CN102559089A - Water-based acrylic thermal-conductive double-sided tape and preparation method thereof - Google Patents
Water-based acrylic thermal-conductive double-sided tape and preparation method thereof Download PDFInfo
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- CN102559089A CN102559089A CN2011104513807A CN201110451380A CN102559089A CN 102559089 A CN102559089 A CN 102559089A CN 2011104513807 A CN2011104513807 A CN 2011104513807A CN 201110451380 A CN201110451380 A CN 201110451380A CN 102559089 A CN102559089 A CN 102559089A
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- sensitive adhesive
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Abstract
The invention provides a water-based acrylic thermal-conductive double-sided tape and a preparation method of the double-sided tape, comprising an upper pressure-sensitive adhesive layer, a glass fiber fabric layer and a lower pressure-sensitive adhesive layer, wherein two sides of the glass fiber layer is coated with the upper pressure-sensitive adhesive layer and the lower pressure-sensitive adhesive layer, respectively, and the upper and lower pressure-sensitive adhesive layer are water-based acrylic thermal-conductive pressure-sensitive adhesive layers. The water-based acrylic thermal-conductive double-sided tape combines the characteristics of a thermal-conductive material and an adhesive tape, namely, high-effective thermal-conductivity, easy operation and powerful adhesion of an adhesive tape, and excellent electrical insulated effect, and is widely used in industries and fields such as high-power transistors, heat sinks, integrated circuits, filler of a gap between a metal structure and a chassis, LED (light-emitting diode) display screens, notebook computers, mobile phones and the like.
Description
Technical field
The present invention relates to adhesive tape and manufacture technology field thereof, particularly relate to a kind of water-based acrylic bond plies band, and relate to the making method of this water-based acrylic bond plies band.
Background technology
The solvent-borne type pressure sensitive adhesive has volatile organic compounds after curing residual.When running into high temperature, can progressively volatilize, form the Environmental Hormone phenomenon, human body and surrounding environment are produced pollution.The high toxicity that solvent-borne type pressure sensitive adhesive inflammable, explosive deleterious characteristics, particularly great majority contain " triphen " type organic solvent brings harm to human body and surrounding environment.
Existing bond plies band is that carrier doping heat conduction powder is formulated with the solvent-borne type pressure sensitive adhesive mostly, and with the bond plies band that its coating makes, though have heat-conducting effect, toxic and harmful easily volatilizees when meeting high temperature.As far as being in the bond plies band of the condition of high temperature for a long time, the solvent-borne type pressure sensitive adhesive is self-evident to the hidden danger that personal and environment are brought.
Existing water-based acrylic pressure sensitive adhesive preparation water-based acrylic heat conduction pressure sensitive adhesive can run into dispersed not enough, agglomeration occurs, or film-forming properties is poor, or heat conduction is inhomogeneous.The film-forming properties and the heat conduction homogeneity that improve water-based acrylic heat conduction pressure sensitive adhesive are difficult problems always, and unmanned or enterprise makes a breakthrough.The thermal conductivity of solvent-borne type pressure sensitive adhesive bond plies band does not surpass 0.9w/mk basically simultaneously, and heat-conducting effect is not good enough.
Summary of the invention
The technical problem that the present invention mainly solves is: to the deficiency of prior art; A kind of water-based acrylic bond plies band and preparation method thereof is provided; Make the thermal conductivity of product reach 1.18w/mk (180 ℃); Stripping strength reaches 26 n/25mm, can between electron device and radiator element, set up passage of heat efficient, cleaning.
For solving the problems of the technologies described above; The technical scheme that the present invention adopts is: a kind of water-based acrylic bond plies band is provided; Comprise: go up pressure-sensitive adhesive layer, glasscloth layer and following pressure-sensitive adhesive layer; Pressure-sensitive adhesive layer and following pressure-sensitive adhesive layer on the separate application of said glasscloth layer both sides, said upper and lower pressure-sensitive adhesive layer is water-based acrylic heat conduction pressure-sensitive adhesive layer.
In preferred embodiment of the present invention, said glasscloth layer is latticed glasscloth layer, and mesh diameter is 0.25-0.35mm.
In preferred embodiment of the present invention; Described pressure-sensitive adhesive layer and the following pressure-sensitive adhesive layer gone up processed by the material of following mass percent: water base high temperature resistant acrylate pressure sensitive adhesive 86-87%, ceramics powder 2-3%, aluminium nitride AlN 1-2%, SP 1 6-7%, dispersion agent 1.2-1.5%, coupling agent 1.5-1.8%.
In preferred embodiment of the present invention, described coupling agent is a titanate coupling agent.
The making method of above-mentioned water-based acrylic bond plies band may further comprise the steps:
1) preparation of upper and lower pressure-sensitive adhesive layer: with water base high temperature resistant acrylate pressure sensitive adhesive doped ceramics powder, aluminium nitride AlN, SP 1, dispersion agent and coupling agent, under 45-55 ℃ temperature, stirred 1.5-2.5 hour, process water-based acrylic heat conduction pressure-sensitive adhesive layer;
2) coating: pressure-sensitive adhesive layer in the side coating of glasscloth layer makes pressure-sensitive adhesive layer uniformly penetrating glasscloth layer, pressure-sensitive adhesive layer under the opposite side of glasscloth layer forms;
3) solidify the rolling again of fitting of back and dicing film, process water-based acrylic bond plies band.
The coating total amount of the upper and lower pressure-sensitive adhesive layer in preferred embodiment of the present invention, said step 2) is 100-500g.
In preferred embodiment of the present invention, the temperature when solidifying in the said step 3) is 105-135 ℃, and speed is 15-30m/min.
In preferred embodiment of the present invention, the water-based acrylic bond plies band that said step 3) is processed also needs through the thermostatic chamber slaking, and curing temperature is 40-50 ℃, and the time is 20-28h.
The invention has the beneficial effects as follows: the present invention has disclosed a kind of water-based acrylic bond plies band and preparation method thereof, is different from common bond plies band and adopts the bigger glasscloth of surface density, but adopt the less latticed glasscloth of surface density; Be convenient to even seep through, latticed pinning colloid is bonding each other firm between layer and the layer simultaneously; The water-based acrylic bond plies band that makes has obdurability, good sticking nature; Also possess high-efficiency heat conduction, powerful bonding, the construction characteristic of simple; And the electric insulation effect is excellent; Be widely used in high power transistor and radiator element, unicircuit and radiator element, industry and fields such as LED display and notebook computer, cell phone.
Description of drawings
Fig. 1 is the structural representation of water-based acrylic bond plies band of the present invention one preferred embodiment;
The mark of each parts is following in the accompanying drawing: 1, go up pressure-sensitive adhesive layer, 2, the glasscloth layer, 3, pressure-sensitive adhesive layer down.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is set forth in detail, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
See also shown in Figure 1ly, the embodiment of the invention comprises:
Embodiment 1:
The making step of water-based acrylic bond plies band as shown in Figure 1 is:
1) preparation of upper and lower pressure-sensitive adhesive layer: upper and lower pressure-sensitive adhesive layer the 1, the 3rd is mix 3% ceramics powder, 2% aluminium nitride AlN, 6% SP 1,1.5% dispersion agent, 1.5% a coupling agent of 86% water base high temperature resistant acrylate pressure sensitive adhesive by mass percent; Stirring was processed in 2 hours under 50 ℃ of temperature; Water base high temperature resistant acrylate pressure sensitive adhesive preferred but not choose the water base high temperature resistant acrylate pressure sensitive adhesive of being produced by Kunshan stone plum chemical industry ltd of HT-160 type with being limited to; Ceramics powder, aluminium nitride AlN and SP 1 preferred but not choose EK 50nm type ceramics powder, YN 50nm type aluminium nitride AlN and the YC 50nm type SP 1 that Shanghai Huzheng Nano-Tech Co., Ltd. produces with being limited to, and dispersion agent and coupling agent preferred but not choose the OP31 type dispersion agent and the KY-200 type titanate coupling agent of the production of high ancient cooking vessel fine chemistry industry (Kunshan) ltd with being limited to;
2) coating: pressure-sensitive adhesive layer 1 in the side coating of glasscloth layer 2; Make pressure-sensitive adhesive layer 1 uniformly penetrating glasscloth layer 2, pressure-sensitive adhesive layer 3 under the opposite side of glasscloth layer 2 forms, said glasscloth layer 2 is latticed glasscloth layer; Mesh diameter is 0.25-0.35mm; Be preferably 0.30mm, the coating total amount of said upper and lower pressure-sensitive adhesive layer 1,3 is 100-500g, is preferably 300g;
3) solidify the rolling again of fitting of back and dicing film, process water-based acrylic bond plies band, the temperature during curing is 105 ℃, and speed is 15m/min.
The water-based acrylic bond plies band of processing also needs through the thermostatic chamber slaking, and curing temperature is 45 ℃, and the time is 24h.
Embodiment 2:
Only the mass percent with the raw material that makes upper and lower pressure-sensitive adhesive layer in the step 1) changes into: water base high temperature resistant acrylate pressure sensitive adhesive 87%, ceramics powder 2%, aluminium nitride AlN 1%, SP 1 7%, dispersion agent 1.2%, coupling agent 1.8%; Temperature when solidifying in the step 3) changes 115 ℃ into, and speed changes 20m/min into.All the other are with the description of embodiment 1.
Embodiment 3:
Only the mass percent with the raw material that makes upper and lower pressure-sensitive adhesive layer in the step 1) changes into: water base high temperature resistant acrylate pressure sensitive adhesive 86.5%, ceramics powder 2.5%, aluminium nitride AlN 1.5%, SP 1 6.5%, dispersion agent 1.5%, coupling agent 1.5%; Temperature when solidifying in the step 3) changes 135 ℃ into, and speed changes 30m/min into.All the other are with the description of embodiment 1.
By the water-based acrylic bond plies band that above embodiment makes, film forming is evenly smooth, and the tolerance rate is smaller or equal to 3%, and thermal conductivity reaches 1.18w/mk (180 ℃), and stripping strength reaches 26 n/25mm.
The present invention has disclosed a kind of water-based acrylic bond plies band and preparation method thereof, is different from common bond plies band and adopts the bigger glasscloth of surface density, but adopt the less latticed glasscloth of surface density; Be convenient to even seep through, latticed pinning colloid is bonding each other firm between layer and the layer simultaneously; The water-based acrylic bond plies band that makes has obdurability, good sticking nature; Also possess high-efficiency heat conduction, powerful bonding, the construction characteristic of simple; And the electric insulation effect is excellent; Be widely used in high power transistor and radiator element, unicircuit and radiator element, industry and fields such as LED display and notebook computer, cell phone.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification sheets of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (7)
1. water-based acrylic bond plies band; Comprise: go up pressure-sensitive adhesive layer, glasscloth layer and following pressure-sensitive adhesive layer; It is characterized in that; Pressure-sensitive adhesive layer and following pressure-sensitive adhesive layer on the separate application of said glasscloth layer both sides, said upper and lower pressure-sensitive adhesive layer is water-based acrylic heat conduction pressure-sensitive adhesive layer.
2. water-based acrylic bond plies band according to claim 1 is characterized in that, said glasscloth layer is latticed glasscloth layer, and mesh diameter is 0.25-0.35mm.
3. water-based acrylic bond plies band according to claim 1; It is characterized in that; Described pressure-sensitive adhesive layer and the following pressure-sensitive adhesive layer gone up processed by the material of following mass percent: water base high temperature resistant acrylate pressure sensitive adhesive 86-87%, ceramics powder 2-3%, aluminium nitride AlN 1-2%, SP 1 6-7%, dispersion agent 1.2-1.5%, coupling agent 1.5-1.8%.
4. water-based acrylic bond plies band according to claim 3 is characterized in that described coupling agent is a titanate coupling agent.
5. the making method of a water-based acrylic bond plies band as claimed in claim 1 is characterized in that, may further comprise the steps:
1) preparation of upper and lower pressure-sensitive adhesive layer: with water base high temperature resistant acrylate pressure sensitive adhesive doped ceramics powder, aluminium nitride AlN, SP 1, dispersion agent and coupling agent, under 45-55 ℃ temperature, stirred 1.5-2.5 hour, process water-based acrylic heat conduction pressure-sensitive adhesive layer;
2) coating: pressure-sensitive adhesive layer in the side coating of glasscloth layer makes pressure-sensitive adhesive layer uniformly penetrating glasscloth layer, pressure-sensitive adhesive layer under the opposite side of glasscloth layer forms;
3) solidify the rolling again of fitting of back and dicing film, process water-based acrylic bond plies band.
6. the making method of water-based acrylic bond plies band according to claim 5 is characterized in that, said step 2) in the coating total amount of upper and lower pressure-sensitive adhesive layer be 100-500g,
The making method of water-based acrylic bond plies band according to claim 5 is characterized in that, the temperature when solidifying in the said step 3) is 105-135 ℃, and speed is 15-30m/min.
7. the making method of water-based acrylic bond plies band according to claim 5 is characterized in that, the water-based acrylic bond plies band that said step 3) is processed also needs through the thermostatic chamber slaking, and curing temperature is 40-50 ℃, and the time is 20-28h.
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| CN2011104513807A CN102559089A (en) | 2011-12-30 | 2011-12-30 | Water-based acrylic thermal-conductive double-sided tape and preparation method thereof |
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| CN2011104513807A CN102559089A (en) | 2011-12-30 | 2011-12-30 | Water-based acrylic thermal-conductive double-sided tape and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103087646A (en) * | 2013-02-01 | 2013-05-08 | 上海晶华粘胶制品发展有限公司 | Thermally conductive adhesive tape and manufacturing process thereof |
| CN107057600A (en) * | 2016-12-30 | 2017-08-18 | 芜湖研高粘胶新材料有限公司 | Water-based acrylic thermal-conductive double-sided tape and preparation method thereof |
| CN109935159A (en) * | 2019-03-28 | 2019-06-25 | 深圳昌茂粘胶新材料有限公司 | A kind of reticulate pattern heat-conducting glue label material and preparation method thereof with flame retarding function |
| CN113416502A (en) * | 2021-05-14 | 2021-09-21 | 杨智童 | Insulating and heat-conducting double-sided adhesive tape and preparation method thereof |
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| CN201276523Y (en) * | 2008-09-16 | 2009-07-22 | 上海佳隆纤维胶带有限公司 | Glass fibre adhesive tape |
| JP2011001452A (en) * | 2009-06-18 | 2011-01-06 | Jsr Corp | Heat-conductive resin composition and heat-conductive film |
| CN102161871A (en) * | 2011-03-09 | 2011-08-24 | 烟台德邦电子材料有限公司 | Heat-conductive insulated adhesive tape for large-power light-emitting diode (LED) and preparation method thereof |
| CN102260466A (en) * | 2011-06-14 | 2011-11-30 | 中山金利宝胶粘制品有限公司 | Insulation heat-conducting double-sided adhesive tape and preparation method thereof |
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2011
- 2011-12-30 CN CN2011104513807A patent/CN102559089A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201276523Y (en) * | 2008-09-16 | 2009-07-22 | 上海佳隆纤维胶带有限公司 | Glass fibre adhesive tape |
| JP2011001452A (en) * | 2009-06-18 | 2011-01-06 | Jsr Corp | Heat-conductive resin composition and heat-conductive film |
| CN102161871A (en) * | 2011-03-09 | 2011-08-24 | 烟台德邦电子材料有限公司 | Heat-conductive insulated adhesive tape for large-power light-emitting diode (LED) and preparation method thereof |
| CN102260466A (en) * | 2011-06-14 | 2011-11-30 | 中山金利宝胶粘制品有限公司 | Insulation heat-conducting double-sided adhesive tape and preparation method thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103087646A (en) * | 2013-02-01 | 2013-05-08 | 上海晶华粘胶制品发展有限公司 | Thermally conductive adhesive tape and manufacturing process thereof |
| CN103087646B (en) * | 2013-02-01 | 2016-01-13 | 上海晶华胶粘新材料股份有限公司 | Heat conduction adhesive tape and manufacture craft thereof |
| CN107057600A (en) * | 2016-12-30 | 2017-08-18 | 芜湖研高粘胶新材料有限公司 | Water-based acrylic thermal-conductive double-sided tape and preparation method thereof |
| CN109935159A (en) * | 2019-03-28 | 2019-06-25 | 深圳昌茂粘胶新材料有限公司 | A kind of reticulate pattern heat-conducting glue label material and preparation method thereof with flame retarding function |
| CN109935159B (en) * | 2019-03-28 | 2024-01-26 | 深圳昌茂粘胶新材料有限公司 | Reticulate pattern heat-conducting adhesive label material with flame retardant function and preparation method thereof |
| CN113416502A (en) * | 2021-05-14 | 2021-09-21 | 杨智童 | Insulating and heat-conducting double-sided adhesive tape and preparation method thereof |
| CN113416502B (en) * | 2021-05-14 | 2023-08-29 | 安徽富印新材料股份有限公司 | Insulating heat-conducting double-sided adhesive tape and preparation method thereof |
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Application publication date: 20120711 |