CN106118541A - A kind of glue and preparation method thereof and containing the adhesive tape of this glue and components and parts - Google Patents
A kind of glue and preparation method thereof and containing the adhesive tape of this glue and components and parts Download PDFInfo
- Publication number
- CN106118541A CN106118541A CN201610496440.XA CN201610496440A CN106118541A CN 106118541 A CN106118541 A CN 106118541A CN 201610496440 A CN201610496440 A CN 201610496440A CN 106118541 A CN106118541 A CN 106118541A
- Authority
- CN
- China
- Prior art keywords
- glue
- heat radiation
- adhesive
- acrylic acid
- radiation component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003292 glue Substances 0.000 title claims abstract description 98
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 51
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 230000005855 radiation Effects 0.000 claims abstract description 135
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 62
- 239000000853 adhesive Substances 0.000 claims abstract description 49
- 230000001070 adhesive effect Effects 0.000 claims abstract description 49
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 45
- 150000002148 esters Chemical class 0.000 claims abstract description 42
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 33
- 239000002245 particle Substances 0.000 claims abstract description 27
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000178 monomer Substances 0.000 claims description 52
- 239000003999 initiator Substances 0.000 claims description 36
- 238000000576 coating method Methods 0.000 claims description 32
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 29
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 26
- 238000006243 chemical reaction Methods 0.000 claims description 24
- 238000003756 stirring Methods 0.000 claims description 24
- 239000010409 thin film Substances 0.000 claims description 22
- 239000002270 dispersing agent Substances 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 20
- 239000003960 organic solvent Substances 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000006116 polymerization reaction Methods 0.000 claims description 13
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 13
- 239000010408 film Substances 0.000 claims description 10
- 238000002834 transmittance Methods 0.000 claims description 4
- 238000013019 agitation Methods 0.000 claims description 3
- 238000011065 in-situ storage Methods 0.000 claims description 2
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 27
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 30
- 239000000203 mixture Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 15
- 239000007822 coupling agent Substances 0.000 description 13
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 10
- 238000001035 drying Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 8
- 239000004743 Polypropylene Substances 0.000 description 8
- 239000000654 additive Substances 0.000 description 8
- 230000000996 additive effect Effects 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 8
- 229920001155 polypropylene Polymers 0.000 description 8
- 239000002904 solvent Substances 0.000 description 7
- -1 alkyl sodium sulfate Chemical compound 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 239000004408 titanium dioxide Substances 0.000 description 6
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 5
- 239000008187 granular material Substances 0.000 description 5
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 150000001451 organic peroxides Chemical class 0.000 description 5
- 238000010792 warming Methods 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 4
- 239000004342 Benzoyl peroxide Substances 0.000 description 4
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 230000032683 aging Effects 0.000 description 4
- 235000019400 benzoyl peroxide Nutrition 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000002329 infrared spectrum Methods 0.000 description 3
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000000191 radiation effect Effects 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 238000001149 thermolysis Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical group CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 2
- YENIOYBTCIZCBJ-UHFFFAOYSA-N acetic acid;1-methoxypropan-2-ol Chemical compound CC(O)=O.COCC(C)O YENIOYBTCIZCBJ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000004645 aluminates Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- KWABLUYIOFEZOY-UHFFFAOYSA-N dioctyl butanedioate Chemical compound CCCCCCCCOC(=O)CCC(=O)OCCCCCCCC KWABLUYIOFEZOY-UHFFFAOYSA-N 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005543 nano-size silicon particle Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002627 poly(phosphazenes) Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- JHJUUEHSAZXEEO-UHFFFAOYSA-M sodium;4-dodecylbenzenesulfonate Chemical compound [Na+].CCCCCCCCCCCCC1=CC=C(S([O-])(=O)=O)C=C1 JHJUUEHSAZXEEO-UHFFFAOYSA-M 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to technical field of heat dissipation, particularly relate to a kind of glue and preparation method thereof and the adhesive tape containing this glue and components and parts.The radiating effect of glue and adhesive tape can be improved.The embodiment of the present invention provides a kind of glue, described glue includes esters of acrylic acid adhesive and heat radiation component, described heat radiation component includes: nanometer silicon carbide and Nano titanium nitride, wherein, the particle diameter of described nanometer silicon carbide is between 30 800nm, and the particle diameter of described Nano titanium nitride is between 10 900nm.
Description
Technical field
The present invention relates to technical field of heat dissipation, particularly relate to a kind of glue and preparation method thereof and the glue containing this glue
Band and components and parts.
Background technology
Along with the fast development of science and technology, densification and the miniaturization degree of integrated circuit are more and more higher, electronic component
Become less and run with higher speed so that it is the requirement to heat radiation is more and more higher.In order to heat is distributed as early as possible from thermal source
Go out, occur in that various panoramic heat dissipating method at present, wherein, most commonly seen: at radiator and electronic component
Connecting conducting strip between heating position, conducting strip transfers heat away from the way of horizontal conduction of heat, inefficient, heat radiation effect
The most undesirable.
In the prior art, somebody utilizes Heat dissipation adhesive tape to dispel the heat electronic component, and Heat dissipation adhesive tape is by polyphosphazene polymer
Compound class base material, coating thermal dispersant coatings on the substrate and glue layer composition, but, owing to thermal dispersant coatings is generally passed by heat
The form led is dispelled the heat, and the heat-conductive characteristic of high molecular polymerization species base material is poor, is unfavorable for heat radiation, in order to improve its thermal diffusivity
Can, graphite material excellent for heat-conductive characteristic and high molecular polymerization species base material are combined as Heat dissipation adhesive tape by researcher
Base material, but, owing to graphite is originally as laminated structure, it being susceptible to during as base material pulverize or damage, radiating effect also has
Treat to improve further.
Certainly, in the prior art, also have a lot of method improving radiating effect, but, existing raising radiating effect
Method all rest on increase heat conduction hot property, it is achieved the seamless stage contacted of Heat dissipation adhesive tape and heater element, so, right
The requirement of material is higher, although and heat conductivility improve, but heat easily gathers together and is not easy to distribute, heat radiation
Effect is the most undesirable.
Summary of the invention
Embodiments of the invention provide a kind of glue and preparation method thereof and the adhesive tape containing this glue and components and parts, energy
Enough improve glue and the radiating effect of adhesive tape and mechanical performance.
For reaching above-mentioned purpose, embodiments of the invention adopt the following technical scheme that
First aspect, the embodiment of the present invention provides a kind of glue, and described glue includes esters of acrylic acid adhesive and dissipates
Hot component, described heat radiation component includes: nanometer silicon carbide and Nano titanium nitride, and wherein, the particle diameter of described nanometer silicon carbide is at 30-
Between 800nm, the particle diameter of described Nano titanium nitride is between 10-900nm.
Further, described Nano titanium nitride mass fraction in described heat radiation component is 15-40%.
Preferably, described heat radiation component also includes: nano titanium oxide, and the particle diameter of described nano titanium oxide is at 30-
Between 800nm.
It is further preferred that described esters of acrylic acid adhesive is 90-99 part, described heat radiation component is 1-10 part.
Further, during described heat radiation component is dispersed in described esters of acrylic acid adhesive.
Second aspect, the embodiment of the present invention provides the preparation method of a kind of glue as above, including:
Esters of acrylic acid adhesive and heat radiation component are mixed and stirred for uniformly in presence of organic solvent, it is thus achieved that glue
Water；
Or, each reactive component of esters of acrylic acid adhesive and heat radiation component are carried out former in presence of organic solvent
Position polyreaction, it is thus achieved that glue.
Preferably, described by each reactive component of esters of acrylic acid adhesive and heat radiation component in presence of organic solvent
Carry out home position polymerization reaction to specifically include:
Initiator is dissolved in organic solvent acquisition initiator solution；
By heat radiation component, acrylic monomers or/and prepolymer is scattered in organic solvent, and stir to being uniformly dispersed, obtain
Obtain reactive monomer solution；
Under agitation, it is added dropwise to described initiator solution in described reactive monomer solution home position polymerization reaction,
Reaction 0.5-2h is continued after being added dropwise to complete.
Preferably, described being added dropwise to by described initiator solution specifically includes in described reactive monomer solution:
Described initiator solution is divided 3-6 time and is added dropwise in described reactive monomer solution, between the time of every twice dropping
It is divided into 0.5-1h.
Preferably, dripping quantity each time accounts for the 1/6-1/3 of total amount.
The third aspect, the embodiment of the present invention provides a kind of adhesive tape, including: thin film and be coated on described film surface
Thermal dispersant coatings, described thermal dispersant coatings includes glue as above, the described thin film infrared light transmittance to 8-15 micron wave length
More than or equal to 50%.
Preferably, the thickness of described thin film is 10-200 μm.
Optionally, the thickness of described thermal dispersant coatings is 10-90 μm.
Further, described adhesive tape also includes: cover the release layer on the surface of described thermal dispersant coatings, described release layer
Thickness is 25-100 μm.
Fourth aspect, the embodiment of the present invention provides a kind of components and parts, and the heating position of described components and parts is or/and heat radiation position
Surface-coated has glue as above；
Or, the heating position of described components and parts is or/and heat radiation portion faces is pasted with adhesive tape as above.
Embodiments provide a kind of glue and preparation method thereof and the adhesive tape containing this glue and components and parts, by
Including nanometer silicon carbide and Nano titanium nitride in described heat radiation component, carborundum has heat conductivity height, insulating properties is strong, machinery is strong
Degree is high, be difficult to aging, to produce higher far-infrared spectrum feature, and it is steady that titanium nitride has high-melting-point, high rigidity, high temeperature chemistry
Qualitative and excellent heat conduction, electric conductivity, converting heat can be 8-15 by described carborundum and described titanium nitride at low temperatures
The infrared radiation of micron is gone out, by described heat radiation component being scattered in acrylate adhesive, it is possible to form thermal paste
Water, described heat radiation glue can shield the extraneous infrared ray launching extremely described glue surface, additionally it is possible to by described heat radiation component
The infrared radiation that converting heat is 8-15 micron is gone out, and the normal emittance of described heat radiation component can reach 0.9
Above, normal emittance is the highest, and in its unit are, the heat of radiation is the most such that it is able to improve radiating effect；It addition, institute
Stating acrylate adhesive is a kind of excellent transparent adhesive, and adhesion property is good, itself or prepared glue is being adhered to
At heating position or/and heat radiation portion faces time, it is possible to realize seamless link such that it is able to improve radiating effect further.Gram
Take the defect that radiating effect in prior art is relatively low.
Detailed description of the invention
The adhesive tape to a kind of glue that the embodiment of the present invention provides and preparation method thereof and containing this glue below and unit
Device is described in detail.
First aspect, the embodiment of the present invention provides a kind of glue, and described glue includes esters of acrylic acid adhesive and dissipates
Hot component, described heat radiation component includes: nanometer silicon carbide and Nano titanium nitride, and wherein, the particle diameter of described nanometer silicon carbide is at 30-
Between 800nm, the particle diameter of described Nano titanium nitride is between 10-900nm.
It should be noted that for regular ball shaped nano carborundum and Nano titanium nitride granule, its particle diameter i.e. refers to that it is straight
Footpath；For irregular granule, particle diameter be referred in prior art the definition about particle diameter, its definition method of example can
There to be following three kinds: projected diameter, geometry equivalent footpath or equivalent physical footpath.Wherein, projected diameter: refer to that granule is seen under the microscope
The particle diameter observed；Geometry equivalent footpath: the diameter of spheroidal particle when taking equal with a certain geometric sense of granule；Equivalent physical footpath:
The diameter of spheroidal particle when taking equal with a certain physical quantity of granule.The embodiment of the present invention not definition to particle diameter limits
Fixed, it can be diameter, it is also possible to be any one in projected diameter, geometry equivalent footpath or equivalent physical footpath.
Embodiments provide a kind of glue, owing to described heat radiation component includes nanometer silicon carbide and nano silicon nitride
Titanium, carborundum has heat conductivity height, insulating properties is strong, mechanical strength is high, it is aging to be difficult to, can produce higher far-infrared spectrum
Feature, titanium nitride has high-melting-point, high rigidity, stability at elevated temperature and excellent heat conduction, an electric conductivity, described carborundum and
The infrared radiation that converting heat is 8-15 micron can be gone out by described titanium nitride at low temperatures, by by described heat radiation component
Being scattered in acrylate adhesive, it is possible to form heat radiation glue, described heat radiation glue can shield extraneous transmitting to described glue
The infrared ray of water surface, additionally it is possible to the infrared radiation that converting heat is 8-15 micron is gone out by described heat radiation component, and
And the normal emittance of described heat radiation component can reach more than 0.9, normal emittance is the highest, the heat of radiation in its unit are
Measure the most such that it is able to improve radiating effect；It addition, described acrylate adhesive is a kind of excellent transparent adhesive,
Adhesion property is good, itself or prepared glue being sticked to heating position or/and during heat radiation portion faces, it is possible to realize nothing
Seam connects such that it is able to improve radiating effect further.Overcome the defect that radiating effect in prior art is relatively low.
Wherein, described esters of acrylic acid adhesive can be the acrylate pressure-sensitive adhesive obtained by commercial sources, it is possible to
To be obtained by self-control.Described esters of acrylic acid adhesive can by acrylic monomers and acrylate monomer in organic solvent
It is polymerized under the effect of initiator after mixing and obtains.
In one embodiment of the invention, described acrylic monomers one or two in acrylic acid and methacrylic acid
Plant mixture.
Generally, shown in the structural formula of described acrylate monomer such as following formula (I), wherein, R in formula (I)1Can be hydrogen or
Methyl, R2Can be hydrogen or alkyl.
CH2=CR1-CO-OR2 (I)
Preferably, R1And R2Middle carbon atom number sum is less than or equal to 24.This acrylate monomer easily obtains, cost
Relatively low.
It is further preferred that described acrylate monomer is selected from ethyl acrylate, n-propyl, the positive fourth of acrylic acid
One or several mixture in ester, Isobutyl 2-propenoate, lauryl acrylate and acrylic acid-2-ethyl caproite.These several classes
Acrylate monomer is the most commonly used raw material preparing acrylate adhesive, and widely distributed, cost is relatively low.
In one embodiment of the invention, described initiator is azo-compound or organic peroxide.
Wherein, azo-compound one or two kinds of mixture in azodiisobutyronitrile, 2,2'-Azobis(2,4-dimethylvaleronitrile)；Institute
State organic peroxide one or two kinds of mixture in benzoyl peroxide, lauroyl peroxide.
Preferably, organic solvent is selected from toluene, dimethylbenzene, ethylbenzene, ethyl acetate, butyl acetate and propylene glycol monomethyl ether acetic acid
One or several mixture in ester.
It should be noted that preparing acrylate gluing by commercial sources or by method as above
After agent, described acrylate adhesive and described heat radiation component are mixed and stirred for uniformly, it is thus achieved that described glue.
In one embodiment of the invention, described esters of acrylic acid adhesive is 90-99 part, and described heat radiation component is 1-10
Part.Wherein, part represents a unit, and 1 part can be 1kg, it is also possible to for 1g, the most only represent the ratio between two kinds of materials
Relation, in embodiments of the present invention, described esters of acrylic acid adhesive carries out mixing being obtained with this number with described heat radiation component
The heat dispersion of the described glue obtained is optimal, and described heat radiation component is crossed the raising of multipair heat dispersion and mechanical performance and contributed not
Greatly.
Preferably, the particle diameter of described nanometer silicon carbide and Nano titanium nitride is between 50-200nm.
In general, the particle diameter of nanometer silicon carbide and Nano titanium nitride is the least, and specific surface area is the biggest, and its heat dispersion is more
Good.But, particle diameter is the least, and the requirement to preparation condition is the harshest, and, when particle diameter little to certain limit time, the size of particle diameter
No longer obvious on the impact of performance, such as, for carborundum that particle diameter is 10nm and the heat radiation component of titanium nitride composition and particle diameter
For the carborundum of 50nm and the heat radiation component of titanium nitride composition, the performance of the two is more or less the same.Therefore, the embodiment of the present invention
In the case of considering preparation condition and performance, it is believed that the particle diameter of nanometer silicon carbide and Nano titanium nitride 50-200nm it
Between time, radiating effect can reach optimal.
In one embodiment of the invention, described Nano titanium nitride mass fraction in described heat radiation component is 15-40%.
So, the heat dispersion of heat radiation component is optimal, and the mass fraction of described Nano titanium nitride is too small or excessive, all can be to heat radiation group
The heat radiation divided has a negative impact.
In one embodiment of the invention, described heat radiation component also includes: nano titanium oxide, described nano titanium oxide
Particle diameter is between 30-800nm.Nano titanium oxide is added in heat radiation component, the performance of heat radiation component can be greatly enhanced.This is
Because nanometer silicon carbide and Nano titanium nitride are during being radiated heat in surrounding with ultrared form, also can
Absorbing the ambient radiation infrared ray to its surface, owing to adding nano titanium oxide, its special appearance can reflect one
Part is transmitted into the infrared ray on its surface；Meanwhile, nano titanium oxide can also reflect the infrared ray in a part of environment, thus
Reduce the external world and be radiated the infrared ray on its surface so that on identical area of dissipation, needed for the heat that distributes reduce, heat radiation effect
Fruit is greatly enhanced.Therefore, the heat radiation component including titanium dioxide is scattered in esters of acrylic acid adhesive as inorganic filler,
Glue can be made to have more excellent heat dispersion, be additionally, since the ultraviolet minimizing that its surface receives, its aging resistance can be made
Performance enhancement, increases the service life.
Wherein, the nano titanium oxide of the embodiment of the present invention preferred anatase crystal formation.Use the nanometer two of this crystalline structure
Titanium oxide, has the effect of the reflection external world radiation of excellence, it is possible to launched by the heat that the external world conducts, improves further and dissipate
Thermal effect.
It should be noted that the amount of the nano titanium oxide added in above-mentioned heat radiation component does not limits.Preferably, on
Stating the mass fraction of nano titanium oxide in heat radiation component is 15%-25%.In the range of this mass fraction, this heat radiation component
Performance can be more excellent, more than 25% after launching effect improve inconspicuous.
Wherein, the combination of described heat radiation component with described esters of acrylic acid adhesive is not limited, described heat radiation
Component can be dispersed in the surface of described esters of acrylic acid adhesive, it is also possible to is filled in described esters of acrylic acid glue as one
In stick.
In one embodiment of the invention, described glue also includes coupling agent, and coupling agent is that a class has two heterogeneity officials
The material that can roll into a ball, the maximum feature of its molecular structure is two groups different containing chemical property in molecule, and one is parent's nothing
The group of machine thing, easy and mineral surfaces chemically reactive；Another is organophilic group, can be with described esters of acrylic acid
Synthetic resin in adhesive or other polymer generation chemical reaction or generate hydrogen bond and be dissolved in wherein.Therefore coupling agent is referred to as
" molecular bridge ", in order to improve the interface interaction between inorganic matter and Organic substance, thus is greatly improved the performance of composite, such as thing
Rationality can (mechanical performance), electrical property, hot property, optical property etc..
If containing coupling agent in described glue, described coupling agent can be by heat radiation component and described esters of acrylic acid adhesive
Coupled together by the form of hydrogen bond or chemical bond such that it is able to improve described heat radiation component and described acrylate further
The interface binding power of class adhesive, can also improve described heat radiation glue and the adhesion by patch matrix simultaneously.Described coupling agent
Can be added in described heat radiation component, or be added in esters of acrylic acid adhesive, or both combine.
In one embodiment of the invention, described coupling agent is 0.5-5 part.
In another embodiment of the present invention, described coupling agent is even selected from silane coupler, titanate coupling agent and Aluminate
Any one in connection agent or several mixing.
It is further preferred that described glue can also include additive, described additive can be surfactant, plasticising
One in agent, thickening agent, dispersant, painting face regulator, fluidity regulator, UV absorbent, antioxidant, stabilizer
Or it is several.It is added as needed on additive, it is possible to increase the physically and/or chemically performance of glue by interpolation.
Wherein, described additive is well known to those skilled in the art, does not repeats them here.
In one embodiment of the invention, described heat radiation component is dispersed in described esters of acrylic acid adhesive.
In embodiments of the present invention, described heat radiation component is dispersed in described esters of acrylic acid adhesive, due to this
Heat radiation component is all inorganic rigid nanoparticle, and its particle size is little, modulus is high, with the interface cohesion of esters of acrylic acid adhesive
Power is relatively strong, can also improve glue and the adhesion by patch matrix, further, after described heat radiation component is dispersed simultaneously
Specific surface area is bigger, it is possible to infrared radiation gone out to the full extent, improves radiating effect.
Second aspect, the embodiment of the present invention provides the preparation method of a kind of glue as above, including:
Esters of acrylic acid adhesive and heat radiation component are mixed and stirred for uniformly in presence of organic solvent, it is thus achieved that glue
Water；
Or, each reactive component of esters of acrylic acid adhesive and heat radiation component are carried out former in presence of organic solvent
Position polyreaction, it is thus achieved that glue.
The embodiment of the present invention provides the preparation method of a kind of glue, by directly by esters of acrylic acid adhesive and heat radiation group
Mix homogeneously is divided to prepare glue, or, each reactive component of described esters of acrylic acid adhesive and heat radiation component are carried out in situ
Polyreaction prepares glue, it is possible to described heat radiation component is dispersed in described esters of acrylic acid adhesive, is obtained
Glue be coated on heating position or/and heat radiation portion faces time, it is possible to shielding the external world be sent to described heating position or/and dissipate
The infrared ray on surface, hot spot, additionally it is possible to by described heating position or/and the heat at heat radiation position radiates with ultrared form
Go out, improve radiating effect.
Wherein, described esters of acrylic acid adhesive can be the pressure sensitive adhesive obtained by commercial sources, it is also possible to by certainly
System obtains, and does not repeats them here.
In one embodiment of the invention, described by each reactive component of esters of acrylic acid adhesive and heat radiation component organic
Carry out home position polymerization reaction in the presence of solvent to specifically include:
Initiator is dissolved in organic solvent acquisition initiator solution；
By heat radiation component, acrylic monomers or/and acrylate monomer is scattered in organic solvent, and stir to dispersion all
Even, it is thus achieved that reactive monomer solution；
Under agitation, it is added dropwise to described initiator solution in described reactive monomer solution home position polymerization reaction,
Reaction 0.5-2h is continued after being added dropwise to complete.
In embodiments of the present invention, by initiator solution being added dropwise in described reactive monomer solution, dropping limit, limit
Reaction, in the process, described heat radiation component is wrapped in described esters of acrylic acid adhesive so that disperse more uniform；
It addition, catalyst drops is added in reaction system, it is possible to increase catalyst and the contact area of reactive component, simultaneously, additionally it is possible to
Improve the catalytic effect of reaction system.
In one embodiment of the invention, described initiator is azo-compound or organic peroxide.
Wherein, azo-compound one or two kinds of mixture in azodiisobutyronitrile, 2,2'-Azobis(2,4-dimethylvaleronitrile)；Institute
State organic peroxide one or two kinds of mixture in benzoyl peroxide, lauroyl peroxide.
Preferably, organic solvent is selected from toluene, dimethylbenzene, ethylbenzene, ethyl acetate, butyl acetate and propylene glycol monomethyl ether acetic acid
One or several mixture in ester.
Wherein, acrylic monomers can be selected from the one or two kinds of mixture in acrylic acid, methacrylic acid, and described third
Olefin(e) acid prepolymer refers to be carried out the polymer of polyreaction generation by acrylic monomers, acrylate monomer etc..
Generally, shown in the structural formula of described acrylate monomer such as formula (I), wherein, R in formula (I)1Can be hydrogen or first
Base, R2Can be hydrogen or alkyl.
Preferably, R1And R2Middle carbon atom number sum is less than or equal to 24.This acrylate monomer easily obtains, cost
Relatively low.
It is further preferred that described acrylate monomer is selected from ethyl acrylate, n-propyl, the positive fourth of acrylic acid
One or several mixture in ester, Isobutyl 2-propenoate, lauryl acrylate and acrylic acid-2-ethyl caproite.These are several
Acrylate monomer is the most commonly used raw material making esters of acrylic acid adhesive, is widely used, and cost is relatively low.
In another embodiment of the present invention, described being added dropwise to by described initiator solution in described reactive monomer solution has
Body includes:
Described initiator solution is divided 3-6 time and is added dropwise in described reactive monomer solution, between the time of every twice dropping
It is divided into 0.5-1h.
Dripped by interval, it is possible to react the regular hour after once dripping such that it is able to improve reaction rate.
Exemplary, dripping quantity each time accounts for the 1/6-1/3 of total amount.
Wherein, described initiator is azo-compound or organic peroxide.
Wherein, to the heat radiation component added in course of reaction, acrylic monomers or/and acrylate monomer and initiation
The mass ratio of agent does not limits.
In one embodiment of the invention, in position in polyreaction, described heat radiation component is 1-10 part, described acrylic acid list
Body is or/and acrylate monomer is 90-99 part, and described initiator is 0.1-0.5 part, and described organic solvent is 110-350 part.Its
In, described acrylic monomers and acrylate monomer can mix with arbitrary proportion.
In another embodiment of the present invention, the temperature of described home position polymerization reaction is 60-85 DEG C.
In another embodiment of the present invention, described method also includes:
After having reacted, wherein add additive to described reaction system, and stir；
Or, course of reaction is added in reaction system additive.
Wherein, described additive can be surfactant, coupling agent, plasticizer, thickening agent, dispersant, the regulation of painting face
One or several in agent, fluidity regulator, UV absorbent, antioxidant, stabilizer.By adding as required
Add additive, it is possible to increase the physically and/or chemically performance of glue, such as, by adding coupling agent, it is possible to increase described dissipating
Interface binding power between hot component and described acrylate adhesive, can also improve described glue simultaneously and be pasted matrix
Adhesion.
Surfactant can be selected from dodecyl sodium sulfate, triethanolamine soap, dioctyl succinate disulfonate acid and 12
One or several mixture of alkyl sodium sulfate.
The third aspect, the embodiment of the present invention provides a kind of adhesive tape, including: thin film and be coated on described film surface
Thermal dispersant coatings, described thermal dispersant coatings includes glue as above, the described thin film infrared light transmittance to 8-15 micron wave length
More than or equal to 50%.
The embodiment of the present invention provides a kind of adhesive tape, by the glue with thermolysis is coated in the surface of thin film, energy
Access the adhesive tape with heat dispersion, owing to this thin film is more than or equal to 50% to the infrared light transmittance of 8-15 micron wave length,
By described adhesive tape sticking in certain heating position or/and heat radiation position time, outside the heat radiation component in described glue can shield
Boundary launches to described heating position or/and the infrared ray at heat radiation position, and the heat radiation component in described function of glue coating can also be low
Under temperature, heat is gone out through described thin film radiation with ultrared form such that it is able to improve the radiating effect of described adhesive tape, and
And, the normal emittance on described glue surface can reach more than 0.9, and normal emittance is the highest, the heat dispersion of unit are
The best such that it is able to improve radiating effect further.
Wherein, the material of described thin film is not limited, as long as described glue is with described adhesion of thin film well.
In one embodiment of the invention, the material of described thin film is polyethylene terephthalate (PET), Merlon
(PC), in polyethylene (PE), polypropylene (PP), ethylene vinyl acetate (EVA), polystyrene (PS) and polrvinyl chloride (PVC)
Any one.Described polyethylene terephthalate (PET) is nonpoisonous and tasteless, safety good, high temperature resistant, mechanical property is excellent
Different；Described Merlon (PC) water white transparency, light transmission is good, heat-resisting, and impact resistance is strong, UV radiation；Described polyethylene
(PE) being widely used, cost is relatively low；Polypropylene (PP) is heat-resisting, corrosion-resistant；Described ethylene vinyl acetate (EVA) is heat-resisting, moisture-proof
Property is preferable；Described polystyrene (PS) has good thermal insulation, insulation and the transparency, and described polrvinyl chloride (PVC) pliability is good,
There is good heat resistanceheat resistant, the characteristic of water resistant infiltration.
In one embodiment of the invention, the thickness of described thin film is 10-200 μm.Thin film acts primarily as carrying glue and thoroughly
Crossing ultrared effect, its thickness is excessive affects infrared penetration effect, and thickness is too small is susceptible to breakage.
Wherein, the moulding process of described thin film is not limited, exemplary, described thin film can by biaxial tension or
The technique of person's curtain coating makes and obtains.In stretch processes, by stretch processes is optimized, made
Thin film there is preferable hot strength, impact strength, tearing strength and good glossiness.
Certainly, described thin film can also include described heat radiation component.By described heat radiation component is dispersed in described thin film
In, it is possible to improve further the radiating effect of described adhesive tape, and the external world can be shielded further be transmitted into described film surface
Infrared ray, strengthens the mechanical strength of described thin film.
In one embodiment of the invention, the thickness of described thermal dispersant coatings is 10-90 μm.Described thermal dispersant coatings is the thinnest, bonding
Intensity is poor, and product is unstable, and easily from adhesive matrix sur-face peeling, the biggest heat conduction path of thickness is long, be unfavorable for heat conduction with
Heat radiation.
Preferably, described adhesive tape also includes: cover the release layer on the surface of described thermal dispersant coatings, the thickness of described release layer
Degree is 25-100 μm.By setting up release layer on described thermal dispersant coatings surface, it is possible to described glue is protected, and is prone to
Peeling off, described release layer thickness is the thinnest is susceptible to breakage, is unfavorable for the protection to glue, suffered during the curling of thickness the biggest adhesive tape
Stress is excessive, can be easily separated or produce fold.
Fourth aspect, the embodiment of the present invention provides a kind of components and parts, and the heating position of described components and parts is or/and heat radiation position
Surface-coated has glue as above；
Or, the heating position of described components and parts is or/and heat radiation portion faces is pasted with adhesive tape as above.
The embodiment of the present invention provides a kind of components and parts, by the glue with thermolysis is coated in heating position or/
With heat radiation portion faces, or the adhesive tape with thermolysis is attached to heating position or/and heat radiation position surface, it is possible to
The shielding external world launches to described heating position or/and the infrared ray at heat radiation position, by described heating position or/and heat radiation position
Heat is radiate by ultrared form such that it is able to improve the radiating effect of described components and parts, protects components and parts, extends
Service life.
Wherein, the kind of described components and parts is not limited.
Described components and parts can be mobile phone, notebook computer, digital camera, plasma display, liquid crystal indicator, send out
Optical diode, projector etc..
The heating position surface of described components and parts can be the case surface etc. of processor case surface, back light unit, dissipates
Surface, hot spot can be the surface of radiator.
Other compositions of components and parts about the embodiment of the present invention etc. have been well known to those skilled in the art, at this not
Describe in detail again.
Hereinafter, the embodiment of the present invention will the present invention will be described by embodiment.These embodiments are merely to concrete
The example present invention being described and propose, those skilled in the art are not it is appreciated that the scope of the present invention is by these embodiments
Limit.
Embodiment 1
Respectively by the carborundum of a diameter of for 0.85g 30nm, the titanium nitride of a diameter of 10nm of 0.15g is scattered in 100g second respectively
In acetoacetic ester solvent, stirring, to being uniformly dispersed, then proceedes to add 90g acrylate pressure-sensitive adhesive, continues to stir to mix homogeneously,
Prepare pressure sensitive adhesive heat radiation glue.
Heat radiation glue is sprayed on the PP film that thickness is 10 microns, in the heat radiation forming about 25 microns after 120 DEG C of drying
The adhesive tape of coating, is attached to this adhesive tape on laser radiator FIN sheet, ambient temperature 25 DEG C, during laser heat power 130W,
Spreader surface temperature is 56.0 DEG C, and testing same position temperature after attaching is 50.3 DEG C.
Embodiment 2
Respectively by the carborundum of a diameter of for 0.7g 800nm, the titanium nitride of a diameter of 900nm of 0.8g, a diameter of 30nm of 0.5g
Anatase-type nanometer titanium dioxide disperse respectively in organic solvent (30g toluene, 40g ethyl acetate, 30g ethylbenzene), stirring
To being uniformly dispersed, then proceed to add 1.0g silane coupler, 0.5g dodecylbenzene sodium sulfonate, 19.8g Acrylate pressure sensitive
Glue, continues to stir to mix homogeneously, pressure sensitive adhesive processed heat radiation glue.
Heat radiation glue is sprayed on the PET film that thickness is 200 microns, dissipating formation about 10 microns after 150 DEG C of drying
The adhesive tape of hot coating, is attached to this adhesive tape on laser radiator FIN sheet, at ambient temperature 25 DEG C, laser heat power 130W
Time, radiator FIN surface temperature is 55.4 DEG C, and testing same position temperature after attaching is 49.7 DEG C.
Embodiment 3
Respectively by the carborundum of a diameter of for 6g 200nm, the titanium nitride of a diameter of 200nm of 2.5g, a diameter of 800nm of 1.5g
Anatase-type nanometer titanium dioxide disperses in a solvent (30g dimethylbenzene, 40g ethyl acetate, 30g ethylbenzene) respectively, and stirring is to dividing
Dissipate uniformly, then proceed to add 1g titanate coupling agent, the SA-108 pressure sensitive adhesive of 90g Shanghai Australia of Soviet Union chemical industry, continue stirring to mixed
Close uniformly, prepare pressure sensitive adhesive heat radiation glue.
Heat radiation glue is sprayed on the PS film that thickness is 100 microns, in the heat radiation forming about 90 microns after 100 DEG C of drying
The adhesive tape of coating, is attached to this adhesive tape and this adhesive tape is attached to laser movie theatre driving plate spreader surface, in ambient temperature 25
DEG C time, the spreader surface temperature not attached is 77.5 DEG C, after attaching test same position temperature be 69.7 DEG C.
Embodiment 4
Respectively by the carborundum of a diameter of for 4g 200nm, the titanium nitride of a diameter of 50nm of 1g is scattered in 10kg acetic acid fourth respectively
In ester solvent, stirring, to being uniformly dispersed, then proceedes to add 25g aluminate coupling agent, 495g acrylate pressure-sensitive adhesive, continues to stir
Mix to mix homogeneously, prepare pressure sensitive adhesive heat radiation glue.
Heat radiation glue is sprayed on the PET film that thickness is 50 microns, in the heat radiation forming about 20 microns after 120 DEG C of drying
The adhesive tape of coating, is attached to laser movie theatre light source shell surface by this adhesive tape, when ambient temperature 25 DEG C, and the housing table not attached
Surface temperature is 61.8 DEG C, and testing same position temperature after attaching is 57.3 DEG C.
Embodiment 5
Respectively by the carborundum of a diameter of for 3.5g 200nm, the titanium nitride of a diameter of 200nm of 4g, a diameter of 800nm of 2.5g
Anatase-type nanometer titanium dioxide disperses in organic solvent (30g dimethylbenzene, 40g butyl acetate, 30g ethylbenzene) respectively, stirring
To being uniformly dispersed, then proceed to add 5g silane coupler, 99g acrylate pressure-sensitive adhesive, continue to stir to mix homogeneously, prepare
Pressure sensitive adhesive heat radiation glue.
Heat radiation glue is sprayed on the PP film that thickness is 200 microns, in the heat radiation forming about 25 microns after 120 DEG C of drying
The adhesive tape of coating, is attached to laser movie theatre ray machine surface of shell by this adhesive tape, when ambient temperature 25 DEG C, and the housing table not attached
Surface temperature is 51.0 DEG C, and testing same position temperature after attaching is 47.5 DEG C.
Embodiment 6
0.1g azodiisobutyronitrile and 10g ethyl acetate are configured to initiator solution；Respectively by a diameter of for 0.85g 30nm
Carborundum, the titanium nitride of a diameter of 10nm of 0.15g is dispersed in 100g ethyl acetate respectively, stirring to being uniformly dispersed, then
Continuously add 90g methyl methacrylate, 5g acrylic acid-2-ethyl caproite, 4g acrylic acid, continue stirring to mix homogeneously, system
Obtain reactive monomer solution；
In the reactor with material mixed function and function of temperature control, monomer solution is warming up to 60 DEG C, points 3 times to
In monomer solution, dropping initiator solution carries out polyreaction, drips 1/3 every time, and time for adding is 20 minutes, continues after dropping
Reacting 1 hour, after initiator solution all adds polymerization system, continue reaction 0.5 hour, synthetic reaction terminates, and obtains base
Room temperature height far infrared transmissivity thermal paste water in acrylic compounds.
Heat radiation glue is sprayed in the PVC film that thickness is 20 microns, in the heat radiation forming about 90 microns after 100 DEG C of drying
The adhesive tape of coating, is attached to this adhesive tape and this adhesive tape is attached to laser movie theatre driving plate spreader surface, in ambient temperature 25
DEG C time, the spreader surface temperature not attached is 77.0 DEG C, after attaching test same position temperature be 69.5 DEG C.
Embodiment 7
0.1g benzoyl peroxide and 10g butyl acetate are configured to initiator solution；Respectively by a diameter of for 0.7g 800nm
Carborundum, the titanium nitride of a diameter of 900nm of 0.8g, the anatase-type nanometer titanium dioxide of a diameter of 30nm of 0.5g are scattered in
In 60g butyl acetate solvent, stirring to being uniformly dispersed, then proceed to add 10g phenyl methacrylate, 5g methacrylic acid,
4.8g n-propyl, continues to stir to mix homogeneously, prepares reactive monomer solution；
In the reactor with material mixed function and function of temperature control, monomer solution is warming up to 85 DEG C, points 4 times to
In monomer solution, dropping initiator solution carries out polyreaction, and each time for adding is 15 minutes, drips 1/4, continues after dropping
Reacting 0.8 hour, after thermal initiator solution all adds polymerization system, continue reaction 2 hours, synthetic reaction terminates, and obtains
Room temperature height far infrared transmissivity thermal paste water based on acrylic compounds.
Heat radiation glue is sprayed on the PET film that thickness is 200 microns, dissipating formation about 90 microns after 120 DEG C of drying
The adhesive tape of hot coating, is attached to described thermal dispersant coatings surface by the release layer that thickness is 25 microns, this adhesive tape is attached to laser
Movie theatre light source shell surface, when ambient temperature 25 DEG C, the casing surface temperature not attached is 61.2 DEG C, tests identical after attaching
Position temperature is 56.7 DEG C.
Embodiment 8
0.3g 2,2'-Azobis(2,4-dimethylvaleronitrile) and 50g toluene are configured to initiator solution；Respectively by the carbonization of a diameter of for 6g 200nm
Silicon, the titanium nitride of a diameter of 200nm of 2.5g, the anatase-type nanometer titanium dioxide of a diameter of 800nm of 1.5g are dispersed in 300g first
In benzene solvent, stirring, to being uniformly dispersed, then proceedes to add 50g methyl methacrylate, 20g acrylic acid, 20g acrylic acid positive third
Ester, continues to stir to mix homogeneously, prepares reactive monomer solution；
In the reactor with material mixed function and function of temperature control, monomer solution is warming up to 82 DEG C, points 5 times to
In monomer solution, dropping initiator solution carries out polyreaction, and each time for adding is 15 minutes, drips 1/5, continues after dropping
Reacting 0.5 hour, after initiator solution all adds polymerization system, continue reaction 1 hour, synthetic reaction terminates, and obtains base
Room temperature height far infrared transmissivity thermal paste water in acrylic compounds.
Heat radiation glue is sprayed on the PET film that thickness is 100 microns, dissipating formation about 35 microns after 120 DEG C of drying
The adhesive tape of hot coating, attaches, on described thermal dispersant coatings surface, the release layer that a layer thickness is 100 microns, is attached to sharp by this adhesive tape
Light movie theatre ray machine surface of shell, when ambient temperature 25 DEG C, the casing surface temperature not attached is 50.3 DEG C, tests phase after attaching
Co-located temperature is 47.0 DEG C.
Embodiment 9
2.5g azodiisobutyronitrile and 150g ethyl acetate are configured to initiator solution；Respectively by a diameter of for 4g 200nm
Carborundum, the titanium nitride of a diameter of 50nm of 1g is dispersed in 1kg ethyl acetate solvent respectively, stirring to being uniformly dispersed, then
Continuously add 300g methyl methacrylate, 95g lauryl acrylate, 100g Isobutyl 2-propenoate, continue stirring to mixing all
Even, prepare reactive monomer solution；
In the reactor with material mixed function and function of temperature control, monomer solution is warming up to 85 DEG C, points 6 times to
In monomer solution, dropping initiator solution carries out polyreaction, and each time for adding is 15 minutes, drips 1/6, continues after dropping
React 1 hour, after initiator solution all adds polymerization system, continue reaction 1 hour, synthetic reaction terminates, obtain based on
The room temperature height far infrared transmissivity thermal paste water of acrylic compounds.
Heat radiation glue is sprayed on the PP film that thickness is 25 microns, in the heat radiation forming about 10 microns after 115 DEG C of drying
Coating, covers, on described thermal dispersant coatings surface, the release layer that a layer thickness is 50 microns, and this adhesive tape is attached to laser movie theatre light
Casing surface, when ambient temperature 25 DEG C, the casing surface temperature not attached is 51.9 DEG C, tests same position temperature after attaching
Degree is 46.5 DEG C.
Embodiment 10
2.5g benzoyl peroxide and 150g ethyl acetate are configured to initiator solution；Respectively by a diameter of for 4g 200nm
Carborundum, the titanium nitride of a diameter of 50nm of 1g is dispersed in 1kg ethyl acetate solvent respectively, stirring to being uniformly dispersed, then
Continuously add 100g methyl methacrylate, 195g lauryl acrylate, 200g Isobutyl 2-propenoate, continue stirring to mixing all
Even, prepare reactive monomer solution；
In the reactor with material mixed function and function of temperature control, monomer solution is warming up to 70 DEG C, points 6 times to
In monomer solution, dropping initiator solution carries out polyreaction, and each time for adding is 15 minutes, drips 1/6, continues after dropping
React 1 hour, after initiator solution all adds polymerization system, continue reaction 1 hour, synthetic reaction terminates, obtain based on
The room temperature height far infrared transmissivity thermal paste water of acrylic compounds.
Heat radiation glue is sprayed on the PP film that thickness is 25 microns, in the heat radiation forming about 10 microns after 115 DEG C of drying
Coating, covers, on described thermal dispersant coatings surface, the release layer that a layer thickness is 50 microns, and this adhesive tape is attached to laser movie theatre light
Casing surface, when ambient temperature 25 DEG C, the casing surface temperature not attached is 51.9 DEG C, tests same position temperature after attaching
Degree is 45 DEG C.
In sum, owing to described heat radiation component includes nanometer silicon carbide and Nano titanium nitride, carborundum has heat conduction system
Number is high, insulating properties is strong, mechanical strength is high, it is aging to be difficult to, can produce the feature of higher far-infrared spectrum, and titanium nitride has Gao Rong
Point, high rigidity, stability at elevated temperature and excellent heat conduction, electric conductivity, described carborundum and described titanium nitride are at low temperatures
The infrared radiation that converting heat is 8-15 micron can be gone out, by described heat radiation component is scattered in acrylate gluing
In agent, it is possible to form heat radiation glue, described heat radiation glue can shield the extraneous infrared ray launching extremely described glue surface, moreover it is possible to
Enough by described heat radiation component, the infrared radiation that converting heat is 8-15 micron is gone out, and the normal direction of described heat radiation component
Emissivity can reach more than 0.9, and normal emittance is the highest, and in its unit are, the heat of radiation is the most such that it is able to carry
High radiating effect；It addition, described acrylate adhesive is a kind of excellent transparent adhesive, adhesion property is good, by itself or
Glue prepared by person stick to heating position or/and heat radiation position time, it is possible to realize seamless link such that it is able to carry further
High radiating effect.Overcome the defect that radiating effect in prior art is relatively low.
The above, the only detailed description of the invention of the present invention, but protection scope of the present invention is not limited thereto, and any
Those familiar with the art, in the technical scope that the invention discloses, can readily occur in change or replace, should contain
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with described scope of the claims.
Claims (14)
1. a glue, it is characterised in that described glue includes esters of acrylic acid adhesive and heat radiation component, described heat radiation group
Point include: nanometer silicon carbide and Nano titanium nitride, wherein, the particle diameter of described nanometer silicon carbide between 30-800nm, described in receive
The particle diameter of rice titanium nitride is between 10-900nm.
Glue the most according to claim 1, it is characterised in that described Nano titanium nitride quality in described heat radiation component
Mark is 15-40%.
Glue the most according to claim 1, it is characterised in that described heat radiation component also includes: nano titanium oxide, described
The particle diameter of nano titanium oxide is between 30-800nm.
Glue the most according to claim 1, it is characterised in that described esters of acrylic acid adhesive is 90-99 part is described scattered
Hot component is 1-10 part.
Glue the most according to claim 1, it is characterised in that described heat radiation component is dispersed in described esters of acrylic acid
In adhesive.
6. the preparation method of the glue described in an any one of claim 1-5, it is characterised in that including:
Esters of acrylic acid adhesive and heat radiation component are mixed and stirred for uniformly in presence of organic solvent, it is thus achieved that glue；
Or, each reactive component of esters of acrylic acid adhesive and heat radiation component are carried out the most poly-in presence of organic solvent
Close reaction, it is thus achieved that glue.
Preparation method the most according to claim 6, it is characterised in that
Described each reactive component of esters of acrylic acid adhesive and heat radiation component are carried out in situ poly-in presence of organic solvent
Conjunction reaction specifically includes:
Initiator is dissolved in organic solvent acquisition initiator solution；
By heat radiation component, acrylic monomers or/and acrylate monomer is scattered in organic solvent, and stir to being uniformly dispersed,
Obtain reactive monomer solution；
Under agitation, described initiator solution is added dropwise in described reactive monomer solution occur home position polymerization reaction, dropping
Reaction 0.5-2h is continued after completing.
Preparation method the most according to claim 7, it is characterised in that
Described being added dropwise to by described initiator solution specifically includes in described reactive monomer solution:
Being divided 3-6 time by described initiator solution and be added dropwise in described reactive monomer solution, the time interval of every twice dropping is
0.5-1h。
Preparation method the most according to claim 8, it is characterised in that dripping quantity each time accounts for the 1/6-1/3 of total amount.
10. an adhesive tape, it is characterised in that including: thin film and be coated in the thermal dispersant coatings on described film surface, described dissipates
Hot coating includes the glue as described in any one of claim 1-5, the described thin film infrared light transmittance to 8-15 micron wave length
More than or equal to 50%.
11. adhesive tapes according to claim 10, it is characterised in that the thickness of described thin film is 10-200 μm.
12. adhesive tapes according to claim 10, it is characterised in that the thickness of described thermal dispersant coatings is 10-90 μm.
13. adhesive tapes according to claim 12, it is characterised in that described adhesive tape also includes: cover at described thermal dispersant coatings
The release layer on surface, the thickness of described release layer is 25-100 μm.
14. 1 kinds of components and parts, it is characterised in that the heating position of described components and parts is or/and heat radiation position surface-coated is just like power
Profit requires the glue described in any one of 1-5；
Or, the heating position of described components and parts is or/and heat radiation portion faces attaches just like described in any one of claim 10-13
Adhesive tape.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108165187A (en) * | 2017-12-26 | 2018-06-15 | 宁波大榭开发区综研化学有限公司 | Keep the temperature shading rubber belt |
| CN109868095A (en) * | 2019-03-28 | 2019-06-11 | 上海西怡新材料科技有限公司 | In-situ polymerization type has organic silicon-acrylate adhesive preparation method of light diffusion function and products thereof and application |
| CN114456734A (en) * | 2022-01-13 | 2022-05-10 | 东莞市富印胶粘科技有限公司 | Acrylate pressure-sensitive adhesive and preparation method thereof |
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| CN102433092A (en) * | 2011-09-05 | 2012-05-02 | 青岛海信电器股份有限公司 | Pressure-sensitive acrylic acid thermally conductive adhesive, preparation method for same and application thereof |
| CN102746799A (en) * | 2012-07-27 | 2012-10-24 | 天津博苑高新材料有限公司 | Heat-conducting insulated pressure sensitive tape and preparation method thereof |
| CN103087646A (en) * | 2013-02-01 | 2013-05-08 | 上海晶华粘胶制品发展有限公司 | Thermally conductive adhesive tape and manufacturing process thereof |
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- 2016-06-29 CN CN201610496440.XA patent/CN106118541B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102433092A (en) * | 2011-09-05 | 2012-05-02 | 青岛海信电器股份有限公司 | Pressure-sensitive acrylic acid thermally conductive adhesive, preparation method for same and application thereof |
| CN102746799A (en) * | 2012-07-27 | 2012-10-24 | 天津博苑高新材料有限公司 | Heat-conducting insulated pressure sensitive tape and preparation method thereof |
| CN103087646A (en) * | 2013-02-01 | 2013-05-08 | 上海晶华粘胶制品发展有限公司 | Thermally conductive adhesive tape and manufacturing process thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108165187A (en) * | 2017-12-26 | 2018-06-15 | 宁波大榭开发区综研化学有限公司 | Keep the temperature shading rubber belt |
| CN109868095A (en) * | 2019-03-28 | 2019-06-11 | 上海西怡新材料科技有限公司 | In-situ polymerization type has organic silicon-acrylate adhesive preparation method of light diffusion function and products thereof and application |
| CN109868095B (en) * | 2019-03-28 | 2021-04-27 | 上海西怡新材料科技有限公司 | Preparation method of in-situ polymerization type organic silicon-acrylate adhesive with light diffusion function, product and application thereof |
| CN114456734A (en) * | 2022-01-13 | 2022-05-10 | 东莞市富印胶粘科技有限公司 | Acrylate pressure-sensitive adhesive and preparation method thereof |
| CN114456734B (en) * | 2022-01-13 | 2023-11-21 | 东莞市富印胶粘科技有限公司 | Acrylic ester pressure-sensitive adhesive and preparation method thereof |
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| CN106118541B (en) | 2019-01-15 |
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