| CN102443365A (en) * | 2011-10-16 | 2012-05-09 | 上海晶华粘胶制品发展有限公司 | Adhesive for conductive adhesive tapes, and conductive adhesive tape |
| CN102559089A (en) * | 2011-12-30 | 2012-07-11 | 常熟市富邦胶带有限责任公司 | Water-based acrylic thermal-conductive double-sided tape and preparation method thereof |
-
2013
- 2013-02-01 CN CN201310041895.9A patent/CN103087646B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004307747A (en) * | 2003-04-10 | 2004-11-04 | Sliontec Corp | Flame-retardant adhesive tape |
| CN1916098A (en) * | 2005-08-15 | 2007-02-21 | 上海化工研究院 | Flame resisting agent with no halogen in series of crylic acid in use for pressure sensitive adhesive tape, and prepartion method |
| CN102321444A (en) * | 2011-05-30 | 2012-01-18 | 天津安品有机硅材料有限公司 | Thermal conductivity acrylic pressure sensitive glue composition and vinylformic acid heat conduction paster |
| CN102260466A (en) * | 2011-06-14 | 2011-11-30 | 中山金利宝胶粘制品有限公司 | Insulation heat-conducting double-sided adhesive tape and preparation method thereof |
| CN102443365A (en) * | 2011-10-16 | 2012-05-09 | 上海晶华粘胶制品发展有限公司 | Adhesive for conductive adhesive tapes, and conductive adhesive tape |
| CN102559089A (en) * | 2011-12-30 | 2012-07-11 | 常熟市富邦胶带有限责任公司 | Water-based acrylic thermal-conductive double-sided tape and preparation method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105885094A (en) * | 2016-06-29 | 2016-08-24 | 海信集团有限公司 | Heat dissipation composition as well as preparation method and application thereof |
| CN106118541A (en) * | 2016-06-29 | 2016-11-16 | 海信集团有限公司 | A kind of glue and preparation method thereof and containing the adhesive tape of this glue and components and parts |
| CN105885094B (en) * | 2016-06-29 | 2019-02-26 | 海信集团有限公司 | A kind of Heat dissipation composition and the preparation method and application thereof |
| CN108003818A (en) * | 2017-12-14 | 2018-05-08 | 深圳市德镒盟电子有限公司 | Low halogen fire retardant pressure sensitive glue of a kind of heat conduction and preparation method thereof |
| CN117186792A (en) * | 2023-09-12 | 2023-12-08 | 惠州市帕克威乐新材料有限公司 | Flame-retardant adhesive heat-conducting adhesive film and preparation method thereof |
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| Publication number | Publication date |
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| CN103087646B (en) | 2016-01-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 201600 Shanghai city Songjiang District street Yongfeng River Road No. 89 Applicant after: SHANGHAI SMITH ADHESIVE NEW MATERIAL CO., LTD. Address before: 201600 Shanghai city Songjiang District street Yongfeng River Road No. 89 Applicant before: Shanghai Smith Adhesive Tape Development Co., Ltd. |
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| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: SHANGHAI SMITH ADHESIVE TAPE DEVELOPMENT CO., LTD. TO: SHANGHAI JINGHUA ADHESIVE NEW MATERIALS CO., LTD. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160113 Termination date: 20190201 |