CN103064209A - Method for preparing liquid crystal display panel - Google Patents
Method for preparing liquid crystal display panel Download PDFInfo
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- CN103064209A CN103064209A CN2013100366009A CN201310036600A CN103064209A CN 103064209 A CN103064209 A CN 103064209A CN 2013100366009 A CN2013100366009 A CN 2013100366009A CN 201310036600 A CN201310036600 A CN 201310036600A CN 103064209 A CN103064209 A CN 103064209A
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Abstract
The invention discloses a method for preparing a liquid crystal display panel and relates to the field of liquid crystal display. The method for preparing the liquid crystal display panel comprises the following steps of: arranging frame sealing glue between an upper substrate and a lower substrate to finish a fastening technology, wherein the frame sealing glue is arranged in a region corresponding to an upper cutting line on the upper substrate, and the area of the upper substrate is smaller than that of the lower substrate; arranging a shading region on the upper substrate or the lower substrate along the upper cutting line; solidifying the frame sealing glue outside the shading region by an illumination mode; and cutting the upper substrate along the upper cutting line, and cutting the lower substrate along a lower cutting line on the lower substrate to obtain a display panel unit. By the method for preparing the liquid crystal display panel, the upper substrate and the lower substrate are supported by non-solidified frame sealing glue, so that the problem of bending deformation caused by cutting of the substrates can be effectively solved.
Description
Technical field
The present invention relates to technical field of liquid crystal display, particularly a kind of display panels preparation method.
Background technology
As take thin film transistor (TFT) as control element, liquid crystal is the O-E Products that integrates large-scale semiconductive integrated circuit and dull and stereotyped light source technology of medium---liquid crystal display panel of thin film transistor with its low-power consumption, be convenient for carrying, usable range is wide, the advantage such as high-quality becomes a new generation main flow display panel.
The display quality of liquid crystal display panel of thin film transistor and overall performance are subject to the impact of material, device architecture and technological process to a great extent.At present, liquid crystal display panel of thin film transistor be by array base palte and color membrane substrates to box after, between array base palte and color membrane substrates, inject liquid crystal material and form.Form the orientation that electric field is controlled liquid crystal in the liquid crystal cell by the electrode application voltage on pair array substrate and the color membrane substrates, utilize the optical characteristics such as optical anisotropy, the birefringence control of liquid crystal molecule to pass the luminous flux of liquid crystal cell, thereby obtain required display pattern.Thickness by array base palte and the formed liquid crystal cell of color membrane substrates directly affects the luminous flux that passes liquid crystal cell, so the thickness of retentive control liquid crystal cell has very important effect to homogeneity, the optimization display performance that improves the display panels demonstration.
Usually form the cutting line by cutter on the surface to the glass substrate behind the box, glass substrate is split along the cutting line, thereby make display panels form a piece panel unit.At present common panel construction is as shown in Figure 1a: wherein, and 110 expression viewing areas, 120 expression sealed plastic boxs zones, 131 expression upper substrate lines of cut, 132 expression infrabasal plate lines of cut.In order to allow the sealed plastic box after solidifying can not affect follow-up cutting technique, sealed plastic box has certain distance apart from line of cut.Fig. 1 b is the sectional view of panel cutting process, wherein, and 140 expression cutter, 150 expression upper substrates, 160 expression infrabasal plates, the liquid crystal of 170 expression viewing areas, 180 expression sealed plastic boxs.
Raising along with the lightening requirement of panel, the thickness of substrate is more and more thinner, in cutting process, the substrate at close line of cut edge is owing to lacking support, tend to produce Bending Deformation shown in Fig. 1 b, the on the one hand normal formation of impact cutting line, except the generation that causes the glass-cutting unfavorable condition, when sliver the sliver chip also easy damaged be positioned at rete, cabling and the circuit of the non-cutting substrate face in line of cut place; Affect on the other hand the thickness of cut edge liquid crystal cell, cause periphery to show unequal bad phenomenon, directly have influence on yield and the grade of product.
Summary of the invention
The technical matters that (one) will solve
The technical problem to be solved in the present invention is: how to provide a kind of display panels preparation method, to avoid producing Bending Deformation in the substrate cut process.
(2) technical scheme
For solving the problems of the technologies described above, the invention provides a kind of display panels preparation method, it comprises:
Between upper substrate and infrabasal plate, sealed plastic box is set, finish box technique, wherein, region division corresponding to upper line of cut on the described upper substrate has described sealed plastic box, and the area that surrounds less than the lower line of cut on the described infrabasal plate of the area that surrounds of the upper line of cut on the described upper substrate;
On described upper substrate or the infrabasal plate on described line of cut shading region is set;
Be cured processing by illumination methods to being positioned at the outer sealed plastic box of described shading region;
Along described upper line of cut described upper substrate is cut, along the lower line of cut on the described infrabasal plate described infrabasal plate is cut, obtain display panel unit.
Wherein, described upper line of cut and described lower line of cut are at the overseas area coincidence of periphery circuit region except display panel unit.
Wherein, described shading region arranges continuously along described upper line of cut.
Wherein, the sealed plastic box that is positioned at the peripheral circuit area of described display panel unit is in described shading region fully.
Wherein, described shading region intermittently arranges along described upper line of cut, and described shading region is arranged at the corner of described upper line of cut.
Wherein, adopt mask plate on described upper substrate or the infrabasal plate on described line of cut shading region is set.
Wherein, describedly by illumination methods the sealed plastic box that is positioned at photic zone is cured processing, also comprises afterwards:
Sealed plastic box between described upper substrate and the infrabasal plate is carried out thermal pretreatment.
Wherein, the described display panel unit that obtains also comprises afterwards:
Remove sealed plastic box uncured in the described display panel unit.
Wherein, remove sealed plastic box uncured in the described display panel unit, specifically comprise:
Remove the uncured sealed plastic box that is positioned in the described display panel unit outside the upper substrate;
Remaining sealed plastic box in the described display panel unit is heat-treated.
Wherein, remove sealed plastic box uncured in the described display panel unit, specifically comprise:
Sealed plastic box in the described display panel unit is heat-treated;
Remove the sealed plastic box that is positioned in the described display panel unit outside the upper substrate.
(3) beneficial effect
Display panels preparation method of the present invention, adopt uncured sealed plastic box to support upper and lower base plate, can effectively overcome the problem that produces Bending Deformation in the substrate cut process, thereby the normal formation that can guarantee to cut line on the one hand, avoid the generation of glass-cutting unfavorable condition, the damage of sliver chip is positioned at rete, cabling and the circuit of the non-cutting substrate face in line of cut place when avoiding sliver; Avoid on the other hand affecting the thickness of cut edge liquid crystal cell, avoid periphery to show unequal bad phenomenon, improved yield and the grade of product.
Description of drawings
Fig. 1 a is existing display panel structure schematic diagram;
Fig. 1 b is existing display panel Bending Deformation schematic diagram in cutting process;
Fig. 2 is display panels preparation method's of the present invention process flow diagram;
Fig. 3 is that wherein display panel unit of the present invention is the display panel structure schematic diagram that sequential matrix is arranged;
Fig. 4 a is the first shading scheme schematic diagram in the embodiment of the invention 1;
Fig. 4 b is the second shading scheme schematic diagram in the embodiment of the invention 1;
Fig. 4 c is the third shading scheme schematic diagram in the embodiment of the invention 1;
Fig. 5 a is the planimetric map of embodiment 1 described display panel unit;
Fig. 5 b is V-V ' direction cut-open view among Fig. 5 a;
Fig. 6 a is the display panel unit schematic diagram after the embodiment of the invention 1 uncured sealed plastic box is all removed;
Fig. 6 b is V-V ' direction cut-open view among Fig. 6 a;
Fig. 6 c is the display panel unit schematic diagram after the part of the embodiment of the invention 1 is removed uncured sealed plastic box;
Fig. 6 d is V-V ' direction cut-open view among Fig. 6 c;
Fig. 6 e is the display panel unit schematic diagram after the another kind of part of the embodiment of the invention 1 is removed uncured sealed plastic box;
Fig. 6 f is V-V ' direction cut-open view among Fig. 6 e;
Fig. 7 a is the display panel unit schematic diagram after the embodiment of the invention 1 described heat curing is processed;
Fig. 7 b is V-V ' direction cut-open view among Fig. 7 a;
Fig. 8 is that wherein display panel unit of the present invention is the display panel structure schematic diagram that interlacing inverted sequence matrix is arranged;
The first shading scheme schematic diagram in Fig. 9 a embodiment of the invention 2;
Fig. 9 b is the second shading scheme schematic diagram in the embodiment of the invention 2;
Fig. 9 c is the third shading scheme schematic diagram in the embodiment of the invention 2;
Figure 10 a is the display panel unit schematic diagram after the embodiment of the invention 2 described heat curings are processed;
Figure 10 b is the cut-open view of V-V ' direction among Figure 10 a.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples are used for explanation the present invention, but are not used for limiting the scope of the invention.
Fig. 2 is display panel preparation method's of the present invention process flow diagram, and as shown in Figure 2, described method comprises step:
S100: between upper substrate and infrabasal plate, sealed plastic box is set, finishes box technique; Wherein, region division corresponding to upper line of cut on the described upper substrate has described sealed plastic box, and the area that surrounds less than the lower line of cut on the described infrabasal plate of the area that surrounds of the upper line of cut on the described upper substrate.Described upper substrate is array base palte, and described infrabasal plate is color membrane substrates; Perhaps, described upper substrate is color membrane substrates, and described infrabasal plate is array base palte.Described upper line of cut is positioned on the described upper substrate, is the mark line that described upper substrate is cut, follow-up will the cutting described upper substrate along this mark line.The area that the area that makes described upper line of cut surround surrounds less than described lower line of cut, with the area that guarantees upper substrate in the display panel unit that cutting the obtains area less than infrabasal plate, and then the outshot of the infrabasal plate in display panel unit arranges peripheral circuit.
S200: on described upper substrate or the infrabasal plate on described line of cut shading region is set;
S300: be cured processing to being positioned at the outer sealed plastic box of described shading region by illumination methods;
S400: along described upper line of cut described upper substrate is cut, along lower line of cut described infrabasal plate is cut, obtain display panel unit.Be similar to described upper line of cut, described lower line of cut is positioned on the described infrabasal plate, is the mark line that described infrabasal plate is cut, follow-up will the cutting described infrabasal plate along this mark line.
Below divide embodiment that described preparation method is elaborated.
Embodiment 1
Referring to Fig. 3, each display panel unit is the sequential matrix arrangement at whole array base palte or color membrane substrates in the present embodiment, and this characteristics that put in order are that the peripheral circuit area 230 of every row display panel unit is all on same direction.In the present embodiment, described display panel preparation method is as follows:
S1: sealed plastic box 220 is set between upper substrate and infrabasal plate, and filling liquid crystal is finished box technique.In the present embodiment, upper substrate is color membrane substrates, and infrabasal plate is array base palte, the area that the area that the upper line of cut 241 on the color membrane substrates surrounds surrounds less than the lower line of cut 242 on the array base palte.Wherein, the non-emphasis of the present invention of the preparation process of color membrane substrates and array base palte does not repeat them here.In addition, in the present embodiment, adopt print process or rubbing method that sealed plastic box 220 is set between upper substrate and infrabasal plate, described sealed plastic box 220 be arranged on each display panel unit viewing area 210 around, and at the region division of upper line of cut 241 correspondences described sealed plastic box 220 is arranged.Can see, adopt this sealed plastic box set-up mode after, mutually colleague display panel unit between sealed plastic box link into an integrated entity.Wherein, be reserved with line of cut 241 on the described upper substrate, be reserved with lower line of cut 242 on the infrabasal plate, described upper line of cut 241 and lower line of cut 242 are at the area coincidence except the peripheral circuit area 230 of the first row display panel unit, that is to say, corresponding to the position of lower line of cut 242, the zone except the peripheral circuit area 230 of the first row display panel unit all is reserved with described upper line of cut 241 on the upper substrate.
Above-mentioned filling liquid crystal can be with ODF(One Drop Filling, liquid crystal drip-injection) method or Liquid crystal pour method carry out, and when adopting the Liquid crystal pour method, should reserve liquid crystal injecting port when described sealed plastic box 220 is set.The preferred ODF method that adopts in the present embodiment.
S2: on described upper substrate or the infrabasal plate on described line of cut 241 shading region 250 is set.
Referring to Fig. 4 a, in a kind of preferred implementation of the present embodiment, described shading region 250 arranges continuously along described upper line of cut 241, described shading region 250 is used for preventing that the sealed plastic box 220 of respective regions is by illumination curing, thereby utilize uncured front toughness and the hardness of the sealed plastic box 220 of this respective regions to support described upper substrate and infrabasal plate, avoid described upper substrate and infrabasal plate deformation in cutting process, to occur.Therefore, when described shading region 250 is set, preferably make described upper line of cut 241 all be positioned at the coverage of described shading region 250.
Referring to Fig. 4 b, in the another kind of preferred implementation of the present embodiment, described shading region 250 intermittently arranges along described upper line of cut 241, and described shading region 250 preferably is arranged on the corner of described upper line of cut 241.
Referring to Fig. 4 c, in another preferred implementation of the present embodiment, described shading region 250 arranges continuously along described upper line of cut 241, and makes the peripheral circuit area 230 interior sealed plastic boxs 220 of described display panel unit be in fully in the described shading region 250.Adopt this shading region plan of establishment, can be convenient in subsequent step, remove those for supporting upper substrate and the infrabasal plate sealed plastic boxs that arrange more.
Above-mentioned shading scheme can adopt and light shield layer directly is set on upper substrate or infrabasal plate or adopt the UV(ultraviolet) optical mask plate, because light shield layer is set can affect the normal circuit cabling, strengthen the panel designs difficulty, and easily cutting is formed obstruction, the present embodiment preferably adopts the UV optical mask plate.
S3: be cured processing to being positioned at described shading region 250 outer sealed plastic boxs by the UV illumination methods.
Can also comprise step after this step S3: the sealed plastic box between described upper substrate and the infrabasal plate is carried out thermal pretreatment.Consider that this thermal pretreatment might affect follow-up cutting step, therefore also can omit this thermal pretreatment.
S4: cut along 241 pairs of described upper substrates of described upper cutting, cut along 242 pairs of described infrabasal plates of lower line of cut, obtain display panel unit.
Fig. 5 a is the planimetric map of embodiment 1 described display panel unit, and Fig. 5 b is V-V ' direction cut-open view among Fig. 5 a.Referring to Fig. 5 a, after the illumination curing processing, described sealed plastic box 220 becomes two kinds, and a kind of is the curing sealed plastic box 221 that is positioned at outside the shading region 250, and a kind of is the uncured sealed plastic box 222 that is positioned at shading region 250.Referring to Fig. 5 b, described display panel unit comprises upper substrate 261 and infrabasal plate 262, the liquid crystal 211 between described upper substrate 261 and infrabasal plate 262, curing sealed plastic box 221 and uncured sealed plastic box 222.Wherein, described upper substrate 261 does not cover the peripheral circuit area 230 of this display panel unit, and it is exposed outside to be positioned at the described uncured sealed plastic box 222 of described peripheral circuit area 230.
Through above-mentioned steps S1 to S4, obtained display panel unit, if at this moment the sealed plastic box of upper line of cut corresponding region does not impact subsequent technique, then the preparation process of display panel unit finishes, if the sealed plastic box of upper line of cut corresponding region impacts subsequent technique, then can be according to uncured sealed plastic box after the following step S5 removal photo-irradiation treatment.
S5: remove in the described display panel unit the uncured sealed plastic box 222 through photo-irradiation treatment.
Here removing the uncured sealed plastic box 222 in the described display panel unit, can be that uncured sealed plastic box 222 is all removed.Fig. 6 a is the display panel unit schematic diagram after the embodiment of the invention 1 uncured sealed plastic box 222 is all removed, Fig. 6 b is V-V ' direction cut-open view among Fig. 6 a, referring to Fig. 6 a and Fig. 6 b, can see that the uncured sealed plastic box 222 between described upper substrate 261 and infrabasal plate 262 is removed fully, only residue is solidified sealed plastic box 221.
In addition, can also select part to remove uncured sealed plastic box 222, Fig. 6 c is the display panel unit schematic diagram after the part of the embodiment of the invention 1 is removed uncured sealed plastic box 222, Fig. 6 d is V-V ' direction cut-open view among Fig. 6 c, referring to Fig. 6 c and Fig. 6 d, can see that the uncured sealed plastic box 222 between described upper substrate 261 and infrabasal plate 262 is partly removed, residue is solidified sealed plastic box 221 and the uncured sealed plastic box 222 of part, and remaining uncured sealed plastic box 222 is hidden in the inside, edge of described upper substrate 261.
Fig. 6 e is the display panel unit schematic diagram after the another kind of part of the embodiment of the invention 1 is removed uncured sealed plastic box 222, Fig. 6 f is V-V ' direction cut-open view among Fig. 6 e, referring to Fig. 6 e and Fig. 6 f, can see that the uncured sealed plastic box 222 between described upper substrate 261 and infrabasal plate 262 is partly removed, residue is solidified sealed plastic box 221 and the uncured sealed plastic box 222 of part, and remaining uncured sealed plastic box 222 is just concordant with the edge of described upper substrate 261, that is to say only to have removed the uncured sealed plastic box 222 of exposing outside the described upper substrate 261 in this embodiment.
The present embodiment preferably adopts above-mentioned the third to remove the scheme of the sealed plastic box of upper line of cut corresponding region, removes scheme by this sealed plastic box, and remaining uncured sealed plastic box 222 can be born larger external force after follow-up curing, better the stabilizing liquid crystal box.
Among this step S5, finish after the sealed plastic box of line of cut corresponding region in the above-mentioned removal, can also comprise: remaining sealed plastic box in the described display panel unit is heat-treated.Here remaining sealed plastic box comprises described curing sealed plastic box 221 in the display panel, also may comprise the remaining described uncured sealed plastic box 222 of part.Fig. 7 a is the display panel unit schematic diagram after the embodiment of the invention 1 described heat curing is processed, Fig. 7 b is V-V ' direction cut-open view among Fig. 7 a, referring to Fig. 7 a and 7b, after the heat curing processing, remaining sealed plastic box forms heat curing sealed plastic box 223 in the display panel, and the edge of described heat curing sealed plastic box 223 is just concordant with the edge of described upper substrate 261.
Embodiment 2
Referring to Fig. 8, each display panel unit is the arrangement of interlacing inverted sequence matrix at whole array base palte or color membrane substrates in the present embodiment, this characteristics that put in order are, the peripheral circuit area 830 of every row display panel unit is not on same direction, this arrangement mode can make gluing track more continuous, thus simplified manufacturing technique.In addition, among Fig. 8,810 expression viewing areas, 820 expression sealed plastic boxs, the upper line of cut of 841 expressions, the lower line of cut of 842 expressions.The implementation step of this embodiment is substantially the same manner as Example 1, below only the difference of two embodiment is described as follows:
Fig. 9 a embodiment of the invention 2 the first shading scheme schematic diagram, similar with Fig. 4 a, shading region 850 arranges continuously along described upper line of cut 841, different from Fig. 4 a is, owing to not having peripheral circuit area between the adjacent two row display panel units in the present embodiment, therefore between the adjacent two row display panel units sealed plastic box 820 is set fully, correspondingly, between the adjacent two row display panel units single file shading region 850 is set.Simultaneously, all there is peripheral circuit area 830 below of the top of the first row display panel unit and the second row display panel unit, and line of cut 841 and lower line of cut 842 all do not overlap on this two places peripheral circuit area 830 is interior.
Fig. 9 b is the embodiment of the invention 2 the second shading scheme schematic diagram, and similar with Fig. 4 b, shading region 850 intermittently arranges along described upper line of cut 841, mainly is arranged on the corner of line of cut 841.
Fig. 9 c is the embodiment of the invention 2 the third shading scheme schematic diagram, similar with Fig. 4 c, described shading region 850 arranges continuously along described upper line of cut 841, and makes the peripheral circuit area 830 interior sealed plastic boxs 820 of described display panel unit be in fully in the described shading region 850.
The present embodiment preferably adopts above-mentioned the third shading scheme, after the shading treatment, carries out successively following steps:
S3 ': be cured processing to being positioned at described shading region 850 outer sealed plastic boxs by the UV illumination methods.
S4 ': cut along 841 pairs of described upper substrates of described upper cutting, cut along 842 pairs of described infrabasal plates of lower line of cut, obtain display panel unit.
Similar with embodiment 1, through above-mentioned processing, obtained display panel unit, at this moment can select whether to remove uncured sealed plastic box according to concrete applicable cases.If remove described uncured sealed plastic box, can process according to following step S5 '.
S5 ': remove sealed plastic box uncured in the described display panel unit.
This step S5 ' is with the difference of embodiment 1 described step S5, at first the sealed plastic box in the described display panel unit is heat-treated, that is to say that the curing sealed plastic box and all uncured sealed plastic boxs that make in the described display panel unit are cured as heat curing sealed plastic box 823 fully, shown in Figure 10 a.Figure 10 b is the cut-open view of V-V ' direction among Figure 10 a, wherein, is provided with liquid crystal 811 and described heat curing sealed plastic box 823 at upper substrate 861 and infrabasal plate 862, can see that described heat curing sealed plastic box 823 protrudes from outside the described upper substrate 861.
After above-mentioned heat curing processing, this step S5 ' can further comprise: adopt etching technics to remove the heat curing sealed plastic box 823 that is positioned in the described display panel unit outside the upper substrate 861.
The described display panels preparation method of the embodiment of the invention, adopt uncured sealed plastic box to support upper and lower base plate, can effectively overcome the problem that produces Bending Deformation in the substrate cut process, thereby the normal formation that can guarantee to cut line on the one hand, avoid the generation of glass-cutting unfavorable condition, the damage of sliver chip is positioned at rete, cabling and the circuit of the non-cutting substrate face in line of cut place when avoiding sliver; Avoid on the other hand affecting the thickness of cut edge liquid crystal cell, avoid periphery to show unequal bad phenomenon, improved yield and the grade of product.
Above embodiment only is used for explanation the present invention; and be not limitation of the present invention; the those of ordinary skill in relevant technologies field; in the situation that do not break away from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all technical schemes that are equal to also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.
Claims (10)
1. a display panels preparation method is characterized in that, comprising:
Between upper substrate and infrabasal plate, sealed plastic box is set, finish box technique, wherein, region division corresponding to upper line of cut on the described upper substrate has described sealed plastic box, and the area that surrounds less than the lower line of cut on the described infrabasal plate of the area that surrounds of the upper line of cut on the described upper substrate;
On described upper substrate or the infrabasal plate on described line of cut shading region is set;
Be cured processing by illumination methods to being positioned at the outer sealed plastic box of described shading region;
Along described upper line of cut described upper substrate is cut, along the lower line of cut on the described infrabasal plate described infrabasal plate is cut, obtain display panel unit.
2. the method for claim 1 is characterized in that, described upper line of cut and described lower line of cut are at the overseas area coincidence of periphery circuit region except display panel unit.
3. the method for claim 1 is characterized in that, described shading region arranges continuously along described upper line of cut.
4. method as claimed in claim 3 is characterized in that, the sealed plastic box that is positioned at the peripheral circuit area of described display panel unit is in described shading region fully.
5. the method for claim 1 is characterized in that, described shading region intermittently arranges along described upper line of cut, and described shading region is arranged at the corner of described upper line of cut.
6. the method for claim 1 is characterized in that, adopt mask plate on described upper substrate or the infrabasal plate on described line of cut shading region is set.
7. the method for claim 1 is characterized in that, describedly by illumination methods the sealed plastic box that is positioned at photic zone is cured processing, also comprises afterwards:
Sealed plastic box between described upper substrate and the infrabasal plate is carried out thermal pretreatment.
8. the method for claim 1 is characterized in that, the described display panel unit that obtains also comprises afterwards:
Remove sealed plastic box uncured in the described display panel unit.
9. method as claimed in claim 8 is characterized in that, removes sealed plastic box uncured in the described display panel unit, specifically comprises:
Remove the uncured sealed plastic box that is positioned in the described display panel unit outside the upper substrate;
Remaining sealed plastic box in the described display panel unit is heat-treated.
10. method as claimed in claim 8 is characterized in that, removes sealed plastic box uncured in the described display panel unit, specifically comprises:
Sealed plastic box in the described display panel unit is heat-treated;
Remove the sealed plastic box that is positioned in the described display panel unit outside the upper substrate.
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