CN103064209B - A kind of display panels preparation method - Google Patents
A kind of display panels preparation method Download PDFInfo
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- CN103064209B CN103064209B CN201310036600.9A CN201310036600A CN103064209B CN 103064209 B CN103064209 B CN 103064209B CN 201310036600 A CN201310036600 A CN 201310036600A CN 103064209 B CN103064209 B CN 103064209B
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Abstract
The invention discloses a kind of display panels preparation method, relate to field of liquid crystal display.Described display panels preparation method comprises: between upper substrate and infrabasal plate, arrange sealed plastic box, complete box technique, wherein, the region that the upper line of cut on described upper substrate is corresponding is provided with described sealed plastic box, and the area of described upper substrate is less than the area of described infrabasal plate; Described upper substrate or infrabasal plate arrange shading region along line of cut on described; By illumination methods, process is cured to the sealed plastic box be positioned at outside described shading region; Along described upper line of cut, described upper substrate is cut, along the lower cutting line on described infrabasal plate, described infrabasal plate is cut, obtain display panel unit.Described display panels preparation method, adopts uncured sealed plastic box to support upper and lower base plate, can effectively overcome the problem producing Bending Deformation in substrate cut process.
Description
Technical field
The present invention relates to technical field of liquid crystal display, particularly a kind of display panels preparation method.
Background technology
As taking thin film transistor (TFT) as control element, liquid crystal is the O-E Products integrating large-scale semiconductive integrated circuit and dull and stereotyped light source technology of medium---liquid crystal display panel of thin film transistor with its low-power consumption, be convenient for carrying, main flow display panel that the advantage such as usable range is wide, high-quality becomes a new generation.
The display quality of liquid crystal display panel of thin film transistor and overall performance are subject to the impact of material, device architecture and technological process to a great extent.At present, liquid crystal display panel of thin film transistor be by array base palte and color membrane substrates to after box, between array base palte and color membrane substrates, inject liquid crystal material and formed.The orientation that electric field controls liquid crystal in liquid crystal cell is formed by the electrode application voltage in array substrate and color membrane substrates, utilize the optical characteristics controls such as the optical anisotropy of liquid crystal molecule, birefringence through the luminous flux of liquid crystal cell, thus the display pattern needed for obtaining.The thickness of the liquid crystal cell formed by array base palte and color membrane substrates directly affects the luminous flux through liquid crystal cell, therefore retentive control liquid crystal cell thickness to improve display panels display homogeneity, optimize display performance have very important effect.
Usually on the surface to the glass substrate after box, form cutting line by cutter, then glass substrate is split along cutting line, thus make display panels form one piece of block panel unit.Panel construction common is at present as shown in Figure 1a: wherein, and 110 represent viewing areas, and 120 represent sealed plastic box regions, and 131 represent upper substrate lines of cut, and 132 represent infrabasal plate lines of cut.In order to allow the sealed plastic box after solidifying can not affect follow-up cutting technique, sealed plastic box has certain distance apart from line of cut.Fig. 1 b is the sectional view of panel cutting process, and wherein, 140 represent cutter, and 150 represent upper substrate, and 160 represent infrabasal plate, and the liquid crystal of 170 expression viewing areas, 180 represent sealed plastic boxs.
Along with the raising of the lightening requirement of panel, the thickness of substrate is more and more thinner, in cutting process, substrate near line of cut edge is owing to lacking support, often produce Bending Deformation as shown in Figure 1 b, the on the one hand normal formation of impact cutting line, except causing the generation of glass-cutting unfavorable condition, when sliver sliver chip also easy damaged be positioned at the rete of line of cut place non-cutting real estate, cabling and circuit; Affect the thickness of cut edge liquid crystal cell on the other hand, cause periphery to show unequal bad phenomenon, directly have influence on yield and the grade of product.
Summary of the invention
(1) technical matters that will solve
The technical problem to be solved in the present invention is: how to provide a kind of display panels preparation method, to avoid producing Bending Deformation in substrate cut process.
(2) technical scheme
For solving the problems of the technologies described above, the invention provides a kind of display panels preparation method, it comprises:
Between upper substrate and infrabasal plate, sealed plastic box is set, complete box technique, wherein, the region that the upper line of cut on described upper substrate is corresponding is provided with described sealed plastic box, and the area that the upper line of cut on described upper substrate surrounds is less than the area that the lower cutting line on described infrabasal plate surrounds;
Described upper substrate or infrabasal plate arrange shading region along line of cut on described;
By illumination methods, process is cured to the sealed plastic box be positioned at outside described shading region;
Along described upper line of cut, described upper substrate is cut, along the lower cutting line on described infrabasal plate, described infrabasal plate is cut, obtain display panel unit.
Wherein, the area coincidence that described upper line of cut and described lower cutting line are overseas in the periphery circuit region except display panel unit.
Wherein, described shading region is arranged continuously along described upper line of cut.
Wherein, the sealed plastic box being positioned at the peripheral circuit area of described display panel unit is in described shading region completely.
Wherein, described shading region is intermittently arranged along described upper line of cut, and described shading region is arranged at the corner of described upper line of cut.
Wherein, adopt mask plate, on described upper substrate or infrabasal plate, shading region is set along line of cut on described.
Wherein, describedly by illumination methods, process is cured to the sealed plastic box being positioned at photic zone, also comprises afterwards:
Thermal pretreatment is carried out to the sealed plastic box between described upper substrate and infrabasal plate.
Wherein, described in obtain display panel unit, also comprise afterwards:
Remove sealed plastic box uncured in described display panel unit.
Wherein, remove sealed plastic box uncured in described display panel unit, specifically comprise:
Remove in described display panel unit the uncured sealed plastic box be positioned at outside upper substrate;
Sealed plastic box remaining in described display panel unit is heat-treated.
Wherein, remove sealed plastic box uncured in described display panel unit, specifically comprise:
Sealed plastic box in described display panel unit is heat-treated;
Remove in described display panel unit the sealed plastic box be positioned at outside upper substrate.
(3) beneficial effect
Display panels preparation method of the present invention, uncured sealed plastic box is adopted to support upper and lower base plate, can effectively overcome the problem producing Bending Deformation in substrate cut process, thus the normal formation of cutting line can be ensured on the one hand, avoid the generation of glass-cutting unfavorable condition, when avoiding sliver, the damage of sliver chip is positioned at the rete of line of cut place non-cutting real estate, cabling and circuit; Avoid the thickness affecting cut edge liquid crystal cell on the other hand, avoid periphery to show unequal bad phenomenon, improve yield and the grade of product.
Accompanying drawing explanation
Fig. 1 a is existing display panel structure schematic diagram;
Fig. 1 b is existing display panel Bending Deformation schematic diagram in cutting process;
Fig. 2 is the process flow diagram of display panels preparation method of the present invention;
Fig. 3 is wherein display panel unit of the present invention is the display panel structure schematic diagram that sequential matrix arranges;
Fig. 4 a is the first the shading scheme schematic diagram in the embodiment of the present invention 1;
Fig. 4 b is the second shading scheme schematic diagram in the embodiment of the present invention 1;
Fig. 4 c is the third shading scheme schematic diagram in the embodiment of the present invention 1;
Fig. 5 a is the planimetric map of display panel unit described in embodiment 1;
Fig. 5 b is V-V ' direction cut-open view in Fig. 5 a;
Fig. 6 a is the display panel unit schematic diagram after uncured sealed plastic box all being removed of the embodiment of the present invention 1;
Fig. 6 b is V-V ' direction cut-open view in Fig. 6 a;
Fig. 6 c is the display panel unit schematic diagram after the part of the embodiment of the present invention 1 removes uncured sealed plastic box;
Fig. 6 d is V-V ' direction cut-open view in Fig. 6 c;
Fig. 6 e is the display panel unit schematic diagram after the another kind of part of the embodiment of the present invention 1 removes uncured sealed plastic box;
Fig. 6 f is V-V ' direction cut-open view in Fig. 6 e;
Fig. 7 a is the display panel unit schematic diagram after heat curing process described in the embodiment of the present invention 1;
Fig. 7 b is V-V ' direction cut-open view in Fig. 7 a;
Fig. 8 is wherein display panel unit of the present invention is the display panel structure schematic diagram that interlacing inverted sequence matrix arranges;
The first shading scheme schematic diagram in Fig. 9 a embodiment of the present invention 2;
Fig. 9 b is the second shading scheme schematic diagram in the embodiment of the present invention 2;
Fig. 9 c is the third shading scheme schematic diagram in the embodiment of the present invention 2;
Figure 10 a is the display panel unit schematic diagram after heat curing process described in the embodiment of the present invention 2;
Figure 10 b is the cut-open view in V-V ' direction in Figure 10 a.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
Fig. 2 is the process flow diagram of display panel preparation method of the present invention, and as shown in Figure 2, described method comprises step:
S100: arrange sealed plastic box between upper substrate and infrabasal plate, completes box technique; Wherein, the region that the upper line of cut on described upper substrate is corresponding is provided with described sealed plastic box, and the area that the upper line of cut on described upper substrate surrounds is less than the area that the lower cutting line on described infrabasal plate surrounds.Described upper substrate is array base palte, and described infrabasal plate is color membrane substrates; Or described upper substrate is color membrane substrates, described infrabasal plate is array base palte.Described upper line of cut is positioned on described upper substrate, is the mark line cut described upper substrate, follow-uply will cut along this mark line described upper substrate.The area making described upper line of cut surround is less than the area that described lower cutting line surrounds, be less than the area of infrabasal plate with the area ensureing to cut upper substrate in the display panel unit that obtains, and then the outshot of infrabasal plate in display panel unit arranges peripheral circuit.
S200: on described upper substrate or infrabasal plate, shading region is set along line of cut on described;
S300: process is cured to the sealed plastic box be positioned at outside described shading region by illumination methods;
S400: along described upper line of cut, described upper substrate is cut, along lower cutting line, described infrabasal plate is cut, obtain display panel unit.Be similar to described upper line of cut, described lower cutting line is positioned on described infrabasal plate, is the mark line cut described infrabasal plate, follow-uply will cut along this mark line described infrabasal plate.
Below point embodiment is described in detail to described preparation method.
Embodiment 1
See Fig. 3, each display panel unit arrangement in sequential matrix on whole array base palte or color membrane substrates in the present embodiment, this feature put in order is, often the peripheral circuit area 230 of row display panel unit all in the same direction.In the present embodiment, described display panel preparation method is as follows:
S1: arrange sealed plastic box 220 between upper substrate and infrabasal plate, filling liquid crystal, completes box technique.In the present embodiment, upper substrate is color membrane substrates, and infrabasal plate is array base palte, and the area that the upper line of cut 241 on color membrane substrates surrounds is less than the area that the lower cutting line 242 on array base palte surrounds.Wherein, the preparation process non-invention emphasis of color membrane substrates and array base palte, does not repeat them here.In addition, in the present embodiment, adopt print process or rubbing method between upper substrate and infrabasal plate, arrange sealed plastic box 220, described sealed plastic box 220 is arranged on the viewing area 210 of each display panel unit around, and the region of upper line of cut 241 correspondence is provided with described sealed plastic box 220.Can see, after adopting this sealed plastic box set-up mode, the sealed plastic box between the display panel unit of going together mutually links into an integrated entity.Wherein, described upper substrate is reserved with line of cut 241, infrabasal plate is reserved with lower cutting line 242, described upper line of cut 241 and lower cutting line 242 are at the area coincidence except the peripheral circuit area 230 of the first row display panel unit, that is, upper substrate corresponds to the position of lower cutting line 242, the region except the peripheral circuit area 230 of the first row display panel unit is all reserved with described upper line of cut 241.
Above-mentioned filling liquid crystal can with ODF(One Drop Filling, liquid crystal drip-injection) method or Liquid crystal pour method carry out, and when adopting Liquid crystal pour method, should reserve liquid crystal injecting port when arranging described sealed plastic box 220.Preferably ODF method is adopted in the present embodiment.
S2: on described upper substrate or infrabasal plate, shading region 250 is set along line of cut 241 on described.
See Fig. 4 a, in a kind of preferred implementation of the present embodiment, described shading region 250 is arranged continuously along described upper line of cut 241, described shading region 250 is for preventing the sealed plastic box 220 of respective regions by illumination curing, thus utilize the uncured front toughness of the sealed plastic box 220 of this respective regions and hardness to support described upper substrate and infrabasal plate, avoid described upper substrate and infrabasal plate to occur deformation in cutting process.Therefore, when arranging described shading region 250, preferably make described upper line of cut 241 all be positioned at the coverage of described shading region 250.
See Fig. 4 b, in the another kind of preferred implementation of the present embodiment, described shading region 250 is intermittently arranged along described upper line of cut 241, and described shading region 250 is preferably arranged on the corner of described upper line of cut 241.
See Fig. 4 c, in another preferred implementation of the present embodiment, described shading region 250 is arranged continuously along described upper line of cut 241, and makes the sealed plastic box 220 in the peripheral circuit area 230 of described display panel unit be in completely in described shading region 250.Adopting the plan of establishment of this shading region, can being convenient to remove in subsequent step the sealed plastic box that those are arranged for supporting upper substrate and infrabasal plate more.
Above-mentioned shading scheme can adopt and directly arrange light shield layer or employing UV(ultraviolet on upper substrate or infrabasal plate) optical mask plate, normal circuit cabling can be affected owing to arranging light shield layer, strengthen panel designs difficulty, and easily form obstruction to cutting, the present embodiment preferably adopts UV optical mask plate.
S3: process is cured to the sealed plastic box be positioned at outside described shading region 250 by UV illumination methods.
Step can also be comprised: thermal pretreatment is carried out to the sealed plastic box between described upper substrate and infrabasal plate after this step S3.Consider that this thermal pretreatment likely can affect follow-up cutting step, therefore also can omit this thermal pretreatment.
S4: along described upper cutting 241, described upper substrate is cut, along lower cutting line 242, described infrabasal plate is cut, obtain display panel unit.
Fig. 5 a is the planimetric map of display panel unit described in embodiment 1, and Fig. 5 b is V-V ' direction cut-open view in Fig. 5 a.See Fig. 5 a, after illumination curing process, described sealed plastic box 220 becomes two kinds, and a kind of is the solidification sealed plastic box 221 be positioned at outside shading region 250, and a kind of is the uncured sealed plastic box 222 being positioned at shading region 250.See Fig. 5 b, described display panel unit comprises upper substrate 261 and infrabasal plate 262, the liquid crystal 211 between described upper substrate 261 and infrabasal plate 262, solidification sealed plastic box 221 and uncured sealed plastic box 222.Wherein, described upper substrate 261 does not cover the peripheral circuit area 230 of this display panel unit, and the described uncured sealed plastic box 222 being positioned at described peripheral circuit area 230 is outside exposed.
Through above-mentioned steps S1 to S4, obtain display panel unit, if at this moment the sealed plastic box of upper line of cut corresponding region does not impact subsequent technique, then the preparation process of display panel unit terminates, if the sealed plastic box of upper line of cut corresponding region impacts subsequent technique, then can according to sealed plastic box uncured after the photo-irradiation treatment of step S5 removal below.
S5: remove the uncured sealed plastic box 222 through photo-irradiation treatment in described display panel unit.
Here removing the uncured sealed plastic box 222 in described display panel unit, can be uncured sealed plastic box 222 all removed.Fig. 6 a is the display panel unit schematic diagram after uncured sealed plastic box 222 all being removed of the embodiment of the present invention 1, Fig. 6 b is V-V ' direction cut-open view in Fig. 6 a, see Fig. 6 a and Fig. 6 b, can see that the uncured sealed plastic box 222 between described upper substrate 261 and infrabasal plate 262 is removed completely, only residue solidification sealed plastic box 221.
In addition, part can also be selected to remove uncured sealed plastic box 222, Fig. 6 c is the display panel unit schematic diagram after the part of the embodiment of the present invention 1 removes uncured sealed plastic box 222, Fig. 6 d is V-V ' direction cut-open view in Fig. 6 c, see Fig. 6 c and Fig. 6 d, can see that the uncured sealed plastic box 222 between described upper substrate 261 and infrabasal plate 262 is partially removed, residue solidification sealed plastic box 221 and the uncured sealed plastic box 222 of part, and the edge that remaining uncured sealed plastic box 222 is hidden in described upper substrate 261 is inner.
Fig. 6 e is the display panel unit schematic diagram after the another kind of part of the embodiment of the present invention 1 removes uncured sealed plastic box 222, Fig. 6 f is V-V ' direction cut-open view in Fig. 6 e, see Fig. 6 e and Fig. 6 f, can see that the uncured sealed plastic box 222 between described upper substrate 261 and infrabasal plate 262 is partially removed, residue solidification sealed plastic box 221 and the uncured sealed plastic box 222 of part, and remaining uncured sealed plastic box 222 is just concordant with the edge of described upper substrate 261, that is the uncured sealed plastic box 222 exposed outside described upper substrate 261 is only eliminated in this embodiment.
The present embodiment preferably adopts above-mentioned the third to remove the scheme of the sealed plastic box of upper line of cut corresponding region, and remove scheme by this sealed plastic box, remaining uncured sealed plastic box 222 can bear larger external force after subsequent cure, can stabilizing liquid crystal box better.
In this step S5, after completing the sealed plastic box of line of cut corresponding region in above-mentioned removal, can also comprise: sealed plastic box remaining in described display panel unit is heat-treated.Here in display panel, remaining sealed plastic box comprises described solidification sealed plastic box 221, also may comprise the described uncured sealed plastic box 222 of some residual.Fig. 7 a is the display panel unit schematic diagram after heat curing process described in the embodiment of the present invention 1, Fig. 7 b is V-V ' direction cut-open view in Fig. 7 a, see Fig. 7 a and 7b, after heat curing process, in display panel, remaining sealed plastic box forms heat curing sealed plastic box 223, and the edge of described heat curing sealed plastic box 223 is just concordant with the edge of described upper substrate 261.
Embodiment 2
See Fig. 8, each display panel unit arrangement in interlacing inverted sequence matrix on whole array base palte or color membrane substrates in the present embodiment, this feature put in order is, often the peripheral circuit area 830 of row display panel unit is not in the same direction, this arrangement mode can make gluing track more continuous, thus simplified manufacturing technique.In addition, in Fig. 8,810 represent viewing area, and 820 represent sealed plastic box, and 841 represent upper line of cut, and 842 represent lower cutting line.The implementation step of this embodiment is substantially the same manner as Example 1, is only described as follows the difference of two embodiments below:
The first shading scheme schematic diagram of Fig. 9 a embodiment of the present invention 2, similar with Fig. 4 a, shading region 850 is arranged continuously along described upper line of cut 841, with Fig. 4 a unlike, owing to there is no peripheral circuit area between adjacent rows display panel unit in the present embodiment, therefore between adjacent rows display panel unit, sealed plastic box 820 is set completely, correspondingly, single file shading region 850 is set between adjacent rows display panel unit.Meanwhile, all there is peripheral circuit area 830 top of the first row display panel unit and the below of the second row display panel unit, and in this two places peripheral circuit area 830, line of cut 841 and lower cutting line 842 all do not overlap.
Fig. 9 b is the embodiment of the present invention 2 the second shading scheme schematic diagram, and similar with Fig. 4 b, shading region 850 is intermittently arranged along described upper line of cut 841, is mainly arranged on the corner of line of cut 841.
Fig. 9 c is the third shading scheme schematic diagram of the embodiment of the present invention 2, similar with Fig. 4 c, described shading region 850 is arranged continuously along described upper line of cut 841, and makes the sealed plastic box 820 in the peripheral circuit area 830 of described display panel unit be in completely in described shading region 850.
The present embodiment preferably adopts the third shading scheme above-mentioned, after shading treatment, performs following steps successively:
S3 ': process is cured to the sealed plastic box be positioned at outside described shading region 850 by UV illumination methods.
S4 ': along described upper cutting 841, described upper substrate is cut, along lower cutting line 842, described infrabasal plate is cut, obtain display panel unit.
Similar with embodiment 1, through above-mentioned process, obtain display panel unit, at this moment can select whether remove uncured sealed plastic box according to embody rule situation.If remove described uncured sealed plastic box, can process according to step S5 ' below.
S5 ': remove sealed plastic box uncured in described display panel unit.
This step S5 ' is with the difference of step S5 described in embodiment 1, first the sealed plastic box in described display panel unit is heat-treated, that is the solidification sealed plastic box in described display panel unit and all uncured sealed plastic boxs is made to be cured as heat curing sealed plastic box 823 completely, as shown in Figure 10 a.Figure 10 b is the cut-open view in V-V ' direction in Figure 10 a, wherein, upper substrate 861 and infrabasal plate 862 is provided with liquid crystal 811 and described heat curing sealed plastic box 823, can sees that described heat curing sealed plastic box 823 protrudes from outside described upper substrate 861.
After above-mentioned heat curing process, this step S5 ' can comprise further: adopt etching technics to remove in described display panel unit the heat curing sealed plastic box 823 be positioned at outside upper substrate 861.
Display panels preparation method described in the embodiment of the present invention, uncured sealed plastic box is adopted to support upper and lower base plate, can effectively overcome the problem producing Bending Deformation in substrate cut process, thus the normal formation of cutting line can be ensured on the one hand, avoid the generation of glass-cutting unfavorable condition, when avoiding sliver, the damage of sliver chip is positioned at the rete of line of cut place non-cutting real estate, cabling and circuit; Avoid the thickness affecting cut edge liquid crystal cell on the other hand, avoid periphery to show unequal bad phenomenon, improve yield and the grade of product.
Above embodiment is only for illustration of the present invention; and be not limitation of the present invention; the those of ordinary skill of relevant technical field; without departing from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.
Claims (10)
1. a display panels preparation method, is characterized in that, comprising:
Between upper substrate and infrabasal plate, sealed plastic box is set, complete box technique, wherein, the region that upper line of cut on described upper substrate is corresponding is provided with described sealed plastic box, sealed plastic box between the display panel unit of going together mutually links into an integrated entity, and the area that the upper line of cut on described upper substrate surrounds is less than the area that the lower cutting line on described infrabasal plate surrounds;
Described upper substrate or infrabasal plate arrange shading region along line of cut on described;
By illumination methods, process is cured to the sealed plastic box be positioned at outside described shading region;
Along described upper line of cut, described upper substrate is cut, along the lower cutting line on described infrabasal plate, described infrabasal plate is cut, obtain display panel unit.
2. the method for claim 1, is characterized in that, the area coincidence that described upper line of cut and described lower cutting line are overseas in the periphery circuit region except display panel unit.
3. the method for claim 1, is characterized in that, described shading region is arranged continuously along described upper line of cut.
4. method as claimed in claim 3, it is characterized in that, the sealed plastic box being positioned at the peripheral circuit area of described display panel unit is in described shading region completely.
5. the method for claim 1, is characterized in that, described shading region is intermittently arranged along described upper line of cut, and described shading region is arranged at the corner of described upper line of cut.
6. the method for claim 1, is characterized in that, adopts mask plate to arrange shading region along line of cut on described on described upper substrate or infrabasal plate.
7. the method for claim 1, is characterized in that, is describedly cured process by illumination methods to the sealed plastic box being positioned at photic zone, also comprises afterwards:
Thermal pretreatment is carried out to the sealed plastic box between described upper substrate and infrabasal plate.
8. the method for claim 1, is characterized in that, described in obtain display panel unit, also comprise afterwards:
Remove sealed plastic box uncured in described display panel unit.
9. method as claimed in claim 8, is characterized in that, remove sealed plastic box uncured in described display panel unit, specifically comprise:
Remove in described display panel unit the uncured sealed plastic box be positioned at outside upper substrate;
Sealed plastic box remaining in described display panel unit is heat-treated.
10. method as claimed in claim 8, is characterized in that, remove sealed plastic box uncured in described display panel unit, specifically comprise:
Sealed plastic box in described display panel unit is heat-treated;
Remove in described display panel unit the sealed plastic box be positioned at outside upper substrate.
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| JP2007264525A (en) * | 2006-03-30 | 2007-10-11 | Sony Corp | Display device and method of manufacturing display device |
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| US5851411A (en) * | 1996-07-09 | 1998-12-22 | Lg Electronics, Inc. | High-density liquid crystal display and method |
| CN1442738A (en) * | 2002-03-06 | 2003-09-17 | Lg.菲利浦Lcd株式会社 | Liquid crystal display device and its manufacturing method |
| CN1447164A (en) * | 2002-03-23 | 2003-10-08 | Lg.菲利浦Lcd株式会社 | LCD and its mf. method |
| CN102736296A (en) * | 2011-04-13 | 2012-10-17 | 乐金显示有限公司 | Fabricating method of liquid crystal display device |
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