CN103079335A - Multilayer printed circuit board - Google Patents
Multilayer printed circuit board Download PDFInfo
- Publication number
- CN103079335A CN103079335A CN 201110326790 CN201110326790A CN103079335A CN 103079335 A CN103079335 A CN 103079335A CN 201110326790 CN201110326790 CN 201110326790 CN 201110326790 A CN201110326790 A CN 201110326790A CN 103079335 A CN103079335 A CN 103079335A
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- CN
- China
- Prior art keywords
- circuit board
- layer circuit
- multilayer printed
- printed circuit
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to the technical field of a printed circuit board, in particular to a multilayer printed circuit board. The circuit board comprises a first layer circuit board, a second layer circuit board and a third layer circuit board, wherein the first layer circuit board, the second layer circuit board and the third layer circuit board are laminated in order; the lower surfaces of the first layer circuit board and the second layer circuit board are provided with a convex part respectively; the upper surfaces of the second layer circuit board and the third layer circuit board are provided with a concave part respectively; and the convex parts and the concave parts are connected respectively in a matching way. Through the increase of the surface area of the multilayer printed circuit board, the available manufacturing completion of more complicated circuits and more elements on the circuit board is guaranteed; the circuit board is simple in structure and convenient to manufacture; and in addition, the working efficiency is improved and the manufacturing cost is decreased.
Description
Technical field
The present invention relates to the printed substrate technical field, especially a kind of multilayer printed circuit board.
Background technology
Along with the extensive use of electronic product, circuit board role in these products is more and more important, and in order to strive to get market, producer has done a lot of improvement for client's demand at circuit board.But present multilayer circuit board form is single, is made by processing technology by multilayer circuit board, and components and parts are subject to the surface area of circuit board, causes complicated circuit and components and parts to have to just can complete on a very large circuit board.
Summary of the invention
In order to overcome the long-pending inadequate deficiency of existing PCB surface, the invention provides a kind of multilayer printed circuit board.
The technical solution adopted for the present invention to solve the technical problems is: a kind of multilayer printed circuit board, this wiring board comprises successively ground floor wiring board, second layer wiring board and the 3rd sandwich circuit board of lamination, the lower surface of described ground floor wiring board and second layer wiring board is provided with protuberance, the upper surface of described second layer wiring board and the 3rd sandwich circuit board is provided with recess, and described protuberance and recess are connected respectively.
According to another embodiment of the invention, comprise that further described protuberance and recess are the T font.
The invention has the beneficial effects as follows, by increasing the surface area of multilayer printed circuit board, guarantee that complicated circuit and more components and parts can complete in the circuit board.This circuit board structure is simple, and is easy to make, improved operating efficiency, reduced cost of manufacture.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is structural representation of the present invention;
Among the figure 1, the ground floor wiring board, 2, second layer wiring board, the 3, the 3rd sandwich circuit board, 4, protuberance, 5, recess.
Embodiment
Structural representation of the present invention such as Fig. 1, a kind of multilayer printed circuit board, this wiring board comprises successively ground floor wiring board 1, second layer wiring board 2 and the 3rd sandwich circuit board 3 of lamination, the lower surface of described ground floor wiring board 1 and second layer wiring board 2 is provided with protuberance 4, the upper surface of described second layer wiring board 2 and the 3rd sandwich circuit board 3 is provided with recess 5, and described protuberance 4 and recess 5 are connected respectively.
Described protuberance 4 and recess 5 are the T font.Described protuberance 4 and recess 5 also can be I shape or other regular shapes, not affect other components and parts work as prerequisite.
Protuberance 4 and recess 5 have increased the surface area of this wiring board, by increasing the surface area of multilayer printed circuit board, guarantee that complicated circuit and more components and parts can complete in the circuit board.This circuit board structure is simple, and is easy to make, improved operating efficiency, reduced cost of manufacture.
Claims (2)
1. multilayer printed circuit board, it is characterized in that, this wiring board comprises successively ground floor wiring board (1), second layer wiring board (2) and the 3rd sandwich circuit board (3) of lamination, the lower surface of described ground floor wiring board (1) and second layer wiring board (2) is provided with protuberance (4), the upper surface of described second layer wiring board (2) and the 3rd sandwich circuit board (3) is provided with recess (5), and described protuberance (4) and recess (5) are connected respectively.
2. multilayer printed circuit board according to claim 1 is characterized in that, described protuberance (4) and recess (5) are the T font.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110326790 CN103079335A (en) | 2011-10-25 | 2011-10-25 | Multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110326790 CN103079335A (en) | 2011-10-25 | 2011-10-25 | Multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103079335A true CN103079335A (en) | 2013-05-01 |
Family
ID=48155707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110326790 Pending CN103079335A (en) | 2011-10-25 | 2011-10-25 | Multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103079335A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050316A (en) * | 2015-06-17 | 2015-11-11 | 安徽达胜电子有限公司 | Double-layer circuit board |
-
2011
- 2011-10-25 CN CN 201110326790 patent/CN103079335A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050316A (en) * | 2015-06-17 | 2015-11-11 | 安徽达胜电子有限公司 | Double-layer circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130501 |