CN103064701A - Mmc柔性直流输电阀基控制器程序在线烧写系统 - Google Patents
Mmc柔性直流输电阀基控制器程序在线烧写系统 Download PDFInfo
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- CN103064701A CN103064701A CN2012105338867A CN201210533886A CN103064701A CN 103064701 A CN103064701 A CN 103064701A CN 2012105338867 A CN2012105338867 A CN 2012105338867A CN 201210533886 A CN201210533886 A CN 201210533886A CN 103064701 A CN103064701 A CN 103064701A
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104598259A (zh) * | 2013-11-01 | 2015-05-06 | 上海机电工程研究所 | 对经三防处理的io控制器进行软件在线烧写装置及方法 |
CN104965743A (zh) * | 2015-07-10 | 2015-10-07 | 许继电气股份有限公司 | 一种mmc子模块软件程序在线升级方法、系统及mmc子模块 |
CN109412741A (zh) * | 2018-09-17 | 2019-03-01 | 中国科学院电工研究所 | 基于光纤通信的大规模阵列式系统状态监控与软件升级的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US20030216902A1 (en) * | 2002-05-20 | 2003-11-20 | Hwang-Kyu Lim | Chip development system with built-in function library |
CN101008665A (zh) * | 2006-01-27 | 2007-08-01 | 诚瑞科技股份有限公司 | 并接烧录测试系统 |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US20030216902A1 (en) * | 2002-05-20 | 2003-11-20 | Hwang-Kyu Lim | Chip development system with built-in function library |
CN101008665A (zh) * | 2006-01-27 | 2007-08-01 | 诚瑞科技股份有限公司 | 并接烧录测试系统 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104598259A (zh) * | 2013-11-01 | 2015-05-06 | 上海机电工程研究所 | 对经三防处理的io控制器进行软件在线烧写装置及方法 |
CN104965743A (zh) * | 2015-07-10 | 2015-10-07 | 许继电气股份有限公司 | 一种mmc子模块软件程序在线升级方法、系统及mmc子模块 |
CN104965743B (zh) * | 2015-07-10 | 2018-12-07 | 许继电气股份有限公司 | 一种mmc子模块软件程序在线升级方法、系统及mmc子模块 |
CN109412741A (zh) * | 2018-09-17 | 2019-03-01 | 中国科学院电工研究所 | 基于光纤通信的大规模阵列式系统状态监控与软件升级的方法 |
CN109412741B (zh) * | 2018-09-17 | 2020-08-04 | 中国科学院电工研究所 | 基于光纤通信的大规模阵列式系统状态监控与软件升级的方法 |
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Address after: 102211 Beijing city Changping District Xiaotangshan town big East Village Road No. 270 (future technology city) Co-patentee after: CHINA-EPRI ELECTRIC POWER ENGINEERING Co.,Ltd. Patentee after: STATE GRID SMART GRID Research Institute Co-patentee after: STATE GRID SHANGHAI MUNICIPAL ELECTRIC POWER Co. Co-patentee after: State Grid Corporation of China Address before: 102211 Beijing city Changping District Xiaotangshan town big East Village Road No. 270 (future technology city) Co-patentee before: CHINA-EPRI ELECTRIC POWER ENGINEERING Co.,Ltd. Patentee before: STATE GRID SMART GRID Research Institute Co-patentee before: SHANGHAI MUNICIPAL ELECTRIC POWER Co. Co-patentee before: State Grid Corporation of China |
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Effective date of registration: 20170525 Address after: 102200 Beijing city Changping District South Shao Zhen Nan Road No. 16 Co-patentee after: STATE GRID SHANGHAI MUNICIPAL ELECTRIC POWER Co. Patentee after: CHINA-EPRI ELECTRIC POWER ENGINEERING Co.,Ltd. Co-patentee after: State Grid Corporation of China Address before: 102211 Beijing city Changping District Xiaotangshan town big East Village Road No. 270 (future technology city) Co-patentee before: CHINA-EPRI ELECTRIC POWER ENGINEERING Co.,Ltd. Patentee before: STATE GRID SMART GRID Research Institute Co-patentee before: STATE GRID SHANGHAI MUNICIPAL ELECTRIC POWER Co. Co-patentee before: State Grid Corporation of China |
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