CN105885094A - Heat dissipation composition as well as preparation method and application thereof - Google Patents
Heat dissipation composition as well as preparation method and application thereof Download PDFInfo
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- CN105885094A CN105885094A CN201610498512.4A CN201610498512A CN105885094A CN 105885094 A CN105885094 A CN 105885094A CN 201610498512 A CN201610498512 A CN 201610498512A CN 105885094 A CN105885094 A CN 105885094A
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Abstract
The embodiment of the invention discloses a heat dissipation composition as well as a preparation method and application thereof, relating to the technical field of heat dissipation materials. The heat dissipation composition can achieve the effect of increasing the normal emittance of product raw materials. The heat dissipation composition comprises nano silicon carbide and nano titanium nitride, wherein the grain sizes of nano silicon carbide and nano titanium nitride are 10-900nm. The heat dissipation composition can be filled in various product raw materials to improve the heat dissipation properties of the product raw materials.
Description
Technical field
The present invention relates to heat sink material technical field, particularly relate to a kind of Heat dissipation composition and preparation side thereof
Method and application.
Background technology
Along with the fast development of science and technology, the densification of integrated circuit and miniaturization degree are increasingly
Height, electronic component becomes less and runs with higher speed so that it is the requirement to heat radiation is more and more higher.
In order to be distributed as early as possible from thermal source by heat, widespread practice mainly has two kinds the most in the industry: a kind of
Being to increase area of dissipation, its typical shortcoming is to cause volume excessive, bigger on product form impact；
Another kind of way is to install the supplemental heat rejected facility such as radiator fan near pyrotoxin, but the method one side
Face can increase energy consumption, and meanwhile, supplemental heat rejected facility self also can produce heat, affects radiating efficiency.
In order to realize more preferable radiating effect, in recent years, Chinese scholars and technical staff progressively will notes
Meaning power concentrates in the research of the Heat dissipation composition with infra-red radiation, and Heat dissipation composition can be by heat
It radiate with ultrared form, thus realize radiating effect.In prior art, it has been disclosed that side
Method has, by the heat radiation coating of the infra-red radiation that the Heat dissipation composition of doping infra-red radiation prepares, by this painting
Material is coated on the outer surface needing heat radiation and can realize heat radiation.
But, in existing known heat radiation coating use oxides as Heat dissipation composition, such as with
Cheap hematite is primary raw material, is aided with manganese oxide, copper oxide, aluminium oxide, cobalt oxide, oxygen
Changing zinc, nickel oxide, titanium oxide, magnesium oxide, silicon oxide, these oxides have good heat conductivity
Can, it is possible to realize heat radiation to a certain extent, but, comprise the red of these oxide Heat dissipation composition
External radiation coating emission band is wider, and radiating effect is the most undesirable.
Summary of the invention
Embodiments provide a kind of Heat dissipation composition and preparation method and application, in order to provide
A kind of Heat dissipation composition improving products material normal emittance.
First aspect, embodiments provides a kind of Heat dissipation composition, described Heat dissipation composition
Including: nanometer silicon carbide and Nano titanium nitride, wherein, described nanometer silicon carbide and Nano titanium nitride
Particle diameter between 10nm-900nm.
Optionally, the mass fraction of described Nano titanium nitride is 15-40%.
Optionally, the particle diameter of described nanometer silicon carbide and Nano titanium nitride 10nm-600nm it
Between.
Optionally, the particle diameter of described nanometer silicon carbide and Nano titanium nitride 50nm-200nm it
Between.
Optionally, described Heat dissipation composition also includes nano titanium oxide, described nano titanium oxide
Particle diameter between 10nm-800nm.
Optionally, the mass fraction of described nano titanium oxide is 5-25%.
Optionally, described Heat dissipation composition also includes coupling agent.
Second aspect, embodiments provides the preparation side of a kind of any of the above-described Heat dissipation composition
Method, including: the component of described Heat dissipation composition is added in organic solvent, volatilize after being uniformly dispersed
Organic solvent obtains described Heat dissipation composition.
The third aspect, embodiments provides a kind of above-mentioned Heat dissipation composition and is preparing heat-radiation coating
Application in material, heat radiation glue, far IR fibre or heat radiation plastics.
Fourth aspect, embodiments provides a kind of heat radiation coating, by any of the above-described kind of heat radiation
Compositions is combined with binding agent prepares gained.
5th aspect, embodiments provides a kind of heat radiation glue, by any of the above-described kind of heat radiation
Compositions is combined with pressure sensitive adhesive prepares gained.
6th aspect, embodiments provides a kind of heat radiation plastics, by any of the above-described kind of heat radiation
Compositions is combined with plastic raw materials prepares gained.
Embodiments provide a kind of Heat dissipation composition and preparation method and application, if by this bag
Heat dissipation composition containing nanometer silicon carbide and Nano titanium nitride is added in products material, and prepare can
The products material of heat radiation, the normal emittance of the prepared products material dispelled the heat can reach 0.9
Above.
Owing to normal emittance is the highest, in its unit are, the heat of radiation is the biggest, and radiating effect is the best,
Therefore, a kind of heat radiation combination improving products material normal emittance is embodiments provided
Thing.Further, for the Heat dissipation composition that the embodiment of the present invention provides is compared to prior art,
Its component comprised is less, it is possible to solve to cause processing technique multiple in prior art because component is more
Miscellaneous problem.
Accompanying drawing explanation
The preparation method schematic flow sheet of a kind of Heat dissipation composition that Fig. 1 provides for the embodiment of the present invention.
Detailed description of the invention
Now will be provided in detail the reference of embodiment of the present invention, one or more example is described in
Hereafter.There is provided each example as explanation the unrestricted present invention.It practice, to art technology
For personnel, it is obvious that the present invention can be carried out numerous modifications and variations without departing from
The scope of the present invention or spirit.Such as, illustrate as the part of an embodiment or describe
Feature may be used for, in another embodiment, producing further embodiment.Therefore, base
Embodiment in the present invention, those of ordinary skill in the art are not making creative work premise
Lower obtained every other embodiment, broadly falls into the scope of protection of the invention.
Material involved by the embodiment of the present invention all can obtain by commercial sources or by applicant
Take.
Embodiment one
Embodiments providing a kind of Heat dissipation composition, this Heat dissipation composition includes: nano-sized carbon
SiClx and Nano titanium nitride, wherein, the particle diameter of nanometer silicon carbide and Nano titanium nitride exists
Between 10nm-900nm.
It should be noted that for regular ball shaped nano carborundum and Nano titanium nitride granule, its
Particle diameter i.e. refers to its diameter；For irregular granule, particle diameter be referred in prior art about
The definition of particle diameter, its definition method of example can have following three kinds: projected diameter, geometry equivalent footpath
Or equivalent physical footpath.Wherein, projected diameter: refer to the most viewed particle diameter of granule；
Geometry equivalent footpath: the diameter of spheroidal particle when taking equal with a certain geometric sense of granule；Physics is worked as
Amount footpath: the diameter of spheroidal particle when taking equal with a certain physical quantity of granule.The embodiment of the present invention
The definition to particle diameter is not defined, and it can be diameter, it is also possible to be projected diameter, geometry equivalent
Any one in footpath or equivalent physical footpath.
This Heat dissipation composition can convert heat to infrared ray when room temperature, heat with infrared ray
Form be radiated in surrounding, and in the infrared ray radiated, wave-length coverage is positioned at
The far infrared of 8～15um occupies the biggest ratio, and the far infrared in this wave-length coverage compares
Easily propagate through the plastics electric appliance casing of routine, during transmission, run into shell and remaining shell
During body, reflect less, it is thus possible to reach more preferable radiating effect.
The Heat dissipation composition embodiment of the present invention provided is as Inorganic Fillers Filled to products material
In (usually polymer), the products material being filled with Heat dissipation composition can be made to have excellence
Heat dispersion, its normal emittance can reach more than 0.9, and normal emittance is the highest, its unit
On area, the heat of radiation is the biggest, and radiating effect is the best.
It addition, the component of the Heat dissipation composition of embodiment of the present invention offer is nanoscale, specific surface
Long-pending relatively big, therefore, be filled with that the products material of this Heat dissipation composition can absorb in air is a small amount of
Moisture, on surface can the great nanoscale of quantity of formation " water-vaporizer ", by the steaming of moisture
Dissipate a part of heat, thus further enhance the radiating effect of products material.
To sum up, the Heat dissipation composition that the embodiment of the present invention provides, raw material is extensive, cheap, energy
Enough is that infrared radiation is gone out by converting heat, and normal direction radiance is high, meanwhile, and institute's infrared radiation
The large percentage of mid and far infrared line, therefore, has the heat dispersion of excellence, can reach preferably to dissipate
Thermal effect.By Heat dissipation composition that the embodiment of the present invention is provided as Inorganic Fillers Filled in poly-
In compound, polymer can be made to have the heat dispersion of excellence and good mechanical performance.
It should be noted that the ratio of Nano titanium nitride and nanometer silicon carbide can in this Heat dissipation composition
To be arbitrary proportion mixing.And preferred, the mass fraction of Nano titanium nitride in this Heat dissipation composition
For 15%-40%.So, the heat dispersion of Heat dissipation composition is optimal, the matter of described Nano titanium nitride
Amount mark is too small or excessive, all radiating effect can be produced impact.
Preferably, the particle diameter of nanometer silicon carbide and Nano titanium nitride is between 10nm-600nm.
In this particle size range, it is possible to increase specific surface area, improve described normal emittance, thus
Improving radiating effect, particle diameter is too small can improve difficulty of processing.
It is further preferred that the particle diameter of nanometer silicon carbide and Nano titanium nitride is at 50nm-200nm
Between.
In general, the particle diameter of nanometer silicon carbide and Nano titanium nitride is the least, and specific surface area is the biggest,
Its heat dispersion is the best, when the two is added in other materials, and the machinery of the composite of formation
Performance also can be more excellent.But, particle diameter is the least, and the requirement to preparation condition is the harshest, and,
When particle diameter little to certain limit time, the size of particle diameter is no longer obvious on the impact of performance, such as, right
The Heat dissipation composition formed in the carborundum that particle diameter is 10nm and titanium nitride is 50nm's with particle diameter
For the Heat dissipation composition of carborundum and titanium nitride composition, the performance of the two is more or less the same.Therefore,
The embodiment of the present invention is in the case of considering preparation condition and performance, it is believed that nanometer silicon carbide and
When the particle diameter of Nano titanium nitride is between 50nm-200nm, specific surface area is relatively big, radiating effect
Can reach optimal.
Nano titanium oxide also can be provided in the Heat dissipation composition of above-mentioned offer, the most preferably, on
Stating Heat dissipation composition and also include nano titanium oxide, the particle diameter of nano titanium oxide is at 10nm-800nm
Between.
Nano titanium oxide is added in Heat dissipation composition, the property of Heat dissipation composition can be greatly enhanced
Energy.This is because heat is being radiated by nanometer silicon carbide and Nano titanium nitride with ultrared form
During in surrounding, also can absorb the ambient radiation infrared ray to its surface, due to
Adding nano titanium oxide, its special appearance can reflect a part and be transmitted into the infrared of its surface
Line；Meanwhile, nano titanium oxide can also reflect the ultraviolet in a part of environment, thus reduces
The external world is radiated the electromagnetic wave on its surface so that on identical area of dissipation, needed for the heat that distributes
Amount reduces, and radiating effect is greatly enhanced.Therefore, using the Heat dissipation composition that includes titanium dioxide as
Inorganic Fillers Filled, in polymer, can make polymer have more excellent heat dispersion, and
And, the ultraviolet received due to its surface reduces, and its ageing resistace can be made to strengthen, and extends and uses
Life-span.
Wherein, the nano titanium oxide of the embodiment of the present invention preferred anatase crystal formation.Use this crystal formation
The nano titanium oxide of structure, has the effect of the reflection external world radiation of excellence, it is possible to passed in the external world
The heat led is launched, and improves radiating effect further.
It should be noted that the amount of the nano titanium oxide added in above-mentioned Heat dissipation composition is not done
Limit.And preferred, in above-mentioned Heat dissipation composition, the mass fraction of nano titanium oxide is
5%-25%.In the range of this mass fraction, the performance of this Heat dissipation composition can be more excellent, super
After crossing 25%, launching effect improves inconspicuous.
Preferably, the Heat dissipation composition that the embodiment of the present invention provides also includes coupling agent.
Coupling agent is the material that a class has Liang Zhong heterogeneity functional group, the maximum of its molecular structure
Feature is containing different two groups of chemical property in molecule, and one is the group of parent's inorganic matter,
Easily and mineral surfaces chemically reactive；Another is organophilic group, energy and synthetic resin
Other polymer generation chemical reaction or generate hydrogen bond.Therefore coupling agent is referred to as " molecular bridge ",
In order to improve the interface interaction between inorganic matter and Organic substance.In the composite, coupling agent can
With some radical reaction of inorganic filler surface, can react with polymeric matrix, in inorganic filler again
And forming a boundary layer between polymeric matrix, boundary layer can transmit stress, thus enhance nothing
Bonding strength between machine material and polymeric matrix, improves the performance of composite, such as physics
Performance (mechanical performance), electrical property, hot property, optical property etc..
Owing to Heat dissipation composition includes coupling agent, group and the heat radiation group of parent's inorganic matter in coupling agent
Inorganic nano-particle effect in compound, group organophilic in coupling agent does not react,
When by above-mentioned coupling agent modified after Heat dissipation composition add products material to (such as: synthetic resin
Or other polymer) in time, the organophilic group in coupling agent can be with the matrix of products material
Material generation chemical reaction or generation hydrogen bond, thus obtain a kind of heat dispersion both with excellence,
Meanwhile, there is again the composite of the mechanical performance of excellence.
In one embodiment of the invention, the mass fraction of described coupling agent is 0.5%-5%.
It should be noted that the kind of coupling agent has multiple in prior art, in actual applications,
Those skilled in the art can be according to practical situations such as corresponding solvent species, compound host materials
Select suitable coupling agent kind and consumption, here, do not limit.
Embodiment two
Embodiments providing the preparation method of a kind of Heat dissipation composition, the method includes following step
Rapid:
S101: the component of Heat dissipation composition is added in organic solvent.
Wherein, the component of Heat dissipation composition can include nanometer silicon carbide and Nano titanium nitride, it is possible to
To include nanometer silicon carbide, Nano titanium nitride and nano titanium oxide, it is also possible to include aforementioned
Also coupling agent is included while inorganic nano-particle.
Each component is joined in organic solvent, can be divided into two kinds of situations:
A kind of situation is for not comprising coupling agent, only comprising the Heat dissipation composition of inorganic nano-particle
For, can be that all components is added in organic solvent together, such as, by nanometer silicon carbide,
Nano titanium nitride adds in organic solvent together, or by nanometer silicon carbide, Nano titanium nitride with
And nano titanium oxide adds together；Can also be that each component is divided and is front and back sequentially added into, now, right
The sequencing added does not limits, for example, it may be initially charged Nano titanium nitride, add and receives
Rice carborundum, it is also possible to be to be initially charged nanometer silicon carbide, add Nano titanium nitride.
Another kind of situation is for the Heat dissipation composition comprising coupling agent, first has to coupling agent
Dissolve in organic solvent, after coupling agent dissolves completely, add inorganic nano-particle, now,
Can be that nanometer silicon carbide, Nano titanium nitride are added in organic solvent together, or by nanometer
Carborundum, Nano titanium nitride and nano titanium oxide add together；Can also be by various nanometers
Particle divides and is front and back sequentially added into, and now, does not limits the sequencing added.
For the Heat dissipation composition comprising coupling agent, first coupling agent is dissolved in organic solvent
In, add inorganic nano-particle, send out so that inorganic nano-particle and coupling agent are fully contacted
Raw reaction.After the Heat dissipation composition that this is comprised coupling agent is filled in products material, can make
The mechanical performance obtaining products material is further improved.
It should be noted that organic solvent herein plays the effect of dispersion inorganic nano-particle, or
Further functioning as the effect dissolving coupling agent, in general, the machine solvent of common are all can be applied
In the present embodiment.Such as, the solvent in the present embodiment can be toluene, ethyl acetate, acetic acid
One or several the mixture therein such as butyl ester, ethylbenzene, the quality of solvent does not limits at this
It is fixed, as long as scattered effect can be met.
S102: after each component being uniformly dispersed, volatile organic solvent obtains described Heat dissipation composition.
Each component is uniformly dispersed, can by be by stirring in the way of, it is also possible to be to pass through ultrasound wave
Scattered mode, does not limits at this.
Volatile organic solvent, can be to dry at a higher temperature, it is also possible to be relatively low
At a temperature of slowly dry, those of skill in the art can according to actual needs to dry temperature
It is configured with the time, as long as ensure that while solvent flashing, will not be to Heat dissipation composition
In other compositions produce harmful effect.
Through above-mentioned steps, it is possible to obtain the finely dispersed Heat dissipation composition of each component.
Hereinafter, multiple concrete schemes in the embodiment of the present invention will be given.These schemes are merely in detail
The example embodiment of the present invention being described and propose, those skilled in the art are it should be recognized that the scope of the present invention
Do not limited by these schemes.
The heat radiation group not including coupling agent that option A 1 to option A 6 provides for the embodiment of the present invention
The particular make-up of compound and preparation method.
Option A 1
The carborundum of a diameter of for 6.0g 900nm is scattered in 100g toluene solvant, agitated all
The backward dispersion liquid of even dispersion adds the titanium nitride of a diameter of 10nm of 4.0g, continues stirring to again
Secondary it is uniformly dispersed, under the conditions of 150 DEG C, then dries 2h, obtain described Heat dissipation composition.
Option A 2
The carborundum of a diameter of for 8.5g 600nm is scattered in solvent (30g toluene, 40g acetic acid
Ethyl ester, 30g ethylbenzene), agitated dispersed after to add 1.5g again in dispersion liquid a diameter of
The titanium nitride of 50nm, continues to stir to being again uniformly dispersed, then dries under the conditions of 200 DEG C
1h, obtains described Heat dissipation composition.
Option A 3
The carborundum of a diameter of for 6.5g 10nm is scattered in 100g toluene solvant, agitated all
The backward dispersion liquid of even dispersion adds the titanium nitride of a diameter of 900nm of 3.5g, continues stirring extremely
Again it is uniformly dispersed, under the conditions of 150 DEG C, then dries 1.5h, obtain described Heat dissipation composition.
Option A 4
The carborundum of a diameter of for 12.0g 200nm is scattered in 100g ethyl acetate solvent, warp
Stir and disperse backward dispersion liquid adds the titanium nitride of a diameter of 800nm of 3.0g, continue
Stirring, to being again uniformly dispersed, adds the sharp titanium of a diameter of 10nm of 5.0g the most again in dispersion liquid
Ore deposit type titanium dioxide, continuation stirring, to being uniformly dispersed, finally dry 1.5h under the conditions of 200 DEG C,
Obtain described Heat dissipation composition.
Option A 5
The carborundum of a diameter of for 11.0g 800nm is scattered in solvent (30g toluene, 40g second
Acid butyl ester, 30g ethylbenzene), in dispersion liquid, add 8.0g after being stirred until homogeneous dispersion more a diameter of
The titanium nitride of 10nm, continues to stir to being again uniformly dispersed, and adds 1.0g the most again in dispersion liquid
The anatase titanium dioxide of a diameter of 800nm, continuation stirring, to being uniformly dispersed, finally exist
Dry 1h under the conditions of 200 DEG C, obtain described Heat dissipation composition.
Option A 6
The carborundum of a diameter of for 12.0g 800nm is scattered in 100g butyl acetate solvent, stirs
Mix to the titanium nitride adding a diameter of 10nm of 6.0g after dispersed again in dispersion liquid, continue to stir
Mix to being again uniformly dispersed, in dispersion liquid, add the sharp titanium of a diameter of 400nm of 2.0g the most again
Ore deposit type titanium dioxide, continuation stirring, to being uniformly dispersed, finally dry 2h under the conditions of 150 DEG C,
To described Heat dissipation composition.
The heat radiation combination including coupling agent that option A 7 to option A 9 provides for the embodiment of the present invention
The particular make-up of thing and preparation method.
Option A 7
Being dissolved in toluene solvant by 0.5g silane coupler, stir formation coupling agent solution,
Coupling agent is 0.5:99.5 with the mass ratio of toluene solvant；Then by 5.5g nanometer silicon carbide, 4.0g
Nano titanium nitride adds in coupling agent solution, and the particle diameter of inorganic nano heat radiation particle is 10nm,
Specific surface area is 1500m2/g, and the proportion of inorganic nano heat radiation particle is 0.2；Vapor away toluene
Solvent, volatilization temperature is 90 DEG C, obtain coupling agent modified after Heat dissipation composition.
Option A 8
0.2g titanate coupling agent is dissolved (30g toluene, 40g ethyl acetate, 30g in a solvent
Ethylbenzene), stir formation coupling agent solution, and coupling agent is 10:90 with the mass ratio of toluene solvant；
Then 19.8g nanometer silicon carbide, 10g Nano titanium nitride, 10g nano titanium oxide are added even
In connection agent solution, the particle diameter of inorganic nano heat radiation particle is 200nm, inorganic nano heat radiation particle
Proportion be 0.5；Evaporation of solvent, volatilization temperature is 80 DEG C, obtain coupling agent modified after dissipate
Hot compositions.
Option A 9
0.3g distearyl acyl-oxygen aluminum isopropoxide acid esters DL-411 coupling agent is dissolved in ethyl acetate
In solution, stir formation coupling agent solution, and coupling agent with the mass ratio of ethyl acetate solution is
5:95；Then 8.2g nanometer silicon carbide, 1.5g Nano titanium nitride are added in coupling agent solution, nothing
The particle diameter of machine nanometer heat radiation particle is 900nm, and the proportion of inorganic nano heat radiation particle is 0.6；
Evaporation of solvent, volatilization temperature is 70 DEG C, obtain coupling agent modified after Heat dissipation composition.
The preparation method of the Heat dissipation composition that the embodiment of the present invention provides, owing to relating to component relatively
It is few, hence in so that preparation technology is simple.Certainly, this preparation method the Heat dissipation composition prepared is same
Sample possesses the effect in embodiment one, is not added with at this repeating.
Embodiment three
Embodiments provide Heat dissipation composition described in embodiment one prepare heat radiation coating,
Application in heat radiation glue or heat radiation plastics.
By using the Heat dissipation composition provided in the embodiment of the present invention one as Inorganic Fillers Filled
In corresponding products material (matrix material in other words), corresponding composite can be obtained,
I.e. heat radiation coating, heat radiation glue or heat radiation plastics.During filling, can set scattered according to actual needs
Hot compositions and the mass ratio of matrix material, the embodiment of the present invention is preferred, dissipates in composite
The mass fraction scope of hot compositions is 0.5%～15%.
Concrete, for heat radiation coating, it is to be filled in Heat dissipation composition in binding agent to prepare.
Wherein, bonding agent here is the raw material preparing coating.
For heat radiation glue, it is to be filled in Heat dissipation composition in pressure sensitive adhesive to prepare.Here pressure
Quick glue is the raw material preparing glue.
For heat radiation plastics, it is to be filled in Heat dissipation composition in plastic raw materials to prepare.
Wherein, Heat dissipation composition is filled in matrix material can there is two ways:
Mode one, the Heat dissipation composition that embodiment one is provided, or will embodiment two prepare
Heat dissipation composition be filled in matrix material.
Each constituent and matrix material one in mode two, the Heat dissipation composition that will provide in embodiment one
Rise to add in organic solvent and prepare.
The concrete steps embodiment below of each filling mode describes in detail.
Embodiment four
Embodiments providing a kind of heat radiation coating, this heat radiation coating is by arbitrary in embodiment one
Kind Heat dissipation composition is combined with binding agent prepares gained.
Concrete preparation method has following two, as described in embodiment three.
Below scheme is provided to illustrate for mode one, the embodiment of the present invention:
Option b 1, do not change what option A in embodiment two 1～A6 obtained through coupling agent respectively
The Heat dissipation composition of property is prepared into after mixing homogeneously with the silicate binder that mass fraction is 35%
To different heat radiation coatings.Wherein, mass fraction is that the silicate binder implication of 35% is: silicon
In hydrochlorate binding agent, the mass fraction of silicate component is 35%.
This heat radiation coating is used method (preferably spraying method) difference of spraying, brushing, silk-screen
It is coated on the outer surface needing heat radiation, the material surface normal emittance value such as table 1 below obtained
Shown in:
Table 1
| Scheme | A1 | A2 | A3 | A4 | A5 | A6 |
| Normal emittance | 0.92 | 0.92 | 0.91 | 0.94 | 0.95 | 0.95 |
Option b 2, respectively option A in embodiment two 7～A9 is obtained through coupling agent modified
Heat dissipation composition from prepare after the silicone adhesive agent mix homogeneously that mass fraction is 35% different
Heat radiation coating.
This heat radiation coating is used method (preferably spraying method) difference of spraying, brushing, silk-screen
It is coated on the outer surface needing heat radiation, the material surface normal emittance value such as table 2 below obtained
Shown in:
Table 2
| Scheme | A7 | A8 | A9 |
| Normal emittance | 0.94 | 0.93 | 0.94 |
As can be seen from Table 1 and Table 2, the heat radiation coating that the embodiment of the present invention provides, its normal direction
Emissivity is all higher than 0.9, and even up to 0.95, it is scattered that this illustrates that the embodiment of the present invention provides
Hot compositions has the heat dispersion of excellence, and itself and matrix material carry out the compound composite wood obtained
Material has the radiating effect of excellence.
It should be noted that the heat radiation coating obtained by option b 1 can produce precipitation after standing,
Illustrate without coupling agent modified Heat dissipation composition dispersion effect in described heat radiation coating not
Good, and the heat radiation coating obtained by option b 2 precipitates substantially without producing after standing, through idol
The Heat dissipation composition of connection agent modification dispersion effect in described heat radiation coating is preferable, and coupling agent can
As " molecular bridge ", Heat dissipation composition and silicate binder are connected by hydrogen bond or chemical bond
Get up, between inorganic Heat dissipation composition and described silicate binder, form a boundary layer, energy
Enough increase interfacial stress such that it is able to strengthen mechanical performance；By this heat radiation coating use spraying,
When brushing, the method (preferably spraying method) of silk-screen are respectively coated on the outer surface needing heat radiation,
Mechanical performance mainly shows themselves in that not stand easily to produce through coupling agent modified heat radiation coating sinks
Form sediment, poor adhesive force, it is difficult to brush, when paint application, easy plug nozzle.
Below scheme is provided to illustrate for mode two, the embodiment of the present invention:
Scheme C1
Respectively by the carborundum of a diameter of for 1.1g 200nm, the titanium nitride of a diameter of 50nm of 0.8g
Being scattered in 100g ethyl acetate solvent, stirring, to being uniformly dispersed, then proceedes to add 0.1g silicon
Alkane coupling agent and 50g mass fraction are the silicate binder of 35%, continue stirring to mixing all
Even, obtain heat radiation coating.
Scheme C2
Respectively by the carborundum of a diameter of for 23.8g 10nm, the titanium nitride of a diameter of 10nm of 6g,
The anatase-type nanometer titanium dioxide of a diameter of 10nm of 10g disperse in a solvent (30g toluene,
40g ethyl acetate, 30g ethylbenzene), stirring, to being uniformly dispersed, then proceedes to add 0.2g silicon
Alkane coupling agent and 134.86g mass fraction are the phosphate binders of 35%, continue stirring to mixing
Uniformly, heat radiation coating is obtained.
Scheme C3
Respectively by the carborundum of a diameter of for 14.6g 900nm, the titanium nitride of a diameter of 900nm of 4g,
The anatase-type nanometer titanium dioxide of a diameter of 800nm of 1g disperse in a solvent (30g dimethylbenzene,
40g ethyl acetate, 30g ethylbenzene), stirring, to being uniformly dispersed, then proceedes to add 0.4g silane
Coupling agent and the silicone adhesive agent that 3.98kg mass fraction is 35%, continue to stir to mix homogeneously,
Obtain heat radiation coating.
Scheme C4
Respectively by the carborundum of a diameter of for 6g 200nm, the titanium nitride of a diameter of 200nm of 8g,
The anatase-type nanometer titanium dioxide of a diameter of 30nm of 5g disperses in a solvent (30g diformazan respectively
Benzene, 40g butyl acetate, 30g ethylbenzene), stirring, to being uniformly dispersed, then proceedes to add 1g
Silane coupler and 180g mass fraction are the acrylic resin binder of 35%, continue stirring extremely
Mix homogeneously, obtains heat radiation coating.
Scheme C5
Respectively by the carborundum of a diameter of for 15.8g 200nm, the titanium nitride of a diameter of 200nm of 3g,
The anatase-type nanometer titanium dioxide of a diameter of 400nm of 1g disperses in a solvent (30g bis-respectively
Toluene, 40g ethyl acetate, 30g ethylbenzene), stirring, to being uniformly dispersed, then proceedes to add 0.2g
Silane coupler and 380g mass fraction are the polyurethane adhesive of 35%, continue stirring to mixing
Uniformly, heat radiation coating is obtained.
It should be noted that in such scheme, the kind of coupling agent, the kind of organic solvent and
The kind of binding agent can select according to actual needs, at this without limitation.
Wherein, the quality of coupling agent and the quality of binding agent can select according to actual needs,
Do not limit at this.
The heat radiation coating that the embodiment of the present invention provides, the method that spraying, brushing, silk-screen can be used
(preferably spraying method) is coated on the outer surface of the object needing heat radiation, thus realizes heat radiation
Purpose.
Embodiment five
The embodiment of the present invention five provides a kind of heat radiation glue, and this heat radiation glue is by described in embodiment one
Heat dissipation composition be combined with pressure sensitive adhesive and prepare gained.
The preparation method of this heat radiation glue, can be by reality for mode one as described in embodiment three
Execute in the Heat dissipation composition in example one or embodiment two and prepare Heat dissipation composition, mix with pressure sensitive adhesive
Close and uniformly obtain, be specifically not described in detail in this.
The present embodiment provides following scheme to illustrate to use described in the mode two in embodiment three
Method prepare heat radiation glue process, specific as follows:
Scheme D1
Respectively by the carborundum of a diameter of for 1.1g 200nm, the titanium nitride of a diameter of 50nm of 0.8g
Being scattered in 100g ethyl acetate solvent, stirring, to being uniformly dispersed, then proceedes to add 0.1g silicon
Alkane coupling agent and 50g mass fraction are the acrylate pressure-sensitive adhesive of 35%, continue stirring to mixing all
Even, obtain the glue that dispels the heat.
Scheme D2
Respectively by the carborundum of a diameter of for 23.8g 10nm, the titanium nitride of a diameter of 10nm of 6g,
The anatase-type nanometer titanium dioxide of a diameter of 800nm of 10g disperse in a solvent (30g toluene,
40g ethyl acetate, 30g ethylbenzene), stirring, to being uniformly dispersed, then proceedes to add 0.2g silane
Coupling agent and 134.86g mass fraction are the acrylate pressure-sensitive adhesive of 35%, continue stirring to mixing
Uniformly, the glue that dispels the heat is obtained.
Scheme D3
Respectively by the carborundum of a diameter of for 14.6g 900nm, the titanium nitride of a diameter of 900nm of 4g,
The anatase-type nanometer titanium dioxide of a diameter of 10nm of 1g disperse in a solvent (30g dimethylbenzene,
40g ethyl acetate, 30g ethylbenzene), stirring, to being uniformly dispersed, then proceedes to add 0.4g silane
Coupling agent and 3.98kg mass fraction are the acrylate pressure-sensitive adhesive of 35%, continue stirring to mixing
Uniformly, the glue that dispels the heat is obtained.
It should be noted that in such scheme, the kind of coupling agent, the kind of organic solvent and
The kind of pressure sensitive adhesive can select according to actual needs, at this without limitation.
Wherein, the quality of coupling agent and the quality of binding agent can select according to actual needs,
Do not limit at this.
The heat radiation glue that the embodiment of the present invention provides, can coat PE (polyethylene) or PP (poly-
Propylene) product surface, as protecting film, this protecting film is used directly for the former film of optical thin film
Processing, the processing of functional optical thin film, thus be applied in laser projection device, and also may be used
It is applied in the processing of liquid crystal display, the effect of heat radiation can not only be realized, moreover it is possible to prevent optics
Thin film is contaminated by dust and scratches.
Embodiment seven
The embodiment of the present invention seven provides a kind of heat radiation plastics, and these heat radiation plastics are by described in embodiment one
Heat dissipation composition be combined with plastic raw materials and prepare gained.
The preparation method of these heat radiation plastics, can be by reality for mode one as described in embodiment three
Execute in the Heat dissipation composition in example one or embodiment two and prepare Heat dissipation composition, with plastic raw materials
Mix homogeneously obtains, and is not described in detail in this.
The present embodiment provides following scheme to illustrate to use described in the mode two in embodiment three
Method prepare heat radiation plastics process, specific as follows:
Scheme F1
Respectively by the carborundum of a diameter of for 1.10.9g 500nm, the nitrogen of a diameter of 10nm of 0.80.6g
Changing titanium to be scattered in 100g ethyl acetate solvent, stirring is to being uniformly dispersed, with 0.5g silicon after drying
Alkane coupling agent, 50g polypropylene (PP), carry out melt blending, obtains the plastics that dispel the heat.
Scheme F2
Respectively by the carborundum of a diameter of for 23.8g 10nm, the titanium nitride of a diameter of 200nm of 6g,
The anatase-type nanometer titanium dioxide of a diameter of 10nm of 10g disperses in a solvent (30g bis-respectively
Toluene, 40g ethyl acetate, 30g ethylbenzene), stirring is to being uniformly dispersed, with 0.2g silicon after drying
Alkane coupling agent, 134.86g propylene/butadiene/styrene copolymers (ABS) carry out melt blending,
Obtain described heat radiation plastics.
Scheme F3
Respectively by the carborundum of a diameter of for 14.6g 900nm, the titanium nitride of a diameter of 900nm of 4g,
The anatase-type nanometer titanium dioxide of a diameter of 800nm of 1g disperse in a solvent (30g toluene,
40g butyl acetate, 30g ethylbenzene), stirring is to being uniformly dispersed, silane coupled with 0.4g after drying
Agent, 3.98kg polrvinyl chloride (PVC) carry out melt blending, obtain the plastics that dispel the heat.
Scheme F4
Respectively by the carborundum of a diameter of for 6g 200nm, the titanium nitride of a diameter of 200nm of 8g, 5g
Anatase-type nanometer titanium dioxide dispersion (30g toluene, the 40g in a solvent of a diameter of 100nm
Butyl acetate, 30g ethylbenzene), stirring to being uniformly dispersed, after drying with 1g silane coupler,
180g polystyrene (PS) carries out melt blending, obtains the plastics that dispel the heat.
It should be noted that in such scheme, the kind of coupling agent, the kind of organic solvent and
The kind of plastic raw materials can select according to actual needs, at this without limitation.Example,
Plastic raw materials can be thermoset plastic, it is also possible to be thermoplastic plastic.
The embodiment of the present invention provide heat radiation plastics can be used for make phone housing, computer casing or its
He needs the shell of the electronic devices and components of heat radiation, the especially shell of laser projection device, equipment work
Heat is produced big during work, high to cooling requirements, it is possible to achieve good radiating effect, favorably
In protection electronic devices and components, increase the service life.
The above, the only detailed description of the invention of the present invention, but protection scope of the present invention is also
Being not limited to this, any those familiar with the art is at the technology model that the invention discloses
In enclosing, change can be readily occurred in or replace, all should contain within protection scope of the present invention.
Therefore, protection scope of the present invention should be as the criterion with described scope of the claims.
Claims (12)
1. a Heat dissipation composition, it is characterised in that described Heat dissipation composition includes: nano silicon carbide
Silicon and Nano titanium nitride, wherein, the particle diameter of described nanometer silicon carbide and Nano titanium nitride exists
Between 10nm-900nm.
Heat dissipation composition the most according to claim 1, it is characterised in that described nano silicon nitride
The mass fraction of titanium is 15-40%.
Heat dissipation composition the most according to claim 1, it is characterised in that described nano silicon carbide
The particle diameter of silicon and Nano titanium nitride is between 10nm-600nm.
Heat dissipation composition the most according to claim 3, it is characterised in that described nano silicon carbide
The particle diameter of silicon and Nano titanium nitride is between 50nm-200nm.
Heat dissipation composition the most according to claim 1, it is characterised in that described heat radiation combination
Thing also includes nano titanium oxide, and the particle diameter of described nano titanium oxide is between 10nm-800nm.
Heat dissipation composition the most according to claim 5, it is characterised in that described nano-silica
The mass fraction changing titanium is 5-25%.
7. according to the Heat dissipation composition described in claim 1-6, it is characterised in that described heat radiation combination
Thing also includes coupling agent.
8. a preparation method for the Heat dissipation composition as described in any one of claim 1-7, its feature
It is, including: the component of described Heat dissipation composition is added in organic solvent, waves after being uniformly dispersed
Send out organic solvent and obtain described Heat dissipation composition.
9. Heat dissipation composition described in any one of claim 1-7 prepare heat radiation coating, heat radiation glue or
Application in heat radiation plastics.
10. a heat radiation coating, it is characterised in that by the heat radiation described in any one of claim 1-7
Compositions is combined with binding agent prepares gained.
11. 1 kinds of heat radiation glue, it is characterised in that by the heat radiation described in any one of claim 1-7
Compositions is combined with pressure sensitive adhesive prepares gained.
12. 1 kinds of heat radiation plastics, it is characterised in that by the heat radiation described in any one of claim 1-7
Compositions is combined with plastic raw materials prepares gained.
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