CN102748737A - LED (light-emitting diode) lamp and radiating pipe thereof - Google Patents
LED (light-emitting diode) lamp and radiating pipe thereof Download PDFInfo
- Publication number
- CN102748737A CN102748737A CN2012102197640A CN201210219764A CN102748737A CN 102748737 A CN102748737 A CN 102748737A CN 2012102197640 A CN2012102197640 A CN 2012102197640A CN 201210219764 A CN201210219764 A CN 201210219764A CN 102748737 A CN102748737 A CN 102748737A
- Authority
- CN
- China
- Prior art keywords
- nano
- heat
- heat pipe
- nanometer
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention provides a radiating pipe belonging to the field of LED (light-emitting diode) light sources. The radiating pipe comprises a pipe shell. The pipe shell comprises a common material layer and a nano radiating layer, wherein the nano radiating layer is formed on the external surface of the common material layer and is made of hydrophobic organic and inorganic hybrid resin and/or micro-nano radiating powder. The invention additionally provides an LED lamp with the radiating pipe. Due to the nano radiating layer, the radiating performance of the LED lamp can be improved. Compared with the existing radiating pipe used for the LED lamp, the heat conductivity of the radiating pipe provided by the invention is improved by more than 40 times. When the radiating pipe is used for a high-power LED lamp, the service life of the lamp can be obviously prolonged. Besides, the nano radiating layer coated on the pipe shell of the radiating pipe has acid-resistant, alkali-resistant, salt-resistant and corrosion-resistant performance.
Description
Technical field
The present invention relates to a kind of LED (Light Emitting Diode, light emitting diode) light source, relate in particular to a kind of LED lamp and heat pipe thereof.
Background technology
Along with becoming increasingly conspicuous of global energy problem, augmentation of heat transfer plays crucial effects in the exploitation of the energy with in practicing thrift, and is also increasingly high to the requirement of the performance indications such as efficient low-resistance compactness of heat-exchange system.
Characteristics such as high brightness LED (LED) has that power consumption is little, the life-span is long, response speed is fast, volume is little, pollution-free, easy of integrationization are the light sources of new generation that causes illumination revolution and traditional lighting upgrading of industries.Particularly become today of theme at energy-saving and emission-reduction, protection environment, semiconductor lighting becomes new growth engines especially, thereby receives the great attention of national governments and industrial circle.
The American market investigation StrategiesUnlimited of company estimates that by 2010, high-brightness LED market will reach 8,300,000,000 dollars, and the sum than 2005 is above 2 times.In recent years, the form that is applied to throw light on along with great power LED forms gradually, and solving heat dissipation problem has become the prerequisite that great power LED is used; For existing LED light efficiency level; 70% ~ 80% of input electric energy is transformed into the heat that can't discharge by radiation, and led chip is small-sized, if it is bad to dispel the heat; Chip temperature is raise, cause that thermal stress distribution is uneven, chip light emitting efficient reduces, the sharp decrease in efficiency of penetrating of fluorescent material.
Research shows: when temperature surpasses certain value, it is soaring that the crash rate of device will be index law, the every rising 2e of device temperature, and reliability then descends 10%.If a plurality of high-power LED chip dense arrangement constitute white lumination system, the dissipation problem of heat is even more serious.Therefore, how improving the package cooling ability is present stage one of the key technology that needs to be resolved hurrily of illumination level great power LED.
And adopt the high-performance heat radiation coating to come the heat radiation of strengthening electronic device a kind of method preferably of can yet be regarded as.For example, patent CN101659829A discloses a kind of infra-red radiation composite radiating coating.Patent adopts dual-coating, and bottom is a charcoal blacking, and surface layer is high radiation nano composite dope, utilizes the investment precoat high radiant rate to reach the purpose of radiating and cooling.But this coating application complex process, demanding again coating layer thickness is realized radiating and cooling simultaneously, so cost is higher.Patent CN101070448A has related to a kind of preparation method who has boron nitride filler and bond to process heat radiation coating.Its method is that the bond reaction through the boron nitride of 30-70% and 30-70% makes, and adopts spraying and 80 ℃ of following heated bakings to make then, and the radiating effect of coating is obvious.Find through the surface area test: compare with tabula rasa, the microcosmic surface of coating is long-pending to have increased about 154 times.Patent CN101993621A relates to the condense composition of heat dissipation film of a kind of spraying, and it consists of heat-resisting Teflon resin and silicon carbide powder.Owing to be a kind of solvent based coating, environmental pollution is bigger.Patent CN101942270A relates to a kind of LED heat radiation coating, and it has used bigger beryllium oxide of toxicity and the more expensive aluminium nitride of price to improve the radiating effect of coating.
More than the heat radiation coating of report is conventional solvent type coating mostly; No matter a large amount of toxic harmful exhaust gas, the discharging of waste water are all arranged in manufacture process or construction application process; Environment, atmosphere and water resource are polluted, also cause the waste of the resource and the energy simultaneously.In addition, the coating after the film forming is made up of organic matter mostly, and burning causes potential safety hazard to environment easily.Therefore, technological based on the water-based hybrid inorganic-organic, as to have inorganic and organic matter cooperative effect high-performance coating material causes people's extensive concern, becomes one of main direction of current surface functional material research and development.
Summary of the invention
The object of the present invention is to provide a kind of heat pipe, it can be delivered to radiator with the heat of led light source, and a large amount of heats that the led chip that exists with the solution prior art produces are difficult to timely problem of outwards distributing.
Another object of the present invention is to provide a kind of LED lamp that contains above-mentioned heat pipe.
Heat pipe provided by the invention comprises shell, and said shell comprises common material layers and nanometer heat dissipating layer, and said nanometer heat dissipating layer is formed at the outer surface of common material layers.
The material of said nanometer heat dissipating layer is water-based organic-inorganic hybrid resin and/or micro-nano heat radiation powder.
Said water-based organic-inorganic hybrid resin is an inorganic precursor with metal alkoxide and Nano sol, is organic precursor with the trialkoxy silane that has functional group, forms through hydrolysis and condensation under given conditions.The number-average molecular weight of said water-based organic-inorganic hybrid resin is 1000 ~ 30000, and solid content is 45-55%, and said metal alkoxide, Nano sol and the said weight ratio that has the trialkoxy silane of functional group are 1:1 ~ 5:2 ~ 10.
Alkyl in the said metal alkoxide is C
1-8Alkyl, metal are silicon, titanium, zirconium or aluminium.Said metal alkoxide is preferably one or more in ethyl orthosilicate, zirconium-n-propylate and the butyl titanate.
Said Nano sol is one or more in nanometer titanium colloidal sol, Nano silica sol, nano aluminum colloidal sol and the nanometer zirconium colloidal sol.
The said trialkoxy silane that has functional group is one or more in MTES, isobutyl group triethoxysilane, octyltri-ethoxysilane, MTES, dimethyldiethoxysilane, vinyltrimethoxy silane, VTES, γ-glycidyl ether oxygen propyl trimethoxy silicane, gamma-aminopropyl-triethoxy-silane, γ-methacryloxypropyl trimethoxy silane and trimethyl one Ethoxysilane.
Said micro-nano heat radiation powder is one or more in metal or nonmetallic carbide, metal or nonmetal oxide and metal or the non-metal nitride.Said carbide is selected from one or more in nanometer tungsten carbide, carborundum, zirconium carbide, aluminium carbide and the titanium carbide.Said oxide is selected from one or more the mixture in boron oxide, sodium oxide molybdena, magnesia, aluminium oxide, silica, calcium oxide, transition metal oxide and the rare earth oxide.Said nitride is selected from one or several the mixture in nano-silicon nitride, nano vanadium nitride and the Nano titanium nitride of nano-silicon nitride magnesium, nano aluminum nitride, nm-class boron nitride, order orientation structure.
When the material of said nanometer heat dissipating layer was the mixture of water-based organic-inorganic hybrid resin and micro-nano heat radiation powder, the weight ratio of water-based organic-inorganic hybrid resin and micro-nano heat radiation powder was 100:0.3 ~ 3.5.
Said micro-nano heat radiation powder preferably passes through surface modification treatment.
LED lamp provided by the invention contains above-mentioned heat pipe.
Beneficial effect of the present invention: the shell of heat pipe of the present invention is coated with the nanometer heat dissipating layer; Its heat dissipating layer can improve the heat dispersion of LED lamp; The more existing heat pipe that is used for the LED lamp; Heat pipe for thermal conductivity rate of the present invention improves more than 40 times, can obviously improve the service life of light fixture when it is used for high-powered LED lamp.In addition; The nanometer heat dissipating layer that applies on the shell of heat pipe of the present invention has the antiseptic property of acid and alkali resistance, salt; Adopt the GB/T1763-89 standard detecting method that the heat pipe that is coated with the nanometer heat dissipating layer is detected; Respectively it is dipped in 30d in the salt solution of 10% sulfuric acid, 10% sodium hydroxide solution and 30g/L, non-foaming, nondiscolouring, do not come off, non-corroding.
Description of drawings
Fig. 1 is the front view of LED lamp of the present invention.
Fig. 2 is the internal structure sketch map of LED lamp of the present invention.
Fig. 3 is the structure for amplifying sketch map between light source of the present invention, lamp stand and the heat pipe.
Fig. 4 is the wall portion structural representation of heat pipe of the present invention.
Reference numeral: lower house padlock, 3 second radiators, 4 lower houses, 5 cloches, 10 heat pipes, 11 shells, 12LED light source, 13, radiator, 16 lamp stands, 110 common material layers, 120 nanometer heat dissipating layers on 1 first radiator, 2.
The specific embodiment
Below in conjunction with the accompanying drawing and the specific embodiment the present invention is explained further details.
The present invention is that example is explained with the LED light fixture with two-stage radiation, and concrete structure is explained as follows:
As shown in Figure 1; Modular two-stage radiation LED street lamp of the present invention; Comprise lamp housing, led light source, cloche 5; Wherein lamp housing is the structure that lower house 4 is provided with first radiator 1 and second radiator (upper shell) 3, and 2 is the latch-up structure (going up the lower house padlock) of lower house 4 and upper shell 3.Led light source 12 connects and composes the one-level heat radiation through the heat pipe 10 and first radiator 1 that is located at the light source bottom, and in addition, led light source 12 is connected to form the secondary heat radiation through the lamp stand 16 and second radiator 3.
The shell 11 of heat pipe 10 comprises common material layers 110 and nanometer heat dissipating layer 120, and this nanometer heat dissipating layer 120 is formed at the outer surface of common material layers 110.
In addition, as the material of nanometer heat dissipating layer 120, can be the water-based organic-inorganic hybrid resin, can also be micro-nano heat radiation powder, also can be the mixture of the two.Discuss in the face of one of which one down.
With the organic-inorganic hybrid resin of making coatings, can be metal alkoxide such as the silane oxide of representing inorganic part, zirconium alkoxide, alkyl titanium oxide etc., and Nano sol; And the water-based organic-inorganic hybrid resin that makes through hydrolysis and condensation of the trialkoxy silane that has functional group of representing organic moiety; The number-average molecular weight that GPC (gel permeation chromatography) tests this water-based organic-inorganic hybrid resin is 1000 ~ 30000; Solid content is 45-55%, and said metal alkoxide, Nano sol and the said weight ratio that has the trialkoxy silane of functional group are 1:1 ~ 5:2 ~ 10.
Alkyl in the said metal alkoxide can be C
1-8Alkyl, metal can be silicon, titanium, zirconium, aluminium.Such as, said silane oxide can be an ethyl orthosilicate; Said zirconium alkoxide can be a zirconium-n-propylate; Said alkyl titanium oxide can be a butyl titanate.
Said Nano sol can be one or more in nanometer titanium colloidal sol, Nano silica sol, nano aluminum colloidal sol and the nanometer zirconium colloidal sol.Preferred titanium dioxide, silica, aluminium dioxide or the mass percent concentration of zirconium dioxide received are 20-40%.
The said trialkoxy silane that has functional group can be one or more in MTES, isobutyl group triethoxysilane, octyltri-ethoxysilane, MTES, dimethyldiethoxysilane, vinyltrimethoxy silane, VTES, γ-glycidyl ether oxygen propyl trimethoxy silicane, gamma-aminopropyl-triethoxy-silane, γ-methacryloxypropyl trimethoxy silane and trimethyl one Ethoxysilane.
The preparation method of above-mentioned water-based organic-inorganic hybrid resin is following:
(1) preparation of Nano sol: commercially available nano titanium oxide, nano silicon, nanometer titanium dioxide aluminium or nano zirconium dioxide powder are formed corresponding Nano sol through ultrasonic dispersing in organic solvent;
(2) preparation of water-based organic-inorganic hybrid resin: metal alkoxide and the trialkoxy silane that has functional group are mixed by said ratio; By said ratio Nano sol is at the uniform velocity added then; Solution becomes is muddy; Continue stirring and drip phosphoric acid simultaneously as catalyst, transparent until solution, thus obtain organic-inorganic hybrid resin.
Enumerate several examples below.
Embodiment 1
Step 1, commercially available nano-titanium dioxide powder (particle diameter 30nm) is formed mass percent concentration through ultrasonic dispersing in butyl acetate be 30% Ludox;
Step 1, commercially available nano-titanium dioxide powder (particle diameter 30nm) is formed mass percent concentration through ultrasonic dispersing in butyl acetate be 30% Ludox;
As one of micro-nano heat radiation powder, can be metal or nonmetallic carbide, such as nanometer tungsten carbide.Can certainly be other metals such as carborundum, zirconium carbide, aluminium carbide or titanium carbide or nonmetallic nano-carbide.
Why choose tungsten carbide as micro-nano heat radiation powder, be because: compare with ferrous materials, Talide has particular chemical and physical property; For example; The thermal conductivity of tungsten carbide is higher 2～4 times than ferrous materials, and it has high strength and the high tenacity that equates with high-speed steel, and in the time of 600 ℃; Its high temperature hardness still surpasses the normal temperature hardness of high-speed steel, still surpasses the normal temperature hardness of carbon steel in the time of 1000 ℃.
Single tungsten carbide particle has only about 10～100nm, BET surface area 1～50m
2/ g; Help very much to improve its heat dispersion; When particularly it joined in the coating that above-mentioned hybrid resin constitutes as filler, the bulk effect that can make full use of the nano functional filler was filled the unavoidable structure hole of conventional coating (aperture is more than 1nm), forms the compacted zone of atresia; Stop the infiltration of various corrosive mediums, realize that heat radiation and corrosion-resistant are integrated.
Preparation method as tungsten carbide: useful W elements and carbon commonly used in the industry directly react; Perhaps tungstic acid and carbon react in inert atmosphere, also can adopt utilize the wolframic acid base inorganic-organicly mix lamellar compound prepares the tungsten carbide nano-powder for single source predecessor preparation method (Chinese patent CN101780982B).
As micro-nano heat radiation powder, can also be metal or nonmetal oxide, such as one or more the mixture in boron oxide, sodium oxide molybdena, magnesia, aluminium oxide, silica, calcium oxide, transition metal oxide or the rare earth oxide.
As micro-nano heat radiation powder; Can also be metal or non-metal nitride, such as one or several the mixture in the multiple super-high heat-conductive fillers such as nano-silicon nitride magnesium, nano aluminum nitride, nm-class boron nitride, nano-silicon nitride (order orientation structure), nano vanadium nitride or Nano titanium nitride.After deliberation, these micro-nano heat radiation powders are the high heat conductive insulating composite granule.
The mixture that uses multiple nitride is during as the heat radiation powder; Can be prone to the different of wetability, doping mark, self heat conductivility according to the particle diameter of every kind of material and form, surface, use the different particle of particle diameter, let and form maximum degree of piling up between filler; Heat conduction network in the system is formed to the full extent and reach effective heat conduction (also promptly forming the almost compacted zone of atresia); Acquisition high heat conductive body system, thermal conductivity factor even can reach more than the 400W/MK, and also insulating properties is fine; Resistivity more than 10 16 powers, and can be anti-1800 degree high temperature.Be suitable for very much the heat radiation of high-powered LED lamp.
When the material as nanometer heat dissipating layer 120 is the mixture of above-mentioned water-based organic-inorganic hybrid resin and above-mentioned micro-nano heat radiation powder; The weight ratio of above-mentioned water-based organic-inorganic hybrid resin solids and above-mentioned micro-nano heat radiation powder is 100:0.3 ~ 3.5, is preferably 100:1.
In addition; Can carry out surface modification treatment to said micro-nano heat radiation powder; Thereby introduce organic reaction functional group, like this, can improve the dispersiveness of micro-nano heat radiation powder in coating material on the one hand; In film forming procedure, make the reaction of the organic reaction functional group that is introduced into and resin generation chemical graft on the other hand, thus improve heat dissipating layer compactness, hardness, shock resistance and with the adhesive force of ground.Such as above-mentioned nitride; If handle through special surface, after the introducing organic reaction functional group, its content of surface oxygen is extremely low; Thereby can the success be applied in epoxy resin, polyurethane, heat conductive silica gel, heat-conducting silicone grease, the plastics; Because its heat conductivility is extremely strong, general adding proportion is about 1% (mass ratio), can make macromolecule resin reach the thermal conductivity factor about 3W.
Enumerate an example of micro-nano heat radiation powder surface modification below.
Embodiment 3 silicon-dioxide powdery modifications
Ethyl orthosilicate is dissolved in a certain amount of absolute ethyl alcohol; The hydrochloric acid that in system, adds quantitative 1mol/L again; Regulating the pH value is 2; Then according to ethyl orthosilicate: γ-glycidyl ether oxygen propyl trimethoxy silicane is 1:4 (mol ratio) adds γ-glycidyl ether oxygen propyl trimethoxy silicane and metering in reaction system a distilled water, and 78 ℃ are reacted 6h down; Reaction after finishing is taken out accessory substance, and reaction system is sealed ageing, obtains the transparent modified silicon dioxide sol of homogeneous.
In addition; Can know according to above-mentioned argumentation,, also can include only common material layers 110 as the shell 11 of the heat pipe among Fig. 3 of the present invention 10; Only this common material layers 110 is to be formed by one or more plastics that mix among above-mentioned nitride, oxide and the person's carbide person that 0.5-3wt% is arranged; And common plastics are because be added with above-mentioned additive, so its thermal conductivity brings up to 2.0 from original 0.1, thermal conductivity has improved 20 times.Realized the effect that can heat conduction alleviates the weight of LED street lamp again.
As the radiation nano powder body material is applied to the method that heat pipe package gets on, can also can be the whole bag of tricks such as plasma spraying also through the method for spraying through the method (CN102181212A) of electrophoresis.
Nanometer tungsten carbide can make an addition in pottery or binding agent such as macromolecular material or the agent for fixing, is coated in the outer wall surface of this common material layers 110 after the mixing.
In addition, above-mentioned nanometer heat radiation coating can also form on last lower house except being formed at heat pipe.
Can know that by technological general knowledge the present invention can realize through other the embodiment that does not break away from its spirit or essential feature.Therefore, above-mentioned disclosed embodiment with regard to each side, all just illustrates, and is not only.All within the scope of the present invention or the change in being equal to scope of the present invention all comprised by the present invention.
Claims (10)
1. a heat pipe comprises shell, it is characterized in that, said shell comprises common material layers and nanometer heat dissipating layer, and said nanometer heat dissipating layer is formed at the outer surface of common material layers.
2. heat pipe according to claim 1 is characterized in that, the material of said nanometer heat dissipating layer is water-based organic-inorganic hybrid resin and/or micro-nano heat radiation powder.
3. heat pipe according to claim 2; It is characterized in that; Said water-based organic-inorganic hybrid resin is an inorganic precursor with metal alkoxide and Nano sol, is organic precursor with the trialkoxy silane that has functional group, forms through hydrolysis and condensation under given conditions; Wherein, the number-average molecular weight of said water-based organic-inorganic hybrid resin is 1000 ~ 30000, and solid content is 45-55%, and said metal alkoxide, Nano sol and the said weight ratio that has the trialkoxy silane of functional group are 1:1 ~ 5:2 ~ 10.
4. heat pipe according to claim 3 is characterized in that, the alkyl in the said metal alkoxide is C
1-8Alkyl, metal are silicon, titanium, zirconium or aluminium; Said Nano sol is one or more in nanometer titanium colloidal sol, Nano silica sol, nano aluminum colloidal sol and the nanometer zirconium colloidal sol; The said trialkoxy silane that has functional group is one or more in MTES, isobutyl group triethoxysilane, octyltri-ethoxysilane, MTES, dimethyldiethoxysilane, vinyltrimethoxy silane, VTES, γ-glycidyl ether oxygen propyl trimethoxy silicane, gamma-aminopropyl-triethoxy-silane, γ-methacryloxypropyl trimethoxy silane and trimethyl one Ethoxysilane.
5. heat pipe according to claim 4 is characterized in that, said metal alkoxide is one or more in ethyl orthosilicate, zirconium-n-propylate and the butyl titanate.
6. heat pipe according to claim 2 is characterized in that, said micro-nano heat radiation powder is one or more the mixture in metal or nonmetallic carbide, metal or nonmetallic oxide and metal or the nonmetallic nitride; Wherein, said carbide is selected from one or more the mixture in nanometer tungsten carbide, carborundum, zirconium carbide, aluminium carbide and the titanium carbide; Said oxide is selected from one or more the mixture in boron oxide, sodium oxide molybdena, magnesia, aluminium oxide, silica, calcium oxide, transition metal oxide and the rare earth oxide; Said nitride is selected from one or more the mixture in nano-silicon nitride, nano vanadium nitride and the Nano titanium nitride of nano-silicon nitride magnesium, nano aluminum nitride, nm-class boron nitride, order orientation structure.
7. heat pipe according to claim 6 is characterized in that, said micro-nano heat radiation powder is through surface modification treatment.
8. heat pipe according to claim 2 is characterized in that, the water-based organic-inorganic hybrid resin in the material of said nanometer heat dissipating layer and the weight ratio of micro-nano heat radiation powder are 100:0.3 ~ 3.5.
9. heat pipe according to claim 8 is characterized in that, the water-based organic-inorganic hybrid resin in the material of said nanometer heat dissipating layer and the weight ratio of micro-nano heat radiation powder are 100:1.
10. a LED lamp is characterized in that, comprises the arbitrary described heat pipe of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210219764.0A CN102748737B (en) | 2012-06-28 | 2012-06-28 | LED (light-emitting diode) lamp and radiating pipe thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210219764.0A CN102748737B (en) | 2012-06-28 | 2012-06-28 | LED (light-emitting diode) lamp and radiating pipe thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102748737A true CN102748737A (en) | 2012-10-24 |
| CN102748737B CN102748737B (en) | 2014-06-04 |
Family
ID=47029131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210219764.0A Expired - Fee Related CN102748737B (en) | 2012-06-28 | 2012-06-28 | LED (light-emitting diode) lamp and radiating pipe thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102748737B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104696925A (en) * | 2013-12-06 | 2015-06-10 | 苏州浩华光电科技有限公司 | LED radiating module |
| CN104896452A (en) * | 2015-06-11 | 2015-09-09 | 固态照明张家口有限公司 | Heat dissipation material, LED spot light radiator based on same, and LED spot light |
| CN105062292A (en) * | 2015-08-06 | 2015-11-18 | 苏州好洁清洁器具有限公司 | High-corrosion-resistance aluminum alloy pipe material |
| CN105754475A (en) * | 2016-03-29 | 2016-07-13 | 东莞艾宝纳米科技有限公司 | Nano heat-dissipation coating and preparation method |
| CN105885094A (en) * | 2016-06-29 | 2016-08-24 | 海信集团有限公司 | Heat dissipation composition as well as preparation method and application thereof |
| CN108489311A (en) * | 2018-02-09 | 2018-09-04 | 上海大学 | The removal alloying preparation method of high heat transfer rate heat-transfer pipe |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010054495A1 (en) * | 1999-09-27 | 2001-12-27 | Yevin Oleg A. | Surfaces having particle structures with broad range radiation absorptivity |
| CN1661317A (en) * | 2004-02-27 | 2005-08-31 | 鸿富锦精密工业（深圳）有限公司 | Heat pipes |
| CN1800766A (en) * | 2005-01-07 | 2006-07-12 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe and manufacturing method thereof |
-
2012
- 2012-06-28 CN CN201210219764.0A patent/CN102748737B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010054495A1 (en) * | 1999-09-27 | 2001-12-27 | Yevin Oleg A. | Surfaces having particle structures with broad range radiation absorptivity |
| CN1661317A (en) * | 2004-02-27 | 2005-08-31 | 鸿富锦精密工业（深圳）有限公司 | Heat pipes |
| CN1800766A (en) * | 2005-01-07 | 2006-07-12 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe and manufacturing method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 王为军等: "纳米AL2O3/有机-无机杂化复合铝合金涂层的耐腐蚀性能研究", 《涂料工业》 * |
| 王秀华等: "铝合金表面新型有机-无机杂化纳米SiO2涂层的制备及其性能", 《材料保护》 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104696925A (en) * | 2013-12-06 | 2015-06-10 | 苏州浩华光电科技有限公司 | LED radiating module |
| CN104896452A (en) * | 2015-06-11 | 2015-09-09 | 固态照明张家口有限公司 | Heat dissipation material, LED spot light radiator based on same, and LED spot light |
| CN105062292A (en) * | 2015-08-06 | 2015-11-18 | 苏州好洁清洁器具有限公司 | High-corrosion-resistance aluminum alloy pipe material |
| CN105754475A (en) * | 2016-03-29 | 2016-07-13 | 东莞艾宝纳米科技有限公司 | Nano heat-dissipation coating and preparation method |
| CN105885094A (en) * | 2016-06-29 | 2016-08-24 | 海信集团有限公司 | Heat dissipation composition as well as preparation method and application thereof |
| CN105885094B (en) * | 2016-06-29 | 2019-02-26 | 海信集团有限公司 | A kind of Heat dissipation composition and the preparation method and application thereof |
| CN108489311A (en) * | 2018-02-09 | 2018-09-04 | 上海大学 | The removal alloying preparation method of high heat transfer rate heat-transfer pipe |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102748737B (en) | 2014-06-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102748737B (en) | LED (light-emitting diode) lamp and radiating pipe thereof | |
| CN102471637B (en) | Heat dissipation coating agent and heat-dissipating plate including same | |
| CN107760128A (en) | A kind of water paint of high heat dispersion and preparation method thereof | |
| CN106322238A (en) | Wall lamp mechanism | |
| CN104693968A (en) | High heat conduction and dissipation coating and preparation method thereof | |
| CN106439526A (en) | Bulb for LED lamp | |
| CN102585638A (en) | Preparation method for waterborne nano radiating and cooling environment-friendly coating, and coating | |
| CN110760233A (en) | Heat-conducting composite coating and heat-conducting coating prepared from same | |
| CN101985519A (en) | Moulded-in-place high molecular thermal conductive composite material and preparation method thereof | |
| CN105970192B (en) | The preparation method and application of intelligent corrosion-inhibiting coating | |
| CN104031388A (en) | Phenyl siloxane rubber nanometer composite material and preparation method thereof | |
| CN105419672A (en) | Preparation method of high-heat-dissipation electric-conductive glue used for high-power LED | |
| CN103665875B (en) | A kind of preparation method of conductive silicon rubber | |
| CN106195781B (en) | A kind of watertight light fitting of excellent radiation performance | |
| CN110776819A (en) | Graphene heat dissipation coating for electronic and electric appliances | |
| CN106519908A (en) | Anticorrosive coating in radiator | |
| CN104449337A (en) | Preparation method of high-thermal-conductivity photocuring functional coating | |
| CN202813289U (en) | LED lamp and heat pipe thereof | |
| CN104861862A (en) | Heat-dissipating coating for LED lamp and preparation method thereof | |
| CN104776338B (en) | Lighting device | |
| CN102732148A (en) | Urushiol silicon high temperature resistant liquid anti-corrosion paint | |
| CN110317519A (en) | A kind of preparation method of environment friendly flame-retardant LED heat radiation coating | |
| CN104672496B (en) | Insulating heat-conductive graphite microparticles with core shell structure and its production and use | |
| CN104219936B (en) | Production process for dustproof heat-conducting foam | |
| CN108730940A (en) | Graphene heat dissipation LED road lamp fluorescent tube |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140604 Termination date: 20160628 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |