CN103025528A - Screen printing frame - Google Patents
Screen printing frame Download PDFInfo
- Publication number
- CN103025528A CN103025528A CN2010800253081A CN201080025308A CN103025528A CN 103025528 A CN103025528 A CN 103025528A CN 2010800253081 A CN2010800253081 A CN 2010800253081A CN 201080025308 A CN201080025308 A CN 201080025308A CN 103025528 A CN103025528 A CN 103025528A
- Authority
- CN
- China
- Prior art keywords
- breach
- screen printing
- layer
- coating
- printing forme
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/34—Screens, Frames; Holders therefor
- B41F15/36—Screens, Frames; Holders therefor flat
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/247—Meshes, gauzes, woven or similar screen materials; Preparation thereof, e.g. by plasma treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2215/00—Screen printing machines
- B41P2215/50—Screen printing machines for particular purposes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Printing Plates And Materials Therefor (AREA)
- Printing Methods (AREA)
Abstract
The invention relates to a screen printing frame comprising: a first layer as a screen printing template carrier, designed as a high-grade steel foil and being provided with first cavities which are designed such that they reach from an upper side to a bottom side of the first layer; a second layer as a screen printing template, designed as a masking layer which is rigidly connected to the lower side of the first layer. The second layer is provided with second cavities which at least partially overlap the first cavities of the first layer such that a printing medium can be conveyed through the first cavities of the first layer from the upper side thereof through the second cavities of the second layer in the direction of the lower side onto a substrate that can be placed beneath. The surfaces of the first and/or the second cavities are provided with a coating which has a thickness which is at least 5 % of the smallest cross-section inner width of the respective cavity, the ratio of the total height of the screen printing frame to the largest cross-section inner width of the first and/or second non-coated cavity is less than 1 :1 and the ratio of the total height of the screen printing frame to the largest cross-section inner width of the first and/or second coated cavity is greater than 1 :1.
Description
The present invention relates to screen printing forme, its have comprise the first breach, serve as the ground floor of mask to print carrier and have the second layer the second breach, that serve as mask, the second layer firmly is connected with ground floor.
When serigraphy or in the method for biting, printed medium is applied on the screen printing forme, here, and subsequently by along the top side guiding movement of screen printing forme or very close to the scraper of this top side guiding movement printed medium being scraped in the breach of screen printing forme.Such screen printing forme is arranged, and it has the serigraphy mask carrier that comprises the first breach, and described the first breach so consists of, and the bottom side is led in its top side from serigraphy mask carrier.Can settle the serigraphy mask in the bottom side of serigraphy mask carrier subsequently, the serigraphy mask has the second breach, and at least part of the first breach with this serigraphy mask carrier of wherein said the second breach overlaps.By the motion of the one or many scraper above serigraphy mask carrier, printed medium can be delivered on the base material that is positioned at its below through the first breach and the second breach.Printed medium does not arrive by serigraphy mask masked areas, thereby forms printed patterns at base material, and this printed patterns corresponds essentially to the breach of serigraphy mask.
The use of serigraphy and screen printing forme is known and tested for a long time.But along with the trace to be printed that for example is used for solar cell is more and more microminiaturized, following difficulty occurs, printed medium may pass narrow breach by screen printing forme and carry.In the situation that conductive trace is narrow, may wish that also conductor resistance is as far as possible little.This can so accomplish,, prints out relatively thick narrow trace that is.In serigraphy, easily accomplish to print such trace at present, it highly for example equals 20% of track width.This is corresponding to 1: 5 depth-width ratio of traces.If but it is less wish to print the wiring area of stitching on base material, simultaneously conductor resistance also keep as far as possible little, then the depth-width ratio of trace should be at least 1: 2,1: 1 or larger, for example be 2: 1.Have such requirement aspect the solar cell metallization, here, the width of printing metal trace should be as far as possible narrow, in order to cover little solar-electricity pool area and provide the large area of trying one's best that solar energy is converted to electric energy.
If print width less than narrow trace 60 microns and highly low with screen printing forme, following difficulty is then generally arranged, have the lower this narrow trace of reproducible height and mainly utilize screen printing technique manufacturing.The narrow thin metallization structure that for example comprises silver can be used as initiation layer in the solar cell metallization, be used for further electroplating applying.The metallization structure height of this initiation layer only needs the hundreds of nanometer this moment, but, utilizes present available screen printing forme to realize here.Can not reach this target as the photosensitive layer of serigraphy mask by exposure, can not adopt lithographic technique to reach this target.Really also have for example ink jet printing of other printing technology, can make whereby lower metallization structure height, but such technology is relatively costly and unreliable, this is because nozzle often stops up and thereby can't print.
Thereby a task is to provide a kind of screen printing forme, and its minimum compact mechanism is not subjected to the restriction of the structured techniques of serigraphy mask, and can utilize width less than the next reproducible ground of 60 microns trace and at low cost manufacturing.Another task of the present invention is to decide on the high or low application of trace height, in the depth-width ratio between open height and the width to realizing the trace of width less than 60 microns under the stable condition.
This task will be finished by the theme of independent claims.Favourable improvement project of the present invention is the theme of dependent claims.
According to screen printing forme of the present invention, it has: ground floor, described ground floor serve as serigraphy mask carrier, and described ground floor has the first breach, and described the first breach so consists of, that is, described the first breach leads to the bottom side from the top side of described ground floor; The second layer, the described second layer serves as the serigraphy mask, the described second layer is constituted as mask layer and firmly is connected with the bottom side of described ground floor, here, the described second layer has the second breach, described the second breach is at least part of to be overlapped with described first breach of ground floor, thereby printed medium can pass by described first breach of described ground floor described second breach of the described second layer from the top side of described ground floor is sent to the bottom side, and can be transported on the base material that can be placed in below, described bottom side, wherein, described first and/or the surface of described the second breach have coating, described coating has a thickness, described thickness equal each breach the minimum cross-section inner width at least 5%, wherein, the ratio of the maximum cross section inner width of the total height of described screen printing forme and not coated described the first breach and/or not coated described the second breach is less than 1: 1, and the ratio of the maximum cross section inner width of the total height of described screen printing forme and coated described the first breach and/or coated described the second breach was greater than 1: 1.
Therefore breach in the screen printing forme can be made according to present common size, wherein, the coating in this breach so that the remaining opening that penetrates obviously dwindle.In the situation that coating is relatively thick, can forms the remaining opening that penetrates less than 60 microns for printed medium, thereby utilize such serigraphy mask also can produce width less than 60 microns narrow trace.
Described first and/or the surface of the second breach preferably have coating, described coating has a thickness, described thickness equal each breach the minimum cross-section inner width at least 20%.
According to an embodiment of the invention, the water contact angle degree of described coating is in 0 °-90 ° scope.Contact angle refers to such angle, that is, and and the angle that the drop on the surface of solids relatively should the surface consists of.Therefore contact angle is in the situation that 0 ° of-90 ° of scope, the printed medium of liquid state or paste produces relative good reciprocation with coating surface, thereby when screen printing forme was removed from printed substrate, the major part of printed medium remained adhered in such coating breach.Thereby on base material, only stay the printing coating of relative thin, thereby can produce narrow and simultaneously thinner trace.
The plating initiation layer of realizing with the silver paste serigraphy for example can use in 1 micron thickness situation reliably.With regard to technology and economy, when function especially expensive when printed medium and product to be manufactured did not need a lot of material, this thickness need not greater than 2 microns to 5 microns.
If the water contact angle degree of described coating then only produces weak anastomosis in greater than 90 ° to 150 ° scope between printed medium and the coating surface.Under these circumstances, when screen printing forme was removed from base material, the printed medium that is added in the breach only had sub-fraction to stay in the breach.The result obtains width less than 60 microns narrow trace, and the height of this narrow trace can equal the height of screen printing forme.Therefore, this trace can have 1: 1 or larger depth-width ratio.
With reference to the following drawings other features and advantages of the present invention are described, wherein:
Fig. 1 illustrates the cross section of the first embodiment of screen printing forme of the present invention and printed substrate;
Fig. 2 illustrates the cross section of the second embodiment of screen printing forme of the present invention and printed substrate;
Fig. 3 illustrates the cross section of the 3rd embodiment of screen printing forme of the present invention and printed substrate;
Fig. 4 illustrates the cross section of the 4th embodiment of screen printing forme of the present invention and printed substrate.
Fig. 1 illustrates screen printing forme 1, its have comprise the first breach 4, serve as the ground floor 2 of serigraphy mask carrier and comprise the second layer 3 the second breach 5, that serve as the serigraphy mask.The first breach 4 has identical cross section inner width 8 with the second breach 5, and here, they are overlapped layout up and down.In these two breach 4 and 5, add coating 6, this coating 6 so that the residue inner width of breach 4 and 5 dwindle.Coating 6 in this embodiment along the setting of whole breach wall and have thickness 9, thereby the residue cross section inner width of breach 4 and 5 81 deducts the twice of coating layer thickness 9 values for width 8.
If for example by along the scraper of the top side of serigraphy mask carrier pulling process printed medium 30 being scraped breach 4 and 5 into coating 6, then printed medium 30 arrives and is located on the base material 20 of screen printing forme 1 below.At the water contact angle degree of this embodiment floating coat 6 in greater than 90 ° to 150 ° scope.Printed medium 30 only has weak reciprocation with coating 6 surfaces for this reason, thereby after base material 20 removes screen printing forme 1 (referring to arrow 50), stays printing coating 31, and it has height 10 and width 11.Width 11 is corresponding to residue breadth of penetration or the cross section inner width of coated breach, here, and height 10 height 7 corresponding to serigraphy mask 1.Shown in 1, even the depth-width ratio that the ratio of the total height 7 of screen printing forme 1 and the maximum cross section inner width 8 of uncoated breach 4 and 5 less than 1: 1, also can utilize the such screen printing forme 1 for printing coating 31 to obtain greater than 1: 1.
Have as the ground floor 2 of serigraphy mask carrier with as the screen printing forme 1 of the second layer 3 of serigraphy mask and can one consist of.So this two-layer 2 and 3 is only limited by the degree of depth of breach 4 and 5.But, can consist of ground floor 2 and the second layer 3 by two parts equally, these two parts are made by same or different material.According to the present invention, serigraphy mask carrier 2 is made by stainless steel foil.The serigraphy mask also can be made of the serigraphy mask.In another embodiment, the mask carrier is by only having the first breach 4 and consisting of with the paper tinsel film of mask layer combination, this mask layer is made by photosensitive emulsion, capillary-pipe film or solid resist based on polyvinyl alcohol, and perhaps the electroplating activity by preferred employing nickel produces.
In the second embodiment of screen printing forme of the present invention 1 shown in Figure 2, obtain almost with the first embodiment in the same structure.Coating 61 with width 12 is arranged in the breach 4 and 5 that all has cross section inner width 8, and its floating coat 61 is around being coated in breach 4 and 5.But be with the difference of the first embodiment, the water contact angle degree of coating 61 is in 0 °-90 ° scope.For this reason, between printed medium 30 and coating 61 surfaces, have relatively good reciprocation, thereby after base material 20 removes screen printing forme 1 (referring to arrow 50), the printed medium 30 under the seal only leaves coating slightly.The result stays printing coating 31 at base material 20, and it only has relatively little height 13.Therefore, can utilize such screen printing forme 1 to make the narrow trace with width 14 and height 13.The high wide ratio of this trace is less than 1: 1, still, and when breach 4,5 does not have coating, less than the absolute value of 60 microns the width 14 cross section inner width 8 less than breach 4 and 5.
In the 3rd embodiment of screen printing forme of the present invention shown in Figure 3, in the first breach, be provided with crossover 40.The wall of the wall of crossover 40 and the first breach 4 and the second breach 5 all has coating 63.The printed medium 30 that is added in the breach 4 can press down crossover, thereby can obtain relatively wide printing coating 31.The water contact angle degree of coating 63 is in 0 ° of-90 ° of scope.Thereby after base material 20 removes screen printing forme 1 (referring to arrow 50), in the first breach 4, stay relatively most printed medium 30, thereby on base material 20, can obtain lower printing coating 31, in the width range of this printing coating 31, it has the altitude profile shape of relative uniformity.
Fig. 4 illustrates the 4th embodiment of screen printing forme of the present invention.Breach 4 and 5 has coating 64, and the water contact angle degree of this coating is in 90 ° of-150 ° of scopes.Thereby after base material 20 removes screen printing forme 1 (referring to arrow 50), in the first breach 4, stay the printed medium 30 of relative fraction, thereby on base material 20, can obtain high printing coating 31, in the width range of this printing coating, it has relatively even altitude profile shape always.Dotted line 32 expressions are the altitude profile shape of the printing coating 31 after removing mask just, and here, solid line 33 is illustrated in the altitude profile shape of the printing coating 31 after printed medium 30 sidesways.In this embodiment, can produce the printing coating 31 with 1: 1 high Width.
Claims (4)
1. screen printing forme, it has:
Ground floor, described ground floor serve as serigraphy mask carrier, and described ground floor consists of with the stainless steel foil form and has the first breach, and described the first breach so consists of, that is, described the first breach leads to the bottom side from the top side of described ground floor,
The second layer, the described second layer serves as the serigraphy mask, the described second layer is constituted as mask layer and firmly is connected with the described bottom side of described ground floor, here, the described second layer has the second breach, described the second breach overlaps with described first breach of described ground floor at least partly, thereby printed medium can pass by described first breach of described ground floor described second breach of the described second layer from the top side of described ground floor is sent to bottom side, and can be transported on the base material that can be placed in below, described bottom side
Wherein, the surface of described the first breach and/or described the second breach has coating, and described coating has a thickness, described thickness equal each breach the minimum cross-section inner width at least 5%,
Wherein, the ratio of the maximum cross section inner width of the total height of described screen printing forme and not coated described the first breach and/or not coated described the second breach is less than 1: 1, and the ratio of the maximum cross section inner width of the total height of described screen printing forme and coated described the first breach and/or coated described the second breach was greater than 1: 1.
2. screen printing forme according to claim 1, wherein, the surface of described the first breach and/or described the second breach has coating, described coating has a thickness, described thickness equal each breach the minimum cross-section inner width at least 20%.
3. screen printing forme according to claim 1 and 2, wherein, the water contact angle degree of described coating is in 0 °-90 ° scope.
4. screen printing forme according to claim 1 and 2, wherein, the water contact angle degree of described coating is in greater than 90 ° to 150 ° scope.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009024873A DE102009024873A1 (en) | 2009-06-09 | 2009-06-09 | Screen printing form has layer as screen printing stencil carrier, where layer is provided with recesses that are formed such that they reach from upper side to lower side of layer |
DE102009024873.0 | 2009-06-09 | ||
PCT/DE2010/000643 WO2010142274A2 (en) | 2009-06-09 | 2010-06-09 | Screen printing frame |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103025528A true CN103025528A (en) | 2013-04-03 |
Family
ID=42675483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010800253081A Pending CN103025528A (en) | 2009-06-09 | 2010-06-09 | Screen printing frame |
Country Status (5)
Country | Link |
---|---|
CN (1) | CN103025528A (en) |
DE (2) | DE102009024873A1 (en) |
IT (1) | IT1400931B1 (en) |
NL (1) | NL2004844C2 (en) |
WO (1) | WO2010142274A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109673169A (en) * | 2016-09-21 | 2019-04-23 | 三星Sdi株式会社 | Solar cel electrode pattern forming method, the electrode and solar cell manufactured with it |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2481079B (en) * | 2009-09-21 | 2014-06-25 | Dtg Int Gmbh | Printing screens and method of fabricating the same |
DE102011003287A1 (en) * | 2011-01-27 | 2012-08-02 | Christian Koenen Gmbh | Printing template for applying a printing pattern to a substrate and method for producing a printing stencil |
DE102011016453A1 (en) * | 2011-04-08 | 2013-01-17 | Universität Stuttgart | Process for producing a screen printing form and solar cell produced therewith |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1148830A (en) * | 1994-07-07 | 1997-04-30 | 弗兰西斯·布里埃 | Stencil for depositing and portioning variously thick spot layers of a viscous material |
CN1392762A (en) * | 2001-06-01 | 2003-01-22 | 日本电气株式会社 | Printing soldering tin paste on soldering area of printed circuit board and having rised printing mask with through hole |
DE10231698A1 (en) * | 2002-03-26 | 2003-10-23 | Fraunhofer Ges Forschung | Process for improving the transfer of additive material to support used in the production of printed circuit boards comprises using template having openings with coating for the structured transfer of the additive material to the support |
US20030222125A1 (en) * | 2002-05-17 | 2003-12-04 | Fleck Ian Mcphee | Solder printing using a stencil having a reverse-tapered aperture |
US20050268801A1 (en) * | 1998-02-24 | 2005-12-08 | Chad Cobbley | Method and stencil for extruding material on a substrate |
US20090081823A1 (en) * | 2007-09-20 | 2009-03-26 | Fry's Metals, Inc. | Electroformed stencils for solar cell front side metallization |
CN102202907A (en) * | 2008-09-26 | 2011-09-28 | Nb技术股份有限公司 | Screen printing frame |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1337578A (en) * | 1969-12-17 | 1973-11-14 | Du Pont | Method of decreasing the wettability of surfaces |
JPH09277487A (en) * | 1996-02-16 | 1997-10-28 | Riso Kagaku Corp | Plate making method of thermosensible stencil base sheet, thermosensible stencil base sheet using it, and composition |
DE10200181A1 (en) * | 2001-10-12 | 2003-04-30 | Daniel Mahler | Screen printing form and process for its production |
TWI458648B (en) * | 2006-04-07 | 2014-11-01 | Mitsubishi Paper Mills Ltd | A method for manufacturing a photographic mask for printing a resin, and a screen printing mask for resin |
-
2009
- 2009-06-09 DE DE102009024873A patent/DE102009024873A1/en not_active Ceased
-
2010
- 2010-06-08 NL NL2004844A patent/NL2004844C2/en not_active IP Right Cessation
- 2010-06-09 CN CN2010800253081A patent/CN103025528A/en active Pending
- 2010-06-09 WO PCT/DE2010/000643 patent/WO2010142274A2/en active Application Filing
- 2010-06-09 IT ITVI2010A000158A patent/IT1400931B1/en active
- 2010-06-09 DE DE202010007774U patent/DE202010007774U1/en not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1148830A (en) * | 1994-07-07 | 1997-04-30 | 弗兰西斯·布里埃 | Stencil for depositing and portioning variously thick spot layers of a viscous material |
US20050268801A1 (en) * | 1998-02-24 | 2005-12-08 | Chad Cobbley | Method and stencil for extruding material on a substrate |
CN1392762A (en) * | 2001-06-01 | 2003-01-22 | 日本电气株式会社 | Printing soldering tin paste on soldering area of printed circuit board and having rised printing mask with through hole |
DE10231698A1 (en) * | 2002-03-26 | 2003-10-23 | Fraunhofer Ges Forschung | Process for improving the transfer of additive material to support used in the production of printed circuit boards comprises using template having openings with coating for the structured transfer of the additive material to the support |
US20030222125A1 (en) * | 2002-05-17 | 2003-12-04 | Fleck Ian Mcphee | Solder printing using a stencil having a reverse-tapered aperture |
US20090081823A1 (en) * | 2007-09-20 | 2009-03-26 | Fry's Metals, Inc. | Electroformed stencils for solar cell front side metallization |
CN102202907A (en) * | 2008-09-26 | 2011-09-28 | Nb技术股份有限公司 | Screen printing frame |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109673169A (en) * | 2016-09-21 | 2019-04-23 | 三星Sdi株式会社 | Solar cel electrode pattern forming method, the electrode and solar cell manufactured with it |
CN109673169B (en) * | 2016-09-21 | 2022-02-22 | 上海匠聚新材料有限公司 | Method for forming electrode pattern of solar cell, electrode manufactured by using same, and solar cell |
Also Published As
Publication number | Publication date |
---|---|
NL2004844A (en) | 2010-12-13 |
DE202010007774U1 (en) | 2010-09-02 |
DE102009024873A1 (en) | 2010-12-16 |
IT1400931B1 (en) | 2013-07-02 |
NL2004844C2 (en) | 2011-06-09 |
WO2010142274A2 (en) | 2010-12-16 |
ITVI20100158A1 (en) | 2010-12-10 |
WO2010142274A3 (en) | 2013-03-21 |
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Application publication date: 20130403 |