CN103223768A - Metal printing template with different diaphragm thicknesses formed by single printing - Google Patents
Metal printing template with different diaphragm thicknesses formed by single printing Download PDFInfo
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- CN103223768A CN103223768A CN2012100216280A CN201210021628A CN103223768A CN 103223768 A CN103223768 A CN 103223768A CN 2012100216280 A CN2012100216280 A CN 2012100216280A CN 201210021628 A CN201210021628 A CN 201210021628A CN 103223768 A CN103223768 A CN 103223768A
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- perforate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
Abstract
The invention discloses a metal printing template with different diaphragm thicknesses formed by single printing. The metal printing template mainly comprises a metal diaphragm defined with a first diaphragm thickness coating region and a second diaphragm thickness coating region in different printing diaphragm thicknesses, wherein the first diaphragm thickness coating region is a homalographic open pore penetrating from an attachment surface to a printing surface; the second diaphragm thickness coating region comprises a plurality of array micropores; and the porosity of the array micropores accounts for 40-90% of the area ratio of the second diaphragm thickness coating region.
Description
Technical field
The present invention is particularly to the cut metal stencil that a kind of one-step print forms different thickness about in order to form the printing apparatus of accurate coating.
Background technology
In traditional electronic building brick processing procedure, is lower-cost pattern formation technology with screen painting (screen printing) with stencilization (stencil printing), special a large amount of productions applicable to solar cell, laminated ceramic electric capacity, other lamination type or film-type electronic product.Yet screen painting can't once advance to improve because of pattern reproduction, precision and resolution ratio that the half tone that uses has knot order that netting twine and netting twine interlock to cause printing formation.Thereby, the applicant is at TaiWan, China patent of invention I299304 " cut metal stencil and using method thereof ", TaiWan, China patent of invention I306061 " multiple field cut metal stencil and manufacture method thereof " and the novel patent M388414 of TaiWan, China " cut metal stencil ", multiple tool that can high-accuracy stencilization is provided, its main body is the single or multiple lift metal film of precise electrotyping, all is to improve the shortcoming of traditional screen painting.
In addition, have the needs that the printed patterns coating requires to have different-thickness at the specific electron product, according to existing screen printing technology then needs designs two cover different patterns half tone and carry out two (many) roads printing operation, the half tone of the first impression have simultaneously than the thick coating layer of film with than the corresponding pattern of the thick coating layer of thick film, carry out the second impression after the drying again, the half tone of the second impression only has the corresponding pattern than the thick coating layer of thick film, also need to dry once more after the second impression, not only processing procedure efficient is relatively poor, and the bit errors of twice printing also can cause the thickness deficiency than the thick coating layer of thick film directly to broaden with line.Therefore, client wishes that the needs that form different-thickness printed patterns coating with one-step print can be arranged in the high-accuracy stencilization processing procedure that pattern forms.
Summary of the invention
In view of this, the technical problem to be solved in the present invention is to provide a kind of one-step print to form the cut metal stencil of different thickness, can reach one-step print and form the effect that two (many) plant the patterning coating of different thickness.
Of the present invention time a purpose is to provide a kind of one-step print to form the cut metal stencil of different thickness, to open the problem of fission shape in the metallic membrane easily than the thick applying area of thick film.
A further object of the present invention is to provide a kind of one-step print to form the cut metal stencil of different thickness, accumulates easily to be stained with and sticks in making the special construction that forms different thickness applying area to improve printing coatings, as the filler breach of array micropore, link overline bridge etc.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
In aforesaid cut metal stencil, this metallic membrane can be not more than central point between those array micropores to 1/2nd of the pitch of central point at the entity bar width between those array micropores.
In aforesaid cut metal stencil, this homalographic perforate can be a long slot bore.
In aforesaid cut metal stencil, can comprise a plurality of binding overline bridges in addition, its one is connected in the long limit of two symmetries of this homalographic perforate of this metallic membrane, to prevent from when stretching this metallic membrane, to cause the cracking of long slot bore, and those link overline bridge and do not protrude in this printing surface, and those thickness that link overline bridge can make each link overline bridge and be formed with a filler breach at the position towards this attaching face less than this metallic membrane by the thickness of this attaching face to this printing surface.
In aforesaid cut metal stencil, this homalographic perforate can have a link that extends in this second thickness applying area.
In aforesaid cut metal stencil, this link of this homalographic perforate can be between two array micropores of adjacent row.
In aforesaid cut metal stencil, this homalographic perforate can run through this second thickness applying area.
In aforesaid cut metal stencil, this metallic membrane can be an electroforming steel version, and its thickness is between 15 ~ 300 microns.
In aforesaid cut metal stencil, can comprise in addition:
One first lubricant film layer is formed on this printing surface;
One second lubricant film layer is formed in the hole wall of this homalographic perforate; And
One the 3rd lubricant film layer is formed in the hole wall of those array micropores.
In aforesaid cut metal stencil, this homalographic perforate can be a long slot bore and has the long limit of two symmetries, and this cut metal stencil can comprise in addition:
A plurality of binding overline bridges, its one are connected in this long limit of two symmetries of this homalographic perforate of this metallic membrane; And
One the 4th lubricant film layer is formed at those binding overline bridges and is emerging in this homalographic perforate interior side and bottom surface.
Description of drawings
Fig. 1 forms the floor map of the cut metal stencil of different thickness for a kind of one-step print of one first specific embodiment of the present invention.
Fig. 2 is the part plan schematic diagram of this cut metal stencil of one first specific embodiment of the present invention.
Fig. 3 is the plane enlarged diagram of this cut metal stencil of one first specific embodiment of the present invention at two thickness applying area places.
Fig. 4 is the schematic perspective view of this cut metal stencil of one first specific embodiment of the present invention at the 3rd figure.
Fig. 5 is the cut-away illustration of this cut metal stencil of one first specific embodiment of the present invention along the 4th Fig. 5-5 line.
Fig. 6 A and Fig. 6 B are that this cut metal stencil of one first specific embodiment of the present invention forms the schematic cross-section of the patterning coating of the different thickness of two (many) kinds with using the back in use on a substrate.
Fig. 7 forms the part plan schematic diagram of the cut metal stencil of different thickness for the another kind of one-step print of one second specific embodiment of the present invention.
Fig. 8 is the plane enlarged diagram of this cut metal stencil of one second specific embodiment of the present invention at two thickness applying area places.
Fig. 9 is the schematic perspective view of this cut metal stencil of one second specific embodiment of the present invention at the 8th figure.
[primary clustering symbol description]
100 cut metal stencil, 110 metallic membranes
111 attaching faces, 112 printing surfaces
113 first thickness applying area, 114 second thickness applying area
Two array micropores of the adjacent row of 115 array micropore 115A
The most contiguous array micropore 116 links of 115B
120 link overline bridge 121 filler breach
130 frame pattern plates, 131 openings
141 first lubricant film layers, 142 second lubricant film layers
143 the 3rd lubricant film layers 144 the 4th lubricant film layer
200 cut metal stencil, 310 things to be printed
320 scrapers, 330 coating
331 first thickness coating layers, 332 second thickness coating layers
Central point is to the pitch of central point between the P array micropore
The entity bar width of W1 between the array micropore
The W2 link is to the distance of the most contiguous array micropore
T1 is by first thickness of attaching face to printing surface
T2 links second thickness of overline bridge.
The specific embodiment
Below will cooperate appended diagram to describe embodiments of the invention in detail, so it should be noted, those diagrams are the schematic diagram of simplification, only basic framework of the present invention or implementation method are described with illustrative method, so only show assembly and the syntagmatic relevant with the present invention, shown assembly is not that number, shape, the size implemented with reality are done equal proportion and drawn among the figure, and some dimension scale and other relative dimensions ratios or exaggerated or simplify processing are to provide clearer description.Actual number, shape and the dimension scale of implementing is a kind of design of putting property of choosing, and detailed assembly layout may be more complicated.
According to first specific embodiment of the present invention, the cut metal stencil that a kind of one-step print forms different thickness is illustrated in the 5-5 line cut-away illustration along Fig. 4 at schematic perspective view and Fig. 5 of the 3rd figure of the plane enlarged diagram at two thickness applying area places, Fig. 4 of part plan schematic diagram, Fig. 3 of floor map, Fig. 2 of Fig. 1.The present invention discloses the cut metal stencil 100 that a kind of one-step print forms different thickness, mainly comprise a metallic membrane 110, this metallic membrane 110 has an attaching face 111 and a printing surface 112, and definition has the one first thickness applying area 113 and the one second thickness applying area 114 of different printing thickness.Usually this metallic membrane 110 is upheld and is attached at a frame pattern plate 130 times, and the printing surface 112 of this metallic membrane 110 is revealed in the opening 131 of this frame pattern plate 130.This attaching face 111 is in order to be pasted to a thing 310 to be printed (as shown in Figure 6A), and this thing 310 to be printed can be the master slice of an electronic building brick, as solar cell substrate, light emitting diode wafer, IC wafers, passive component pottery master slice or base plate for packaging master slice or the like.This printing surface 112 is the scraped finish surface of scraper 320, the surface (as shown in Figure 6A) that can supply coating 330 to insert, and this coating 330 can be conductive paste, for example silver paste or copper cream or the like.In the present embodiment, this metallic membrane 110 can be an electroforming steel version, and its one first thickness T 1 that has is between 15 ~ 300 microns, and promptly this metallic membrane 110 can be single layer structure for the precise electrotyping membrane structure of no stratum reticulare.And the material of this metallic membrane 110 is nickel or nickel cobalt (Ni-Co) alloy, hard and smooth comparatively, in the time of reducing printing printing ink be stained with glutinously, help the operation of steel plate printing.
This first thickness applying area 113 is one to run through the homalographic perforate of this attaching face 111 and this printing surface 112, in other words, the area size of this first thickness applying area 113 is defined by this homalographic perforate, and the hole wall of this homalographic perforate is as the edge of this first thickness applying area 113.In the present embodiment, this homalographic perforate can be a long slot bore and has the long limit of two symmetries, generally speaking can have a narrow width for the homalographic perforate of long slot bore form (i.e. this first thickness applying area 113), promptly this two symmetry is grown the clearance distance on limits, can be about 1 ~ 10000 micron (can be lower than 1cm), more specifically can be between 10 ~ 100 microns.As shown in Figures 3 and 4, the width of this homalographic perforate (i.e. this first thickness applying area 113) is less than the pitch P of a plurality of array micropores 115 in this second thickness applying area 114, and parallel near those array micropores 115 to edge or aperture, for example: form when this homalographic perforate (i.e. this first thickness applying area 113) provides the circuit as solar cell, the width of this homalographic perforate (i.e. this first thickness applying area 113) specifically can be 50 ~ 70 microns.In addition, the length on these two symmetrical long limits of this homalographic perforate (i.e. this first thickness applying area 113) reaches several centimeters to tens of centimetres, can do the extension variation or the connection of suitable length according to product demand.As shown in Figure 2, a plurality of homalographic perforates (i.e. this first thickness applying area 113) can connect into the pectination slotted eye.
Include this a plurality of array micropores 115 in this second thickness applying area 114, the percent opening of those array micropores 115 accounts for 40% ~ 90% area ratio of this second thickness applying area 114, wherein so-called percent opening is female number with the sum total of all hole areas of those array micropores 115 as subnumber and with the area of this second thickness applying area 114, the percentage that subnumber obtains divided by female number.And the area size of this second thickness applying area 114 is defined by peripheral sideline around the row at the edge of those array micropores 115 and the row.The percent opening of those array micropores 115 is answered corresponding coating stickiness and is limited to a particular range, when percent opening of those array micropores 115 too high (as the fine mesh structure) or hole depth deficiency, can't reach the thinning coating of being scheduled to, and, when stretching this metallic membrane 110 or scraper wiper, will rupture easily between those array micropores 115; Otherwise, cross when low when the percent opening of those array micropores 115, represent that the entity bar width between those array micropores 115 is excessive, will be difficult for opening up loosing by the coating of deriving in those array micropores 115 and connect into a coating.More specifically, the percent opening of those array micropores 115 accounts for 50% ~ 80% area ratio of this second thickness applying area 114.In addition, have between those array micropores 115 central point to a fixed knot of central point apart from P.Usually the pitch P of those array micropores 115 can be not more than 100 microns (μ m), the aperture of those array micropores 115 or long limit can be not less than those array micropores 115 pitch P 1/2nd, for example be about 50 microns, arrange to reach densification.In the present embodiment, those array micropores 115 are square opening.More specifically, see also Fig. 4, this metallic membrane 110 can be not more than central point between those array micropores 115 to 1/2nd of the pitch P of central point in the entity bar width W between those array micropores 115, can guarantee this metallic membrane 110 after printing since thing to be printed when breaking away from originally the coating those array micropores 115 in can on thing to be printed, open up the diffusing thinning coating that connects into.In addition, the hole depth of those array micropores 115 can be equivalent to this metallic membrane 110 by first thickness T 1 of this attaching face 111 to this printing surface 112.And the long edge lengths of this homalographic perforate (i.e. this first thickness applying area 113) is the aperture or long more than tens of times of limit of those array micropores 115, even can reach thousand times.In the present embodiment, above-mentionedly include the formation that these a plurality of array micropore 115 these second thickness applying area 114 can provide the bus wire (bus) as solar cell.
As shown in Figure 6A, when using this cut metal stencil 100 to carry out stencilization, this attaching face 111 of this metallic membrane 110 is pasted to this thing 310 to be printed, utilize this scraper 320 wiper on this printing surface 112 of this metallic membrane 110, make coating 330 insert to this homalographic perforate (i.e. the first thickness applying area 113) with this second thickness applying area 114 in those array micropores 115 in.Shown in Fig. 6 B, after breaking away from this cut metal stencil 100, coating 330 will form one first thickness coating layer 331 on this thing 310 to be printed in this homalographic perforate, coating 330 will be opened up diffusing the connection mutually and form one second thickness coating layer 332 on this thing 310 to be printed in those array micropores 115, and be connected to this first thickness coating layer 331, wherein the thickness of this second thickness coating layer 332 can be significantly less than the thickness of this first thickness coating layer 331, for example below 2/3rds of thickness of this first thickness coating layer 331.In the present embodiment, the thickness of this first thickness coating layer 331 approximately can be at 31 ~ 50 microns, and the thickness of this second thickness coating layer 332 approximately can be at 10 ~ 30 microns.Therefore, utilize cut metal stencil 100 of the present invention can in one-step print, form the coating layer 331,332 of different thickness, can save known repeatedly the processing procedure time and the cost of printing, also not have the offset deviation of coating layer misalignment in the known repeatedly printing.
Preferably, this cut metal stencil 100 can comprise a plurality of binding overline bridges 120 in addition, its one is connected in this long limit of two symmetries of this homalographic perforate of this metallic membrane 110, to prevent causing when this metallic membrane 110 of tension opening of long slot bore to split, promptly in order to improve in this metallic membrane 110 in order to form the problems that the first thickness applying area 113 thick than thick film opened fission shape easily.And those binding overline bridges 120 are preferably and do not protrude in this printing surface 112, not influence the operation of scraper.Preferably, but those link overline bridge 120 coplines ground and be aligned in this printing surface 112, make when making those link overline bridges 120 and can carry out more easily during presswork, and can prevent when presswork that coating is stained with and stick above those binding overline bridges 120.And, each links overline bridge 120 and is formed with a filler breach 121 at the position towards this attaching face 111, be those one second thickness T 2 that link overline bridges 120 less than this metallic membrane 110 by first thickness T 1 of this attaching face 111 to this printing surface 112, look this first thickness applying area 113 (i.e. this homalographic perforate) by the sight of this attaching face 111 directions, it has the bore edges of connection, to guarantee the continuous formation of coating line pattern on thing to be printed, and look this first thickness applying area 113 (being the homalographic perforate) by these printing surface 112 sights, it can be interrupted shape long slot bore form.Particularly, those binding overline bridges 120 can be made in the electroforming processing procedure so as this metallic membrane 110.Specifically, those materials that link overline bridges 120 can be selected from one of them of nickel, nickel alloy, copper, copper alloy, can be material identical or inequality with this metallic membrane 110, because linking overline bridge 120, those also can utilize the electroforming processing procedure to make, so can in this homalographic perforate, produce the individual layer or the metal structure of composite bed easily.In addition, those link overline bridges 120 have one with the long limit of the two symmetries width in the same way of this homalographic perforate, it can be not more than the gap (be the width of this homalographic perforate that be long slot bore form) of the corresponding first thickness applying area 113 on this long limit of two symmetries, to reduce the corresponding first thickness applying area 113, help coating and insert and fill up corresponding filler breach 121 fast by the unit maximum area that those link overline bridges 120 cover.More specifically, those second thickness T 2 that link overline bridges 120 can relatively define the degree of depth of this filler breach 121 between sixth to three/two of first thickness T 1 of this metallic membrane 110.In the present embodiment, the thickness of this metallic membrane 110 is about 50 microns, and those thickness that link overline bridge 120 can be between 20 ~ 25 microns or lower.In addition, preferably, those binding overline bridges 120 can be and equidistantly are arranged in each first thickness applying area 113, to meet with stresses equably.Therefore, those link the following of overline bridges 120 can be for coating by to spread to the horizontal plane of this attaching face 111, and can strengthen and the long slot bore structure that supports this homalographic perforate, the generation gap, two symmetry length limits that prevents this first thickness applying area 113 when stencilization changes or long slot bore is opened the effect of splitting so have.
Preferably, this homalographic perforate (i.e. this first thickness applying area 113) can have a link 116 that extends in this second thickness applying area 114.Of the present invention one more specifically in the structure, this link 116 of this homalographic perforate can make this link 116 to the distance W 2 of the most contiguous array micropore 115B be not more than the entity bar width W 1 of this metallic membrane 110 between those array micropores 115 between two array micropore 115A of adjacent row.Therefore, shown in Fig. 6 B, this structure is guaranteed that just this first thickness coating layer 331 is connected with opening up mutually of this second thickness coating layer 332 is diffusing, after heat-agglomerating, this first thickness coating layer 331 can become conducting wire thicker and can be thinner, what this second thickness coating layer 332 can become thin and broad is electrically conducted bus (bus), and both electrically connect mutually.
As shown in Figure 5, in a preferred embodiment, this cut metal stencil 100 can comprise one in addition and be formed at second lubricant film layer 142 and that first lubricant film layer 141, on this printing surface 112 is formed at the hole wall of this homalographic perforate and be formed at the 3rd lubricant film layer 143 in the hole wall of those array micropores 115.Those lubricant film layers 141,142,143 can be the identical lubricated material of organic or inorganic (iron dragon not for example of the coating tool not being stained with glutinous characteristic, molybdenum oxide, aluminium oxide, talcum powder etc.) and with suitable surface treatment mode formation its thickness is controlled between 0.1 ~ 20 micron, more specifically can be controlled in 0.5 ~ 5 micron, the effect that most coating can be printed on the effect of thing 310 to be printed and make these printing surface 112 scratch resistance cutter scraped finishes when being provided in not to be stained with in the holes such as this homalographic perforate and those array micropores 115 glutinous coating in order to the demoulding is so can further control both film thickness differences of being scheduled to of this first thickness coating layer 331 and this second thickness coating layer 332 well.Wherein, concrete formation method about those lubricant film layers 141,142,143, can utilize compound plating (or can be analyse plating) mode forms to have those lubricant film layers 141,142,143, promptly in plating bath, add the organic or inorganic particle in attached to holes such as this homalographic perforate and those array micropores 115.Perhaps, those lubricant film layers 141,142,143 can be the metal lubrication material of the coating tool not being stained with glutinous characteristic, and can be formed in the surface and hole wall of this metallic membrane 110 with plating mode.For example, in another concrete formation method of those lubricant film layers 141,142,143, when the material of those lubricant film layers 141,142,143 is metal oxide, can plate corresponding metal earlier and give oxidation processes again and get final product, for example the anode of aluminum or aluminum alloy is handled.
Specifically, again as shown in Figure 5, when this homalographic perforate (i.e. this first thickness applying area 113) can be a long slot bore and when having the long limits of two symmetrical minor faces and two symmetries, except preferably including a plurality of binding overline bridges 120, this cut metal stencil 100 can comprise one the 4th lubricant film layer 144 in addition, is formed at those binding overline bridges 120 and is emerging in this homalographic perforate interior side and bottom surface.As shown in Figure 6A, utilize the 4th lubricant film layer 144 will help flowing of coating 330 in order to filling up the filler breach 121 that those link overline bridge 120 belows.Therefore, cut metal stencil of the present invention can be improved printing coatings and accumulates easily to be stained with and stick in making the special construction that forms different thickness applying area, and for example those array micropores or those link the filler breach of overline bridges etc.
According to second specific embodiment of the present invention, the cut metal stencil that another kind of one-step print forms different thickness is disclosed, illustrate Fig. 7 part plan schematic diagram, Fig. 8 at the plane enlarged diagram at two thickness applying area places and the schematic perspective view of Fig. 9 at Fig. 8.Wherein, will continue to use same reference numbers with the assembly of the first specific embodiment same names.This cut metal stencil 200 mainly comprises a metallic membrane 110.As first specific embodiment, mainly comprise a metallic membrane 110, this metallic membrane 110 has an attaching face 111 and a printing surface 112, and definition has the one first thickness applying area 113 and the one second thickness applying area 114 of different printing thickness, wherein this first thickness applying area 113 is one to run through the homalographic perforate of this attaching face 111 and this printing surface 112, include a plurality of array micropores 115 in this second thickness applying area 114, the percent opening of those array micropores 115 accounts for 40% ~ 90% area ratio of this second thickness applying area 114.In the present embodiment, this homalographic perforate (i.e. this first thickness applying area 113) can run through this second thickness applying area 114, to guarantee being connected to the thin second thickness coating layer that is formed by this second thickness applying area 114 by the thicker first thickness coating layer that this first thickness applying area 113 forms.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limiting the present invention, anyly be familiar with this technical staff, in not breaking away from technical scope of the present invention, any simple modification of being done, equivalence change and modify, and all still belong in the technical scope of the present invention.
Claims (10)
1. an one-step print forms the cut metal stencil of different thickness, it is characterized in that, comprises:
One metallic membrane, have an attaching face and a printing surface, and definition has the one first thickness applying area and the one second thickness applying area of different printing thickness, wherein this first thickness applying area is one to run through the homalographic perforate of this attaching face and this printing surface, include a plurality of array micropores in this second thickness applying area, the percent opening of those array micropores accounts for 40% ~ 90% area ratio of this second thickness applying area.
2. form the cut metal stencil of different thickness according to the one-step print of claim 1, it is characterized in that, this metallic membrane is not more than central point between those array micropores to 1/2nd of the pitch of central point at the entity bar width between those array micropores.
3. form the cut metal stencil of different thickness according to the one-step print of claim 1, it is characterized in that, this homalographic perforate is a long slot bore.
4. form the cut metal stencil of different thickness according to the one-step print of claim 3, it is characterized in that, other comprises a plurality of binding overline bridges, its one is connected in this long limit of two symmetries of this homalographic perforate of this metallic membrane, to prevent from when stretching this metallic membrane, to cause the cracking of long slot bore, and those link overline bridge and do not protrude in this printing surface, and each binding overline bridge is formed with a filler breach at the position towards this attaching face.
5. form the cut metal stencil of different thickness according to the one-step print of claim 3 or 4, it is characterized in that, this homalographic perforate has a link that extends in this second thickness applying area.
6. form the cut metal stencil of different thickness according to the one-step print of claim 5, it is characterized in that, this link of this homalographic perforate is between two array micropores of adjacent row.
7. form the cut metal stencil of different thickness according to the one-step print of claim 3 or 4, it is characterized in that, this homalographic perforate runs through this second thickness applying area.
8. form the cut metal stencil of different thickness according to the one-step print of claim 1, it is characterized in that, this metallic membrane is an electroforming steel version, it is characterized in that, its one first thickness that has is between 15 ~ 300 microns.
9. form the cut metal stencil of different thickness according to the one-step print of claim 1, it is characterized in that other comprises:
One first lubricant film layer is formed on this printing surface;
One second lubricant film layer is formed in the hole wall of this homalographic perforate; And
One the 3rd lubricant film layer is formed in the hole wall of those array micropores.
10. form the cut metal stencil of different thickness according to the one-step print of claim 9, it is characterized in that, this homalographic perforate is that a long slot bore has the long limit of two symmetries, and this cut metal stencil comprises in addition:
A plurality of binding overline bridges, its one are connected in this long limit of two symmetries of this homalographic perforate of this metallic membrane; And
One the 4th lubricant film layer is formed at those binding overline bridges and is emerging in this homalographic perforate interior side and bottom surface.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210021628.0A CN103223768B (en) | 2012-01-31 | 2012-01-31 | Metal printing template with different diaphragm thicknesses formed by single printing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210021628.0A CN103223768B (en) | 2012-01-31 | 2012-01-31 | Metal printing template with different diaphragm thicknesses formed by single printing |
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| CN103223768A true CN103223768A (en) | 2013-07-31 |
| CN103223768B CN103223768B (en) | 2015-01-14 |
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| GB2521344A (en) * | 2013-10-27 | 2015-06-24 | Asm Assembly Systems Switzerland Gmbh | Printing screens, methods of fabricating the same and methods of screen printing |
| CN105658433A (en) * | 2013-10-27 | 2016-06-08 | 先进装配系统瑞士有限公司 | Printing screens, methods of fabricating the same and methods of screen printing |
| CN105436476A (en) * | 2014-09-18 | 2016-03-30 | 仓和股份有限公司 | Liquid metal screen cloth and manufacturing method thereof |
| CN105436476B (en) * | 2014-09-18 | 2018-12-28 | 仓和股份有限公司 | liquid metal screen cloth and its manufacturing method |
| CN107031174A (en) * | 2015-11-20 | 2017-08-11 | 先进装配系统有限责任两合公司 | Method and apparatus for selecting a paste stencil for paste printing by means of the selected paste stencil and applying paste to a substrate |
| CN107398392A (en) * | 2017-07-31 | 2017-11-28 | 京东方科技集团股份有限公司 | A kind of silk-screen half tone |
| US11297719B2 (en) * | 2018-03-07 | 2022-04-05 | Interlatin S De Rl De Cv | Template that improves solder-paste stenciling and production method thereof |
| CN113320278A (en) * | 2021-06-11 | 2021-08-31 | 江阴嘉仕德网业有限公司 | High-strength low-extension printing silk screen and production process thereof |
| CN113320278B (en) * | 2021-06-11 | 2022-03-15 | 江阴嘉仕德网业有限公司 | High-strength low-extension printing silk screen and production process thereof |
| TWI820452B (en) * | 2021-07-19 | 2023-11-01 | 倉和股份有限公司 | Coated printing screen and production method thereof |
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