CN204810674U - Copper pressfitting structure - Google Patents
Copper pressfitting structure Download PDFInfo
- Publication number
- CN204810674U CN204810674U CN201520476510.6U CN201520476510U CN204810674U CN 204810674 U CN204810674 U CN 204810674U CN 201520476510 U CN201520476510 U CN 201520476510U CN 204810674 U CN204810674 U CN 204810674U
- Authority
- CN
- China
- Prior art keywords
- copper
- prepreg
- copper layer
- layers
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 49
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 46
- 239000010949 copper Substances 0.000 title claims abstract description 46
- 238000003825 pressing Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 5
- YXLXNENXOJSQEI-UHFFFAOYSA-L Oxine-copper Chemical compound [Cu+2].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 YXLXNENXOJSQEI-UHFFFAOYSA-L 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
The utility model provides a copper pressfitting structure, including the first core, first copper layer, a prepreg, second copper layer, second core, third copper layer, the 2nd prepreg, fourth copper layer and the third core that from top to bottom set gradually, wherein, first core, second core and third core plate thickness are 0.2mm, and a prepreg and the 2nd prepreg's thickness is 0.15mm, and the thickness on first copper layer, second copper layer, third copper layer and fourth copper layer is 280nm. Since adopted above -mentioned structure, consequently, the utility model discloses only need to use two prepreg to reduced the circuit plate thickness, not only can satisfy the customer and to the requirement that the board is thick, still reach sparingly cost, improved production efficiency's purpose, had that the flow is simple, maneuverability is strong, the thick thinner characteristics of board.
Description
Technical field
The utility model relates to circuit board manufacturing area, particularly a kind of copper coin pressing structure.
Background technology
In PCB industry, general super thick copper coin is in bonding processes, the prepreg of multiple high glue is all used to make, so just bring drawback to production, because multiple prepregs and operating process are complicated, production efficiency is low, easy slide plate, completing thicker some problems such as grade of thickness of slab cannot avoid, and brings very large puzzlement to copper coin producer thick in industry.
Utility model content
The utility model provides the copper coin pressing structure that a kind of cost is low, production efficiency is high, thickness of slab is thinner.
For solving the problem, as an aspect of the present utility model, provide a kind of copper coin pressing structure, comprise the first central layer, the first layers of copper, the first prepreg, the second layers of copper, the second central layer, the 3rd layers of copper, the second prepreg, the 4th layers of copper and the 3rd central layer that set gradually from top to bottom, wherein, the thickness of the first central layer, the second central layer and the 3rd central layer is 0.2mm, the thickness of the first prepreg and the second prepreg is 0.15mm, and the thickness of the first layers of copper, the second layers of copper, the 3rd layers of copper and the 4th layers of copper is 280nm.
Preferably, the first prepreg and the second prepreg are the prepreg that gel content is greater than 90%.
Owing to have employed said structure, therefore, the utility model only needs use two prepregs, thus reduce the thickness of circuit board, not only can meet the requirement of client to thickness of slab, also reach saving cost, the object of enhancing productivity, have the advantages that flow process is simple, workable, thickness of slab is thinner.
Accompanying drawing explanation
Fig. 1 schematically shows structural representation of the present utility model.
Reference numeral in figure: 1, the first central layer; 2, the first layers of copper; 3, the first prepreg; 4, the second layers of copper; 5, the second central layer; 6, the 3rd layers of copper; 7, the second prepreg; 8, the 4th layers of copper; 9, the 3rd central layer.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in detail, but the multitude of different ways that the utility model can be defined by the claims and cover is implemented.
Please refer to Fig. 1, the utility model provides a kind of copper coin pressing structure, comprise the first central layer 1, first layers of copper 2, first prepreg 3, second layers of copper 4, second central layer 5, the 3rd layers of copper 6, second prepreg 7, the 4th layers of copper 8 and the 3rd central layer 9 that set gradually from top to bottom, wherein, the thickness of the first central layer 1, second central layer 5 and the 3rd central layer 9 is 0.2mm, the thickness of the first prepreg 3 and the second prepreg 7 is 0.15mm, and the thickness of the first layers of copper 2, second layers of copper 4, the 3rd layers of copper 6 and the 4th layers of copper 8 is 280nm.
Owing to have employed said structure, therefore, the utility model only needs use two prepregs, thus reduce the thickness of circuit board, not only can meet the requirement of client to thickness of slab, also reach saving cost, the object of enhancing productivity, have the advantages that flow process is simple, workable, thickness of slab is thinner.
Preferably, the first prepreg 3 and the second prepreg 7 prepreg that is greater than 90% for gel content.Like this, ensure that central layer is in bonding processes, there are enough resin fillings in the gap of thick copper.It should be noted that, the prepreg that gel content is greater than 90% is existing prepreg on the market.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (2)
1. a copper coin pressing structure, it is characterized in that, comprise the first central layer (1) set gradually from top to bottom, first layers of copper (2), first prepreg (3), second layers of copper (4), second central layer (5), 3rd layers of copper (6), second prepreg (7), 4th layers of copper (8) and the 3rd central layer (9), wherein, described first central layer (1), the thickness of described second central layer (5) and described 3rd central layer (9) is 0.2mm, the thickness of described first prepreg (3) and described second prepreg (7) is 0.15mm, described first layers of copper (2), described second layers of copper (4), the thickness of described 3rd layers of copper (6) and the 4th layers of copper (8) is 280nm.
2. copper coin pressing structure according to claim 1, is characterized in that, the prepreg that described first prepreg (3) and described second prepreg (7) are greater than 90% for gel content.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520476510.6U CN204810674U (en) | 2015-07-06 | 2015-07-06 | Copper pressfitting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520476510.6U CN204810674U (en) | 2015-07-06 | 2015-07-06 | Copper pressfitting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204810674U true CN204810674U (en) | 2015-11-25 |
Family
ID=54595416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520476510.6U Expired - Fee Related CN204810674U (en) | 2015-07-06 | 2015-07-06 | Copper pressfitting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204810674U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113382565A (en) * | 2021-06-09 | 2021-09-10 | 金禄电子科技股份有限公司 | Multi-layer circuit board, core board structure and laminating method thereof |
-
2015
- 2015-07-06 CN CN201520476510.6U patent/CN204810674U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113382565A (en) * | 2021-06-09 | 2021-09-10 | 金禄电子科技股份有限公司 | Multi-layer circuit board, core board structure and laminating method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: Baoan District manhole Street sand Shenzhen city 518000 four Guangdong province Dongbao Industrial Zone No. H building, the first floor of building G, Room 203, floor two floor Patentee after: SHENZHEN XUNJIEXING TECHNOLOGY Corp.,Ltd. Address before: Baoan District manhole Street sand Shenzhen city Guangdong province 518000 Industrial Zone No. four Dongbao building H Patentee before: SHENZHEN XUNJIEXING CIRCUIT TECH Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151125 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |