CN111063827A - Display mother board and preparation method of display panel - Google Patents
Display mother board and preparation method of display panel Download PDFInfo
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- CN111063827A CN111063827A CN201911318431.1A CN201911318431A CN111063827A CN 111063827 A CN111063827 A CN 111063827A CN 201911318431 A CN201911318431 A CN 201911318431A CN 111063827 A CN111063827 A CN 111063827A
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- organic light
- mother board
- emitting display
- display panel
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- 238000002360 preparation method Methods 0.000 title abstract description 10
- 239000011521 glass Substances 0.000 claims abstract description 246
- 239000004568 cement Substances 0.000 claims abstract description 164
- 238000004806 packaging method and process Methods 0.000 claims abstract description 119
- 238000005520 cutting process Methods 0.000 claims abstract description 62
- 238000000034 method Methods 0.000 claims abstract description 31
- 230000002093 peripheral effect Effects 0.000 claims abstract description 17
- 239000003292 glue Substances 0.000 claims description 53
- 230000008569 process Effects 0.000 claims description 18
- 238000005538 encapsulation Methods 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- 238000005452 bending Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 230000002349 favourable effect Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 240000005528 Arctium lappa Species 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The embodiment of the invention discloses a display mother board and a preparation method of a display panel. The method comprises the following steps: an organic light emitting display array motherboard and a cover plate motherboard; the organic light emitting display array motherboard comprises a plurality of organic light emitting display panel areas, wherein each organic light emitting display panel area comprises a display area and a peripheral area; a plurality of glass cement packaging structures are arranged between the organic light-emitting display array mother board and the cover plate mother board; a glass cement connecting part is arranged between the glass cement packaging structures corresponding to the two adjacent organic light-emitting display panel areas; the adjacent glass cement packaging structures are connected with the glass cement connecting parts between the adjacent glass cement packaging structures into an integral structure; the cover plate mother board is provided with a plurality of shading strips; the vertical projection of the light shading strip on the cover plate mother board is positioned in the vertical projection of the glass cement connecting part on the cover plate mother board, and the vertical projection of the cutting line on the cover plate mother board is positioned in the vertical projection of the light shading strip on the cover plate mother board. By adopting the technical scheme, the frame of the display panel can be reduced.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a display mother board and a preparation method of a display panel.
Background
Organic light emitting display panels are widely used in various high performance display fields due to their advantages of high brightness, low power consumption, wide viewing angle, high response speed, wide temperature range, etc.
However, moisture and oxygen in the ambient environment seriously affect the life span of the organic light emitting display panel. Therefore, it is necessary to encapsulate the organic light emitting display panel. In the prior art, due to the existence of the packaging structure, the narrow frame design of the organic light-emitting display panel is not facilitated, and meanwhile, the utilization rate of a substrate of a display mother board is low.
Disclosure of Invention
In view of this, embodiments of the present invention provide a display mother board and a method for manufacturing a display panel, which are beneficial to reducing a frame of the display panel and improving a substrate utilization rate of the display mother board.
In a first aspect, an embodiment of the present invention provides a display motherboard, where the display motherboard includes: the organic light emitting display array mother board and the cover board mother board are oppositely arranged;
the organic light emitting display array motherboard comprises a plurality of organic light emitting display panel areas, and the plurality of organic light emitting display panel areas are arranged in an array manner; each organic light-emitting display panel area comprises a display area and a peripheral area positioned at the periphery of the display area; a plurality of glass cement packaging structures are arranged between the organic light-emitting display array mother board and the cover plate mother board; each glass cement packaging structure is positioned in the peripheral area and surrounds the display area;
a glass cement connecting part is arranged between the glass cement packaging structures corresponding to the two adjacent organic light-emitting display panel areas; the adjacent glass cement packaging structures are connected with the glass cement connecting parts between the adjacent glass cement packaging structures into an integral structure;
the cover plate mother board is provided with a plurality of shading strips; the plurality of light shading strips are positioned between the organic light-emitting display array mother board and the cover board mother board or on one side deviating from the organic light-emitting display array mother board; the vertical projection of the light shading strip on the cover plate mother board is positioned in the vertical projection of the glass cement connecting part on the cover plate mother board, and the vertical projection of the cutting line on the cover plate mother board is positioned in the vertical projection of the light shading strip on the cover plate mother board.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing a display panel, where the method for manufacturing a display panel includes:
providing an organic light emitting display array motherboard; the organic light emitting display array motherboard comprises a plurality of organic light emitting display panel areas, and the plurality of organic light emitting display panel areas are arranged in an array manner; each organic light-emitting display panel area comprises a display area and a peripheral area positioned at the periphery of the display area;
providing a cover plate mother board;
forming a plurality of light shading strips on one side of the cover plate mother plate, which is far away from the organic light-emitting display array mother plate, forming a plurality of glass cement packaging structures which are arranged in an array manner and forming glass cement connecting parts between the glass cement packaging structures corresponding to two adjacent organic light-emitting display panel areas on one side of the cover plate mother plate, which is far towards the organic light-emitting display array mother plate; or forming a plurality of light-shielding strips on one side of the cover plate mother plate facing the organic light-emitting display array mother plate, forming a plurality of glass cement packaging structures on one side of the light-shielding strips away from the cover plate mother plate and forming glass cement connecting parts between the glass cement packaging structures corresponding to two adjacent organic light-emitting display panel areas; each glass cement packaging structure is positioned in the peripheral area and surrounds the display area; the adjacent glass cement packaging structures are connected with the glass cement connecting parts between the adjacent glass cement packaging structures into an integral structure; the vertical projection of the shading strip on the cover plate mother board is positioned in the vertical projection of the glass cement connecting part on the cover plate mother board;
placing one side of the cover plate mother board provided with a plurality of glass cement packaging structures on the organic light-emitting display array mother board;
carrying out laser melting treatment on the glass cement packaging structure from one side of the cover plate mother board, which is far away from the organic light-emitting display array mother board;
and cutting the cover plate mother board and the organic light emitting display array mother board along cutting lines, wherein the cutting lines are positioned in the vertical projection of the light shielding bars on the cover plate mother board.
According to the display mother board and the preparation method of the display panel provided by the embodiment of the invention, the glass cement connecting parts between the glass cement packaging structures corresponding to the two adjacent organic light-emitting display panel areas and the adjacent glass cement packaging structures are connected into an integral structure, and the light shielding strips are arranged in the areas corresponding to the glass cement connecting parts on the cover board mother board, so that on one hand, laser beams in the areas corresponding to the glass cement connecting parts can be shielded by the light shielding strips, the glass cement connecting parts are prevented from melting, and therefore, the cutting is facilitated, and the problem that the cutting effect is influenced due to the fact that the stress is large during cutting after the glass cement connecting parts are melted and solidified is avoided because the glass cement connecting parts are in a non-solidified state; on the other hand, because the glass that two adjacent organic light emitting display panel district correspond glues packaging structure and adjacent glass glues the glass between the packaging structure and glue the connecting portion and connect structure as an organic whole, so, need not to set up glass for every organic light emitting display panel district alone and glue packaging structure, can avoid reserving certain region between line of cut and glass and glue packaging structure, make glass glue packaging structure coating influence the cutting in the position of line of cut when having process error when avoiding coating glass to glue packaging structure, can avoid cutting the problem that glass glues packaging structure and influence the encapsulation effect when having process volatility during the cutting simultaneously, be favorable to reducing display panel's frame, can improve the utilization ratio of the base plate in the display mother board simultaneously, realize solid row.
Drawings
FIG. 1 is a schematic diagram of a display motherboard according to the prior art;
FIG. 2 is a cross-sectional view taken along the direction QQ' in FIG. 1;
fig. 3 is a schematic structural diagram of a display motherboard according to an embodiment of the present invention;
FIG. 4 is a sectional view taken along the direction WW' in FIG. 3;
FIG. 5 is a schematic structural diagram of another display motherboard according to an embodiment of the present invention;
FIG. 6 is a cross-sectional view taken along ZZ' in FIG. 5;
FIG. 7 is a schematic structural diagram of another display motherboard according to an embodiment of the present invention;
FIG. 8 is a cross-sectional view taken along direction YY' in FIG. 7;
FIG. 9 is a schematic structural diagram of another display motherboard according to an embodiment of the present invention;
FIG. 10 is a schematic structural diagram of another display motherboard according to an embodiment of the present invention;
FIG. 11 is a schematic structural diagram of another display motherboard according to an embodiment of the present invention;
fig. 12 is an enlarged schematic view of the light-shielding bar of fig. 11;
fig. 13 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Fig. 1 is a schematic structural view of a display mother substrate in the related art, and fig. 2 is a cross-sectional view taken along a direction QQ 'in fig. 1, and as shown in fig. 1 and 2, the related display mother substrate includes an organic light emitting display array mother substrate 10' and a cover mother substrate 20 ', and further includes a plurality of organic light emitting display panel regions 30'. Coating glass cement 40 'on the cover mother board 20' corresponding to the peripheral area of each organic light emitting display panel area 30 ', matching the cover mother board 20' coated with the glass cement 40 'with the organic light emitting display array mother board 10', irradiating the glass cement 40 'by laser beams, melting the glass cement 40' by using the energy of the laser beams, bonding the organic light emitting display array mother board 10 'and the cover mother board 20' together after cooling the melted glass cement 40 ', and then cutting along the cutting line 50' to form a plurality of organic light emitting display panels. In the process of preparing the display mother board, the encapsulation of the organic light emitting display panel is completed by the melting of the glass paste 40'.
However, since a process error may occur during cutting and an error may also exist when the glass paste 40 ' is coated on the peripheral region of the cover mother board 20 ' corresponding to each organic light emitting display panel region 30 ', a certain region needs to be reserved during the preparation of the display mother board, that is, a certain distance a needs to be reserved between the cutting line 50 ' and the glass paste 40 ', so that the frame of the organic light emitting display panel is increased, and the utilization rate of the substrate in the display mother board is reduced.
Based on the above technical problem, an embodiment of the present invention provides a display motherboard and a method for manufacturing a display panel, where the display motherboard includes: the organic light emitting display array mother board and the cover board mother board are oppositely arranged; the organic light emitting display array motherboard comprises a plurality of organic light emitting display panel areas, and the plurality of organic light emitting display panel areas are arranged in an array manner; each organic light-emitting display panel area comprises a display area and a peripheral area positioned at the periphery of the display area; a plurality of glass cement packaging structures are arranged between the organic light-emitting display array mother board and the cover plate mother board; each glass cement packaging structure is positioned in the peripheral area and surrounds the display area; a glass cement connecting part is arranged between the glass cement packaging structures corresponding to the two adjacent organic light-emitting display panel areas; the adjacent glass cement packaging structures are connected with the glass cement connecting parts between the adjacent glass cement packaging structures into an integral structure; the cover plate mother board is provided with a plurality of shading strips; the plurality of light shading strips are positioned between the organic light-emitting display array mother board and the cover board mother board or on one side deviating from the organic light-emitting display array mother board; the vertical projection of the light shading strip on the cover plate mother board is positioned in the vertical projection of the glass cement connecting part on the cover plate mother board, and the vertical projection of the cutting line on the cover plate mother board is positioned in the vertical projection of the light shading strip on the cover plate mother board. By adopting the technical scheme, the glass cement connecting parts between the glass cement packaging structures corresponding to the two adjacent organic light-emitting display panel areas and the adjacent glass cement packaging structures are connected into an integral structure, and the light shielding strips are arranged in the areas corresponding to the glass cement connecting parts on the cover plate mother plate, so that on one hand, laser beams in the areas corresponding to the glass cement connecting parts can be shielded by the light shielding strips, and the glass cement connecting parts are prevented from melting, thereby being beneficial to cutting; on the other hand, because the glass that two adjacent organic light emitting display panel district correspond glues packaging structure and adjacent glass glues the glass between the packaging structure and glue the connecting portion and connect structure as an organic whole, so, need not to set up glass for every organic light emitting display panel district alone and glue packaging structure, can avoid reserving certain distance between line of cut and glass and glue packaging structure, there is technological error and make glass glue packaging structure coating influence the cutting in the position of line of cut when avoiding coating glass to glue packaging structure, the problem that there is technological fluctuation nature cutting glass to glue packaging structure and influence the encapsulation effect simultaneously can be avoided when cutting, be favorable to reducing display panel's frame, can improve the utilization ratio of the base plate in the display mother board simultaneously, realize solid matter.
The above is the core idea of the present invention, and the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without any creative work belong to the protection scope of the present invention.
Fig. 3 is a schematic structural diagram of a display motherboard according to an embodiment of the present invention, and fig. 4 is a cross-sectional view taken along a direction WW' in fig. 3, referring to fig. 3 and 4, the display motherboard includes: an organic light emitting display array mother board 10 and a cover mother board 20 which are oppositely arranged; the organic light emitting display array mother board 10 includes a plurality of organic light emitting display panel regions 30, the plurality of organic light emitting display panel regions 30 being arranged in an array; each organic light emitting display panel region 30 includes a display region AA and a peripheral region AB located at the periphery of the display region AA; a plurality of glass cement packaging structures 40 are arranged between the organic light emitting display array mother board 10 and the cover plate mother board 20; each glass adhesive packaging structure 40 is located in the peripheral area AB and surrounds the display area AA; a glass cement connecting part 41 is arranged between the glass cement packaging structures 40 corresponding to the two adjacent organic light-emitting display panel areas 30; the adjacent glass cement packaging structures 40 are connected with the glass cement connecting parts 41 between the adjacent glass cement packaging structures 40 into an integral structure; the cover plate mother plate 20 is provided with a plurality of light-shielding strips 60; the plurality of light-shielding strips 60 are positioned between the organic light-emitting display array mother board 10 and the cover board mother board 20 or on the side departing from the organic light-emitting display array mother board 10; the vertical projection of the light-shielding bars 60 on the cover mother board 20 is located within the vertical projection of the glass cement connection portions 41 on the cover mother board 20, and the vertical projection of the cutting lines 50 on the cover mother board 20 is located within the vertical projection of the light-shielding bars 60 on the cover mother board 20.
The glass cement connection parts 41 between the glass cement encapsulation structures 40 and the adjacent glass cement encapsulation structures 40 corresponding to the two adjacent organic light emitting display panel regions 30 in the display mother board provided by the embodiment of the invention are connected into an integral structure, because the adjacent glass cement packaging structures 40 and the glass cement connecting parts 41 between the adjacent glass cement packaging structures 40 are prepared together to form an integral structure in the preparation process, only one process error exists during preparation, i.e., a manufacturing error of the integrated structure between the adjacent two organic light emitting display panel regions 30, and if the glass paste encapsulation structure 40 is separately provided for each organic light emitting display panel region 30, not only a certain distance needs to be reserved for process errors existing during the coating of the glass cement packaging structure 40, but also a certain distance needs to be reserved for process fluctuation existing during cutting, so that the frame of the display panel is increased; meanwhile, when the distance is reserved, there may be a deviation, which causes the reserved distance between two adjacent organic light emitting display panel regions 30 to be different, thereby affecting the coating precision and further affecting the packaging effect. Therefore, the glass cement connecting parts 41 between the adjacent glass cement packaging structures 40 and the adjacent glass cement packaging structures 40 are prepared together to form an integral structure, so that a certain distance can be prevented from being reserved between the cutting line and the glass cement packaging structures 40, the reduction of the frame of the display panel is facilitated, the utilization rate of the substrates in the display mother board can be improved, and dense arrangement is realized.
Further, by arranging the light shielding bars 60 on the cover plate mother board 20 in the areas corresponding to the glass cement connecting parts 41, the light shielding bars 60 shield the laser beams in the areas corresponding to the glass cement connecting parts 41, so as to prevent the glass cement connecting parts 41 from melting, thereby facilitating cutting; and because glass glues connecting portion 41 and is the non-solidification state, avoided when glass glues connecting portion 41 melting solidification back, the stress during cutting is big and leads to the chimb, and then influences the problem of cutting effect.
It should be noted that the light shielding bar 60 may be disposed between the organic light emitting display array motherboard 10 and the cover board motherboard 20, or disposed on a side away from the organic light emitting display array motherboard 10, and this embodiment is not particularly limited as long as the light shielding bar 60 can shield the laser beam in the area corresponding to the glass cement connection portion 41 and prevent the glass cement connection portion 41 from melting, and fig. 3 and 4 are exemplarily illustrated only by disposing the light shielding bar 60 on the side of the cover board motherboard 20 away from the organic light emitting display array motherboard 10.
Optionally, a glass cement connecting part is arranged between the glass cement packaging structures corresponding to two adjacent organic light emitting display panel areas in the same row; or a glass cement connecting part is arranged between the glass cement packaging structures corresponding to two adjacent organic light-emitting display panel areas in the same column.
Illustratively, with continued reference to fig. 3 and 4, a glass paste connection portion 41 is disposed between the glass paste encapsulation structures corresponding to two adjacent organic light emitting display panel regions 30 in the same row. Specifically, because the glass between the adjacent glass glues packaging structure 40 and glues connecting portion 41 and form a body structure with the adjacent glass of same line, so on being in the line direction, need not to reserve certain distance between line of cut and glass glues packaging structure 40, be favorable to reducing display panel's left and right sides frame, can improve the utilization ratio of the base plate in the display mother board simultaneously, realize densely arranging.
For example, fig. 5 is a schematic structural diagram of another display mother board according to an embodiment of the present invention, fig. 6 is a cross-sectional view along ZZ' direction in fig. 5, and referring to fig. 5 and fig. 6, a glass paste connection portion 41 is disposed between glass paste encapsulation structures 40 corresponding to two adjacent organic light emitting display panel regions 30 in the same column. Specifically, because the glass between the adjacent glass glue packaging structure 40 and the adjacent glass glue packaging structure 40 of the same row glues connecting portion 41 and forms a body structure, so in the direction of being listed as, need not to reserve certain distance between line of cut and glass glue packaging structure 40, be favorable to reducing display panel's last frame, can improve the utilization ratio of the base plate in the display mother board simultaneously, realize closely arranging.
It can be understood that, since the lower frame of the display panel needs to reserve the binding region, only the glass cement connection portion 41 is disposed between the glass cement encapsulation structures 40 corresponding to the two organic light emitting display panel regions 30 in the same column. For example, referring to fig. 5 and 6, only the glass paste packaging structure 40 corresponding to the first organic light emitting display panel area 30 and the glass paste packaging structure 40 corresponding to the second organic light emitting display panel area 30 in the same column are provided with glass paste connection portions, the glass paste packaging structure 40 corresponding to the third organic light emitting display panel area 30 and the glass paste packaging structure 40 corresponding to the fourth organic light emitting display panel area 30 are provided with glass paste connection portions, that is, the bonding area in the first organic light emitting display panel area 30 and the bonding area 90 in the second organic light emitting display panel area 30 are arranged oppositely, and the bonding area in the third organic light emitting display panel area 30 and the bonding area 90 in the fourth organic light emitting display panel area 30 are arranged oppositely.
It is understood that other figures also include a binding region, but the other figures do not show a binding region in order to better embody the inventive aspects of the present application.
Alternatively, fig. 7 is a schematic structural diagram of another display mother board according to an embodiment of the present invention, fig. 8 is a cross-sectional view along the YY' direction in fig. 7, referring to fig. 7 and 8, a glass paste connection portion 41 includes a first sub glass paste connection portion 411 and a second sub glass paste connection portion 412; the light-shielding bars 60 include first sub light-shielding bars 61 and second sub light-shielding bars 62; a first sub-glass adhesive connecting part 411 is arranged between the glass adhesive packaging structures 40 corresponding to two adjacent organic light-emitting display panel areas 30 in the same row, and a second sub-glass adhesive connecting part 412 is arranged between the glass adhesive packaging structures 40 corresponding to two adjacent organic light-emitting display panel areas 30 in the same column; the first sub light shielding strips 61 extend in parallel to the array row direction, and the vertical projection on the cover plate mother board 20 is located in the vertical projection of the first sub glass cement connecting part 411 on the cover plate mother board 20; the second sub light-shielding strips 62 extend parallel to the array column direction, and the vertical projection on the motherboard cover plate 20 is located in the vertical projection of the second sub glass cement connecting part 412 on the motherboard cover plate 20.
Specifically, because the adjacent glass of same line glues packaging structure 40 and the adjacent glass glues first sub-glass between packaging structure 40 and glues connecting portion 411 and form a body structure, and simultaneously, the adjacent glass of same row glues packaging structure 40 and the adjacent glass glues second sub-glass between packaging structure 40 and glues connecting portion 412 and form a body structure, so in line direction and row direction, all need not to reserve certain distance between line of cut and glass and glues packaging structure 40, be favorable to reducing display panel frame all around, can improve the utilization ratio of the base plate in the display mother board simultaneously, realize densely arranging. Further, by arranging the first sub light-shielding strip 61 on the cover plate mother board 20 in the area corresponding to the first sub glass cement connection portion 411, the first sub light-shielding strip 61 shields the laser beam in the area corresponding to the first sub glass cement connection portion 411, and meanwhile, by arranging the second sub light-shielding strip 62 on the cover plate mother board 20 in the area corresponding to the second sub glass cement connection portion 412, the second sub light-shielding strip 62 shields the laser beam in the area corresponding to the second sub glass cement connection portion 412, the first sub glass cement connection portion 411 and the second sub glass cement connection portion 412 are prevented from being melted, thereby facilitating cutting; and because first sub glass glues connecting portion 411 and second sub glass and glues connecting portion 412 and be the non-solidification state, avoided when first sub glass glues connecting portion 411 and the second sub glass and glue the melting solidification back of connecting portion 412, stress during the cutting is big and leads to the chimb, and then influences the problem of cutting effect.
Optionally, fig. 9 is a schematic structural diagram of another display mother board according to an embodiment of the present invention, and referring to fig. 9, the organic light emitting display panel area 30 includes a special-shaped display panel area; the special-shaped display panel area comprises a circular display panel area 31; the included angle between the central axis L of the circular display panel area 31 and a straight line parallel to the array column direction is R, and R is more than or equal to 30 degrees and less than or equal to 60 degrees. Wherein, the central axis L through with circular display panel district 31 sets up to R with the contained angle of the parallel straight line of array row direction, R is not less than 30 ≤ R, and simultaneously, the glass that same row of adjacent glass glues packaging structure 40 and adjacent glass glues connecting portion 41 between packaging structure 40 and forms a body structure, the glass that same row of adjacent glass glues packaging structure 40 and adjacent glass glues between packaging structure 40 glues connecting portion 41 and forms a body structure, can further reduce display panel frame all around, can improve the utilization ratio of the base plate in the display mother board simultaneously, realize densely arranging.
Optionally, fig. 10 is a schematic structural diagram of another display mother board according to an embodiment of the present invention, and referring to fig. 10, each light-shielding bar 60 includes a plurality of discrete sub light-shielding bars 61, and a slit structure 62 is provided between any two adjacent sub light-shielding bars 61.
It is considered that when the light-shielding strip 60 is made of a metal material and has a unitary structure, electrostatic damage may be caused. In this embodiment, the slit structure 62 is disposed on the light-shielding strip 60, so that the light-shielding strip 60 is prevented from being damaged by electrostatic shock caused by a metal material and an integral structure.
Optionally, with continued reference to fig. 10, a second gap 70 is provided between two adjacent rows of glass cement encapsulation structures 40; the perpendicular projection of the scored structure 62 on the mother plate of the cover plate is located within the perpendicular projection of the second gap 70 on the mother plate of the cover plate.
Here, since each organic light emitting display panel region 30 includes a binding region, the second gap 70 may be a binding region.
Specifically, when the light shielding bar 60 is provided with the seam structure 62, when the glass cement encapsulation structure 40 is irradiated by the laser beam, the glass cement connection part 41 is irradiated by the seam structure 62, so that the glass cement connection part 41 corresponding to the seam structure 62 is melted and is not beneficial to cutting. In this embodiment, the notch structure 62 is disposed in the region corresponding to the second gap 70 between two adjacent rows of glass cement packaging structures 40, so that the electrostatic damage can be avoided, and the problem that the glass cement connecting portion 41 corresponding to the notch structure 62 is fused and is not beneficial to cutting can also be avoided.
Optionally, with continued reference to fig. 7 and 8, the glass paste connection portion 41 includes a first sub-glass paste connection portion 411 and a second sub-glass paste connection portion 412; a first sub-glass cement connecting part 411 is arranged between the glass cement packaging structures 40 corresponding to two adjacent organic light-emitting display panel areas 30 in the same row; a second sub-glass cement connecting part 412 is arranged between the glass cement packaging structures 40 corresponding to two adjacent organic light-emitting display panel areas 30 in the same column; the organic light emitting display panel region 30 includes a special-shaped display panel region; the special-shaped display panel area comprises a bending angle; a first gap 80 is formed between the bending angles of a plurality of adjacent special-shaped display panel areas; the perpendicular projection of the scored structure 62 on the cover plate platter lies within the perpendicular projection of the first gap 80 on the cover plate platter.
Wherein it is contemplated that when the organic light emitting display panel region 30 comprises a shaped display panel region; the irregular display panel area includes a bending angle, and if there is no gap between the bending angles of a plurality of adjacent irregular display panel areas, the moment in the bending angle area becomes large during cutting, and the stress becomes large, but the stress in the non-bending angle is different from the stress in the bending angle area, and the glass cement connection portion 41 is cracked due to uneven stress. Therefore, in the embodiment, the first gap 80 is formed between the bending angles of the plurality of adjacent special-shaped display panel regions, and the glass cement connecting part 41 is not arranged, so that the problem that the glass cement connecting part 41 in the region of the bending angle is cracked due to uneven stress and the packaging effect is influenced can be avoided.
In addition, by arranging the notch structure 62 in the area corresponding to the first gap 80 formed by the bending angles of a plurality of adjacent special-shaped display panel areas, electrostatic damage can be avoided.
Optionally, with continued reference to fig. 3, in the array row direction, the width of the gobos 60 is M1, and the panel cutting precision is M2, where M1 ≧ 2| M2 |.
Wherein, the cutting precision of the panel is more than or equal to 30 μ M and less than or equal to M2 and less than or equal to 60 μ M, and correspondingly, the width of the shading strip 60 is more than or equal to 60 μ M and less than or equal to M1 and less than or equal to 120 μ M.
Illustratively, the panel cutting precision M2 is 50 μ M, and correspondingly, the width M1 of the gobo 60 is 100 μ M. Specifically, the vertical projection of the cutting line 50 on the cover mother board 20 is located within the vertical projection of the light shielding bar 60 on the cover mother board 20. The width M1 of the light-shielding bar 60 is 100 μ M in consideration of process variability, i.e., when actually cutting, the cutting line 50 may be 50 μ M to the left or 50 μ M to the right.
In the embodiment, the width of the light-shielding strip 60 is set to be M1 along the array row direction, the panel cutting precision is M2, wherein M1 is equal to or greater than 2 × M2|, so that the problem that cutting is not facilitated due to process fluctuation that the cutting line during cutting does not cut the light-shielding strip 60 but cuts the area of the molten glass cement packaging structure 40 is avoided.
Optionally, the width of the light-shielding bars 60 along the array row direction is in the range of 60-120 μm.
In the embodiment, by setting the width range of the light-shielding bars 60 to 60-120 μm along the array row direction, the melting of the glass cement packaging structure 40 is not affected due to the too wide light-shielding bars 60, and when the width range is too narrow, the cutting line during cutting does not cut the light-shielding bars 60 but cuts the area of the glass cement packaging structure 40 which is already melted due to the process fluctuation, so that the problem that the packaging effect is affected by the cutting and the easy falling after cutting still exists.
Optionally, the display motherboard further includes a plurality of touch electrodes and touch electrode lines (not shown in the figure); the light-shielding bars 60 and the touch electrode lines are formed of the same material in the same process.
In the embodiment, the light-shielding bars 60 and the touch electrode lines are formed in the same process by adopting the same material, so that the process flow is reduced; meanwhile, when the light-shielding strip 60 and the touch electrode line are respectively disposed on different film layers, the light-shielding strip 60 and the touch electrode line in the embodiment are disposed on the same layer, so that the overall thickness of the display panel can be reduced.
Optionally, fig. 11 is a schematic structural diagram of another display mother board according to an embodiment of the present invention, and fig. 12 is an enlarged structural diagram of the light-shielding strip in fig. 11. Referring to fig. 11 and 12, on the side facing the display area AA, the edge of the light-shielding bar 60 forms a comb shape in a vertical projection of the plane on which the mother substrate of the cover plate is located.
In consideration of the possibility of diffraction occurring in the light-shielding bar 60, the glass paste connection portion 41 in the region corresponding to the light-shielding bar 60 is melted. This implementation is through the formation broach form with the edge of light shield strip 60 at the planar vertical projection of apron mother board place, so, can weaken the diffraction problem, avoided the solidification of the glass that light shield strip 60 corresponds to glue connecting portion 41 and cause and be unfavorable for cutting and the problem that the cutting back drops easily and influence the encapsulation effect.
Based on the same inventive concept, the embodiment of the invention also provides a preparation method of the display panel. Fig. 13 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention, and as shown in fig. 13, the method for manufacturing a display panel includes:
s110, providing an organic light-emitting display array mother board; the organic light emitting display array motherboard comprises a plurality of organic light emitting display panel areas, and the plurality of organic light emitting display panel areas are arranged in an array manner; each organic light emitting display panel region includes a display region and a peripheral region located at the periphery of the display region.
The organic light-emitting display array motherboard comprises a motherboard substrate, partial film layers in the display panels can be prepared in regions of the motherboard substrate corresponding to the organic light-emitting display panel, and a plurality of display panels can be obtained by cutting one display motherboard, so that the production efficiency is improved.
S120, providing a cover plate mother plate.
The material of the cover mother board may include glass, for example, to protect the display panel formed after cutting.
S130, forming a plurality of shading strips on one side of the cover plate mother plate, which is far away from the organic light-emitting display array mother plate, forming a plurality of glass cement packaging structures which are arranged in an array mode on one side of the cover plate mother plate, which is far towards the organic light-emitting display array mother plate, and forming glass cement connecting parts between the glass cement packaging structures corresponding to two adjacent organic light-emitting display panel areas; or forming a plurality of light-shielding strips on one side of the cover plate mother plate facing the organic light-emitting display array mother plate, forming a plurality of glass cement packaging structures on one side of the light-shielding strips away from the cover plate mother plate, and forming glass cement connecting parts between the glass cement packaging structures corresponding to two adjacent organic light-emitting display panel areas; each glass cement packaging structure is positioned in the peripheral area and surrounds the display area; the adjacent glass cement packaging structures are connected with the glass cement connecting parts between the adjacent glass cement packaging structures into an integral structure; the vertical projection of the shading strip on the cover plate mother board is positioned in the vertical projection of the glass cement connecting part on the cover plate mother board.
And S140, placing the side, provided with the plurality of glass cement packaging structures, of the cover plate mother board on the organic light-emitting display array mother board.
S150, carrying out laser melting treatment on the glass cement packaging structure from one side of the cover plate mother plate, which is far away from the organic light-emitting display array mother plate.
And S160, cutting the cover plate mother board and the organic light emitting display array mother board along cutting lines, wherein the cutting lines are positioned in the vertical projection of the light shading strips on the cover plate mother board.
This embodiment glues the packaging structure through the glass that adjacent glass glues between the packaging structure and the adjacent glass of in-process of preparation and glues connecting portion and prepare together and form a body structure, so need not to set up glass for every organic light emitting display panel district alone and glue the packaging structure, need not to reserve certain distance between line of cut and glass promptly between the packaging structure, there is technological error and make glass glue the packaging structure coating influence the cutting in the position of line of cut when avoiding coating glass to glue the packaging structure, there is the undulant cutting of technology to glass glue the packaging structure and influence the problem of encapsulation effect simultaneously when can avoiding cutting, be favorable to reducing display panel's frame, can improve the utilization ratio of the base plate in the display mother board simultaneously, realize close row. Furthermore, the area corresponding to the glass cement connecting part on the cover plate mother plate is provided with the shading strip, the laser beam corresponding to the area of the glass cement connecting part is shaded by the shading strip, and the glass cement connecting part is prevented from melting, so that the cutting is facilitated.
Optionally, a plurality of light-shielding strips are formed on one side of the cover plate mother board, which is away from the organic light-emitting display array mother board; or, a plurality of light-shielding strips are formed on one side of the cover plate mother board facing the organic light-emitting display array mother board, and the method further comprises the following steps: forming a plurality of touch electrode wires on the cover plate mother board; the shading strips and the touch electrode wires are formed in the same process by adopting the same material.
In the embodiment, the light-shielding bars and the touch electrode wires are formed in the same process by adopting the same material, so that the process flow is reduced; meanwhile, compared with the case that the light-shielding strip and the touch electrode wire are respectively arranged on different film layers, the light-shielding strip and the touch electrode wire in the embodiment are arranged on the same layer, so that the overall thickness of the display panel can be reduced.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (13)
1. A display motherboard, comprising: the organic light emitting display array mother board and the cover board mother board are oppositely arranged;
the organic light emitting display array motherboard comprises a plurality of organic light emitting display panel areas, and the plurality of organic light emitting display panel areas are arranged in an array manner; each organic light-emitting display panel area comprises a display area and a peripheral area positioned at the periphery of the display area; a plurality of glass cement packaging structures are arranged between the organic light-emitting display array mother board and the cover plate mother board; each glass cement packaging structure is positioned in the peripheral area and surrounds the display area;
a glass cement connecting part is arranged between the glass cement packaging structures corresponding to the two adjacent organic light-emitting display panel areas; the adjacent glass cement packaging structures are connected with the glass cement connecting parts between the adjacent glass cement packaging structures into an integral structure;
the cover plate mother board is provided with a plurality of shading strips; the plurality of light shading strips are positioned between the organic light-emitting display array mother board and the cover board mother board or on one side deviating from the organic light-emitting display array mother board; the vertical projection of the light shading strip on the cover plate mother board is positioned in the vertical projection of the glass cement connecting part on the cover plate mother board, and the vertical projection of the cutting line on the cover plate mother board is positioned in the vertical projection of the light shading strip on the cover plate mother board.
2. The display mother board according to claim 1, wherein the glass cement connection part is arranged between the glass cement encapsulation structures corresponding to two adjacent organic light emitting display panel areas in the same row; alternatively, the first and second electrodes may be,
and the glass cement connecting part is arranged between the glass cement packaging structures corresponding to two adjacent organic light-emitting display panel areas in the same column.
3. The display motherboard of claim 1, wherein the glass cement connection comprises a first sub-glass cement connection and a second sub-glass cement connection; the light-shielding bars comprise a first sub light-shielding bar and a second sub light-shielding bar;
the first sub-glass glue connecting part is arranged between the glass glue packaging structures corresponding to the two adjacent organic light-emitting display panel areas in the same row, and the second sub-glass glue connecting part is arranged between the glass glue packaging structures corresponding to the two adjacent organic light-emitting display panel areas in the same column;
the first sub shading strips extend in parallel to the array row direction, and the vertical projection of the first sub glass cement connecting part on the cover plate mother plate is positioned in the vertical projection of the first sub glass cement connecting part on the cover plate mother plate;
the second sub shading strips extend in parallel to the array column direction, and the vertical projection of the second sub glass cement connecting part on the cover plate mother plate is positioned in the vertical projection of the second sub glass cement connecting part on the cover plate mother plate.
4. The display mother board according to claim 1, wherein the organic light emitting display panel region includes a specially shaped display panel region;
the special-shaped display panel area comprises a circular display panel area; the included angle between the central axis of the circular display panel area and a straight line parallel to the array column direction is R, and R is more than or equal to 30 degrees and less than or equal to 60 degrees.
5. The display mother substrate according to claim 1, wherein each of the light-shielding bars comprises a plurality of discrete sub light-shielding bars, and a slit structure is provided between any two adjacent sub light-shielding bars.
6. The display motherboard of claim 5, wherein the glass cement connection comprises a first sub-glass cement connection and a second sub-glass cement connection; the first sub-glass cement connecting part is arranged between the glass cement packaging structures corresponding to two adjacent organic light-emitting display panel areas in the same row; the second sub-glass cement connecting part is arranged between the glass cement packaging structures corresponding to two adjacent organic light-emitting display panel areas in the same row;
the organic light emitting display panel region comprises a special-shaped display panel region;
the special-shaped display panel area comprises a bending angle; a first gap is formed between the bending angles of a plurality of adjacent special-shaped display panel areas; the vertical projection of the notch structure on the cover plate mother plate is positioned in the vertical projection of the first gap on the cover plate mother plate.
7. The display motherboard of claim 5, wherein there is a second gap between two adjacent rows of glass cement encapsulation structures; and the vertical projection of the notch structure on the cover plate mother plate is positioned in the vertical projection of the second gap on the cover plate mother plate.
8. The display mother board according to claim 1, wherein the width of the light-shielding bars in the array row direction is M1, and the panel cutting precision is M2, wherein M1 ≧ 2 × M2 |.
9. The display mother panel according to claim 1, wherein the width of the light-shielding bars in the array row direction is in a range of 60-120 μm.
10. The display motherboard of claim 1, further comprising a plurality of touch electrodes and touch electrode lines;
the shading strips and the touch electrode wires are formed in the same process by adopting the same material.
11. The display mother board according to claim 1, wherein the edge of the light shielding bar forms a comb shape in a vertical projection of a plane in which the cover mother board is located on a side facing the display area.
12. A method for manufacturing a display panel, comprising:
providing an organic light emitting display array motherboard; the organic light emitting display array motherboard comprises a plurality of organic light emitting display panel areas, and the plurality of organic light emitting display panel areas are arranged in an array manner; each organic light-emitting display panel area comprises a display area and a peripheral area positioned at the periphery of the display area;
providing a cover plate mother board;
forming a plurality of light shading strips on one side of the cover plate mother plate, which is far away from the organic light-emitting display array mother plate, forming a plurality of glass cement packaging structures which are arranged in an array manner and forming glass cement connecting parts between the glass cement packaging structures corresponding to two adjacent organic light-emitting display panel areas on one side of the cover plate mother plate, which is far towards the organic light-emitting display array mother plate; or forming a plurality of light-shielding strips on one side of the cover plate mother plate facing the organic light-emitting display array mother plate, forming a plurality of glass cement packaging structures on one side of the light-shielding strips away from the cover plate mother plate and forming glass cement connecting parts between the glass cement packaging structures corresponding to two adjacent organic light-emitting display panel areas; each glass cement packaging structure is positioned in the peripheral area and surrounds the display area; the adjacent glass cement packaging structures are connected with the glass cement connecting parts between the adjacent glass cement packaging structures into an integral structure; the vertical projection of the shading strip on the cover plate mother board is positioned in the vertical projection of the glass cement connecting part on the cover plate mother board;
placing one side of the cover plate mother board provided with a plurality of glass cement packaging structures on the organic light-emitting display array mother board;
carrying out laser melting treatment on the glass cement packaging structure from one side of the cover plate mother board, which is far away from the organic light-emitting display array mother board;
and cutting the cover plate mother board and the organic light emitting display array mother board along cutting lines, wherein the cutting lines are positioned in the vertical projection of the light shielding bars on the cover plate mother board.
13. The method of claim 12, wherein a plurality of light-shielding bars are formed on a side of the cover mother board facing away from the organic light-emitting display array mother board; or, a plurality of light shielding bars are formed on one side of the cover plate mother board facing the organic light emitting display array mother board, and the method further comprises the following steps: forming a plurality of touch electrode wires on the cover plate mother board;
the light-shielding strips and the touch electrode lines are formed in the same process by adopting the same material.
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| CN112967608A (en) * | 2021-02-26 | 2021-06-15 | 昆山国显光电有限公司 | Display device and electronic apparatus |
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Effective date of registration: 20211105 Address after: No.8, liufangyuan Henglu, Donghu New Technology Development Zone, Wuhan City, Hubei Province Applicant after: WUHAN TIANMA MICRO-ELECTRONICS Co.,Ltd. Applicant after: Wuhan Tianma Microelectronics Co.,Ltd. Shanghai Branch Address before: Room 509, building 1, No. 6111, Longdong Avenue, Pudong New Area, Shanghai, 200120 Applicant before: SHANGHAI TIANMA AM-OLED Co.,Ltd. |
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