CN103042302B - Heat transmit plate manufacturing method and heat transmit plate - Google Patents

Heat transmit plate manufacturing method and heat transmit plate Download PDF

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Publication number
CN103042302B
CN103042302B CN201210559581.3A CN201210559581A CN103042302B CN 103042302 B CN103042302 B CN 103042302B CN 201210559581 A CN201210559581 A CN 201210559581A CN 103042302 B CN103042302 B CN 103042302B
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China
Prior art keywords
thermal medium
lid component
medium pipe
cover slot
heat transfer
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CN201210559581.3A
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Chinese (zh)
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CN103042302A (en
Inventor
堀久司
濑尾伸城
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Nippon Light Metal Co Ltd
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Nippon Light Metal Co Ltd
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Priority claimed from JP2008131748A external-priority patent/JP5125760B2/en
Priority claimed from JP2008145997A external-priority patent/JP5071249B2/en
Application filed by Nippon Light Metal Co Ltd filed Critical Nippon Light Metal Co Ltd
Publication of CN103042302A publication Critical patent/CN103042302A/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
    • B23K20/1225—Particular aspects of welding with a non-consumable tool
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • F28F7/02—Blocks traversed by passages for heat-exchange media
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/14—Heat exchangers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/06—Fastening; Joining by welding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/06—Fastening; Joining by welding
    • F28F2275/062—Fastening; Joining by welding by impact pressure or friction welding

Abstract

Provided are a method for producing a heat exchanger plate with a small number of work steps, and a heat exchanger plate. A method for producing a heat exchanger plate comprises a step for inserting a pipe (16) for heating medium into a groove (8) formed on the bottom surface of a lid groove (6) opening to the front surface side of a base member (2), a step for inserting a lid member (10) into the lid groove (6) and making the lid member (10) abut against the bottom surface of the lid groove (6), and a bounding step for performing friction stir bonding by moving a rotary tool relatively to a pair of butting portions (V1, V2) facing the both sidewalls of the lid groove (6) and the both side surfaces of the lid member, respectively. The outside diameter at the shoulder of the rotary tool is the same as the width of the opening of a lid groove (6) or larger, and friction stirring is performed simultaneously for the pair of butting portions (V1, V2) by moving the rotary tool once in the bonding step.

Description

The manufacture method of heat transfer plate and heat transfer plate
Patent application of the present invention is international application no is PCT/JP2009/057069, international filing date is on April 6th, 2009, the application number entering National Phase in China is 200980118474.3, the divisional application of the application for a patent for invention that name is called " manufacture method of heat transfer plate and heat transfer plate ".
Technical field
The present invention relates to a kind of manufacture method and heat transfer plate of the heat transfer plate adopted in such as heat exchanger, firing equipment or cooling device etc.
Background technology
Basal component as this heat transfer plate main body will be passed in for the thermal medium pipe of the such as thermal medium such as high-temperature liquid or cooling water circulation, with formed with for carrying out heat exchange, the object of heating or cooling contacts or the heat transfer plate of adjacent configuration.
Figure 22 is the figure representing existing heat transfer plate (with reference to patent document 1), and Figure 22 (a) is stereogram, and Figure 22 (b) is side view.Existing heat transfer plate 100 comprises: basal component 102, and this basal component 102 has the groove 108 of the cover slot 106 towards the rectangular in cross-section of surface opening and the bottom surface upper shed in this cover slot 106; Insert the thermal medium pipe 116 of groove 108; And insert the cover plate 110 of cover slot 106.Implement friction-stir engage by the two sides of two side 105 and the cover plate 110 along cover slot 106 113,114 respective interfaces, form plastification region W 1, W 2.
Patent document 1: Japanese Patent Laid-Open 2004-314115 publication
Disclosure of an invention
Invent technical problem to be solved
But, because the two sides 113 of the two side 105 in existing heat transfer plate 100 pairs of cover slots 106 and cover plate 110,114 respective interfaces carry out at least two friction-stir, therefore there is flow chart and increase such problem.
From the point of view, technical problem of the present invention is to provide manufacture method and the heat transfer plate of the heat transfer plate that a kind of flow chart is few.
The technical scheme that technical solution problem adopts
The feature of the manufacture method of the heat transfer plate of the present invention solved the problems of the technologies described above is, comprise: thermal medium pipe inserts operation, insert in operation at this thermal medium pipe, thermal medium pipe is inserted in the groove on the bottom surface of the cover slot of the face side opening be formed at towards basal component, lid component inserts operation, inserts in operation, lid component is inserted above-mentioned cover slot, and above-mentioned lid component is abutted with the bottom surface of above-mentioned cover slot at this lid component, and bonding process, in this bonding process, the docking section making throw relative with the side of above-mentioned lid component relative to the sidewall of above-mentioned cover slot relatively moves to carry out friction-stir, the external diameter of the shoulder of above-mentioned throw is more than the width of the opening portion of above-mentioned cover slot, in above-mentioned bonding process, the state of plastic deformation is there is not with above-mentioned thermal medium pipe, above-mentioned throw is made to move once, thus friction-stir is carried out to the docking section of another side of a sidewall of above-mentioned cover slot and the docking section of a side of above-mentioned lid component and another sidewall of above-mentioned cover slot and above-mentioned lid component simultaneously.
According to above-mentioned manufacture method, be set to more than the width of the opening portion of cover slot by the external diameter of the shoulder by throw, as long as thus make throw move relative to a pair docking section once just friction-stir can be carried out.By this, the flow chart of bonding process can be reduced.
In addition, it is preferable that, be set to the distance of the bottom of above-mentioned lid component larger than the vertical height of above-mentioned thermal medium pipe from the bottom of above-mentioned groove.
According to above-mentioned manufacture method, because lid component and thermal medium separate with managing, the plastic deformation of thermal medium pipe therefore reliably can be prevented when carrying out friction-stir.
In addition, it is preferable that, the bottom of above-mentioned lid component is formed along the shape of above-mentioned thermal medium pipe, and makes it contact with above-mentioned thermal medium pipe.According to above-mentioned manufacture method, due to the cavity formed at thermal medium pipe periphery can be reduced, the heat conduction efficiency of heat transfer plate therefore can be improved.
In addition, it is preferable that, before above-mentioned lid component inserts operation, comprise filling work procedure, in above-mentioned filling work procedure, heat conductivity material is filled into the space surrounded by the outer peripheral face of above-mentioned groove and above-mentioned thermal medium pipe.In addition, it is preferable that, above-mentioned heat conductivity material is metal dust, metal dust thickener, sheet metal or low melting point wlding.
According to above-mentioned manufacture method, the generation in the cavity formed at thermal medium pipe periphery can not only be suppressed, can also utilize heat conductivity material that heat is transmitted efficiently.
In addition, it is preferable that, the maximum gauge of the stirring pin of above-mentioned throw is set to more than the width of above-mentioned cover slot.In addition, it is preferable that, the minimum diameter of the stirring pin of above-mentioned throw is set to more than the width of above-mentioned cover slot.
According to above-mentioned manufacture method, larger than the opening portion of cover slot by the size stirring pin is set to, as long as thus make throw move relative to a pair docking section once reliably to carry out friction-stir.
In addition, in above-mentioned bonding process, the scope (degree of depth) that Plastic Flow occurs is not limited, but in order to lid component is engaged more firmly with basal component, it is preferable that, the most deep in plastification region is set as the position of more than 1/3 of the gauge arriving downward above-mentioned lid component from the upper surface of above-mentioned lid component.More preferably, the most deep in plastification region is the position of more than 1/2 of the gauge arriving downward above-mentioned lid component from the upper surface of above-mentioned lid component.Ideal, the most deep in plastification region is set as the position of more than 2/3 of the gauge of downward above-mentioned lid component from the upper surface of above-mentioned lid component.
In addition, it is preferable that, after above-mentioned bonding process, comprise again: cap member inserts operation, inserting in operation in above-mentioned cap member, in the face side of above-mentioned basal component, the bottom surface of the cap member upper cover slot larger than above-mentioned cover slot with being formed as width being abutted; And cap member bonding process, in cap member bonding process, make throw along the docking section relative movement of the side of the sidewall of above-mentioned upper cover slot and above-mentioned cap member to carry out friction-stir.
According to above-mentioned manufacture method, by being configured with cap member again on lid component, thus thermal medium pipe can be formed in darker position.
In addition, in the manufacture method of heat transfer plate of the present invention, heat transfer plate has: basal component, and this basal component comprises towards face side opening and the large groove of the vertical height of depth ratio thermal medium pipe, thermal medium is managed, and this thermal medium pipe is inserted into above-mentioned groove, and lid component, this lid component covers above-mentioned thermal medium pipe, and it is characterized in that, the manufacture method of above-mentioned heat transfer plate comprises: thermal medium pipe inserts operation, inserts in operation, above-mentioned thermal medium pipe is inserted above-mentioned groove at above-mentioned thermal medium pipe, lid component inserts operation, inserts in operation, above-mentioned lid component is inserted the top of above-mentioned thermal medium pipe at above-mentioned lid component, and bonding process, in this bonding process, the docking section making throw relative with the side of above-mentioned lid component relative to the sidewall of above-mentioned groove relatively moves to carry out friction-stir, the external diameter of the shoulder of above-mentioned throw is more than the width of the opening portion of above-mentioned groove, in above-mentioned bonding process, the pressing force of above-mentioned throw is made to be passed to above-mentioned thermal medium pipe via above-mentioned lid component, with the state of above-mentioned thermal medium pipe generation plastic deformation, simultaneously to the docking section of a sidewall of above-mentioned groove and a side of above-mentioned lid component, and friction-stir is carried out in the docking section of another sidewall of above-mentioned groove and above-mentioned another side of lid component.
According to this manufacture method, because the external diameter of the shoulder of throw is larger than the width of groove, therefore, once moves with throw and just can carry out friction-stir to a pair docking section of lid component and basal component simultaneously, thus operation formality can be reduced.In addition, because the external diameter of the shoulder of throw is larger than the width of groove, therefore, the state that can be positioned at the top of thermal medium pipe with throw carries out friction-stir.By this, owing to making the pressing force of throw be passed to thermal medium pipe efficiently via lid component, thermal medium therefore can be made to manage and preferably plastic deformation to occur, thus the adhesion of groove and thermal medium pipe can be improved.
In addition, in the manufacture method of heat transfer plate of the present invention, heat transfer plate has: basal component, and this basal component comprises the cover slot towards face side opening and the bottom surface opening in above-mentioned cover slot and the little groove of the vertical height of depth ratio thermal medium pipe, thermal medium is managed, and this thermal medium pipe is inserted into above-mentioned groove, and lid component, this lid component covers above-mentioned thermal medium pipe, and it is characterized in that, the manufacture method of above-mentioned heat transfer plate comprises: thermal medium pipe inserts operation, inserts in operation, above-mentioned thermal medium pipe is inserted above-mentioned groove at thermal medium pipe, lid component inserts operation, inserts in operation, above-mentioned lid component is inserted the top of above-mentioned thermal medium pipe at lid component, and bonding process, in bonding process, the docking section making throw relative with the side of above-mentioned lid component relative to the sidewall of above-mentioned cover slot relatively moves to carry out friction-stir, the external diameter of the shoulder of above-mentioned throw is more than the width of the opening portion of above-mentioned cover slot, in above-mentioned bonding process, the pressing force of above-mentioned throw is made to be passed to above-mentioned thermal medium pipe via above-mentioned lid component, and with the state of above-mentioned thermal medium pipe generation plastic deformation, simultaneously to the docking section of a sidewall of above-mentioned cover slot and a side of above-mentioned lid component, and friction-stir is carried out in the docking section of another side of another sidewall of above-mentioned cover slot and above-mentioned lid component.
According to above-mentioned manufacture method, because the external diameter of the shoulder of throw is larger than the width of cover slot, therefore, once moves with throw and just can carry out friction-stir to a pair docking section of lid component and basal component simultaneously, thus operation formality can be reduced.In addition, because the external diameter of the shoulder of throw is larger than the width of cover slot, therefore, the state that can be positioned at the top of thermal medium pipe with throw carries out friction-stir.By this, owing to making the pressing force of throw be passed to thermal medium pipe efficiently via lid component, therefore, thermal medium can be made to manage and preferably plastic deformation to occur, thus the adhesion of groove and thermal medium pipe can be improved.
In addition, in above-mentioned bonding process, it is preferable that, the bottom surface of above-mentioned lid component and above-mentioned cover slot is abutted against.According to above-mentioned manufacture method, when being pressed into throw, because lid component abuts with the bottom surface of cover slot, thermal medium therefore can be prevented to manage and to be exceedingly out of shape.That is, the setting of the deflection of thermal medium pipe can easily be carried out.
In addition, in the manufacture method of heat transfer plate of the present invention, heat transfer plate has: basal component, and this basal component comprises the cover slot towards face side opening and the bottom surface opening in above-mentioned cover slot and the large groove of the vertical height of depth ratio thermal medium pipe, thermal medium is managed, and this thermal medium pipe is inserted into above-mentioned groove, and lid component, this lid component comprises the wide portion being inserted into above-mentioned cover slot and the narrow portion being inserted into above-mentioned groove, and it is preferable that, the manufacture method of above-mentioned heat transfer plate comprises: thermal medium pipe inserts operation, insert in operation at this thermal medium pipe, above-mentioned thermal medium pipe is inserted above-mentioned groove, lid component inserts operation, inserts in operation, above-mentioned lid component is inserted the top of above-mentioned thermal medium pipe at above-mentioned lid component, and bonding process, in bonding process, the docking section making throw relative with the side of above-mentioned lid component relative to the sidewall of above-mentioned cover slot relatively moves to carry out friction-stir, the external diameter of the shoulder of above-mentioned throw is more than the width of the opening portion of above-mentioned cover slot, in above-mentioned bonding process, the pressing force of above-mentioned throw is made to be passed to above-mentioned thermal medium pipe via the above-mentioned narrow width portions of above-mentioned lid component, with the state of above-mentioned thermal medium pipe generation plastic deformation, simultaneously to the docking section of a sidewall of above-mentioned cover slot and a side of above-mentioned lid component, and friction-stir is carried out in the docking section of another side of another sidewall of above-mentioned cover slot and above-mentioned lid component.
According to above-mentioned manufacture method, because the external diameter of the shoulder of throw is larger than the width of cover slot, therefore, once moves with throw and just can carry out friction-stir to a pair docking section of lid component and basal component simultaneously, thus operation formality can be reduced.In addition, because the external diameter of the shoulder of throw is larger than the width of cover slot, the state that therefore can be positioned at the top of thermal medium pipe with throw carries out friction-stir.By this, owing to making the pressing force of throw be passed to thermal medium pipe efficiently via lid component, thermal medium therefore can be made to manage and preferably plastic deformation to occur, thus the adhesion of groove and thermal medium pipe can be improved.
In addition, in above-mentioned bonding process, it is preferable that, the above-mentioned wide portion of above-mentioned lid component and the bottom surface of above-mentioned cover slot are abutted against.According to above-mentioned manufacture method, when being pressed into throw, because lid component abuts with the bottom surface of cover slot, thermal medium therefore can be prevented to manage and to be exceedingly out of shape.That is, the setting of the deflection of thermal medium pipe can easily be carried out.
In addition, in above-mentioned bonding process, it is preferable that, in the region surrounded by above-mentioned groove and above-mentioned lid component on the vertical cross section after above-mentioned bonding process, girth is set to more than the outer perimeter of above-mentioned thermal medium pipe.According to above-mentioned manufacture method, depressed deformation inside thermal medium Guan Chaoguan can be prevented.
In addition, in above-mentioned bonding process, it is preferable that, the height of the above-mentioned thermal medium pipe after above-mentioned bonding process sets more than 70% of the height of the above-mentioned thermal medium pipe before becoming above-mentioned bonding process.In addition, in above-mentioned bonding process, more preferably, the height of the above-mentioned thermal medium pipe after above-mentioned bonding process sets more than 80% of the height of the above-mentioned thermal medium pipe before becoming above-mentioned bonding process.According to above-mentioned manufacture method, thermal medium can be prevented to manage and exceedingly to flatten.
In addition, it is preferable that, the shape of the bottom of above-mentioned lid component along above-mentioned thermal medium pipe is formed, and makes it contact with above-mentioned thermal medium pipe.According to above-mentioned manufacture method, due to the cavity formed at thermal medium pipe periphery can be reduced, the heat conduction efficiency of heat transfer plate therefore can be improved.
In addition, it is preferable that, before above-mentioned lid component inserts operation, comprise filling work procedure, in above-mentioned filling work procedure, heat conductivity material is filled into the space surrounded by the outer peripheral face of above-mentioned groove and above-mentioned thermal medium pipe.In addition, above-mentioned heat conductivity material is the wlding of metal dust, metal dust thickener, sheet metal or low melting point.
According to above-mentioned manufacture method, the generation in the cavity formed at thermal medium pipe periphery can not only be suppressed, can also utilize heat conductivity material that heat is transmitted efficiently.
In addition, it is preferable that, the maximum gauge of the stirring pin of above-mentioned throw is set to more than the width of above-mentioned groove.In addition, it is preferable that, the minimum diameter of the stirring pin of above-mentioned throw is set to more than the width of above-mentioned groove.In addition, it is preferable that, the maximum gauge of the stirring pin of above-mentioned throw is set to more than the width of above-mentioned cover slot.In addition, it is preferable that, the minimum diameter of the stirring pin of above-mentioned throw is set to more than the width of above-mentioned cover slot.According to above-mentioned manufacture method, once move with throw and just can carry out friction-stir to a pair docking section more reliably.
In addition, in above-mentioned bonding process, the scope (degree of depth) that Plastic Flow occurs is not limited, but in order to lid component is engaged more firmly with basal component, it is preferable that, the most deep in plastification region is set as the position of more than 1/3 of the gauge arriving downward above-mentioned lid component from the upper surface of above-mentioned lid component, more preferably, the most deep in plastification region is set as the position of more than 1/2 of the gauge arriving downward above-mentioned lid component from the upper surface of above-mentioned lid component, ideal is, the most deep in plastification region is set as the position of more than 2/3 of the gauge arriving downward above-mentioned lid component from the upper surface of above-mentioned lid component.
In addition, after above-mentioned bonding process, also comprise: cap member inserts operation, inserting in operation in this cap member, in the face side of above-mentioned basal component, the bottom surface of the cap member upper cover slot larger than the width of above-mentioned groove with being formed as width being abutted; And cap member bonding process, in cap member bonding process, make throw along the docking section relative movement of the side of the sidewall of above-mentioned upper cover slot and above-mentioned cap member to carry out friction-stir.
In addition, after above-mentioned bonding process, also comprise: cap member inserts operation, inserting in operation in this cap member, in the face side of above-mentioned basal component, the bottom surface of the cap member upper cover slot larger than the width of above-mentioned groove with being formed as width being abutted; And cap member bonding process, in cap member bonding process, make throw along the docking section relative movement of the side of the sidewall of above-mentioned upper cover slot and above-mentioned cap member to carry out friction-stir.
According to above-mentioned manufacture method, by being configured with cap member again above lid component, thus thermal medium pipe can be formed in darker position.
In addition, heat transfer plate of the present invention, it comprises: basal component, and this basal component has the groove be formed at towards on the bottom surface of the cover slot of face side opening; Thermal medium is managed, and this thermal medium pipe is inserted into above-mentioned groove; And lid component, this lid component is inserted into above-mentioned cover slot, this heat transfer plate uses throw to carry out friction-stir joint to form, and can not plastic deformation be there is in above-mentioned thermal medium pipe, it is characterized in that, more than the width of above-mentioned cover slot is formed as to the width in the plastification region of that the docking section of a sidewall of above-mentioned cover slot and the docking section of a side of above-mentioned lid component and another sidewall of above-mentioned cover slot and above-mentioned another side of lid component is formed.
According to said structure, be set to more than the width of the opening portion of cover slot by the external diameter of the shoulder by throw, as long as thus make throw move relative to a pair docking section once just friction-stir can be carried out.By this, heat transfer plate can be manufactured with less flow chart.
In addition, it is preferable that, heat transfer of the present invention has: basal component, and the face side that this basal component is also included in above-mentioned basal component is formed and the width upper cover slot larger than above-mentioned cover slot; And cap member, this cap member is inserted into above-mentioned upper cover slot, and friction-stir is implemented in the docking section along the side of the sidewall of above-mentioned upper cover slot and above-mentioned cap member.
According to said structure, by being configured with cap member again above lid component, thus thermal medium pipe can be formed in darker position.
In addition, heat transfer plate of the present invention, comprising: basal component, and this basal component has towards face side opening and the large groove of the square height of vertical of depth ratio thermal medium pipe; Thermal medium is managed, and this thermal medium pipe is inserted into the bottom of above-mentioned groove; And lid component, this lid component covers the above-mentioned thermal medium pipe in above-mentioned groove, above-mentioned heat transfer plate is that above-mentioned basal component and above-mentioned lid component friction-stir joint form, and there is meeting plastic deformation in above-mentioned thermal medium pipe, it is characterized in that, to the docking section of another side of a sidewall of above-mentioned cover slot and the docking section of a side of above-mentioned lid component and another sidewall of above-mentioned cover slot and above-mentioned lid component and the width in the plastification region of formed is formed as more than the width of above-mentioned groove.
According to said structure, be set to more than the width of the opening portion of groove by the external diameter of the shoulder by throw, thus once move with throw and just can carry out friction-stir to a pair docking section of lid component and basal component simultaneously.By this, operation formality can be reduced.In addition, because the external diameter of the shoulder of throw is larger than the width of groove, the state that therefore can be positioned at the top of thermal medium pipe with throw carries out friction-stir.By this, owing to making the pressing force of throw be passed to thermal medium pipe efficiently via lid component, thermal medium therefore can be made to manage and to be out of shape preferably, thus improve the adhesion of groove and thermal medium pipe.
In addition, it is preferable that, have: basal component, the face side that this basal component is also included in above-mentioned basal component is formed and the width upper cover slot larger than above-mentioned groove; And cap member, this cap member is inserted into above-mentioned upper cover slot, and friction-stir is implemented in the docking section along the side of the sidewall of above-mentioned upper cover slot and above-mentioned cap member.
According to said structure, by being configured with cap member again above lid component, thus thermal medium pipe can be formed in darker position.
In addition, heat transfer plate of the present invention, comprising: basal component, and this basal component has bottom surface upper shed in the cover slot towards face side opening and the little groove of the height of the vertical of depth ratio thermal medium pipe; Thermal medium is managed, and this thermal medium pipe is inserted into above-mentioned groove; And lid component, this lid component covers the above-mentioned thermal medium pipe in above-mentioned groove, above-mentioned heat transfer plate is that above-mentioned basal component engages with above-mentioned lid component friction-stir and forms, and can plastic deformation be there is in above-mentioned thermal medium pipe, it is preferable that, to the docking section of another side of a sidewall of above-mentioned cover slot and the docking section of a side of above-mentioned lid component and another sidewall of above-mentioned cover slot and above-mentioned lid component and the width in the plastification region of formed is formed as more than the width of above-mentioned cover slot.
In addition, heat transfer plate of the present invention, has: basal component, and this basal component has bottom surface upper shed in the cover slot towards face side opening and the large groove of the height of the vertical of depth ratio thermal medium pipe; Thermal medium is managed, and this thermal medium pipe is inserted into above-mentioned groove; And lid component, this lid component comprises the wide portion being inserted into above-mentioned cover slot and the narrow portion being inserted into above-mentioned groove, above-mentioned heat transfer plate is that above-mentioned basal component engages with above-mentioned lid component friction-stir and forms, and can plastic deformation be there is in above-mentioned thermal medium pipe, it is preferable that, to the docking section of another side of a sidewall of above-mentioned cover slot and the docking section of a side of above-mentioned lid component and another sidewall of above-mentioned cover slot and above-mentioned lid component and the width in the plastification region of formed is formed as more than the width of above-mentioned cover slot.
According to said structure, be set to more than the width of the opening portion of groove by the external diameter of the shoulder by throw, thus once move with throw and just can carry out friction-stir to a pair docking section of lid component and basal component simultaneously.By this, operation formality can be reduced.In addition, because the external diameter of the shoulder of throw is larger than the width of groove, the state that therefore can be positioned at the top of thermal medium pipe with throw carries out friction-stir.By this, owing to making the pressing force of throw be passed to thermal medium pipe efficiently via lid component, thermal medium therefore can be made to manage and preferably plastic deformation to occur, thus can improve the adhesion of groove and thermal medium pipe.
In addition, it is preferable that, have: basal component, the face side that this basal component is also included in above-mentioned basal component is formed and the width upper cover slot larger than above-mentioned cover slot; And cap member, this cap member is inserted into above-mentioned upper cover slot, and friction-stir is implemented in the docking section along the side of the sidewall of above-mentioned upper cover slot and above-mentioned cover slot component.
According to said structure, by being configured with cap member again above lid component, thus thermal medium pipe can be formed in darker position.
Invention effect
According to the manufacture method of heat transfer plate of the present invention, heat transfer plate can be manufactured with less flow chart.
Accompanying drawing explanation
Fig. 1 is the stereogram of the heat transfer plate representing the first embodiment.
Fig. 2 (a) is the side view of the throw of the first embodiment and the decomposition side view of heat transfer plate, and Fig. 2 (b) is the schematic configuration view of the heat transfer plate of the first embodiment.
Fig. 3 is the side view of the manufacture method of the heat transfer plate representing the first embodiment, and Fig. 3 (a) represents that thermal medium pipe inserts operation, and Fig. 3 (b) represents that lid component inserts operation, and Fig. 3 (c) represents bonding process, and Fig. 3 (d) has represented figure.
Fig. 4 (a) is the side view of the throw of the second embodiment and the decomposition side view of heat transfer plate, and Fig. 4 (b) is the schematic configuration view of the heat transfer plate of the second embodiment.
Fig. 5 is the side view of the manufacture method of the heat transfer plate of the second embodiment, and Fig. 5 (a) represents bonding process, and Fig. 5 (b) has represented figure.
Fig. 6 (a) is the side view of throw and the decomposition side view of heat transfer plate of the 3rd embodiment, and Fig. 6 (b) is the schematic configuration view of the heat transfer plate of the 3rd embodiment.
Fig. 7 is the side view of the heat transfer plate representing the 3rd embodiment.
Fig. 8 is the decomposition side view of the heat transfer plate of the 4th embodiment.
Fig. 9 is the side view of the heat transfer plate representing the 4th embodiment.
Figure 10 is the figure of the heat transfer plate representing the 5th embodiment, and Figure 10 (a) is stereogram, and Figure 10 (b) is the X1-X1 line sectional view of Figure 10 (a).
Figure 11 (a) is the side view of throw and the decomposition side view of heat transfer plate of the 5th embodiment, and Figure 11 (b) is the schematic configuration view of the heat transfer plate of the 5th embodiment.
Figure 12 is the sectional view of the manufacture method of the heat transfer plate representing the 5th embodiment, and Figure 12 (a) represents that thermal medium pipe inserts operation, and Figure 12 (b) represents that lid component inserts operation, and Figure 12 (c) represents bonding process.
Figure 13 (a) represents that lid component inserts the schematic sectional view of operation, and Figure 13 (b) represents the sectional view crossing pressed state in bonding process, and Figure 13 (c) is schematic sectional view when representing that the 5th embodiment completes.
Figure 14 (a) is the side view of throw and the decomposition side view of heat transfer plate of the 6th embodiment, and Figure 14 (b) is the schematic configuration view of the 6th embodiment.
Figure 15 is the sectional view of the manufacture method of the heat transfer plate of the 6th embodiment, and Figure 15 (a) represents bonding process, and Figure 15 (b) has represented figure.
Figure 16 is schematic sectional view when representing that the 6th embodiment completes.
Figure 17 (a) is the side view of throw and the decomposition side view of heat transfer plate of the 7th embodiment, and Figure 17 (b) is the schematic configuration view of the 7th embodiment.
Figure 18 is the sectional view of the manufacture method of the heat transfer plate representing the 7th embodiment, and Figure 18 (a) represents that thermal medium pipe inserts operation, and Figure 18 (b) represents that lid component inserts operation, and Figure 18 (c) represents bonding process, and Figure 18 (d) has represented figure.
Figure 19 is schematic sectional view when representing that the 7th embodiment completes.
Figure 20 (a) is the decomposition side view of the heat transfer plate representing the 8th embodiment, and Figure 20 (b) is the sectional view of the heat transfer plate representing the 8th embodiment.
Figure 21 (a) is the decomposition side view of the heat transfer plate representing the 9th embodiment, and Figure 21 (b) is the sectional view of the heat transfer plate representing the 9th embodiment.
Figure 22 is the side view representing existing heat transfer plate.
(symbol description)
1 heat transfer plate;
2 basal components;
5a sidewall
5b sidewall
6 cover slots
6a bottom surface
8 grooves
10 lid components
13a side
13b side
16 thermal medium pipes
20 joint throws
22 shoulders (Japanese: ジ ヨ Le ダ portion)
26 stir pin
V docking section
W plastification region
Detailed description of the invention
[the first embodiment]
With reference to accompanying drawing, embodiments of the present invention are described in detail.As depicted in figs. 1 and 2, the heat transfer plate 1 of the first embodiment mainly comprises: the basal component 2 with the slab shape at surface 3 and the back side 4; Be configured in towards the lid component 10 in the cover slot 6 of surface 3 opening of basal component 2; And be inserted in the thermal medium pipe 16 of groove 8 of bottom surface 6a upper shed of cover slot 6, and above-mentioned heat transfer plate 1 is the plastification region W formed by being engaged by friction-stir 1be integrally formed.At this, " plastification region " comprise utilize the frictional heat of throw heat and be in the state of carrying out plastification and this two states of the state of getting back to normal temperature after being passed by throw.
As shown in Figure 2, basal component 2 plays the heat trnasfer of the thermal medium of flowing in thermal medium pipe 16 to outside effect or the effect playing the thermal medium extremely flowed in thermal medium pipe 16 by the heat trnasfer of outside.On the surface 3 of basal component 2, depression is provided with cover slot 6, and the concavity of the bottom surface 6a of groove 6 is provided with the width groove 8 less than cover slot 6.Cover slot 6 is the parts configured for lid component 10, and it is formed continuously on the length direction of whole basal component 2.The rectangular in cross-section of cover slot 6, and there is sidewall 5a, 5b of standing vertically from the bottom surface 6a of cover slot 6.
Groove 8 is parts that heating medium pipe 16 inserts, and it is formed continuously on the length direction of whole basal component 2.The groove of groove 8 to be cross sections of upper opening be U-shaped, is formed with the bottom 7 of cross section semicircular in shape in lower end.The width A of the opening portion of groove 8 is formed as roughly the same with the external diameter B of thermal medium pipe 16, and the degree of depth C of groove 8 is formed as larger than the external diameter B of thermal medium pipe 16.In addition, the width E of cover slot 6 is formed larger than the width A for groove 8, and the degree of depth J-shaped of cover slot 6 becomes roughly equal with the thickness F of lid component 10 described later.In addition, there is no particular restriction for the material of basal component 2, such as, formed by aluminium alloy (JIS:A6061).
As depicted in figs. 1 and 2, lid component 10 is formed by with the congener aluminium alloy of basal component 2, and it is formed with the square-section roughly the same with the cross section of the cover slot 6 of basal component 2, and has upper surface 11, lower surface 12, side 13a and side 13b.In addition, the thickness F of lid component 10 is formed as roughly equal with the degree of depth J of cover slot 6, and the width G of lid component 10 is formed as roughly equal with the width E of cover slot 6.
As shown in Fig. 2 (b), when lid component 10 is inserted cover slot 6, the lower surface 12 (bottom) of lid component 10 and the bottom surface 6a of cover slot 6 abut against.Side 13a, 13b of lid component 10 contact with sidewall 5a, 5b face of cover slot 6 or to separate small gap relative.At this, with the interface of a sidewall 5a of lid component 10 side 13a and cover slot 6 for docking section V 1.And with the interface of another sidewall 5b of another side 13b of lid component 10 and cover slot 6 for docking section V 2.In addition, docking section V 1with docking section V 2also docking section V can be only called.
As shown in Figure 2, thermal medium pipe 16 is the cylindrical duct with the rounded hollow bulb in cross section 18.The external diameter B of thermal medium pipe 16 is formed as roughly equal with the width A of groove 8, and as shown in Figure 1, the thermal medium Lower Half of pipe 16 contacts with 7, the bottom of groove 8.
Thermal medium pipe 16 makes the such as thermal medium such as high-temperature liquid, high-temperature gas in hollow bulb 18, circulate to make heat trnasfer to the component of basal component 2 and lid component 10, or make the such as thermal medium such as cooling fluid, refrigerating gas in hollow bulb 18, circulate the component that heat is passed out from basal component 2 and lid component 10.In addition, can also as making such as heater through to make the heat trnasfer that produced by heater be used to the component of basal component 2 and lid component 10 in the hollow bulb 18 of thermal medium pipe 16.
In addition, in the first embodiment, the cross section of thermal medium pipe 16 is rounded, but its cross section also can be square.In addition, thermal medium pipe 16 uses copper pipe in the first embodiment, but also can use the pipe of other material.
In addition, in the first embodiment, make the bottom 7 of groove 8 contact with the Lower Half face of thermal medium pipe 16 and the upper end of thermal medium pipe 16 is separated with the lower surface 12 of lid component 10, but be not limited to this.Such as, also the degree of depth C of groove 8 and external diameter B can be formed in the scope of B≤C < 1.2B.In addition, also the external diameter B of the width A of groove 8 and thermal medium pipe 16 can be formed in the scope of B≤A < 1.1B.
At this, as shown in Fig. 2 (b), the lower surface 12 of lid component 10 abuts with the bottom surface 6a of cover slot 6, and the degree of depth C of groove 8 is formed as larger than the external diameter B of thermal medium pipe 16.Therefore, after by the groove 8 of thermal medium with pipe 16 basement component 2, when lid component 10 is inserted cover slot 6, the spatial portion P surrounded by the periphery of groove 8, thermal medium pipe 16 and the lower surface 12 of lid component 10 can be formed, in spatial portion P, be filled with heat conductivity material described later.
As shown in Figure 1, plastification region W 1to docking section V 1, V 2region integrated after implementing a part of Plastic Flow of basal component 2 and lid component 10 when friction-stir engages.In the present embodiment, plastification region W 1the Breadth Maximum Wa width of 3 (surface) be formed as larger than the width E (with reference to Fig. 2 (a)) of cover slot 6.
In the present embodiment, plastification region W 1most deep be set to the substantial middle (degree of depth of the upside about 1/2 of lid component 10) arriving lid component 10, but plastification region W 1size also suitably can be set according to the size of the size of lid component 10 and throw described later, such as, plastification region W 1as long as most deep be set to the position of the upside about 2/3 ~ 1/3 reaching lid component 10.
Then, the manufacture method of Fig. 3 to heat transfer plate 1 is adopted to be described.Fig. 3 is the side view of the manufacture method of the heat transfer plate representing the first embodiment, Fig. 3 (a) represents that the thermal medium pipe inserting thermal medium pipe inserts operation, Fig. 3 (b) represents that lid component inserts operation, and Fig. 3 (c) represents bonding process, and Fig. 3 (d) has represented figure.
The manufacture method of the heat transfer plate of the first embodiment comprises: the preparatory process forming basal component 2; Thermal medium pipe 16 is inserted the thermal medium pipe be formed in the groove 8 of basal component 2 and inserts operation; Heat conductivity material 25 is filled into the filling work procedure on groove 8 and thermal medium pipe 16; Lid component lid component 10 being inserted cover slot 6 inserts operation; And make joint throw 20 move the bonding process of carrying out friction-stir joint along docking section V.
First, Fig. 2 (a) is adopted to be described the throw used in the friction-stir of bonding process.The joint throw 20 used in present embodiment is such as formed by tool steel, its there is columniform shoulder 22 and from the central part of the lower surface 24 of shoulder 22 with the sagging stirring pin 26 of the form of concentric shafts.Stir the taper that pin 26 is formed as diminishing towards front end in width, and length is L a.In addition, the side face stirring pin 26 can also be formed along its axial not shown multiple sulculus or screw channel radially.
In the present embodiment, the external diameter X of shoulder 22 1size be formed as the size of more than the width E of cover slot 6.By this, by making joint throw 20 along the mobile once left and right of lid component 10 (cover slot 6), just can simultaneously to docking section V 1, V 2carry out friction-stir.
In addition, in the present embodiment, docking described above is share throw 20 and is set, but such as also can stir base end part (the maximum outside diameter X of pin 26 2) be set as more than the width E of cover slot 6.In addition, such as, also leading section (the minimum outer diameter X of pin 26 will can be stirred 3) be set as more than the width E of cover slot 6.Like this, by the size of joint throw 20 is set significantly relative to width E, thus just can more reliably to docking section V with once moving 1, V 2carry out friction-stir.
(preparatory process)
First, with reference to Fig. 2 (a), utilize such as flush end milling (flat end mill) to process, slab component is formed cover slot 6.Then, on the bottom surface 6a of cover slot 6, utilize such as bulbous end Milling Machining and form the groove 8 with semi-circular cross-section.By this, the basal component 2 comprising cover slot 6 and the groove 8 in the bottom surface 6a upper shed of cover slot 6 is formed.Groove 8 comprises the bottom 7 of cross section semicircular in shape in Lower Half, and from the upper end of bottom 7 with fixed width opening upward.
In addition, in the present embodiment, basal component 2 is formed by machining, but also can use the extrudate of aluminium alloy.
(thermal medium pipe inserts operation)
Then, as shown in Fig. 3 (a), thermal medium pipe 16 is inserted groove 8.The thermal medium Lower Half of pipe 16 contacts with 7, the bottom of the Lower Half forming groove 8.
(filling work procedure)
Then, as shown in Fig. 3 (a), heat conductivity material 25 is filled into the part surrounded by groove 8 and thermal medium pipe 16.In filling work procedure, the bottom surface 6a of the upper surface and cover slot 6 that are filled to heat conductivity material 25 flushes.By heat conductivity material 25 being filled into space P (with reference to Fig. 2 (b)), thus not only spatial portion P being buried the heat conduction efficiency improving heat transfer plate 1, can also play and improve watertightness and bubble-tight effect.In the present embodiment, heat conductivity material 25 uses the low melting point wlding of known metal dust.In addition, as long as heat conductivity material 25 can bury the spatial portion P of heat transfer plate 1 to improve the material of heat transfer efficiency, can be metal dust thickener and sheet metal etc.
(lid component inserts operation)
Then, as shown in Figure 3 (b), by the cover slot 6 of lid component 10 basement component 2.Now, the lower surface 12 of lid component 10 abuts with the bottom surface 6a of cover slot 6, and the upper surface 11 of lid component 10 flushes with the surface 3 of basal component 2.In addition, docking section V can be formed by sidewall 5a, 5b of cover slot 6 and side 13a, 13b of lid component 10 1, V 2.
(bonding process)
Then, as shown in Figure 3 (c), joint throw 20 couples of docking section V (docking section V are used 1, V 2) carry out friction-stir.After being alignd with the center of the width of cover slot 6 at the center of joint throw 20, the lower surface 24 of the shoulder 22 of joint throw 20 is pressed into surface 3 prescribed depth of basal component 2, makes it along docking section V relative movement.
In the present embodiment, the rotating speed of joint throw 20 is such as 50 ~ 1500rpm, and transporting velocity is 0.05 ~ 2m/ minute, and the pressing force that the axis towards joint throw 20 applies is 1kN ~ 20kN.
As shown in Fig. 3 (d), on the surface 3 of basal component 2, form plastification region W by bonding process 1.In the present embodiment, the length that pin 26 is stirred in setting and the intrusion etc. engaged with throw 20, to make plastification region W 1most deep arrive the substantial middle of lid component 10.In addition, by docking section V 1, V 2in plastification region W 1degree of depth Wb be set as about 1/4 of the thickness of lid component 10.By by docking section V 1, V 2in plastification region W 1degree of depth Wb set larger, thus the engaging force of basal component 2 and lid component 10 can be improved.
In addition, plastification region W 1size (degree of depth), engage and just illustrate by the shape of throw 20 and rotating speed or intrusion etc., be not limited, suitably set according to the material of basal component 2 and lid component 10.
As mentioned above, the manufacture method of heat transfer plate according to the present embodiment, due to the joint external diameter X of the shoulder 22 of throw 20 1be set to larger than the width E of cover slot 6, if therefore make joint throw 20 along the width of lid component 10 central mobile once, just can simultaneously to docking section V 1, V 2carry out friction-stir, and by friction-stir, basal component 2 is integrated with lid component 10.
In addition, abutting with the bottom surface 6a of cover slot 6 due to the lower surface 12 of lid component 10 and thermal medium pipe 16 is separated with lid component 10, even if be therefore pressed into joint throw 20 from the upper surface 11 of lid component 10, thermal medium pipe 16 also can not flatten.By this, the stream of thermal medium pipe 16 can reliably be guaranteed.In addition, by increasing the height on the above-below direction of cover slot 6 and lid component 10, thus thermal medium pipe 16 can be configured in the comparatively deep location of basal component 2.
In addition, by heat-conducting substance 25 being filled into (with reference to Fig. 2 (b)) in the spatial portion P that is formed at around thermal medium pipe 16, thus the heat from thermal medium can be transmitted efficiently.In addition, buried by the spatial portion P that may be formed at heat transfer plate 1 inside, thus air-tightness and the watertightness of heat transfer plate 1 can be improved.
In addition, in the present embodiment, bonding process is carried out under the state of separating at thermal medium pipe 16 and lid component 10, but be not limited thereto, and carries out bonding process under the state that also can contact with lid component 10 at thermal medium pipe 16.
[the second embodiment]
Then, the heat transfer plate of second embodiment of the invention and the manufacture method of heat transfer plate are described.
As shown in Figure 4, the heat transfer plate of the second embodiment is different from the first embodiment on this aspect roughly T-shaped in the cross section of lid component 30.In addition, to the part repeated with the first embodiment, the description thereof will be omitted.
As shown in Figure 4 (a), on the surface 33 of basal component 32, depression is provided with cover slot 36, and the concavity of the bottom surface 36a of cover slot 36 is provided with the width groove 38 less than cover slot 36.Cover slot 36 is the parts configured for lid component 30, and it is formed continuously on the length direction of whole basal component 32.The rectangular in cross-section of cover slot 36, and comprise sidewall 35a, 35b of standing vertically from the bottom surface 36a of cover slot 36.The width e of cover slot 36 is formed as the width g with lid component 30 described later 1roughly equal, the degree of depth j of cover slot 36 is formed as the degree of depth f with lid component 30 1roughly equal.
Groove 38 is parts that heating medium pipe 16 and lid component 30 insert, and it is formed continuously on the length direction of whole basal component 32.The groove of groove 38 to be cross sections of upper opening be U-shaped, in the bottom 37 of lower end Formation cross-section semicircular in shape.The width A of groove 38 is formed as roughly equal with the external diameter B of thermal medium pipe 16.
As shown in Figure 4 (a), lid component 30 is inserted into the cover slot 36 of basal component 32 and the component of groove 38, and it has and is formed as the larger wide portion of width 41 and is formed as the width narrow portion 42 less than wide portion 41.Wide portion 41 has upper surface 43, lower surface 44, side 43a, 43b.The width g in wide portion 41 1be formed as roughly equal with the width e of cover slot 36, thickness f 1be formed as roughly equal with the degree of depth j of cover slot 36.
The central authorities of the narrow portion 42 leniently lower surface 44 in portion 41 extend downward.The width g of narrow portion 42 2be formed as roughly equal with the width A of groove 38.
As shown in Figure 4 (b), when lid component 30 is inserted cover slot 36, the lower surface 44 in the wide portion 41 of lid component 30 abuts with the bottom surface 36a of cover slot 36.Side 43a, the 43b in wide portion 41 contact with sidewall 35a, 35b face of cover slot 36 or to separate small gap relative.At this, with the interface of a sidewall 35a of lid component 30 side 43a and cover slot 36 for docking section V 3.And with the interface of another sidewall 35b of another side 43b of lid component 30 and cover slot 36 for docking section V 4.In addition, docking section V 3with docking section V 4also docking section V can be only called.
In addition, when lid component 30 is inserted cover slot 36, the two sides of the narrow portion 42 of lid component 30 and the both sides plane-plane contact of groove 38 or to separate small gap relative.The thickness f of narrow portion 42 2be formed as less than the degree of depth c of groove 38 with the external diameter B sum of thermal medium pipe 16.In other words, as shown in Figure 4 (b), the distance of the lower surface 45 of the narrow portion 42 from the bottom 37 of groove 38 to lid component 30 is larger than the external diameter B of thermal medium pipe 16.Therefore, as shown in Figure 4 (b), when lid component 30 is inserted cover slot 36, the upper end of thermal medium pipe 16 separates with the lower surface 45 of narrow portion 42 with separating predetermined distance.
By this, after by the groove 38 of thermal medium with pipe 16 basement component 32, when lid component 30 is inserted cover slot 36, the spatial portion P1 formed by the periphery of groove 38, thermal medium pipe 16 and the lower surface 45 of lid component 30 can be formed.Heat conductivity material is filled with in spatial portion P1.
Then, the manufacture method of Fig. 5 to the heat transfer plate 49 of the second embodiment is adopted to be described.Fig. 5 (a) be the figure of the bonding process representing the second embodiment, Fig. 5 (b) represent the second embodiment complete figure.
The manufacture method of the heat transfer plate of the second embodiment comprises: the preparatory process forming basal component 32; Thermal medium pipe 16 is inserted the thermal medium pipe be formed in the groove 38 of basal component 32 and inserts operation; Heat conductivity material 25 is filled into the filling work procedure on groove 38 and thermal medium pipe 16; Lid component lid component 30 being inserted cover slot 36 inserts operation; And make joint throw 20 move to carry out the bonding process of friction-stir joint along docking section V.
In addition, due to the preparatory process of the manufacture method of the heat transfer plate of the second embodiment, that thermal medium pipe inserts operation is roughly the same with the first embodiment, and thus the description thereof will be omitted.
(filling work procedure)
As shown in Fig. 5 (a), heat conductivity material 25 is filled into the part surrounded by groove 8 and thermal medium pipe 16.In the present embodiment, the heat conductivity material 25 of specific thickness is filled in the part surrounded at the lower surface 45 by thermal medium pipe 16, groove 38 and lid component 30.
(lid component inserts operation)
With reference to Fig. 4, insert in operation, by the cover slot 36 of lid component 30 basement component 32 at lid component.Now, the lower surface 44 in the wide portion 41 of lid component 30 abuts with the bottom surface 36a of cover slot 36, and the upper surface 43 in wide portion 41 flushes with the surface 3 of basal component 32.In addition, the lower surface 45 of narrow portion 42 abuts with heat conductivity material 25.
(bonding process)
In bonding process, as shown in Fig. 5 (a) He Fig. 5 (b), use joint throw 20 couples of docking section V 1, V 2carry out friction-stir.That is, after being alignd with the center of cover slot 36 at the center of joint throw 20, the lower surface 24 of the shoulder 22 of joint throw 20 is pressed into surface 3 prescribed depth of basal component 32, makes it along docking section V relative movement.
According to the manufacture method of the heat transfer plate of present embodiment discussed above, due to the joint external diameter X of the shoulder 22 of throw 20 1be set to larger than the width e of cover slot 36, therefore, as long as make joint rotating member 20 along the central mobile on the width of lid component 30 once, just can simultaneously to docking section V 3, V 4carry out friction-stir, and by friction-stir, basal component 32 is integrated with lid component 30.That is, the plastification region W formed by bonding process 2breadth Maximum be formed as larger than the width e of cover slot 36.
In addition, because the lower surface 44 in the wide portion 41 of lid component 30 abuts with the bottom surface 36a of cover slot 36, the lower surface 45 of narrow portion 42 and thermal medium pipe 16 separate, therefore, even if be pressed into joint throw 20 from the upper surface 43 of lid component 30, thermal medium pipe 16 also can not flatten.By this, the stream of thermal medium pipe 16 can reliably be guaranteed.In addition, by setting longer by the length (degree of depth) of the narrow portion 42 of lid component 30 and groove 38, thus thermal medium pipe 16 can be configured in darker position.
[the 3rd embodiment]
Then, the manufacture method of the heat transfer plate of third embodiment of the invention is explained.
As shown in Figure 6 (a), the manufacture method of the heat transfer plate of the 3rd embodiment in the bottom of lid component 50 is shape along thermal medium pipe 16 and is formed on this aspect different from the first embodiment.In addition, to the part repeated with the first embodiment, the description thereof will be omitted.
As shown in Figure 6 (a), the lid component 50 of the 3rd embodiment is the component of the cover slot 6 of basement component 2 and a part for groove 8, and it has and is formed as the larger wide portion 51 of width and is formed as the width narrow portion 52 less than wide portion 51.Wide portion 51 has upper surface 53, lower surface 55, side 54a, 54b.The width G in wide portion 51 is formed as roughly equal with the width E of cover slot 6, and thickness F is formed as generally equal with the degree of depth J of cover slot 6.The central authorities of the narrow portion 52 leniently lower surface 55 in portion 51 extend downward.Formed in the bottom of narrow portion 52 and there is the pars convoluta 56 with the external diameter B same curvature of thermal medium pipe 16.The width G 1 of narrow portion 52 is formed as roughly equal with the width A of groove 8.
As shown in Figure 6 (b), when lid component 50 is inserted cover slot 6, the lower surface 55 in the wide portion 51 of lid component 50 abuts with the bottom surface 6a of cover slot 6 and the pars convoluta 56 of narrow portion 52 abuts with thermal medium pipe 16.That is, as shown in Fig. 2 (b), when the lower surface 12 of lid component 10 is smooth, spatial portion P can be formed, but by making the lower end of lid component 10 copy the external diameter B of thermal medium pipe 16 to be formed as the 3rd embodiment, thus thermal medium pipe 16 periphery seal can be made.
In addition, the manufacture method of the heat transfer plate of the 3rd embodiment, due to all identical with the first embodiment except not comprising except filling work procedure, thus omits its detailed description.
According to the manufacture method of the heat transfer plate of the 3rd embodiment, as shown in Figure 7, because the lower surface 55 in the wide portion 51 of lid component 50 abuts with the bottom surface 6a of cover slot 6, therefore, even if be pressed into joint throw 20 to carry out friction-stir from the upper surface 53 of lid component 50, thermal medium pipe 16 also can not flatten.In addition, because the bottom of lid component 50 is formed along the shape of the periphery of thermal medium pipe 16, the generation in space can therefore be prevented.By this, the heat conduction efficiency of heat transfer plate 61 can be improved.
And in the present embodiment, the cross sectional shape of the bottom of narrow portion 52 copies the periphery of thermal medium pipe 16 to form circular arc, but when the cross sectional shape of thermal medium pipe is other shape, this shape also can be copied to form the shape of narrow portion 52.
[the 4th embodiment]
Then, the heat transfer plate of the 4th embodiment and the manufacture method of heat transfer plate are described.Fig. 8 is the decomposition side view of the heat transfer plate representing the 4th embodiment.Fig. 9 is the side view of the heat transfer plate representing the 4th embodiment.
The heat transfer plate 81 of the 4th embodiment shown in Fig. 8 with Fig. 9 includes the structure roughly the same with the heat transfer plate 1 (with reference to Fig. 1) of the first embodiment, is also configured with cap member 70 engages on this aspect different from the first embodiment to implement friction-stir joint in the face side of lid component 10.
In addition, below to the structure identical with above-mentioned heat transfer plate 1 also referred to as lower cover portion M.In addition, the component repeated for the heat transfer plate 1 with the first embodiment marks same-sign and the repetitive description thereof will be omitted.
As can be seen from figures 8 and 9, heat transfer plate 81 has basal component 62, insert the thermal medium pipe 16 of groove 8, lid component 10 and be configured at the cap member 70 of face side of lid component 10, and this heat transfer plate 81 is at plastification region W 1, plastification region W 4, W 5engaged by friction-stir and form integration.
As shown in Figure 8 and Figure 9, basal component 62 is such as made up of aluminium alloy, and it has on the surface 63 of basal component 62: the upper cover slot 64 formed on whole length direction; The cover slot 6 that the whole length direction of the bottom surface 66 of upper cover slot 64 is formed continuously; And the groove 8 formed on the whole length direction of the bottom surface of cover slot 6.The rectangular in cross-section of upper cover slot 64, and there is sidewall 65a, 65b of standing vertically from bottom surface 66.The width of upper cover slot 64 is formed as larger than the width of cover slot 6.
As shown in Figure 8, thermal medium pipe 16 is inserted in the groove 8 being formed at basal component 62 bottom, and clogs with lid component 10, is engaged and at plastification region W by friction-stir 1engage.That is, the lower cover portion M being formed at basal component 62 inside is formed in the mode that the heat transfer plate 1 with the first embodiment is roughly the same.
In addition, the bottom surface 66 of upper cover slot 64 may produce step and burr because carrying out friction-stir joint.Therefore, it is preferable that, with such as plastification region W 1surface be benchmark, face machining is implemented to the bottom surface 66 of upper cover slot 64 and is formed smoothly.By this, the seamless unoccupied place, bottom surface 66 of the upper cover slot 64 after the lower surface 72 of cap member 70 being cut with face configures.
As shown in Figure 8 and Figure 9, cap member 70 is such as made up of aluminium alloy, and it is formed with the square-section roughly the same with the cross section of upper cover slot 64, and has the side 73a and side 73b that are vertically formed from lower surface 72.Cap member 70 is inserted into cover slot 64.That is, side 73a, 73b of cap member 70 contact with sidewall 65a, 65b face of upper cover slot 64 or separate small gap configuration.At this, with the interface of the sidewall 65a of a side 73a and for docking section, upside V 5.And with the interface of another side 73b and another sidewall 65b for docking section, upside V 6.Upside docking section V 5, V 6to be engaged by friction-stir and at plastification region W 4, W 5integration.
The manufacture method of heat transfer plate 81 comprises: utilize the manufacture method identical with heat transfer plate 1 after lower cover portion M is formed at the bottom of basal component 62, the bottom surface 66 of upper cover slot 64 is carried out to the face cutting process of face cutting; Operation is inserted to the cap member that cap member 70 is configured; And along docking section, upside V 5, V 6implement the cap member bonding process that friction-stir engages.
(face cutting process)
In the cutting process of face, remove step (groove) on the bottom surface 66 being formed at upper cover slot 64 and burr by cutting, thus make bottom surface 66 level and smooth.
(cap member insertion operation)
Insert in operation in cap member, cap member 70 is configured at the bottom surface of upper cover slot 64.By carrying out face cutting process, the lower surface 72 of cap member 70 can be configured with the seamless unoccupied place, bottom surface of upper cover slot 64.
(cap member bonding process)
In cap member bonding process, make joint throw (not shown) along docking section, upside V 5, V 6mobile to implement friction-stir joint.As long as the intrusion of the joint throw in cap member bonding process considers the length of the stirring pin of this joint throw and the thickness F of cap member 70 ' and suitably set.In addition, in cap member bonding process, also can adopt the joint throw 20 that the first embodiment uses.
According to the heat transfer plate 81 in embodiment, above lower cover portion M, be configured with cap member 70 again, thus make thermal medium pipe 16 be configured in darker position by implementing friction-stir joint.
In addition, in the 4th embodiment, friction-stir is carried out to the two sides of cap member 70 and forms two plastification region W 4, W 5, but be not limited thereto.Such as, the groove width of upper cover slot 64 can also be formed as the external diameter X of the shoulder 22 than joint throw 20 (with reference to Fig. 4 (a)) 1little, and use joint throw 20 pairs of cap member 70 to carry out the friction-stir of.By this, twists and turns needed for bonding process can be reduced.
Then, suitably with reference to accompanying drawing, the heat transfer plate of the 5th embodiment to the 9th embodiment is described in detail.5th embodiment is different from the first embodiment on this aspect of thermal medium pipe generation plastic deformation to the heat transfer plate of the 9th embodiment.That is, thermal medium pipe, is pressed into by lid component to the 9th embodiment when carrying out bonding process by the 5th embodiment, thus makes the plastic deformation of thermal medium pipe carry out friction-stir joint.
[the 5th embodiment]
As shown in Figure 10 and Figure 11, the heat transfer plate 101 of the 5th embodiment mainly comprises: the basal component 2 possessing the groove 8 towards surperficial 3 openings; Insert the thermal medium pipe 16 of groove 8; And insert the lid component 10 of groove 8, and the plastification region W that above-mentioned heat transfer plate 101 is formed by being engaged by friction-stir 1be integrally formed.As shown in Figure 10 (b), the thermal medium pipe 16 of heat transfer plate 101 is being occurred on this aspect of plastic deformation different from the first embodiment by flattening from top.
As shown in figure 11, basal component 2 plays by the heat trnasfer of the thermal medium of flowing in thermal medium pipe 16 to outside effect, or plays the effect of the thermal medium extremely flowed in thermal medium pipe 16 by the heat trnasfer of outside.On the surface 3 of basal component 2, depression is provided with the groove 8 opened wide upward.
Groove 8 is parts that heating medium pipe 16 inserts, and it is formed continuously on the length direction of whole basal component 2.The groove of groove 8 to be cross sections of upper opening be U-shaped, and have in lower end the bottom 7 that is made up of the curved surface formed with certain curvature and with bottom 7 continuously and separate sidewall 8a, 8b of one fixed width.
The width A (distance between sidewall 8a, sidewall 8b) of groove 8 is formed as larger than the external diameter B1 of thermal medium pipe 16, and the degree of depth C of groove 8 is formed as larger than the external diameter B1 of thermal medium pipe 16.In addition, the curvature of bottom 7 is formed as less than the curvature of the periphery of thermal medium pipe 16.Basal component 2 is such as formed by aluminium alloy (JIS:A6061).
Thermal medium pipe 16 makes the such as thermal medium such as high-temperature liquid, high-temperature gas in hollow bulb 18, circulate to make heat trnasfer to the component of basal component 2 and lid component 10, or make the such as thermal medium such as cooling fluid, refrigerating gas in hollow bulb 18, circulate the component that heat is passed out from basal component 2 and lid component 10.
As shown in figure 11, thermal medium pipe 16 is rounded in bonding process starting section, but as shown in Figure 10 (b), is crushed and along the shape generation plastic deformation of groove 8 and lid component 10 in bonding process.The flattening situation of thermal medium pipe 16 after described.
In addition, at thermal medium, with the thermal medium flowed in pipe 16, there is no particular restriction, such as, also can pass to be used by the component of the heat trnasfer produced by heater to basal component 2 and lid component 10 as making in the hollow bulb 18 of thermal medium pipe 16 heater.
In addition, in the present embodiment, the shape of the thermal medium pipe 16 before bonding process is circular, but there is no particular restriction, also can be ellipsoidal cross section or cross section is square.In addition, in the present embodiment, thermal medium pipe 16 uses copper pipe, but also can use the pipe of other material.In addition, before bonding process, as long as the size of the external diameter B1 of the width A of groove 8 and thermal medium pipe 16 suitably sets in the scope of B1 < A < 1.41B1.
As shown in Figure 10 and Figure 11, lid component 10 is the components inserting groove 8, its rectangular in cross-section, and has upper surface 11, lower surface 12, side 13a and side 13b.Lid component 10 is formed by with the congener aluminium alloy of basal component 2.As shown in Figure 11 (b), in the present embodiment, the thickness F of lid component 10 is formed as making thickness F larger than the degree of depth C of groove 8 with the external diameter B1 sum of thermal medium pipe 16.
Therefore, shown in Figure 11 (b), when thermal medium pipe 16 and lid component 10 are inserted groove 8, the lower surface 12(bottom of lid component 10) abut with thermal medium pipe 16, and the upper surface 11 of lid component 10 gives prominence to projecting height 10a from the surface 3 of basal component 2.
In addition, the upper surface 11 of lid component 10 might not be given prominence to from the surface 3 of basal component 2, also when lid component 10 is inserted groove 8, can be formed with the form that the surface 3 of the upper surface 11 with basal component 2 that make lid component 10 flushes.
In addition, when lid component 10 is inserted groove 8, side 13a, 13b of lid component 10 contact with sidewall 8a, 8b face of groove 8 or to separate small gap relative.At this, with the interface of a sidewall 8a of lid component 10 side 13a and groove 8 for docking section V 1.And with the interface of another sidewall 8b of another side 13b of lid component 10 and groove 8 for docking section V 2.In addition, docking section V 1with docking section V 2also docking section V can be only called.In addition, with the space formed by the bottom 7 of groove 8 and the lower surface 12 of sidewall 8a, 8b and lid component 10 for spatial portion P11.
As shown in Figure 10, plastification region W 1to docking section V 1, V 2region integrated after implementing to make a part of Plastic Flow of basal component 2 and lid component 10 when friction-stir engages.In the present embodiment, plastification region W 1the Breadth Maximum Wa width of 3 (surface) be formed as larger than the width A (with reference to Figure 11 (a)) of groove 8.
In the present embodiment, plastification region W 1most deep be set to the height and position of about 1/3 of the gauge of the lid component 10 arrived from the upper surface 11 of lid component 10, but plastification region W 1size (degree of depth) suitably can set according to the size of the size of lid component 10 and throw described later, such as, plastification region W 1as long as most deep be set to the position of about 2/3 ~ 1/3 of the gauge of the lid component 10 arrived from the upper surface 11 of lid component 10.
Then, the manufacture method of Figure 12 to heat transfer plate 101 is used to be described.Figure 12 is the sectional view of the manufacture method of the heat transfer plate representing the 5th embodiment, and Figure 12 (a) represents that the thermal medium pipe inserting thermal medium pipe inserts operation, and Figure 12 (b) represents that lid component inserts operation, and Figure 12 (c) represents bonding process.
The manufacture method of the heat transfer plate of the 5th embodiment comprises: the preparatory process forming basal component 2; Thermal medium pipe 16 is inserted the thermal medium pipe be formed in the groove 8 of basal component 2 and inserts operation; Lid component lid component 10 being inserted groove 8 inserts operation; And make joint throw 20 move to implement the bonding process of friction-stir joint along docking section V.
(preparatory process)
With reference to Figure 11 (a), first, such as, utilize end mill to process, slab component is formed groove 8.Form the basal component 2 of the groove 8 had towards surperficial 3 openings by this.Groove 8 comprises the bottom 7 by Surface forming in bottom, and from bottom 7 with fixed width opening upward.
In addition, in the present embodiment, basal component 2 is formed by machining, but also can use the extrudate of aluminium alloy.
(thermal medium pipe inserts operation)
Then, as shown in Figure 12 (a), thermal medium pipe 16 is inserted groove 8.The lower end of thermal medium pipe 16 contacts with the bottom 7 of groove 8.
(lid component inserts operation)
Then, as shown in Figure 12 (b), by the groove 8 of lid component 10 basement component 2.Now, the lower surface 12 of lid component 10 abuts with the upper end of thermal medium pipe 16, and the upper surface 11 of lid component 10 is given prominence to from the surface 3 of basal component 2.In addition, docking section V is formed by sidewall 8a, 8b of groove 8 and side 13a, 13b of lid component 10 1, V 2.
(bonding process)
Then, as shown in Figure 12 (c), joint throw 20 couples of docking section V (docking section V are used 1, V 2) carry out friction-stir.That is, after being alignd with the center on the width of groove 8 at the center of joint throw 20, the lower surface 24 of the shoulder 22 of joint throw 20 is pressed into surface 3 prescribed depth of basal component 2, and makes it along docking section V relative movement.In the present embodiment, the rotating speed of joint throw 20 is such as 50 ~ 1500rpm, and transporting velocity is 0.05 ~ 2m/ minute, and the pressing force that the direction of principal axis towards joint throw 20 applies is set to 1kN ~ 20kN.
By bonding process, because the pressing force of joint throw 20 is passed to thermal medium pipe 16 via lid component 10, thermal medium can along the shape generation plastic deformation of the lower surface 12 of groove 8 and lid component 10 with pipe 16.
As shown in Figure 10 (b), form plastification region W by bonding process on the surface 3 of basal component 2 1.In the present embodiment, the length that pin 26 is stirred in setting and the intrusion etc. engaged with throw 20, to make plastification region W 1most deep arrive the height and position of about 1/3 of the gauge of the lid component 10 from the upper surface 11 of lid component 10.In addition, as shown in Figure 12 (c), docking section V 1, V 2in plastification region W 1degree of depth Wb be set to about 1/5 of lid component 10 thickness.By by docking section V 1, V 2in plastification region W 1degree of depth Wb setting comparatively large, the engaging force of basal component 2 and lid component 10 can be improved.
In addition, in the bonding process of present embodiment, the height B 2 of the thermal medium pipe 16 after bonding process is formed as about 70% of the height B 1 of the thermal medium pipe 16 before bonding process.It is preferable that, the height B 2 of the thermal medium pipe 16 after bonding process is more than 70% of the height B 1 of the thermal medium pipe 16 before bonding process.In addition, more preferably, the height B 2 of the thermal medium pipe 16 after bonding process is more than 80% of the height B 1 of the thermal medium pipe 16 before bonding process.In addition, it is preferable that, represent that the value of upsetting rate (B1-B2)/B1 × 100% of the flattening situation of thermal medium pipe 16 is set as 20% ~ 30%.
In addition, plastification region W 1size (degree of depth), engage and just illustrate by the shape of throw 20 and rotating speed or intrusion etc., be not limited, as long as consider that the material of basal component 2 and lid component 10 suitably sets.Such as, in the present embodiment, the length L of the stirring pin 26 with throw 20 is engaged abe formed as the external diameter X of shoulder 22 1about 1/2, but engage the length L with the stirring pin 26 of throw 20 aalso the external diameter X than shoulder 22 can be formed as 11/2 little.By this, the transmission efficiency of the pressing force of joint throw 20 can be improved.
As mentioned above, in the bonding process of the manufacture method of the heat transfer plate of present embodiment, due to the joint external diameter X of the shoulder 22 of throw 20 1be set to larger than the width A of cover slot 6, as long as therefore make joint throw 20 along the central mobile on the width of lid component 10 once, just can simultaneously to docking section V 1, V 2carry out friction-stir, and by friction-stir, basal component 2 is integrated with lid component 10.By this, the operation formality in manufacturing process can be reduced.
Due to the joint external diameter X of the shoulder 22 of throw 20 1larger than the width A of groove 8, the state that therefore can be positioned at above thermal medium pipe 16 with joint throw 20 carries out friction-stir.By this, thermal medium pipe 16 can be made efficiently plastic deformation to occur along the shape of the lower surface 12 of groove 8 and lid component 10, thus the adhesion of groove 8 and thermal medium pipe 16 can be improved.
In addition, in the present embodiment, due on the plumb line being centrally located at through thermal medium Yong Guan 16 center of lid component 10 and joint throw 20, therefore the pressing force of joint throw 20 more efficiently can not only be passed to thermal medium pipe 16, can also make thermal medium pipe 16 that the plastic deformation of high balance occur.
At this, Figure 13 (a) represents that lid component inserts the schematic sectional view of operation, and Figure 13 (b) represents the schematic sectional view crossing pressed state in bonding process, and Figure 13 (c) is schematic sectional view when representing the completing of the 5th embodiment.
As shown in Figure 13 (a), insert in operation at lid component, in the region surrounded by the lower surface 12 of the bottom 7 of groove 8, sidewall 8a, sidewall 8b and lid component 10, girth N2 (length of thick line portion) is formed as larger than the outer perimeter N1 of thermal medium pipe 16.
As shown in Figure 13 (b), if too much in the intrusion of bonding process middle cover component 10, then in the vertical cross section in the region surrounded by the lower surface 12 of groove 8 and lid component 10, girth N2 (length of thick line portion) becomes less than the outer perimeter N1 of thermal medium pipe 16.In addition, the height B 3 of the thermal medium pipe 16 after bonding process when being pressed into too much becomes less than height B 2 (with reference to Figure 12 (c)).
By this, thermal medium pipe 16 depressed deformation to the inside, and spatial portion P12 may be formed between thermal medium pipe 16 and the lower surface 12 of lid component 10.Like this, when there is space between thermal medium pipe 16 and the lower surface 12 of groove 8 and lid component 10, because the heat transfer efficiency of heat transfer plate 101 reduces, thus not satisfactory.
And as shown in Figure 13 (c), when the completing of present embodiment, interior girth N2 (length of thick line portion) is formed as roughly equal with the outer perimeter N1 of thermal medium pipe 16.That is, in the region surrounded due to outer perimeter N1 and the lower surface 12 by groove 8 and lid component 10 of thermal medium pipe 16, girth N2 is more approximate, and spatial portion P11 (with reference to Figure 13 (a)) is less, therefore can improve the heat transfer efficiency of heat transfer plate 101.
In addition, the manufacturing process of present embodiment illustrates, and also can be other operation.For example, referring to Figure 12 (b), also can insert before operation at lid component, the spatial portion P11 between the lower surface 12 being formed at thermal medium pipe 16 and lid component 10 be implemented to fill to the filling work procedure of heat conductivity material.By filling heat conductivity material, the space after having reduced is to improve heat transfer efficiency.
In addition, heat conductivity material such as can adopt the low melting point wlding of known metal dust, as long as but the material that can improve heat transfer efficiency just do not limited, also can be metal dust, metal dust thickener and sheet metal.
[the 6th embodiment]
Then, the heat transfer plate of sixth embodiment of the invention and the manufacture method of heat transfer plate are described.As shown in Figure 14 and Figure 15, the heat transfer plate 91 of the 6th embodiment and the manufacture method of heat transfer plate comprise on this aspect of cover slot 471 and groove 473 different from the 5th embodiment.In addition, to the part identical with the 5th embodiment, the description thereof will be omitted.
As shown in Figure 14 (a), on the surface 483 of basal component 482, depression is provided with cover slot 471, and the concavity of cover slot 471 is provided with the width groove 473 less than cover slot 471.Cover slot 471 is the parts configured for lid component 460, and its length direction along basal component 482 is formed continuously.The rectangular in cross-section of cover slot 471, and comprise sidewall 471a, 471b of standing vertically from the bottom surface 472 of cover slot 471.The width E1 of cover slot 471 is formed as roughly equal with the width G 1 of lid component 460 described later, and the degree of depth j of cover slot 471 is formed as roughly equal with the degree of depth f1 of lid component 460.
Groove 473 is parts that heating medium pipe 16 and lid component 460 insert, and it is formed continuously on the length direction of whole basal component 482.The groove of groove 473 to be cross sections of upper opening be U-shaped, and the bottom 474 of cross section semicircular in shape is formed in lower end.In addition, sidewall 473a, 473b is formed with continuously from bottom 474.The width e 1 of groove 473 is formed as larger than the external diameter B1 of thermal medium pipe 16.In addition, the curvature of bottom 474 is formed as less than the curvature of the periphery of thermal medium pipe 16.
As shown in figure 14, before bonding process, the cross section of thermal medium pipe 16 is rounded, but as shown in figure 15, is crushed by bonding process, and the shape generation plastic deformation of lower surface 465 along groove 473 and lid component 460.The flattening situation of thermal medium pipe 16 after described.
As shown in Figure 14 (a), the component that lid component 460 is side-lookings of being inserted into cover slot 471 and groove 473 in roughly T-shaped, it has and is formed as the larger wide portion 461 of width and the width narrow portion 462 less than wide portion 461.Wide portion 461 has upper surface 463, lower surface 464, side 463a, 463b.The width G 1 in wide portion 461 is formed as roughly equal with the width E1 of cover slot 471, and thickness f1 is formed as roughly equal with the degree of depth j of cover slot 471.
The central authorities of the narrow portion 462 leniently lower surface 464 in portion 461 are extended downward.Narrow portion 462 has side 462a, 462b and lower surface 465.Lower surface 465 is formed as concavity curved surface.The curvature of lower surface 65 is formed as less than the curvature of the periphery of thermal medium pipe 16.The width g1 of narrow portion 462 is formed as roughly equal with the width e 1 of groove 473.The thickness f2 of narrow portion 462 is formed as making thickness f2 larger than the degree of depth c of groove 473 with the external diameter B1 sum of thermal medium pipe 16.
As shown in Figure 14 (b), when thermal medium pipe 16 and lid component 460 are inserted cover slot 471 and then groove 473, the lower surface 465 of the narrow portion 462 of lid component 460 abuts with thermal medium pipe 16, and the upper surface 463 of lid component 460 gives prominence to projecting height 460a from the surface 483 of basal component 482.In addition, the bottom surface 472 of cover slot 471 separates L1 separated by a distance with the lower surface 464 in the wide portion 461 of lid component 460.Projecting height 460a and separated by a distance L1 are roughly equal length.
In addition, when lid component 460 is inserted cover slot 471 and groove 473, side 463a, the 463b in the wide portion 461 of lid component 460 contact with sidewall 471a, 471b face of groove 471 or to separate small gap relative.At this, with the interface of a sidewall 471a of a side 463a in the wide portion 461 of lid component 460 and groove 471 for docking section V 3.And with the interface of another sidewall 471b of another side 463b of lid component 460 and groove 471 for docking section V 4.In addition, docking section V 3and docking section V 4also docking section V can be only called.In addition, with the space formed by the bottom 474 of groove 473 and the lower surface 465 of sidewall 473a, 473b and lid component 460 for spatial portion P13.
As shown in Figure 15 (b), plastification region W 2to docking section V 3, V 4region integrated after implementing to make a part of Plastic Flow of basal component 482 and lid component 460 when friction-stir engages.In the present embodiment, plastification region W 2the Breadth Maximum Wa width of 483 (surface) be formed as larger than the width E1 (with reference to Figure 14 (a)) of cover slot 471.
Then, the manufacture method of Figure 15 to heat transfer plate 491 is used to be described.
The manufacture method of the heat transfer plate of the 6th embodiment comprises: the preparatory process forming basal component 482; Thermal medium pipe 16 is inserted the thermal medium pipe be formed in the groove 473 of basal component 482 and inserts operation; Lid component lid component 460 being inserted cover slot 471 and groove 473 inserts operation; And make joint throw 20 move to implement the bonding process of friction-stir joint along docking section V.In addition, omitted because preparatory process is roughly the same with the 5th embodiment.
(thermal medium pipe inserts operation)
With reference to Figure 14 (a) and Figure 14 (b), insert in operation at thermal medium pipe, thermal medium pipe 16 is inserted in groove 473.The lower end of thermal medium pipe 16 contacts with the bottom 474 of groove 473.
(lid component inserts operation)
Then, as shown in Figure 14 (b), by the cover slot 471 of lid component 460 basement component 482 and groove 473.Now, the lower surface 465 of the narrow portion 462 of lid component 460 abuts with the upper end of thermal medium pipe 16, and the upper surface 463 of lid component 460 is given prominence to from the surface 483 of basal component 482.
(bonding process)
Then, as shown in Figure 15 (b), joint throw 20 couples of docking section V (docking section V are used 3, V 4) carry out friction-stir.That is, after being alignd with the center on the width of cover slot 471 at the center of joint throw 20, the lower surface 24 of the shoulder 22 of joint throw 20 is pressed into surface 483 prescribed depth of basal component 482, and makes it along docking section V relative movement.
In bonding process, because the pressing force of joint throw 20 is passed to thermal medium pipe 16 via lid component 460, the therefore thermal medium shape generation plastic deformation of pipe 16 along the lower surface 465 of the bottom 474 of groove 473 and lid component 460.The vertical height B 4 of the thermal medium pipe 16 after bonding process be crushed the thermal medium pipe 16 before bonding process external diameter B1 about 80%.
As mentioned above, in the manufacture method of the heat transfer plate of present embodiment, due to the joint external diameter X of the shoulder 22 of throw 20 1larger than the width E1 of cover slot 471, therefore just can simultaneously to a pair docking section V of lid component 460 and basal component 482 with the once mobile of joint throw 20 3, V 4carry out friction-stir.By this, the operation formality of manufacturing process can be reduced.
In addition, due to the joint external diameter X of the shoulder 22 of throw 20 1larger than the width E1 of groove 473, the state that therefore can be positioned at the top of thermal medium pipe 16 with joint throw 20 carries out friction-stir.By this, thermal medium pipe 16 can be made efficiently plastic deformation to occur along the shape of the lower surface 465 of groove 473 and lid component 460, thus the adhesion of groove 473 and thermal medium pipe 16 can be improved.
In addition, in the present embodiment, due on the plumb line being centrally located at through thermal medium Yong Guan 16 center of lid component 460 and joint throw 20, therefore, the pressing force of joint throw 20 more efficiently can not only be passed to thermal medium pipe 16, can also make thermal medium pipe 16 that the plastic deformation of high balance occurs.
In addition, in the present embodiment, because the lower surface 465 (bottom) of lid component 460 is curved surface, therefore, the rounded thermal medium pipe 16 in cross section is easily out of shape along lower surface 465, thus can reduce spatial portion P13 efficiently.
That is, as shown in figure 16, when the completing of present embodiment, in the region surrounded by the lower surface 465 of groove 473 and lid component 460, girth N2 (thick line portion of Figure 16) is formed as roughly equal with the outer perimeter N1 of thermal medium pipe 16.By this, the contiguity degree of thermal medium pipe 16 and basal component 482 can be improved.
In addition, the heat transfer plate 491 of present embodiment has the larger cover slot of width 471 and the less groove 473 of width, and lid component 460 also has wide portion 461 and narrow portion 462.Therefore, as shown in Figure 15 (a) shows, when pressing joint throw 20 in bonding process above lid component 460, the lower surface (bottom) 464 in the wide portion 461 of lid component 460 abuts with the bottom surface 472 of cover slot 471.By this, because lid component 460 can not be pressed into than more below, bottom surface 472, therefore can prevent thermal medium pipe 16 from exceedingly plastic deformation occurring.That is, by the thickness f1 etc. in the wide portion 461 of the degree of depth and lid component 460 that set cover slot 471 rightly, the upsetting rate of thermal medium pipe 16 can just easily be set.
[the 7th embodiment]
Then, the heat transfer plate of seventh embodiment of the invention and the manufacture method of heat transfer plate are described.As shown in Figure 17 (a) He Figure 17 (b), the external diameter B1 of the thermal medium pipe 16 of heat transfer plate before bonding process of the 7th embodiment is than different from the 6th embodiment on the degree of depth c2 of groove 148 this aspect large.First, the structure of the heat transfer plate 151 shown in Figure 18 (d) is described.
As shown in Figure 17 (a) shows, on the surface 143 of basal component 142, depression is provided with cover slot 146, and the concavity of the bottom surface 146a of cover slot 146 is provided with the width groove 148 less than cover slot 146.Cover slot 146 is the parts configured for lid component 130, and it is formed continuously on the length direction of whole basal component 142.The rectangular in cross-section of cover slot 146, and comprise sidewall 145a, 145b of standing vertically from the bottom surface 146a of cover slot 146.The width E2 of cover slot 146 is formed as roughly equal with the width g2 of lid component 130 described later, and the degree of depth j2 of cover slot 146 is formed as roughly equal with the degree of depth f3 of lid component 130.
Groove 148 is parts that heating medium pipe 16 inserts, and it is formed continuously on the length direction of whole basal component 142.The groove of groove 148 to be cross sections of upper opening be U-shaped, and the bottom 147 formed by fixing curvature is formed in lower end.The width A2 of the opening portion of groove 148 is formed as larger than the external diameter B1 of thermal medium pipe 16.
As shown in Figure 17 (a) shows, before bonding process, the cross section of thermal medium pipe 16 is rounded, as shown in Figure 18 (c) shows, is crushed and the shape generation plastic deformation of lower surface 132 along groove 148 and lid component 130 by bonding process.For thermal medium pipe 16 flattening situation after described.
As shown in Figure 17 (a) shows, lid component 130 is the components being inserted into cover slot 146, its rectangular in cross-section, and has upper surface 131, lower surface 132, side 133a and side 133b.Lid component 130 formed by with the congener aluminium alloy of basal component 142.In the present embodiment, the thickness f3 of lid component 130 is formed as equal with the degree of depth j2 of cover slot 146.
Therefore, as shown in Figure 17 (b), when thermal medium pipe 16 being inserted groove 148 and lid component 130 being inserted cover slot 146, the lower surface 132 of lid component 130 abuts with thermal medium pipe 16, and the upper surface 131 of lid component 130 gives prominence to projecting height 130a from the surface 143 of basal component 142.
In addition, the upper surface 131 of lid component 130 not necessarily needs to give prominence to from the surface 143 of basal component 142, also can, when lid component 130 is inserted cover slot 146, be formed as the upper surface 131 of lid component 130 is flushed with the surface 143 of basal component 142.
In addition, when lid component 130 is inserted cover slot 146, side 133a, 133b of lid component 130 contact with sidewall 145a, 145b face of cover slot 146 or to separate small gap relative.At this, with the interface of the sidewall 145a of lid component 130 side 133a and cover slot 146 for docking section V 5.And with the interface of the sidewall 145b of another side 133b of lid component 130 and cover slot 146 for docking section V 6.In addition, docking section V 5with docking section V 6also docking section V can be only called.In addition, with the space formed by the lower surface 132 of groove 148, thermal medium pipe 16, cover slot 146 and lid component 130 for spatial portion P4.
As shown in Figure 18 (d), plastification region W 3to docking section V 5, V 6region integrated after implementing to make the part generation Plastic Flow of basal component 142 and lid component 130 when friction-stir engages.In the present embodiment, plastification region W 3the Breadth Maximum Wa width of 143 (surface) be formed as larger than the width E2 (with reference to Figure 17 (a)) of cover slot 146.
Then, the manufacture method of Figure 18 to heat transfer plate 151 is used to be described.
The manufacture method of the heat transfer plate of the 7th embodiment comprises: the preparatory process forming basal component 142; Thermal medium pipe 16 is inserted the thermal medium pipe be formed in the groove 148 of basal component 142 and inserts operation; Lid component lid component 130 being inserted cover slot 146 inserts operation; And make joint throw 20 move to carry out the bonding process of friction-stir joint along docking section V.
(preparatory process)
First, with reference to Figure 18 (a), such as, utilize end mill to process, slab component is formed cover slot 146, after this form groove 148 in the central authorities of the bottom surface 146a of cover slot 146.
In addition, in the present embodiment, basal component 142 utilizes machining to be formed, but also can use the extrudate of aluminium alloy.
(thermal medium pipe inserts operation)
Then, as shown in Figure 18 (a), thermal medium pipe 16 is inserted groove 148.The lower end of thermal medium pipe 16 contacts with the bottom 147 of groove 148.
(lid component inserts operation)
Then, as shown in Figure 18 (b), by the cover slot 146 of lid component 130 basement component 142.Now, the lower surface 132 of lid component 130 abuts with the upper end of thermal medium pipe 16, and the upper surface 131 of lid component 130 is given prominence to from the surface 143 of basal component 142.In addition, docking section V is formed by sidewall 145a, 145b of cover slot 146 and side 133a, 133b of lid component 130 5, V 6.
(bonding process)
Then, as shown in Figure 18 (c) shows, joint throw 20 couples of docking section V (docking section V are used 5, V 6) carry out friction-stir.That is, after being alignd with the center on the width of cover slot 146 at the center of joint throw 20, the lower surface 24 of the shoulder 22 of joint throw 20 is pressed into surface 143 prescribed depth of basal component 142, and makes it along docking section V relative movement.In addition, the joint length L of the stirring pin 26 of throw 20 of present embodiment bbe formed as the external diameter X of shoulder 22 1about 1/5.By making the length L of stirring pin 26 brelative to the external diameter X of shoulder 22 1formed smaller, thus the pressing force of joint throw 20 can be made to be passed to lid component 130 efficiently.
In bonding process, because the pressing force of joint throw 20 is passed to thermal medium pipe 16 via lid component 130, the therefore thermal medium shape generation plastic deformation of pipe 16 along the lower surface 132 of groove 148 and lid component 130.The vertical height B 5 of the thermal medium pipe 16 after bonding process is collapsed into about 70% of the external diameter B1 of the thermal medium pipe 16 before bonding process.
As mentioned above, in the manufacture method of the heat transfer plate of present embodiment, due to the joint external diameter X of the shoulder 22 of throw 20 1larger than the width E2 of cover slot 146, therefore, just can simultaneously to a pair docking section V of lid component 130 and basal component 142 with the once mobile of joint throw 20 5, V 6carry out friction-stir.By this, the operation formality of manufacturing process can be reduced.
Due to the joint external diameter X of the shoulder 22 of throw 20 1larger than the width E2 of cover slot 146, the state that therefore can be positioned at the top of thermal medium pipe 16 with joint throw 20 carries out friction-stir.By this, thermal medium pipe 16 can be made efficiently plastic deformation to occur along the shape of the lower surface 132 of groove 148 and lid component 130, thus the adhesion of groove 148 and thermal medium pipe 16 can be improved.
In addition, in the present embodiment, due on the plumb line being centrally located at through thermal medium Yong Guan 16 center of lid component 130 and joint throw 20, therefore, the pressing force of joint throw 20 can not only be made more efficiently to be passed to thermal medium pipe 16, can also to make thermal medium pipe 16 that the plastic deformation of high balance occurs.
That is, as shown in figure 19, when the completing of present embodiment, in the region surrounded by the lower surface 132 of groove 148 and lid component 130, girth N2 (thick line portion of Figure 19) is formed as roughly equal with the outer perimeter N1 of thermal medium pipe 16.By this, the contiguity degree of thermal medium pipe 16 and basal component 142 can be improved.
In addition, in the present embodiment, when carrying out bonding process, the lower surface 132 of lid component 130 abuts with the bottom surface 146a of cover slot 146.By this, because lid component 130 can not be pressed into the bottom surface 146a more below than cover slot 146, therefore can prevent thermal medium pipe 16 from exceedingly flattening.That is, by the external diameter B1 etc. of the thickness f3 of degree of depth j2 and lid component 130, the degree of depth c2 of groove 148 and the thermal medium pipe 16 that set cover slot 146 rightly, the upsetting rate of thermal medium pipe 16 can just easily be set.
[the 8th embodiment]
Then, the heat transfer plate of the 8th embodiment is described.The heat transfer plate 201 of the 8th embodiment shown in Figure 20 includes the structure roughly the same with the heat transfer plate 101 (with reference to Figure 10) of the 5th embodiment, is also configured with cap member 210 and carries out engaging on this aspect different from the 5th embodiment to implement friction-stir joint above lid component 10.
In addition, below by the structure identical with above-mentioned heat transfer plate 101 also referred to as lower cover portion m.In addition, its explanation repeated is omitted to marking identical symbol with the component that the heat transfer plate 101 of the 5th embodiment repeats.
As shown in Figure 20 (a) He Figure 20 (b), heat transfer plate 201 has: basal component 202; Insert the thermal medium pipe 16 of groove 8; Lid component 10; And be configured at the cap member 210 of face side of lid component 10, and at plastification region W 1, plastification region W 4, W 5engaged by friction-stir and be integrated.
As shown in Figure 20 (a), basal component 202 is such as made up of aluminium alloy, and has the upper cover slot 206 formed on the whole length direction on the surface 203 of basal component 202 and the groove 8 formed continuously on the whole length direction of the bottom surface 206c of upper cover slot 206.The rectangular in cross-section of upper cover slot 206, and comprise sidewall 206a, 206b of vertically standing up from bottom surface 206c.The width of upper cover slot 206 is formed as larger than the width of groove 8.
As shown in Figure 20 (a), thermal medium pipe 16 is inserted and is formed in the groove 8 of the bottom of basal component 202, and clog with lid component 10, be bonded on plastification region W by friction-stir 1engage.That is, the lower cover portion m being formed at the inside of basal component 202 is formed in the mode roughly the same with the heat transfer plate 101 of the 5th embodiment.
In addition, the bottom surface 206c of upper cover slot 206 may produce step (groove) and burr because carrying out friction-stir joint.Therefore, it is preferable that, such as, with plastification region W 1surface be benchmark, processing is cut to the bottom surface 206c of upper cover slot 206 face of implementing and is formed smoothly.By this, the seamless unoccupied place of bottom surface 206c of the upper cover slot 206 after the lower surface 212 of cap member 210 being cut with face configures.
As shown in Figure 20 (a), cap member 210 is such as made up of aluminium alloy, and it forms the square-section roughly the same with the cross section of upper cover slot 206, and has the side 213a and side 213b that are vertically formed from lower surface 212.Cap member 210 is inserted into cover slot 206.That is, side 213a, 213b of cap member 210 contact with sidewall 206a, 206b face of upper cover slot 206 or separate small gap configuration.At this, as shown in Figure 20 (b), with the interface of an a side 213a and sidewall 206a for docking section, upside V 7.And with the interface of the 206b of another side 213b and another sidewall for docking section, upside V 8.Upside docking section V 7, V 8to be engaged by friction-stir and at plastification region W 4, W 5integration.
The manufacture method of heat transfer plate 201 comprises: utilize the manufacture method identical with the heat transfer plate 101 of above-mentioned 5th embodiment, after lower cover portion m is formed at the bottom of basal component 202, the bottom surface 206c of upper cover slot 206 is carried out to the face cutting process of face cutting; Operation is inserted to the cap member that cap member 210 is configured; And along docking section, upside V 7, V 8implement the cap member bonding process that friction-stir engages.
(face cutting process)
In the cutting process of face, remove the step (groove) and burr that are formed on the bottom surface 206c of upper cover slot 206 with cutting way, thus make bottom surface 206c level and smooth.
(cap member insertion operation)
Insert in operation in cap member, after having carried out face cutting process, cap member 210 is configured at the bottom surface of upper cover slot 206.Thus by carrying out face cutting process, the lower surface 212 of cap member 210 is configured with the seamless unoccupied place, bottom surface of upper cover slot 206.
(cap member bonding process)
In cap member bonding process, after the cutting process of face, make joint throw (not shown) along docking section, upside V 7, V 8mobile to implement friction-stir joint.As long as the intrusion of the joint throw in cap member bonding process is considered the length of the stirring pin of this joint throw and the thickness of cap member 210 and is suitably set.In cap member bonding process, also can adopt the joint throw 20 used in the 5th embodiment.
According to the heat transfer plate 201 of the 8th embodiment, cap member 210 is set above lower cover m again, and makes thermal medium pipe 16 be configured in darker position by implementing friction-stir joint.
In addition, in the 8th embodiment, friction-stir is carried out formed two plastification region W to the two sides of cap member 210 4, W 5, but do not limit at this.Such as, the width of upper cover slot 206 can also be formed as the external diameter X of the shoulder 22 than joint throw 20 (with reference to Figure 11 (a)) 1little, and use joint throw 20 pairs of cap member 210 to carry out the friction-stir of.By this, the operation formality of bonding process can be reduced.
[the 9th embodiment]
Then, the heat transfer plate of the 9th embodiment is described.Containing the structure that the heat transfer plate 151 (with reference to Figure 18 (d)) with the 7th embodiment is roughly the same in the heat transfer plate 301 of the 9th embodiment shown in Figure 21, the face side of lid component 130 is also configured with cap member 310 and carries out engaging on this aspect different from the 8th embodiment to implement friction-stir joint.
In addition, below, structure identical for the heat transfer plate 151 with above-mentioned is called lower cover portion m '.In addition, mark identical symbol to the component that the heat transfer plate 151 of the 5th embodiment repeats, and omit its explanation repeated.
As shown in figure 21, heat transfer plate 301 has: basal component 302; Insert the thermal medium pipe 16 of groove 148; Insert the lid component 130 of cover slot 146; And be configured at the cap member 310 of face side of lid component 130, at plastification region W 3, plastification region W 6, W 7to be engaged by friction-stir and integrated.
As shown in Figure 21 (a), basal component 302 is such as formed by aluminium alloy, its groove 148 having the upper cover slot 306 formed on the whole length direction on the surface 303 of basal component 302, the cover slot 146 that the whole length direction of the bottom surface 306c of upper cover slot 306 is formed continuously and formed continuously on the whole length direction of the bottom surface of cover slot 146.The rectangular in cross-section of upper cover slot 306, and comprise sidewall 306a, 306b of standing vertically from bottom surface 306c.The width of upper cover slot 306 is formed as larger than the width of cover slot 146.
As shown in Figure 21 (a), thermal medium pipe 16 is inserted into the groove 148 of the bottom being formed at basal component 302 and lid component 130 is inserted into cover slot 146, is engaged and at plastification region W by friction-stir 3engage.That is, the lower cover portion m ' being formed at the inside of basal component 302 is formed in the mode roughly the same with the heat transfer plate 151 of the 7th embodiment.
In addition, the bottom surface 306c of upper cover slot 306 may produce step (groove) and burr because carrying out friction-stir joint.Therefore, it is preferable that, such as, with plastification region W 3surface be benchmark, face machining is implemented to the bottom surface 306c of upper cover slot 306 and is formed smoothly.By this, the seamless unoccupied place of bottom surface 306c of the upper cover slot 306 after the lower surface 312 of cap member 310 being cut with face configures.
As shown in Figure 21 (a), cap member 310 is such as formed by aluminium alloy, and it forms the square-section roughly the same with the cross section of upper cover slot 306, and has from lower surface 312 vertically formation side 313a and side 313b.Cap member 310 is inserted in cover slot 306.That is, side 313a, 313b of cap member 310 contact with sidewall 306a, 306b face of upper cover slot 306 or separate small gap and arrange.At this, as shown in Figure 21 (b), with the interface of an a side 313a and sidewall 306a for docking section, upside V 9.And with the interface of another side 313b and another sidewall 306b for docking section, upside V 10.Upside docking section V 9, V 10to be engaged by friction-stir and at plastic region W 6, W 7integration.
According to the heat transfer plate 301 of the 9th embodiment, also configure cap member 310 by the top at lower cover portion m ' and engage to implement friction-stir, thus thermal medium pipe 16 can be made to be configured in darker position.In addition, because the manufacturing process of heat transfer plate 301 is roughly the same with the 8th embodiment, thus omitted.
Above embodiments of the present invention are illustrated, but the present invention suitably can change in the scope not departing from present subject matter.Such as, the cross section of the bottom of the groove that heating medium pipe 16 inserts is formed as curved surface, but cross section also can be formed as polygon.

Claims (30)

1. a manufacture method for heat transfer plate, is characterized in that, comprising:
Thermal medium pipe inserts operation, inserts in operation, inserted by thermal medium pipe in the groove on the bottom surface of the cover slot of the face side opening be formed at towards basal component at this thermal medium pipe;
Filling work procedure, in this filling work procedure, is filled in the space surrounded by the outer peripheral face of described groove and described thermal medium pipe by heat conductivity material;
Lid component inserts operation, inserts in operation, lid component is inserted described cover slot, and described lid component is abutted with the bottom surface of described cover slot at this lid component; And
Bonding process, in this bonding process, the docking section making throw relative with the side of described lid component relative to the sidewall of described cover slot relatively moves to carry out friction-stir,
In described bonding process, there is not the state of plastic deformation with described thermal medium pipe, friction-stir is carried out to the docking section of another side of a sidewall of described cover slot and the docking section of a side of described lid component and another sidewall of described cover slot and described lid component.
2. the manufacture method of heat transfer plate as claimed in claim 1, is characterized in that, is set to larger than the vertical height of described thermal medium pipe by the distance to the bottom of described lid component the bottom from described groove.
3. the manufacture method of heat transfer plate as claimed in claim 1, it is characterized in that, described heat conductivity material is metal dust, metal dust thickener or sheet metal.
4. the manufacture method of heat transfer plate as claimed in claim 1, it is characterized in that, described heat conductivity material is the wlding of low melting point.
5. the manufacture method of heat transfer plate as claimed in claim 1, it is characterized in that, in described bonding process, the most deep in the plastification region formed by friction-stir is set as the position of more than 2/3 of the gauge arriving downward described lid component from the upper surface of described lid component.
6. the manufacture method of heat transfer plate as claimed in claim 1, it is characterized in that, in described bonding process, the most deep in the plastification region formed by friction-stir is set as the position of more than 1/2 of the gauge arriving downward described lid component from the upper surface of described lid component.
7. the manufacture method of heat transfer plate as claimed in claim 1, it is characterized in that, in described bonding process, the most deep in the plastification region formed by friction-stir is set as the position of more than 1/3 of the gauge arriving downward described lid component from the upper surface of described lid component.
8. the manufacture method of heat transfer plate as claimed in claim 1, is characterized in that, after described bonding process, also comprise:
Cap member inserts operation, inserting in operation, in the face side of described basal component, the bottom surface of the cap member upper cover slot larger than the width of described cover slot with being formed as width being abutted in this cap member; And
Cap member bonding process, in this cap member bonding process, makes throw along the docking section relative movement of the side of the sidewall of described upper cover slot and described cap member to carry out friction-stir.
9. a manufacture method for heat transfer plate, this heat transfer plate has: basal component, and this basal component comprises towards face side opening and the large groove of the vertical height of depth ratio thermal medium pipe; Thermal medium is managed, and this thermal medium pipe is inserted into described groove; And lid component, this lid component covers described thermal medium pipe, and it is characterized in that, the manufacture method of described heat transfer plate comprises:
Thermal medium pipe inserts operation, inserts in operation, described thermal medium pipe is inserted described groove at this thermal medium pipe;
Filling work procedure, in this filling work procedure, is filled in the space surrounded by the outer peripheral face of described groove and described thermal medium pipe by heat conductivity material;
Lid component inserts operation, inserts in operation, described lid component is inserted the top of described thermal medium pipe at this lid component; And
Bonding process, in bonding process, the docking section making throw relative with the side of described lid component relative to the sidewall of described groove relatively moves to carry out friction-stir,
In described bonding process, the pressing force of described throw is made to be passed to described thermal medium pipe via described lid component, and with the state of described thermal medium pipe generation plastic deformation, friction-stir is carried out to the docking section of another side of a sidewall of described groove and the docking section of a side of described lid component and another sidewall of described groove and described lid component.
10. a manufacture method for heat transfer plate, this heat transfer plate has: basal component, and this basal component comprises the cover slot towards face side opening and the bottom surface upper shed in this cover slot and the little groove of the vertical height of depth ratio thermal medium pipe; Thermal medium is managed, and this thermal medium pipe is inserted into described groove; And lid component, this lid component covers described thermal medium pipe, and it is characterized in that, the manufacture method of described heat transfer plate comprises:
Thermal medium pipe inserts operation, inserts in operation, described thermal medium pipe is inserted described groove at this thermal medium pipe;
Filling work procedure, in this filling work procedure, is filled in the space surrounded by the outer peripheral face of described groove and described thermal medium pipe by heat conductivity material;
Lid component inserts operation, inserts in operation, described lid component is inserted the top of described thermal medium pipe at this lid component; And
Bonding process, in this bonding process, the docking section making throw relative with the side of described lid component relative to the sidewall of described cover slot relatively moves to carry out friction-stir,
In described bonding process, the pressing force of described throw is made to be passed to described thermal medium pipe via described lid component, with the state of described thermal medium pipe generation plastic deformation, friction-stir is carried out to the docking section of another side of a sidewall of described cover slot and the docking section of a side of described lid component and another sidewall of described cover slot and described lid component.
The manufacture method of 11. heat transfer plates as claimed in claim 10, is characterized in that, in described bonding process, the bottom surface of described lid component and described cover slot is abutted against.
The manufacture method of 12. 1 kinds of heat transfer plates, this heat transfer plate has: basal component, and this basal component comprises the cover slot towards face side opening and the bottom surface upper shed in this cover slot and the large groove of the vertical height of depth ratio thermal medium pipe; Thermal medium is managed, and this thermal medium pipe is inserted into described groove; And lid component, this lid component comprises the wide portion being inserted into described cover slot and the narrow portion being inserted into described groove, and it is characterized in that, the manufacture method of described heat transfer plate comprises:
Thermal medium pipe inserts operation, inserts in operation, described thermal medium pipe is inserted described groove at thermal medium pipe;
Filling work procedure, in this filling work procedure, is filled in the space surrounded by the outer peripheral face of described groove and described thermal medium pipe by heat conductivity material;
Lid component inserts operation, inserts in operation, described lid component is inserted the top of described thermal medium pipe at this lid component; And
Bonding process, in this bonding process, the docking section making throw relative with the side of described lid component relative to the sidewall of described cover slot relatively moves to carry out friction-stir,
In described bonding process, the pressing force of described throw is made to be passed to described thermal medium pipe via the described narrow portion of described lid component, with the state of described thermal medium pipe generation plastic deformation, friction-stir is carried out to the docking section of another side of a sidewall of described cover slot and the docking section of a side of described lid component and another sidewall of described cover slot and described lid component.
The manufacture method of 13. heat transfer plates as claimed in claim 12, is characterized in that, in described bonding process, the described wide portion of described lid component and the bottom surface of described cover slot is abutted against.
The manufacture method of 14. heat transfer plates as described in claim 9 or 10 or 12, it is characterized in that, in described bonding process, in the region surrounded by described groove and described lid component on the vertical cross section after described bonding process, girth is set to more than the outer perimeter of described thermal medium pipe.
The manufacture method of 15. heat transfer plates as described in claim 9 or 10 or 12, it is characterized in that, in described bonding process, the height of the described thermal medium pipe after described bonding process sets more than 70% of the height of the described thermal medium pipe before becoming described bonding process.
The manufacture method of 16. heat transfer plates as described in claim 9 or 10 or 12, it is characterized in that, in described bonding process, the height of the described thermal medium pipe after described bonding process sets more than 80% of the height of the described thermal medium pipe before becoming described bonding process.
The manufacture method of 17. heat transfer plates as described in claim 9 or 10 or 12, it is characterized in that, described heat conductivity material is metal dust, metal dust thickener or sheet metal.
The manufacture method of 18. heat transfer plates as described in claim 9 or 10 or 12, it is characterized in that, described heat conductivity material is the wlding of low melting point.
The manufacture method of 19. heat transfer plates as described in claim 9 or 10 or 12, it is characterized in that, in described bonding process, the most deep in the plastification region formed by friction-stir is set as the position of more than 2/3 of the gauge arriving downward described lid component from the upper surface of described lid component.
The manufacture method of 20. heat transfer plates as described in claim 9 or 10 or 12, it is characterized in that, in described bonding process, the most deep in the plastification region formed by friction-stir is set as the position of more than 1/2 of the gauge arriving downward described lid component from the upper surface of described lid component.
The manufacture method of 21. heat transfer plates as described in claim 9 or 10 or 12, it is characterized in that, in described bonding process, the most deep in the plastification region formed by friction-stir is set as the position of more than 1/3 of the gauge arriving downward described lid component from the upper surface of described lid component.
The manufacture method of 22. heat transfer plates as claimed in claim 9, is characterized in that, after described bonding process, also comprise:
Cap member inserts operation, inserting in operation, in the face side of described basal component, the bottom surface of the cap member upper cover slot larger than the width of described groove with being formed as width being abutted in this cap member; And
Cap member bonding process, in this cap member bonding process, makes throw relatively move to carry out friction-stir along the docking section of the side of the sidewall of described upper cover slot and described cap member.
The manufacture method of 23. heat transfer plates as described in claim 10 or 12, is characterized in that, after described bonding process, also comprise:
Cap member inserts operation, inserting in operation, in the face side of described basal component, the bottom surface of the cap member upper cover slot larger than the width of described cover slot with being formed as width being abutted in this cap member; And
Cap member bonding process, in this cap member bonding process, makes throw relatively move to carry out friction-stir along the docking section of the side of the sidewall of described upper cover slot and described cap member.
24. 1 kinds of heat transfer plates, have:
Basal component, this basal component has the groove be formed at towards on the bottom surface of the cover slot of face side opening;
Thermal medium is managed, and this thermal medium pipe is inserted into described groove; And
Lid component, this lid component is inserted into described cover slot,
Described heat transfer plate uses throw to be engaged with described lid component friction-stir by described basal component to form, and described thermal medium pipe plastic deformation can not occur, and it is characterized in that,
Heat conductivity material is filled with in the space that the outer peripheral face by described groove and described thermal medium pipe surrounds.
25. heat transfer plates as claimed in claim 24, is characterized in that,
Described heat transfer plate has: described basal component, and this basal component also comprises the face side that is formed at described basal component and the width upper cover slot larger than described cover slot; And cap member, this cap member is inserted into described upper cover slot,
Friction-stir is implemented in docking section along the side of the sidewall of described upper cover slot and described cap member.
26. 1 kinds of heat transfer plates, have:
Basal component, this basal component has towards face side opening and the large groove of the vertical of depth ratio thermal medium pipe;
Thermal medium is managed, and this thermal medium pipe is inserted into the bottom of described groove; And
Lid component, this lid component covers the described thermal medium pipe in described groove,
Described heat transfer plate is that described basal component engages with described lid component friction-stir and forms, and described thermal medium pipe plastic deformation can occur, and it is characterized in that,
Heat conductivity material is filled with in the space that the outer peripheral face by described groove and described thermal medium pipe surrounds.
27. heat transfer plates as claimed in claim 26, is characterized in that,
Described heat transfer plate has: described basal component, and this basal component also comprises the face side that is formed at described basal component and the width upper cover slot larger than described cover slot; And cap member, this cap member is inserted into described upper cover slot,
Friction-stir is implemented in docking section along the side of the sidewall of described upper cover slot and described cap member.
28. 1 kinds of heat transfer plates, have:
Basal component, this basal component has bottom surface upper shed in the cover slot towards face side opening and the little groove of the vertical height of depth ratio thermal medium pipe;
Thermal medium is managed, and this thermal medium pipe is inserted into described groove; And
Lid component, this lid component covers the described thermal medium pipe in described groove,
Described heat transfer plate is that described basal component engages with described lid component friction-stir and forms, and described thermal medium pipe plastic deformation can occur, and it is characterized in that,
Heat conductivity material is filled with in the space that the outer peripheral face by described groove and described thermal medium pipe surrounds.
29. 1 kinds of heat transfer plates, comprising:
Basal component, this basal component has bottom surface upper shed in the cover slot towards face side opening and the large groove of the vertical height of depth ratio thermal medium pipe;
Thermal medium is managed, and this thermal medium pipe is inserted into described groove; And
Lid component, this lid component comprises the wide portion being inserted into described cover slot and the narrow portion being inserted into described groove,
Described heat transfer plate is that described basal component engages with described lid component friction-stir and forms, and described thermal medium pipe plastic deformation can occur, and it is characterized in that
Heat conductivity material is filled with in the space that the outer peripheral face by described groove and described thermal medium pipe surrounds.
30. heat transfer plates as claimed in claim 29, is characterized in that,
Described heat transfer plate has: described basal component, and this basal component also comprises the face side that is formed at described basal component and the width upper cover slot larger than described cover slot; And cap member, this cap member is inserted into described upper cover slot,
Friction-stir is implemented in docking section along the side of the sidewall of described upper cover slot and described cap member.
CN201210559581.3A 2008-05-20 2009-04-06 Heat transmit plate manufacturing method and heat transmit plate Active CN103042302B (en)

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