CN103223768B - Metal printing template with different diaphragm thicknesses formed by single printing - Google Patents
Metal printing template with different diaphragm thicknesses formed by single printing Download PDFInfo
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- CN103223768B CN103223768B CN201210021628.0A CN201210021628A CN103223768B CN 103223768 B CN103223768 B CN 103223768B CN 201210021628 A CN201210021628 A CN 201210021628A CN 103223768 B CN103223768 B CN 103223768B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
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Abstract
The invention discloses a metal printing template with different diaphragm thicknesses formed by single printing. The metal printing template mainly comprises a metal diaphragm defined with a first diaphragm thickness coating region and a second diaphragm thickness coating region in different printing diaphragm thicknesses, wherein the first diaphragm thickness coating region is a homalographic open pore penetrating from an attachment surface to a printing surface; the second diaphragm thickness coating region comprises a plurality of array micropores; and the porosity of the array micropores accounts for 40-90% of the area ratio of the second diaphragm thickness coating region.
Description
Technical field
The present invention, about the printing apparatus in order to form fine layers, is particularly to the cut metal stencil that a kind of one-step print forms different thickness.
Background technology
In traditional electronic building brick processing procedure, with screen painting (screen printing) and stencilization (stencil printing) for lower-cost pattern formation technology, be applicable to a large amount of productions of solar cell, laminated ceramic electric capacity, other lamination type or thin film-type electronic product especially.But screen painting cannot enter once improved because the half tone knot order that has netting twine and netting twine to interlock used causes printing the pattern reproduction, precision and the resolution ratio that are formed.Thus, applicant is at TaiWan, China patent of invention I299304 " cut metal stencil and using method thereof ", TaiWan, China patent of invention I306061 " Multilayer metal printing template and manufacture method thereof " and TaiWan, China new patent M388414 " cut metal stencil ", there is provided multiple can the tool of high-accuracy stencilization, its main body is the single or multiple lift metal film of precise electrotyping, is all the shortcoming improving traditional screen painting.
In addition, the needs that printed patterns coating needs has different-thickness are had at specific electron product, design two is then needed to overlap the half tone of different pattern and carry out two (many) roads printing operation according to existing screen printing technology, the half tone of the first printing has compared with the thick coating layer of film and the corresponding pattern compared with the thick coating layer of thick film simultaneously, the second printing is carried out again after drying, the half tone of the second printing only has the corresponding pattern compared with the thick coating layer of thick film, also need after the second printing again to dry, not only process efficiency is poor, and the bit errors of twice printing also can cause and broaden with wire diameter compared with the thickness deficiency of the thick coating layer of thick film.Therefore, in the high-accuracy stencilization processing procedure of pattern formation, client wishes there are the needs forming different-thickness printed patterns coating with one-step print.
Summary of the invention
In view of this, the technical problem to be solved in the present invention is to provide a kind of one-step print to form the cut metal stencil of different thickness, can reach one-step print and form effect that two (many) plant the patterning coating of different thickness.
Of the present invention time an object is to provide a kind of one-step print to form the cut metal stencil of different thickness, easily to open the problem of fission shape in metallic membrane compared with the thick applying area of thick film.
Another object of the present invention is to provide a kind of one-step print to form the cut metal stencil of different thickness, easily accumulates to be stained with stick in the special construction making the different thickness applying area of formation, as the filler breach etc. of array micropore, link overline bridge to improve printing coatings.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
In aforesaid cut metal stencil, the entity bar width of this metallic membrane between those array micropores can be not more than central point between those array micropores to central point pitch 1/2nd.
In aforesaid cut metal stencil, this homalographic perforate can be a long slot bore.
In aforesaid cut metal stencil, separately can comprise a plurality of link overline bridge, it is integrally connected to two symmetrical long limits of this homalographic perforate of this metallic membrane, to prevent the cracking causing long slot bore when stretching this metallic membrane, and those link overline bridge and do not protrude from this printing surface, and those link thickness of overline bridges can be less than this metallic membrane by this attaching face to the thickness of this printing surface, makes each link overline bridge and is being formed with a filler breach towards the position in this attaching face.
In aforesaid cut metal stencil, this homalographic perforate can have one and extend to link in this second thickness applying area.
In aforesaid cut metal stencil, this link of this homalographic perforate can between two array micropores of most adjacent row.
In aforesaid cut metal stencil, this homalographic perforate can run through this second thickness applying area.
In aforesaid cut metal stencil, this metallic membrane can be an electroforming steel version, and its thickness is between 15 ~ 300 microns.
In aforesaid cut metal stencil, can separately comprise:
One first lubricant film layer, is formed on this printing surface;
One second lubricant film layer, is formed in the hole wall of this homalographic perforate; And
One the 3rd lubricant film layer, is formed in the hole wall of those array micropores.
In aforesaid cut metal stencil, this homalographic perforate can be a long slot bore and has two symmetrical long limits, and this cut metal stencil can separately comprise:
A plurality of link overline bridge, it is integrally connected to this two symmetrical long limit of this homalographic perforate of this metallic membrane; And
One the 4th lubricant film layer, is formed at those and links overline bridges and be emerging in side in this homalographic perforate and bottom surface.
Accompanying drawing explanation
Fig. 1 is the floor map that a kind of one-step print of one first specific embodiment of the present invention forms the cut metal stencil of different thickness.
Fig. 2 is the part plan schematic diagram of this cut metal stencil of one first specific embodiment of the present invention.
Fig. 3 is the plane enlarged diagram of this cut metal stencil at two thickness applying area places of one first specific embodiment of the present invention.
Fig. 4 is the schematic perspective view of this cut metal stencil at the 3rd figure of one first specific embodiment of the present invention.
Fig. 5 is the cut-away illustration of this cut metal stencil along the 4th Fig. 5-5 line of one first specific embodiment of the present invention.
Fig. 6 A and Fig. 6 B are that this cut metal stencil of one first specific embodiment of the present invention forms the schematic cross-section that two (many) plant the patterning coating of different thickness in use with after use on a substrate.
Fig. 7 is the part plan schematic diagram that the another kind of one-step print of one second specific embodiment of the present invention forms the cut metal stencil of different thickness.
Fig. 8 is the plane enlarged diagram of this cut metal stencil at two thickness applying area places of one second specific embodiment of the present invention.
Fig. 9 is the schematic perspective view of this cut metal stencil at the 8th figure of one second specific embodiment of the present invention.
[primary clustering symbol description]
100 cut metal stencil 110 metallic membranes
111 attach face 112 printing surface
113 first thickness applying area, thickness applying area 114 second
Two array micropores of the most adjacent row of 115 array micropore 115A
115B the most contiguous array micropore 116 link
120 link overline bridge 121 filler breach
130 frame-type template 131 openings
141 first lubricant film layer 142 second lubricant film layers
143 the 3rd lubricant film layer 144 the 4th lubricant film layers
200 cut metal stencil 310 thing to be printed
320 scraper 330 coating
331 first thickness coating layer 332 second thickness coating layers
Between P array micropore, central point is to the pitch of central point
The entity bar width of W1 between array micropore
W2 link is to the distance of the most contiguous array micropore
T1 is by attaching first thickness of face to printing surface
T2 links the second thickness of overline bridge.
Detailed description of the invention
Appended diagram below will be coordinated to describe embodiments of the invention in detail, so it should be noted, those diagrams are the schematic diagram of simplification, only with illustrative method, basic framework of the present invention or implementation method are described, therefore only show the assembly relevant with the present invention and syntagmatic, number, shape, size that assembly shown in figure is not implemented with reality are done equal proportion and are drawn, some dimension scale and other relative dimensions ratios or exaggerated or simplify processes, to provide clearer description.Actual number, shape and the dimension scale implemented is a kind of design of putting property of choosing, and detailed assembly layout may be more complicated.
According to the first specific embodiment of the present invention, the cut metal stencil that a kind of one-step print forms different thickness is illustrated in floor map, the part plan schematic diagram of Fig. 2, the 5-5 line cut-away illustration along Fig. 4 at the plane enlarged diagram at two thickness applying area places, the schematic perspective view at the 3rd figure of Fig. 4 and Fig. 5 of Fig. 3 of Fig. 1.The present invention discloses the cut metal stencil 100 that a kind of one-step print forms different thickness, mainly comprise a metallic membrane 110, this metallic membrane 110 has attaching face 111 and a printing surface 112, and definition has one first thickness applying area 113 and one second thickness applying area 114 of different printing thickness.Usually this metallic membrane 110 is upheld and is attached at a frame-type template 130 times, and the printing surface 112 of this metallic membrane 110 is revealed in an opening 131 of this frame-type template 130.This attaching face 111 is in order to be pasted to a thing 310 (as shown in Figure 6A) to be printed, and this thing 310 to be printed can be the master slice of an electronic building brick, as solar cell substrate, LED wafer, IC wafers, passive component pottery master slice or base plate for packaging master slice etc.This printing surface 112 is the scraped finish surface of scraper 320, and the surface (as shown in Figure 6A) can inserted for coating 330, this coating 330 can be conductive paste, such as silver paste or copper cream etc.In the present embodiment, this metallic membrane 110 can be an electroforming steel version, and its one first thickness T1 had is between 15 ~ 300 microns, and namely this metallic membrane 110 is the precise electrotyping membrane structure without stratum reticulare, can be single layer structure.And the material of this metallic membrane 110 is nickel or nickel cobalt (Ni-Co) alloy, comparatively hard and smooth, when can reduce printing ink be stained with glutinous, contribute to the workability of steel plate printing.
This first thickness applying area 113 is a homalographic perforate running through this attaching face 111 and this printing surface 112, in other words, the area size of this first thickness applying area 113 defined by this homalographic perforate, and the hole wall of this homalographic perforate is as the edge of this first thickness applying area 113.In the present embodiment, this homalographic perforate can be a long slot bore and has two symmetrical long limits, generally speaking for the homalographic perforate (i.e. this first thickness applying area 113) of long slot bore form can have a narrow width, the i.e. clearance distance on this two symmetrical long limit, can about 1 ~ 10000 micron (can lower than 1cm), more specifically can between 10 ~ 100 microns.As shown in Figures 3 and 4, the width of this homalographic perforate (i.e. this first thickness applying area 113) is less than the pitch P of a plurality of array micropore 115 in this second thickness applying area 114, and parallel to edge or aperture close to those array micropores 115, such as: the circuit being provided as solar cell when this homalographic perforate (i.e. this first thickness applying area 113) is formed, and the width of this homalographic perforate (i.e. this first thickness applying area 113) specifically can be 50 ~ 70 microns.In addition, the length on this two symmetrical long limit of this homalographic perforate (i.e. this first thickness applying area 113) reaches several centimeters to tens of centimetre, can do the extension change of suitable length according to product demand or connect.As shown in Figure 2, a plurality of homalographic perforate (i.e. this first thickness applying area 113) can connect into pectination slotted eye.
This plurality of array micropore 115 is included in this second thickness applying area 114, the percent opening of those array micropores 115 accounts for 40% ~ 90% area ratio of this second thickness applying area 114, wherein so-called percent opening is using the sum total of all hole areas of those array micropores 115 as subnumber and with the area of this second thickness applying area 114 for female number, the percentage that subnumber obtains divided by female number.And the area size of this second thickness applying area 114 defined by the most row at edge of those array micropores 115 and the circumferential periphery sideline of row.The percent opening of those array micropores 115 is answered corresponding coating stickiness and is limited to a particular range, when the percent opening of those array micropores 115 too high (as fine mesh structure) or hole depth deficiency, predetermined thinning coating cannot be reached, and, when stretching this metallic membrane 110 or scraper wiper, will easily rupture between those array micropores 115; Otherwise, when the percent opening of those array micropores 115 is too low, represent that the entity bar width between those array micropores 115 is excessive, not easily will be opened up by the coating of deriving in those array micropores 115 and loosely connect into a coating.More specifically, the percent opening of those array micropores 115 accounts for 50% ~ 80% area ratio of this second thickness applying area 114.In addition, there is the fixed knot of central point to central point apart from P between those array micropores 115.Usually the pitch P of those array micropores 115 can be not more than 100 microns (μm), and aperture or the long limit of those array micropores 115 can be not less than 1/2nd of the pitch P of those array micropores 115, such as, be about 50 microns, to reach densification arrangement.In the present embodiment, those array micropores 115 are square opening.More specifically, refer to Fig. 4, the entity bar width W of this metallic membrane 110 between those array micropores 115 can be not more than central point between those array micropores 115 to central point pitch P 1/2nd, can guarantee that this metallic membrane 110 loosely connects into a thinning coating because coating when thing to be printed departs from originally in those array micropores 115 can be opened up on thing to be printed after printing.In addition, the hole depth of those array micropores 115 can be equivalent to this metallic membrane 110 by this attaching face 111 to the first thickness T1 of this printing surface 112.And the long edge lengths of this homalographic perforate (i.e. this first thickness applying area 113) is more than the aperture of those array micropores 115 or the decades of times on long limit, even can reach thousand times.In the present embodiment, above-mentionedly the formation that this second thickness applying area 114 of this plurality of array micropore 115 can be provided as the bus wire (bus) of solar cell is included.
As shown in Figure 6A, when using this cut metal stencil 100 to carry out stencilization, this attaching face 111 of this metallic membrane 110 is pasted to this thing 310 to be printed, utilize this scraper 320 wiper on this printing surface 112 of this metallic membrane 110, coating 330 is inserted to this homalographic perforate (i.e. the first thickness applying area 113) with in those array micropores 115 in this second thickness applying area 114.As shown in Figure 6B, after this cut metal stencil 100 of disengaging, one first thickness coating layer 331 will be formed as on this thing 310 to be printed at this homalographic perforate inside courtyard 330, on this thing 310 to be printed, mutually will open up loose connection at those array micropore 115 inside courtyard 330 and be formed as one second thickness coating layer 332, and be connected to this first thickness coating layer 331, wherein the thickness of this second thickness coating layer 332 can be less than the thickness of this first thickness coating layer 331 significantly, such as this first thickness coating layer 331 thickness less than 2/3rds.In the present embodiment, the thickness of this first thickness coating layer 331 about can at 31 ~ 50 microns, and the thickness of this second thickness coating layer 332 about can at 10 ~ 30 microns.Therefore, utilize cut metal stencil 100 of the present invention can form the coating layer 331,332 of different thickness in one-step print, the known processing time that repeatedly prints and cost can be saved, also do not have the offset deviation of coating layer misalignment in known repeatedly printing.
Preferably, this cut metal stencil 100 separately can comprise a plurality of link overline bridge 120, it is integrally connected to this two symmetrical long limit of this homalographic perforate of this metallic membrane 110, to prevent from causing when this metallic membrane 110 of tension splitting of long slot bore, namely in order to improve in this metallic membrane 110 in order to form the problem of the easy fission shape in first thickness applying area 113 thick compared with thick film.Further, those link overline bridges 120 are preferably and do not protrude from this printing surface 112, not affect the operation of scraper.Preferably, those link overline bridges 120 can be aligned in copline this printing surface 112, make when manufacturing those link overline bridges 120 and presswork time can carry out more easily, and coating can be prevented to be stained with stick when presswork above those link overline bridges 120.And, each links overline bridge 120 and is being formed with a filler breach 121 towards the position in this attaching face 111, namely those link one second thickness T2 of overline bridges 120 and are less than this metallic membrane 110 by this attaching face 111 to the first thickness T1 of this printing surface 112, seen by direction, this attaching face 111 and look this first thickness applying area 113 (i.e. this homalographic perforate), it has the bore edges of connection, to guarantee the continuous formation of coating line pattern on thing to be printed, and look this first thickness applying area 113 (i.e. homalographic perforate) by the sight of this printing surface 112, it can be interrupted shape long slot bore form.Specifically, those link overline bridges 120 can be produced so as this metallic membrane 110 in electroforming processing procedure.Specifically, those link materials of overline bridges 120 can be selected from nickel, nickel alloy, copper, copper alloy one of them, identical or not identical material is can be with this metallic membrane 110, also electroforming processing procedure can be utilized to make because those link overline bridge 120, therefore the metal structure of individual layer or composite bed can be produced easily in this homalographic perforate.In addition, those link the two symmetrical long limit width in the same way that overline bridge 120 has one and this homalographic perforate, it can be not more than the gap (be the width of this homalographic perforate in long slot bore form) of corresponding first thickness applying area 113 on this two symmetrical long limit, to reduce the unit maximum area that corresponding first thickness applying area 113 is covered by those link overline bridges 120, be conducive to coating and insert fast and fill up corresponding filler breach 121.More specifically, those second thickness T2 linking overline bridge 120 between 2/to three/6ths of the first thickness T1 of this metallic membrane 110, can relatively can define the degree of depth of this filler breach 121.In the present embodiment, the thickness of this metallic membrane 110 is about 50 microns, and those thickness linking overline bridge 120 can between 20 ~ 25 microns or lower.In addition, preferably, those link overline bridges 120 can be and are equidistantly arranged in each first thickness applying area 113, to meet with stresses equably.Therefore, those link the lower of overline bridge 120 and can pass through to spread the horizontal plane to this attaching face 111 for coating, and can strengthen and support the long slot bore structure of this homalographic perforate, therefore have and prevent two of this first thickness applying area 113 when stencilization generation gaps, symmetrical long limit changes or long slot bore from opening the effect split.
Preferably, this homalographic perforate (i.e. this first thickness applying area 113) can have one and extend to link 116 in this second thickness applying area 114.In of the present invention one more specifically structure, this link 116 of this homalographic perforate can, between two array micropore 115A of most adjacent row, make this link 116 be not more than the entity bar width W 1 of this metallic membrane 110 between those array micropores 115 to the distance W2 of the most contiguous array micropore 115B.Therefore, as shown in Figure 6B, what this structure was just guaranteed this first thickness coating layer 331 and this second thickness coating layer 332 opens up loose connection mutually, after heat-agglomerating, this the first thickness coating layer 331 can become thicker and can be thinner conducting wire, this the second thickness coating layer 332 can become thinner and wider and be electrically conducted bus (bus), and both are electrically connected mutually.
As shown in Figure 5, in a preferred embodiment, this cut metal stencil 100 separately can comprise the 3rd lubricant film layer 143 in hole wall that the second lubricant film layer 142 and that first lubricant film layer 141, be formed on this printing surface 112 is formed at the hole wall of this homalographic perforate is formed at those array micropores 115.Those lubricant film layers 141, 142, 143 can be and identical be not stained with the organic or inorganic lubrication material of glutinous characteristic to coating tool (such as iron is not imperial, molybdenum oxide, aluminium oxide, talcum powder etc.) and make its thickness be controlled between 0.1 ~ 20 micron with the formation of suitable surface treatment mode, more specifically can be controlled in 0.5 ~ 5 micron, the effect of thing 310 to be printed can be printed on so as to being provided in not to be stained with glutinous coating in the hole such as this homalographic perforate and those array micropores 115 in order to coating most during the demoulding and make the effect of the resistance to scraper scraped finish of this printing surface 112, so can control this first thickness coating layer 331 film thickness difference predetermined with this both the second thickness coating layer 332 further well.Wherein, about the concrete formation method of those lubricant film layers 141,142,143, can utilize Composite Coatings (or can be analyse plating) mode is formed and there is those lubricant film layers 141,142,143, namely add organic or inorganic particle in the plating solution being attached in the hole such as this homalographic perforate and those array micropores 115.Or those lubricant film layers 141,142,143 can be the metal lubrication material of coating tool not being stained with to glutinous characteristic, and in the surface that can be formed at this metallic membrane 110 with plating mode and hole wall.Such as, in another concrete formation method of those lubricant film layers 141,142,143, when the material of those lubricant film layers 141,142,143 is metal oxide, first can plates corresponding metal and give oxidation processes again, the anode process of such as aluminum or aluminum alloy.
Specifically, again as shown in Figure 5, when this homalographic perforate (i.e. this first thickness applying area 113) can be a long slot bore and has two symmetrical minor faces and two symmetrical long limits, except preferably including a plurality of link overline bridge 120, this cut metal stencil 100 separately can comprise one the 4th lubricant film layer 144, is formed at those and links overline bridges 120 and be emerging in side in this homalographic perforate and bottom surface.As shown in Figure 6A, the 4th lubricant film layer 144 is utilized to contribute to the flowing of coating 330 in order to the filler breach 121 filled up below those link overline bridges 120.Therefore, cut metal stencil of the present invention can be improved printing coatings and easily accumulate to be stained with and stick in the special construction making the different thickness applying area of formation, such as those array micropores or those link the filler breach etc. of overline bridges.
According to the second specific embodiment of the present invention, disclose the cut metal stencil that another kind of one-step print forms different thickness, illustrate the part plan schematic diagram of Fig. 7, Fig. 8 at the plane enlarged diagram at two thickness applying area places and the schematic perspective view at Fig. 8 of Fig. 9.Wherein, same reference numbers will be continued to use with the assembly of the first specific embodiment same names.This cut metal stencil 200 mainly comprises a metallic membrane 110.As the first specific embodiment, mainly comprise a metallic membrane 110, this metallic membrane 110 has attaching face 111 and a printing surface 112, and definition has one first thickness applying area 113 and one second thickness applying area 114 of different printing thickness, wherein this first thickness applying area 113 is a homalographic perforate running through this attaching face 111 and this printing surface 112, include a plurality of array micropore 115 in this second thickness applying area 114, the percent opening of those array micropores 115 accounts for 40% ~ 90% area ratio of this second thickness applying area 114.In the present embodiment, this homalographic perforate (i.e. this first thickness applying area 113) can run through this second thickness applying area 114, to guarantee that the thicker first thickness coating layer formed by this first thickness applying area 113 is connected to the thinner second thickness coating layer formed by this second thickness applying area 114.
The above, it is only preferred embodiment of the present invention, not any pro forma restriction is done to the present invention, although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention, be anyly familiar with the technology personnel, not departing from technical scope of the present invention, the change of any simple modification of doing, equivalence and modification, all still belong in technical scope of the present invention.
Claims (9)
1. one-step print forms a cut metal stencil for different thickness, it is characterized in that, comprises:
One metallic membrane, there is an attaching face and a printing surface, and definition has one first thickness applying area and the one second thickness applying area of different printing thickness, wherein this first thickness applying area is a homalographic perforate running through this attaching face and this printing surface, a plurality of array micropore is included in this second thickness applying area, the percent opening of those array micropores accounts for 40% ~ 90% area ratio of this second thickness applying area, it is characterized in that, the entity bar width of this metallic membrane between those array micropores be not more than central point between those array micropores to central point pitch 1/2nd.
2. one-step print according to claim 1 forms the cut metal stencil of different thickness, it is characterized in that, this homalographic perforate is a long slot bore.
3. one-step print according to claim 2 forms the cut metal stencil of different thickness, it is characterized in that, separately comprise a plurality of link overline bridge, it is integrally connected to two symmetrical long limits of this homalographic perforate of this metallic membrane, to prevent the cracking causing long slot bore when stretching this metallic membrane, and those link overline bridge and do not protrude from this printing surface, and each link overline bridge is being formed with a filler breach towards the position in this attaching face.
4. form the cut metal stencil of different thickness according to the one-step print of Claims 2 or 3, it is characterized in that, this homalographic perforate has one and extends to link in this second thickness applying area.
5. one-step print according to claim 4 forms the cut metal stencil of different thickness, it is characterized in that, this link of this homalographic perforate is between two array micropores of most adjacent row.
6. form the cut metal stencil of different thickness according to the one-step print of Claims 2 or 3, it is characterized in that, this homalographic perforate runs through this second thickness applying area.
7. one-step print according to claim 1 forms the cut metal stencil of different thickness, it is characterized in that, this metallic membrane is an electroforming steel version, it is characterized in that, its one first thickness had is between 15 ~ 300 microns.
8. one-step print according to claim 1 forms the cut metal stencil of different thickness, it is characterized in that, separately comprises:
One first lubricant film layer, is formed on this printing surface;
One second lubricant film layer, is formed in the hole wall of this homalographic perforate; And
One the 3rd lubricant film layer, is formed in the hole wall of those array micropores.
9. one-step print according to claim 8 forms the cut metal stencil of different thickness, it is characterized in that, this homalographic perforate is that a long slot bore has two symmetrical long limits, and this cut metal stencil separately comprises:
A plurality of link overline bridge, it is integrally connected to this two symmetrical long limit of this homalographic perforate of this metallic membrane; And
One the 4th lubricant film layer, is formed at those and links overline bridges and be emerging in side in this homalographic perforate and bottom surface.
10. one-step print forms a cut metal stencil for different thickness, it is characterized in that, comprises:
One metallic membrane, there is an attaching face and a printing surface, and definition has one first thickness applying area and the one second thickness applying area of different printing thickness, wherein this first thickness applying area is a homalographic perforate running through this attaching face and this printing surface, a plurality of array micropore is included in this second thickness applying area, the percent opening of those array micropores accounts for 40% ~ 90% area ratio of this second thickness applying area, wherein this homalographic perforate is a long slot bore, and this homalographic perforate has one and extends to link in this second thickness applying area.
11. 1 kinds of one-step prints form the cut metal stencil of different thickness, it is characterized in that, comprise:
One metallic membrane, there is an attaching face and a printing surface, and definition has one first thickness applying area and the one second thickness applying area of different printing thickness, wherein this first thickness applying area is a homalographic perforate running through this attaching face and this printing surface, include a plurality of array micropore in this second thickness applying area, the percent opening of those array micropores accounts for 40% ~ 90% area ratio of this second thickness applying area;
One first lubricant film layer, is formed on this printing surface;
One second lubricant film layer, is formed in the hole wall of this homalographic perforate; And
One the 3rd lubricant film layer, is formed in the hole wall of those array micropores;
It is characterized in that, this homalographic perforate is that a long slot bore has two symmetrical long limits, and this cut metal stencil separately comprises:
A plurality of link overline bridge, it is integrally connected to this two symmetrical long limit of this homalographic perforate of this metallic membrane; And
One the 4th lubricant film layer, is formed at those and links overline bridges and be emerging in side in this homalographic perforate and bottom surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210021628.0A CN103223768B (en) | 2012-01-31 | 2012-01-31 | Metal printing template with different diaphragm thicknesses formed by single printing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210021628.0A CN103223768B (en) | 2012-01-31 | 2012-01-31 | Metal printing template with different diaphragm thicknesses formed by single printing |
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| CN103223768A CN103223768A (en) | 2013-07-31 |
| CN103223768B true CN103223768B (en) | 2015-01-14 |
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| CN201210021628.0A Expired - Fee Related CN103223768B (en) | 2012-01-31 | 2012-01-31 | Metal printing template with different diaphragm thicknesses formed by single printing |
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| CN105436476B (en) * | 2014-09-18 | 2018-12-28 | 仓和股份有限公司 | liquid metal screen cloth and its manufacturing method |
| DE102015120185A1 (en) * | 2015-11-20 | 2017-05-24 | Asm Assembly Systems Gmbh & Co. Kg | A method and apparatus for selecting a paste stencil for paste printing and for applying paste to a substrate using the selected paste stencil |
| CN107398392B (en) * | 2017-07-31 | 2021-01-22 | 京东方科技集团股份有限公司 | Silk screen printing plate |
| MX2018002858A (en) * | 2018-03-07 | 2019-09-09 | Interlatin S De R L De C V | Template that improves solder-paste stencilling and production method thereof. |
| CN113320278B (en) * | 2021-06-11 | 2022-03-15 | 江阴嘉仕德网业有限公司 | High-strength low-extension printing silk screen and production process thereof |
| TWI820452B (en) * | 2021-07-19 | 2023-11-01 | 倉和股份有限公司 | Coated printing screen and production method thereof |
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| US5804248A (en) * | 1995-11-25 | 1998-09-08 | International Business Machines Corporation | Solder paste deposition |
| TW533132B (en) * | 1999-08-31 | 2003-05-21 | Minami Co Ltd | Screen printing apparatus |
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| CN201638835U (en) * | 2010-02-04 | 2010-11-17 | 欧贝黎新能源科技股份有限公司 | Print template for manufacturing crystalline silicon solar cell electrode |
| CN101898469A (en) * | 2009-05-27 | 2010-12-01 | 台湾山叶机车工业股份有限公司 | Screen printing type gum manufacturing process and screen printing plate special for same |
| CN201703016U (en) * | 2010-05-24 | 2011-01-12 | 彰绅精密工业股份有限公司 | Multilayer metal printing template |
| CN102202907A (en) * | 2008-09-26 | 2011-09-28 | Nb技术股份有限公司 | Screen printing frame |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS59172779A (en) * | 1983-03-23 | 1984-09-29 | Toshiba Corp | Solar battery |
| JPH07329273A (en) * | 1994-06-02 | 1995-12-19 | Tani Denki Kogyo Kk | Metal screen for printing and screen printing method for using the same screen |
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5804248A (en) * | 1995-11-25 | 1998-09-08 | International Business Machines Corporation | Solder paste deposition |
| TW533132B (en) * | 1999-08-31 | 2003-05-21 | Minami Co Ltd | Screen printing apparatus |
| CN2607715Y (en) * | 2003-04-01 | 2004-03-24 | 苏州光韵达光电科技有限公司 | Circuit board printing form easy-to-demould |
| CN102202907A (en) * | 2008-09-26 | 2011-09-28 | Nb技术股份有限公司 | Screen printing frame |
| CN101898469A (en) * | 2009-05-27 | 2010-12-01 | 台湾山叶机车工业股份有限公司 | Screen printing type gum manufacturing process and screen printing plate special for same |
| CN201638835U (en) * | 2010-02-04 | 2010-11-17 | 欧贝黎新能源科技股份有限公司 | Print template for manufacturing crystalline silicon solar cell electrode |
| CN201703016U (en) * | 2010-05-24 | 2011-01-12 | 彰绅精密工业股份有限公司 | Multilayer metal printing template |
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| CN103223768A (en) | 2013-07-31 |
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