CN103025528A - 丝网印版 - Google Patents
丝网印版 Download PDFInfo
- Publication number
- CN103025528A CN103025528A CN2010800253081A CN201080025308A CN103025528A CN 103025528 A CN103025528 A CN 103025528A CN 2010800253081 A CN2010800253081 A CN 2010800253081A CN 201080025308 A CN201080025308 A CN 201080025308A CN 103025528 A CN103025528 A CN 103025528A
- Authority
- CN
- China
- Prior art keywords
- breach
- screen printing
- layer
- coating
- printing forme
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/34—Screens, Frames; Holders therefor
- B41F15/36—Screens, Frames; Holders therefor flat
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/247—Meshes, gauzes, woven or similar screen materials; Preparation thereof, e.g. by plasma treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2215/00—Screen printing machines
- B41P2215/50—Screen printing machines for particular purposes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Plates And Materials Therefor (AREA)
- Printing Methods (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009024873A DE102009024873A1 (de) | 2009-06-09 | 2009-06-09 | Siebdruckform |
DE102009024873.0 | 2009-06-09 | ||
PCT/DE2010/000643 WO2010142274A2 (de) | 2009-06-09 | 2010-06-09 | Siebdruckform |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103025528A true CN103025528A (zh) | 2013-04-03 |
Family
ID=42675483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010800253081A Pending CN103025528A (zh) | 2009-06-09 | 2010-06-09 | 丝网印版 |
Country Status (5)
Country | Link |
---|---|
CN (1) | CN103025528A (de) |
DE (2) | DE102009024873A1 (de) |
IT (1) | IT1400931B1 (de) |
NL (1) | NL2004844C2 (de) |
WO (1) | WO2010142274A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109673169A (zh) * | 2016-09-21 | 2019-04-23 | 三星Sdi株式会社 | 太阳电池电极图案形成方法、用其制造的电极及太阳电池 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2480413A1 (de) | 2009-09-21 | 2012-08-01 | DTG International GmbH | Drucksiebe und verfahren zu deren herstellung |
DE102011003287A1 (de) * | 2011-01-27 | 2012-08-02 | Christian Koenen Gmbh | Druckschablone zum Aufbringen eines Druckmusters auf ein Substrat und Verfahren zum Herstellen einer Druckschablone |
DE102011016453A1 (de) * | 2011-04-08 | 2013-01-17 | Universität Stuttgart | Verfahren zur Herstellung einer Siebdruckform und damit hergestellte Solarzelle |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1148830A (zh) * | 1994-07-07 | 1997-04-30 | 弗兰西斯·布里埃 | 用于沉积和分配以点为基础的粘滞料的具有各种厚度涂层的模板 |
CN1392762A (zh) * | 2001-06-01 | 2003-01-22 | 日本电气株式会社 | 用于在印刷电路板焊接区上印刷焊锡膏并具有带通孔的突起的印刷掩膜 |
DE10231698A1 (de) * | 2002-03-26 | 2003-10-23 | Fraunhofer Ges Forschung | Verfahren zur Verbesserung des Transfers von Zusatzmaterial mittels einer Schablone auf einen Träger sowie zugehörige Schablone |
US20030222125A1 (en) * | 2002-05-17 | 2003-12-04 | Fleck Ian Mcphee | Solder printing using a stencil having a reverse-tapered aperture |
US20050268801A1 (en) * | 1998-02-24 | 2005-12-08 | Chad Cobbley | Method and stencil for extruding material on a substrate |
US20090081823A1 (en) * | 2007-09-20 | 2009-03-26 | Fry's Metals, Inc. | Electroformed stencils for solar cell front side metallization |
CN102202907A (zh) * | 2008-09-26 | 2011-09-28 | Nb技术股份有限公司 | 网印网版 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1337578A (en) * | 1969-12-17 | 1973-11-14 | Du Pont | Method of decreasing the wettability of surfaces |
JPH09277487A (ja) * | 1996-02-16 | 1997-10-28 | Riso Kagaku Corp | 感熱孔版原紙の製版方法並びにそれに用いる感熱孔版原紙及び組成物 |
DE10200181A1 (de) * | 2001-10-12 | 2003-04-30 | Daniel Mahler | Siebdruckform sowie Verfahren zu deren Herstellung |
TWI458648B (zh) * | 2006-04-07 | 2014-11-01 | Mitsubishi Paper Mills Ltd | A method for manufacturing a photographic mask for printing a resin, and a screen printing mask for resin |
-
2009
- 2009-06-09 DE DE102009024873A patent/DE102009024873A1/de not_active Ceased
-
2010
- 2010-06-08 NL NL2004844A patent/NL2004844C2/nl not_active IP Right Cessation
- 2010-06-09 WO PCT/DE2010/000643 patent/WO2010142274A2/de active Application Filing
- 2010-06-09 DE DE202010007774U patent/DE202010007774U1/de not_active Expired - Lifetime
- 2010-06-09 IT ITVI2010A000158A patent/IT1400931B1/it active
- 2010-06-09 CN CN2010800253081A patent/CN103025528A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1148830A (zh) * | 1994-07-07 | 1997-04-30 | 弗兰西斯·布里埃 | 用于沉积和分配以点为基础的粘滞料的具有各种厚度涂层的模板 |
US20050268801A1 (en) * | 1998-02-24 | 2005-12-08 | Chad Cobbley | Method and stencil for extruding material on a substrate |
CN1392762A (zh) * | 2001-06-01 | 2003-01-22 | 日本电气株式会社 | 用于在印刷电路板焊接区上印刷焊锡膏并具有带通孔的突起的印刷掩膜 |
DE10231698A1 (de) * | 2002-03-26 | 2003-10-23 | Fraunhofer Ges Forschung | Verfahren zur Verbesserung des Transfers von Zusatzmaterial mittels einer Schablone auf einen Träger sowie zugehörige Schablone |
US20030222125A1 (en) * | 2002-05-17 | 2003-12-04 | Fleck Ian Mcphee | Solder printing using a stencil having a reverse-tapered aperture |
US20090081823A1 (en) * | 2007-09-20 | 2009-03-26 | Fry's Metals, Inc. | Electroformed stencils for solar cell front side metallization |
CN102202907A (zh) * | 2008-09-26 | 2011-09-28 | Nb技术股份有限公司 | 网印网版 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109673169A (zh) * | 2016-09-21 | 2019-04-23 | 三星Sdi株式会社 | 太阳电池电极图案形成方法、用其制造的电极及太阳电池 |
CN109673169B (zh) * | 2016-09-21 | 2022-02-22 | 上海匠聚新材料有限公司 | 太阳电池电极图案形成方法、用其制造的电极及太阳电池 |
Also Published As
Publication number | Publication date |
---|---|
IT1400931B1 (it) | 2013-07-02 |
WO2010142274A2 (de) | 2010-12-16 |
DE202010007774U1 (de) | 2010-09-02 |
DE102009024873A1 (de) | 2010-12-16 |
ITVI20100158A1 (it) | 2010-12-10 |
NL2004844C2 (nl) | 2011-06-09 |
NL2004844A (nl) | 2010-12-13 |
WO2010142274A3 (de) | 2013-03-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130403 |