CN103002726A - Electronic element mounting machine and electronic element mounting method - Google Patents
Electronic element mounting machine and electronic element mounting method Download PDFInfo
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- CN103002726A CN103002726A CN2012103303524A CN201210330352A CN103002726A CN 103002726 A CN103002726 A CN 103002726A CN 2012103303524 A CN2012103303524 A CN 2012103303524A CN 201210330352 A CN201210330352 A CN 201210330352A CN 103002726 A CN103002726 A CN 103002726A
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Abstract
An electronic element mounting machine and an electronic element mounting method are provided. An electronic element can also be mounted even when a solder mark is difficult to identify. An electronic element (P) is mounted on a substrate (8) by the electronic element mounting machine (1). The substrate has a soldering pad part (800), a solder part (81), soldering pad marks (M1, M2) in the same coordinate system as the soldering pad part, and solder marks (m1, m2) in the same coordinate system as the solder part. The electronic element mounting machine can be switched between the solder mark mode where the electronic element is mounted on the substrate with the position of the solder marks as the reference, and the soldering pad mark mode where the electronic element is mounted on the substrate with the position of the soldering pad marks as the reference. When the position of the substrate is being determined, when no electronic element is mounted on the solder marks, the solder mark mode is executed. Under the circumstance of already mounting the electronic element on the solder marks, the soldering pad mark mode is executed.
Description
Technical field
The present invention relates to a kind of on substrate electronic part mounting and the electronic component mounting method of installing electronic elements.
Background technology
Fig. 8 represents to be printed with the vertical view of the substrate of scolder.For convenience of explanation, be marked with hacures in solder portion 103.As shown in Figure 8, the upper surface at substrate 100 disposes pad mark 101, wiring pattern 102 and solder portion 103.Pad mark 101 and wiring pattern 102 are formed at the upper surface of substrate 100.Pad mark 101 and welding disk 102a are disposed at the same coordinate system.Pad mark 101 disposes two altogether at the diagonal position of substrate 100.Solder portion 103 is printed on the upper surface of welding disk 102a of wiring pattern 102.
Enlarged drawing in the frame IX of Fig. 9 presentation graphs 8.As shown in Figure 9, electronic component 104 is installed on the solder portion 103 of the installation coordinate of regulation.Between welding disk 102a and solder portion 103, do not have in the situation of position deviation, can by with pad mark 101 shown in Figure 8 (being welding disk 102a) as the benchmark that coordinate is installed, at the installation coordinate of regulation installing electronic elements 104 correctly.
Yet, have the situation that between welding disk 102a and solder portion 103, produces position deviation because printing is offset.Figure 10 represents that scolder by the vertical view of the substrate that prints with being offset.Figure 11 represents the interior enlarged drawing of frame XI of Figure 10.Such as Figure 10, shown in Figure 11, between welding disk 102a and solder portion 103, produced position deviation.At this moment, if with the benchmark of pad mark 101 as the installation coordinate, then electronic component 104 is correctly installed with respect to welding disk 102a.On the other hand, electronic component 104 is installed by skew ground with respect to solder portion 103.
If under described state, substrate 100 is moved into reflow ovens, then solder portion 103 meltings and become aqueous.Enlarged drawing in the frame XI after Figure 12 represents to reflux.Shown in Figure 12 hollow core arrow, aqueous solder portion 103 is to the central flows of welding disk 102a.At this moment, the electronic component 104 from heavy and light flows with solder portion 103.Therefore, after backflow, electronic component 104 is from the installation coordinate offset of regulation.
As its countermeasure, as shown in Figure 8, have not take pad mark 101 as benchmark, but the method take scolder mark 103a as benchmark installing electronic elements 104.Scolder mark 103a disposes two altogether at the diagonal position of substrate 100.Two scolder mark 103a are made of 4 solder portion 103 respectively.Enlarged drawing in frame XI when Figure 13 represents to be labeled as the benchmark installing electronic elements with scolder.As shown in figure 13, electronic component 104 is mounted take scolder mark 103a as benchmark.That is, electronic component 104 is correctly installed with respect to solder portion 103.On the other hand, electronic component 104 is installed with respect to welding disk 102a with being offset.
If under described state, substrate 100 is moved into reflow ovens, then solder portion 103 meltings and become aqueous.Enlarged drawing in the frame XI after Figure 14 represents to reflux.Shown in Figure 14 hollow core arrow, solder portion 103 and electronic component 104 are to the central flows of welding disk 102a.Therefore, after backflow, electronic component 104 correctly is installed on the installation coordinate of regulation.
Like this, as the method for installing electronic elements 104 on substrate 100, comprise the method for installing take pad mark 101 as benchmark and the method for installing take scolder mark 103a as benchmark.Especially, electronic component 104 grades from heavy and light preferably are installed on substrate 100 take scolder mark 103a as benchmark with solder portion 103 mobile electronic components 104 easily when refluxing.
Patent documentation 1: Japanese kokai publication hei 7-22791 communique
At this, the identification of scolder mark 103a is undertaken by taking 4 solder portion 103 with filming apparatus.When taking scolder mark 103a, require to read by filming apparatus the shape of 4 solder portion 103.Say on the contrary it, in the situation of the shape that can't read 4 solder portion 103 by filming apparatus, be difficult to identify scolder mark 103a.
As the concrete example of the situation of the shape that can't read 4 solder portion 103, be included in the situation that electronic component 104 has been installed in solder portion 103 before the identification scolder mark 103a.That is, the shooting of scolder mark 103a, identification are that the substrate 100 that (when the installation of electronic component 104 begins) locates on for electronic part mounting when the production of substrate 100 begins is carried out.Scolder mark 103a after identification uses until produce end.
But, have the situation that again is installed on electronic part mounting midway after substrate 100 is temporarily pulled down from electronic part mounting of producing.The possibility of deviation occurs in the position of the substrate 100 the when position of the substrate 100 after at this moment, existence is installed again begins with respect to production.Therefore, need to again take and identify scolder mark 103a.Yet the solder portion 103 of using at scolder mark 103a installs in the situation of electronic component 104, and the shape of solder portion 103 is indefinite.Therefore, can't read scolder mark 103a by filming apparatus.
Summary of the invention
Electronic part mounting of the present invention and electronic component mounting method are finished in view of described problem.Even the object of the present invention is to provide a kind of be difficult to identify in the situation of scolder mark also can installing electronic elements electronic part mounting and electronic component mounting method.
(1) in order to solve described problem, a kind of electronic part mounting of the present invention, installing electronic elements on oriented substrate, described substrate has a plurality of welding disks, be printed on a plurality of solder portion on a plurality of described welding disks, be in the pad mark of the same coordinate system and be in the scolder mark of the same coordinate system with a plurality of described solder portion with a plurality of described welding disks, described electronic part mounting is characterised in that, described scolder mark is selected from a plurality of described solder portion, can between scolder marking mode and pad marking mode, switch, described scolder marking mode is installed described electronic component take the position of described scolder mark as benchmark at described substrate, described pad marking mode is installed described electronic component take the position of described pad mark as benchmark at described substrate at least, when the position of oriented described substrate is confirmed, on described scolder mark, do not install in the situation of described electronic component, carry out described scolder marking mode, on described scolder mark, installed in the situation of described electronic component, carried out described pad marking mode.
Electronic part mounting of the present invention can switch between scolder marking mode and pad marking mode.Before installing electronic elements, carry out the location of substrate.In addition, carry out the location confirmation of the substrate after locating.Described location confirmation is to carry out with at least one party in scolder mark and the pad mark.When carrying out described affirmation, do not have at the scolder mark in the situation of installing electronic elements, carry out the scolder marking mode.And install at the scolder mark in the situation of electronic component, carry out the pad marking mode.That is, having installed on the selecteed solder portion in the situation of electronic component as the scolder mark, be labeled as benchmark with pad at least, installing electronic elements on substrate.Like this, according to electronic part mounting of the present invention, can according to whether electronic component is arranged, distinguish use scolder mark and pad mark and installing electronic elements on the scolder mark.Therefore, even be difficult to identify in the situation of scolder mark, also can installing electronic elements.
(2) preferably, in the structure of described (1), in the situation of after the installation process of the described electronic component of described substrate installation that described electronic component is installed to described scolder mark is interrupted, restarting, carry out described pad marking mode.
Install electronic component at the scolder mark, and in the installation process situation of restarting after being interrupted, the substrate when supposing to restart is in any state among following (A), (B).
(A) state that again is positioned after temporarily being released of substrate.
(B) substrate is not released and the state that is positioned constantly from interrupting front beginning.
In the situation of (A), be difficult to take and identify again the scolder mark behind the location.Therefore, need to carry out the pad marking mode.In the situation of (B), can proceed installation process and be interrupted pattern (scolder marking mode or pad marking mode) before.That is, not necessarily need to carry out the pad marking mode.Yet, (A), the judgement operation of (B) is numerous and diverse.About this point, according to this structure, can in fact whether to be released with substrate, again to locate and irrespectively carry out without exception the pad marking mode.Therefore, do not need the judgement operation of (A), (B).
(3) preferably, in the structure of described (2), temporarily be released during before described substrate might restart after described installation process is interrupted and again be carried out in the situation of location, carry out described pad marking mode.
According to this structure, can be after existing substrate temporarily to be released again in the situation of the possibility of location, namely exist in the situation of possibility of (A), carry out the pad marking mode.At this, " possibility of again being located " whether substrate is arranged, carry out such as can install according to electronic component the time location of substrate device (clamping device etc.), carrying substrate until the driving resume of the device of position location (Handling device etc.) etc. judge.
(4) preferably, in the structure of described (2) or (3), comprising: clamping device can position, discharge described substrate; Filming apparatus can be taken the described pad mark of the described substrate of being located by described clamping device, described scolder mark; Suction nozzle is installed described electronic component at the described substrate of being located by described clamping device; And control device, control described clamping device, described filming apparatus and described suction nozzle, in the situation of carrying out described pad marking mode, before described pad marking mode, described control device is carried out following steps: the first pad mark position obtains step, uses described filming apparatus to obtain the position that described installation process is interrupted described pad mark before; The scolder mark position obtains step, uses described filming apparatus to obtain the position that described installation process is interrupted described scolder mark before; The departure calculation procedure is calculated the departure between the position of the position of described pad mark and described scolder mark; And second the pad mark position obtain step, use described filming apparatus to obtain to restart the position of the described pad mark after the described installation process, in described pad marking mode, take the position of obtaining the described pad mark that step obtains by described the second pad mark position and the described departure that calculates by described departure calculation procedure as benchmark, use described suction nozzle that described electronic component is installed.
According to this structure, control device is obtained step, scolder mark position and is obtained after step, departure calculation procedure and the second pad mark position obtain step carrying out the first pad mark position, carries out the pad marking mode.
In the pad marking mode, departure before position, the installation process of the pad mark of (in the situation of the structure of described (3) for again location after) are interrupted after restarting according to installation process between the position of the position of the pad mark of (in the situation of the structure of described (3) for before discharging) and scolder mark, in other words according to the position that is labeled as the scolder mark of benchmark with pad, installing electronic elements.According to this structure, can according to position and the departure of pad mark, restore the scolder mark that to take and to identify owing to the installation of electronic component.
(5) in order to solve described problem, a kind of electronic component mounting method of the present invention, installing electronic elements on oriented substrate, described substrate has a plurality of welding disks, be printed on a plurality of solder portion on a plurality of described welding disks, be in the pad mark of the same coordinate system and be in the scolder mark of the same coordinate system with a plurality of described solder portion with a plurality of described welding disks, described electronic component mounting method is characterised in that, described scolder mark is selected from a plurality of described solder portion, can between scolder marking mode and pad marking mode, switch, described scolder marking mode is installed described electronic component take the position of described scolder mark as benchmark at described substrate, described pad marking mode is installed described electronic component take the position of described pad mark as benchmark at described substrate at least, when the position of oriented described substrate is confirmed, on described scolder mark, do not install in the situation of described electronic component, carry out described scolder marking mode, on described scolder mark, installed in the situation of described electronic component, carried out described pad marking mode.
Electronic component mounting method of the present invention can switch between scolder marking mode and pad marking mode.Before installing electronic elements, carry out the location of substrate.In addition, carry out the location confirmation of the substrate after locating.Described location confirmation is to carry out with at least one party in scolder mark and the pad mark.When carrying out described affirmation, do not have at the scolder mark in the situation of installing electronic elements, carry out the scolder marking mode.And install at the scolder mark in the situation of electronic component, carry out the pad marking mode.That is, having installed on the selecteed solder portion in the situation of electronic component as the scolder mark, be labeled as benchmark with pad at least, installing electronic elements on substrate.Like this, according to electronic component mounting method of the present invention, can according to whether electronic component is arranged, distinguish use scolder mark and pad mark and installing electronic elements on the scolder mark.Therefore, even be difficult to identify in the situation of scolder mark, also can installing electronic elements.
(6) preferably, in the method for described (5), in the situation of after the installation process of the described electronic component of described substrate installation that described electronic component is installed to described scolder mark is interrupted, restarting, carry out described pad marking mode.
Install electronic component at the scolder mark, and in the installation process situation of restarting after being interrupted, the substrate when supposing to restart is in any state among following (A), (B).
(A) state that again is positioned after temporarily being released of substrate.
(B) substrate is not released and the state that is positioned constantly from interrupting front beginning.
In the situation of (A), be difficult to take and identify again the scolder mark behind the location.Therefore, need to carry out the pad marking mode.In the situation of (B), can proceed installation process and be interrupted pattern (scolder marking mode or pad marking mode) before.That is, not necessarily need to carry out the pad marking mode.Yet, (A), the judgement operation of (B) is numerous and diverse.About this point, according to this method, can in fact whether to be released with substrate, again to locate and irrespectively carry out without exception the pad marking mode.Therefore, do not need the judgement operation of (A), (B).
(7) preferably, in the method for described (6), temporarily be released during before described substrate might restart after described installation process is interrupted and again be carried out in the situation of location, carry out described pad marking mode.
According to this method, can be after existing substrate temporarily to be released again in the situation of the possibility of location, namely exist in the situation of possibility of (A), carry out the pad marking mode.At this, " possibility of again being located " whether substrate is arranged, carry out such as can install according to electronic component the time location of substrate device (clamping device etc.), carrying substrate until the driving resume of the device of position location (Handling device etc.) etc. judge.
(8) preferably, in the method for described (6) or (7), in the situation of carrying out described pad marking mode, before described pad marking mode, carry out following steps: the first pad mark position obtains step, obtains the position that described installation process is interrupted described pad mark before; The scolder mark position obtains step, obtains the position that described installation process is interrupted described scolder mark before; The departure calculation procedure is calculated the departure between the position of the position of described pad mark and described scolder mark; And second the pad mark position obtain step, obtain the position of restarting the described pad mark after the described installation process, in described pad marking mode, take the position of obtaining the described pad mark that step obtains by described the second pad mark position and the described departure that calculates by described departure calculation procedure as benchmark described electronic component is installed.
According to this method, obtain step, scolder mark position and obtain after step, departure calculation procedure and the second pad mark position obtain step carrying out the first pad mark position, carry out the pad marking mode.
In the pad marking mode, departure before position, the installation process of the pad mark of (in the situation of the structure of described (7) for again location after) are interrupted after restarting according to installation process between the position of the position of the pad mark of (in the situation of the structure of described (7) for before discharging) and scolder mark, in other words according to the position that is labeled as the scolder mark of benchmark with pad, installing electronic elements.According to this structure, can according to position and the departure of pad mark, restore the scolder mark that to take and to identify owing to the installation of electronic component.
According to the present invention, though can provide a kind of be difficult to identify in the situation of scolder mark also can installing electronic elements electronic part mounting and electronic component mounting method.
Description of drawings
Fig. 1 is the schematic diagram of production line that disposes the electronic part mounting of an embodiment of the invention.
Fig. 2 is the stereogram of described electronic part mounting.
Fig. 3 is the piece figure of described electronic part mounting.
Fig. 4 is Handling device and near the stereogram of clamping device of the module of described electronic part mounting.
Fig. 5 is the flow chart of the electronic component mounting method of an embodiment of the invention.
Fig. 6 is the vertical view of substrate of moving into the electronic part mounting in downstream.
Fig. 7 is the vertical view of the substrate during emergent stopping in the production process in the described electronic part mounting.
Fig. 8 is the vertical view that is printed with the substrate of scolder.
Fig. 9 is the interior enlarged drawing of frame IX of Fig. 8.
Figure 10 is that scolder by the vertical view of the substrate that prints with being offset.
Figure 11 is the interior enlarged drawing of frame XI of Figure 10.
Figure 12 is the interior enlarged drawing of frame XI after refluxing.
Figure 13 is the enlarged drawing in the frame XI when being labeled as the benchmark installing electronic elements with scolder.
Figure 14 is the interior enlarged drawing of frame XI after refluxing.
Embodiment
Below, the execution mode of electronic part mounting of the present invention and electronic component mounting method is described.
＜electronic part mounting 〉
The electronic part mounting of present embodiment at first, is described.Fig. 1 represents to dispose the schematic diagram of production line of the electronic part mounting of present embodiment.As shown in Figure 1, production line 9 comprises host control device 90, a plurality of electronic part mounting 1, substrate appearance inspection machine 91 and reflow ovens 92.A plurality of electronic part mountings 1, substrate appearance inspection machine 91 and reflow ovens 92 are arranged along left and right directions (direction of transfer of substrate).A plurality of electronic part mountings 1 are at the solder portion of substrate installing electronic elements stage by stage.Substrate appearance inspection machine 91 checks the installment state of electronic component on substrate.Reflow ovens 92 heating, cooling base, thus make solder portion melting, curing.That is, via solder portion connecting electronic component on substrate.Host control device 90 Comprehensive Control electronic part mountings 1, substrate appearance inspection machine 91 and reflow ovens 92.
Fig. 2 represents the stereogram of the electronic part mounting of present embodiment.In addition, see through the shell of module 3 and representing.Fig. 3 represents the piece figure of described electronic part mounting.Such as Fig. 2, shown in Figure 3, electronic part mounting 1 comprises base 2, module 3, component supplying apparatus 4, image processing apparatus 5 and control device 7.
Device pallet 36 is installed on the front surface opening of the shell of module 3.Base portion 34 is the diapire of module 3.Upper surface at base portion 34 disposes a pair of Y-axis guide rail 340.A pair of Y-axis guide rail 340 extends upward in front and back.
Fig. 4 represents the Handling device of module of electronic part mounting of present embodiment and near the stereogram the clamping device.In addition, see through substrate 8 and representing.Such as Fig. 1 ~ shown in Figure 4, Handling device 30 comprises fixing wall portion 300, movable wall part 301, a pair of conveyer belt 302 and carrying motor 303.Fixing wall portion 300 extends upward at right and left.The front end of a pair of Y-axis guide rail 340 of fixing wall portion 300 shutoff.Movable wall part 301 extends upward at right and left.Movable wall part 301 is disposed at the rear of fixing wall portion 300.Movable wall part 301 can be at the front and back upward sliding with respect to a pair of Y-axis guide rail 340.A pair of conveyer belt 302 and the rear surface of fixing wall portion 300 and relative configuration of front surface of movable wall part 301.A pair of conveyer belt 302 extends upward at right and left.The a pair of conveyer belt 302 added substrates 8 that are provided with.303 pairs of a pair of conveyer belts 302 of carrying motor are rotated driving.By movable wall part 301 is moved up in front and back, the width between can a pair of conveyer belt 302 of convergent-divergent is the carrying amplitude of substrate 8.
Clamping device 35 comprises brace table (backup table) 350, a plurality of supporting pin (backup pin) 351, a pair of clamp clip 352 and lift motor 353.Brace table 350 is disposed between fixing wall portion 300 and the movable wall part 301.Lift motor 353 can make brace table 350 up and down direction move back and forth.A plurality of supporting pins 351 are disposed at the upper surface of brace table 350.On substrate 8 during installing electronic elements, the lower surface of a plurality of supporting pin 351 supporting substrates 8.A pair of clamp clip 352 is disposed at the upper limb of fixing wall portion 300 and movable wall part 301.During installing electronic elements, a pair of clamp clip 352 is pressed former and later two edges of the upper surface of substrate 8 on substrate 8.That is, when installing electronic elements, substrate 8, is also fixed from the below clamping by a plurality of supporting pins 351 from top clamping and fixing by a pair of clamp clip 352.By described fixing, determine the position of substrate 8.
Such as Fig. 2, shown in Figure 3, XY mechanical arm 31 comprises a pair of X-axis guide rail 310, X-axis slide block 311, a pair of Y-axis guide rail 312, Y-axis slide block 313, X-axis motor 314 and Y-axis motor 315.A pair of Y-axis guide rail 312 is disposed at the upper wall lower surface of the shell of module 3.A pair of Y-axis guide rail 312 extends upward in front and back.Y-axis slide block 313 can be with respect to the forwards, backwards direction slip of a pair of Y-axis guide rail 312.A pair of X-axis guide rail 310 is disposed at the front surface of Y-axis slide block 313.A pair of X-axis guide rail 310 extends upward at right and left.X-axis slide block 311 can be with respect to the to the left and right direction slip of a pair of X-axis guide rail 310.X-axis motor 314 can drive X-axis slide block 311, and Y-axis motor 315 can drive Y-axis slide block 313.By the actuating force of X-axis motor 314 and Y-axis motor 315, X-axis slide block 311 forwards, backwards left and right directions moves.
Mounting head 32 can be installed on X-axis slide block 311 with changing.Mounting head 32 comprises suction nozzle 320, Z axis motor 321 and θ axle motor 322.Suction nozzle 320 can be installed on mounting head 32 with changing.Suction nozzle 320 by Z axis motor 321 can with respect to mounting head 32 up and down direction move, can move to the direction of rotation in the horizontal plane with respect to mounting head 32 by θ axle motor 322.Malleation, negative pressure can supply to suction nozzle 320 with switching.By negative pressure, suction nozzle 320 fixed electronic elements.By malleation, suction nozzle 320 discharges electronic component.
As shown in Figure 3, control device 7 comprises computer 70 and a plurality of drive circuit.Control device 7 is electrically connected with host control device 90 shown in Figure 1.Computer 70 comprises input/output interface 700, operational part 701 and storage part 702.Computer 70 is electrically connected with carrying motor 303, lift motor 353, X-axis motor 314, Y-axis motor 315, Z axis motor 321, θ axle motor 322 and filming apparatus 33 via drive circuit.The described equipment of control device 7 controls.In addition, computer 70 is electrically connected with image processing apparatus 5.5 transmit photographed data from filming apparatus 33 to image processing apparatus.
＜electronic component mounting method 〉
The electronic component mounting method of present embodiment then, is described.Below the electronic component mounting method of explanation is carried out respectively in all electronic part mountings 1 shown in Figure 1.Fig. 5 represents the flow chart of the electronic component mounting method of present embodiment.
At first, prepare as producing the front production of beginning (step 1 (S1)), the control device 7 from host control device shown in Figure 1 90 to each electronic part mounting 1 transmits production routine.Comprise the distribution to the electronic component of each electronic part mounting 1 in the production routine.In addition, comprise the installation coordinate of electronic component on substrate 8.In addition, comprise the pad flag data relevant with the shape of pad mark, position etc., the scolder flag data relevant with the shape of scolder mark, position etc. in the production routine.Pad flag data, scolder flag data share in all electronic part mountings 1.The production routine that transmits is stored in the storage part 702 of computer shown in Figure 3 70.
Fig. 6 represents to move into the vertical view of substrate of the electronic part mounting in downstream.For convenience of explanation, be marked with hacures in solder portion 81.As shown in Figure 6, dispose two pad mark M1 and M2, two scolder mark m1 and m2, wiring pattern 80 and a plurality of solder portion 81 at the upper surface of substrate 8.Pad mark M1, M2 and wiring pattern 80 are formed at the upper surface of substrate 8.Pad mark M1, M2 and wiring pattern 80 are that welding disk 800 forms on substrate 8 simultaneously.Pad mark M1, M2 and wiring pattern 80 are that welding disk 800 is disposed at the same coordinate system.Pad mark M1, M2 dispose two altogether at the diagonal position (left-front corner, right back angle) of substrate 8.
A plurality of solder portion 81 are to be printed on the upper surface of welding disk 800 of wiring pattern 80 by not shown screen printer.Screen printer is disposed at the upstream side of a plurality of electronic part mountings 1 shown in Figure 1.By production routine, 4 solder portion 81 of the left-front corner in a plurality of solder portion 81 are chosen to scolder mark m1, and 4 solder portion 81 at right back angle are chosen to scolder mark m2.Scolder mark m1, m2 and solder portion 81 are disposed at the same coordinate system.
[step 1 (S1), step 2 (S2)]
In step 1, step 2, carry out the location of substrate 8.Particularly, in each electronic part mounting 1, at first such as Fig. 2, shown in Figure 3, control device 7 drives carrying motor 303, makes a pair of conveyer belt 302 rotations.And, move into substrate 8 to electronic part mounting 1.Then, control device 7 drives lift motor 353, and brace table shown in Figure 4 350 is risen.And, lift substrate 8 by a plurality of supporting pins 351 from a pair of conveyer belt 302.Afterwards, clamping and fixing base 8 between a plurality of supporting pins 351 and a pair of clamp clip 352.That is, carry out the location of substrate 8.
[step 3 (S3)]
At scolder mark m1 shown in Figure 6, m2 installing electronic elements P in all electronic part mountings 1 shown in Figure 1 only is the electronic part mounting 1 in downstream (upstream side of substrate appearance inspection machine 91).In all the other electronic part mountings 1, installing electronic elements P not on scolder mark m1, m2.
In step 3, judge whether installing electronic elements on scolder mark m1, m2 of each electronic part mounting 1.That is, be included in the installation coordinate of the predetermined electronic component P that installs in the electronic part mounting 1 in the production routine of the storage part 702 of control device 7 shown in Figure 3.In this step, control device 7 is with reference to this production routine.And, judge whether that on scolder mark m1, m2 installing electronic elements P's is predetermined.
As shown in Figure 6, the stage of electronic part mounting 1 after moving in downstream, installing electronic elements P not yet on the solder portion 81 that consists of scolder mark m1, m2.Electronic part mounting 1 installing electronic elements P on these solder portion 81 in downstream.Thus, in the situation of the electronic part mounting 1 in downstream, control device 7 is selected "Yes".And in the situation of remaining electronic part mounting 1, control device 7 is selected "No".
[step 4 (S4)]
Selected in the situation (situation of the electronic part mounting 1 in downstream) of "Yes" execution in step 4 at control device shown in Figure 37.The concept that step 4 is contained in " the first pad mark position obtains step " of the present invention.In this step, obtain the data relevant with the position of pad mark M1, M2 shown in Figure 6.That is, confirm the position of oriented substrate 8.
Particularly, at first, such as Fig. 2, shown in Figure 3, control device 7 drives X-axis motor 314, Y-axis motor 315.And, filming apparatus 33 is disposed at substrate shown in Figure 68 pad mark M1 directly over.Then, control device 7 is taken pad mark M1 by filming apparatus 33.Afterwards, control device 7 is taken pad mark M2 by identical step.The view data of pad mark M1, M2 is sent to image processing apparatus 5 from filming apparatus 33 as shown in Figure 3.The image that image processing apparatus 5 is implemented regulation to these view data is processed.Image processing apparatus 5 sends the data relevant with the position (horizontal direction coordinate) of pad mark M1, M2 to control device 7.Control device 7 is stored in storage part 702 with these data.
[step 5 (S5)]
The concept that step 5 is contained in " the scolder mark position obtains step " of the present invention.In this step, obtain the data relevant with the position of scolder mark m1, m2 shown in Figure 6.That is, confirm the position of oriented substrate 8.
Particularly, at first, such as Fig. 2, shown in Figure 3, control device 7 drives X-axis motor 314, Y-axis motor 315.And, filming apparatus 33 is disposed at substrate shown in Figure 68 scolder mark m1 directly over.Then, control device 7 is taken scolder mark m1 by filming apparatus 33.Afterwards, control device 7 is taken scolder mark m2 by identical step.The view data of scolder mark m1, m2 is sent to image processing apparatus 5 from filming apparatus 33 as shown in Figure 3.The image that image processing apparatus 5 is implemented regulation to these view data is processed.Image processing apparatus 5 sends the data relevant with the position (horizontal direction coordinate) of scolder mark m1, m2 to control device 7.Control device 7 is stored in storage part 702 with described data.
[step 6 (S6)]
The concept that step 6 is contained in " departure calculation procedure " of the present invention.Electronic part mounting 1 in principle take scolder mark m1, m2 shown in Figure 6 as benchmark on substrate 8 installing electronic elements P (scolder marking mode).Yet, exception is also arranged, in step 12 described later (pad marking mode), take the position of scolder mark m1, the m2 of pad mark M1, M2 benchmark as benchmark, installing electronic elements P on substrate 8.With step 12 accordingly, in this step, control device 7 shown in Figure 3 is stored the data relevant with the position of scolder mark m1, the m2 of pad mark M1, M2 benchmark in storage part 702.
Particularly, at first, the data that the operational part 701 of control device 7 is relevant according to the position with pad mark M1, scolder mark m1 of storage part 702 are calculated the departure between pad mark M1 and the scolder mark m1.Then, control device 7 is stored the data relevant with the position of the scolder mark m1 of pad mark M1 benchmark in storage part 702.Afterwards, control device 7 is by identical step, the storage data relevant with the position of the scolder mark m2 of pad mark M2 benchmark in storage part 702.
[step 7 (S7)]
The concept that step 7 is contained in " scolder marking mode " of the present invention.In this step, Zhou Fig. 2, shown in Figure 3, control device 7 suitably drives X-axis motor 314, Y-axis motor 315, Z axis motor 321 and θ axle motor 322, from tape feeder 40 carrying electronic component P to substrate 8.And, at the installation coordinate installing electronic elements P of the regulation of substrate 8.
At this, the installation coordinate of electronic component P is that the position of the scolder mark m1, the m2 that obtain in step 5 is set as benchmark.Therefore, as shown in Figure 6, electronic component P is not with respect to welding disk 800, but correctly installs with respect to solder portion 81.Therefore, though in solder portion 81 in the situation of welding disk 800 skew, also can be by electronic component P when refluxing with the central flows of aqueous solder portion 81 to welding disk 800, and correctly dispose electronic component P at the installation coordinate of regulation.
[step 8 (S8)]
Following step 8 ~ step 12 is that way substrate 8 is temporarily pulled down from electronic part mounting 1 aborning, and again is installed on and carries out in the situation of electronic part mounting 1.In other words, under identifying the situation of datum mark of installation of electronic component P again, carry out by needs.Say on the contrary it, producing in the situation of successfully carrying out, not execution in step 8 ~ step 12.By the scolder marking mode of step 7, all electronic component P are installed on substrate 8.
In step 8, as shown in Figure 2, operator's emergent stopping electronic part mounting 1.The operator temporarily pulls down substrate 8 from electronic part mounting 1 in order to check.
The vertical view of the substrate when Fig. 7 represents in the electronic part mounting in downstream emergent stopping in the production process.As shown in Figure 7, on 4 solder portion 81 that consist of scolder mark m2, electronic component P has been installed.In addition, on two solder portion 81 in 4 solder portion 81 that consist of scolder mark m1 electronic component P has been installed.
[step 9 (S9), step 10 (S10)]
In step 9, step 10, restart to produce.That is, as shown in Figure 2, the substrate 8 after the operator will check outside equipment is set up in a pair of conveyer belt 302 again.By the step identical with step 2, control device 7 shown in Figure 3 uses a plurality of supporting pins 351,352 clampings of a pair of clamp clip and fixing base 8.
[step 11 (S11)]
The position of fixing substrate 8 is more with the situation of the position deviation of the initial substrate 8 of fixing in step 2 again in step 10.Therefore, for electronic component P is installed on substrate 8, need again again to identify the datum mark of the installation of electronic component P.That is, need to reaffirm the position of oriented substrate 8.
Yet, as shown in Figure 7, on 4 solder portion 81 that consist of scolder mark m2, electronic component P has been installed.In addition, on two solder portion 81 in 4 solder portion 81 that consist of scolder mark m1 electronic component P has been installed.Therefore, be difficult to use filming apparatus 33 to obtain the data relevant with the position of scolder mark m1, m2.
On the other hand, there is not installing electronic elements P at pad mark M1, M2.In addition, the data relevant with the position of scolder mark m1, the m2 of pad mark M1, M2 benchmark in step 6, have been obtained.
Therefore, in step 11, take pad mark M1, M2 as benchmark, in order to restore the position of scolder mark m1, m2, obtain the data relevant with the position of pad mark M1, M2.The concept that step 11 is contained in " the second pad mark position obtains step " of the present invention.
Particularly, by the step identical with step 4, control device 7 is taken pad mark M1, M2 by filming apparatus 33.The view data of pad mark M1, M2 is sent to image processing apparatus 5 from filming apparatus 33 as shown in Figure 3.Image processing apparatus 5 sends the data relevant with the position of pad mark M1, M2 to control device 7.Control device 7 is stored in storage part 702 with described data.
[step 12 (S12)]
The concept that step 12 is contained in " pad marking mode " of the present invention.Control device 7 shown in Figure 3 has been obtained the data relevant with the position of scolder mark m1, the m2 of pad mark M1, M2 benchmark in step 6.In addition, in step 11, the data relevant with the position of pad mark M1, M2 have been obtained.Therefore, control device 7 can be according to the position of these data recovery scolder marks m1, m2.In this step, the installation coordinate of electronic component P is set as benchmark in the position of scolder mark m1, m2 after to restore.Particularly, by the step identical with step 7, at the installation coordinate installing electronic elements P of the regulation of substrate 8.
[step 13 (S13), step 14 (S14)]
In step 13, step 14, send the substrate 8 that all electronic component P have been installed from electronic part mounting 1.Particularly, at first, such as Fig. 2, shown in Figure 3, control device 7 drives lift motor 353, and brace table shown in Figure 4 350 is descended.And, from a plurality of supporting pins 351 to a pair of conveyer belt 302 transfer base substrates 8.Then, control device 7 drives carrying motor 303, makes a pair of conveyer belt 302 rotations.Then, take out of substrate 8.The substrate 8 of taking out of as shown in Figure 1, is by substrate appearance inspection machine 91, reflow ovens 92.
[step 15 (S15)]
In step 3, selected in the situation (situation of the electronic part mounting 1 beyond the downstream) of "No" execution in step 15 at control device shown in Figure 37.In this step, obtain the data relevant with the position of scolder mark m1, m2 shown in Figure 6.That is, confirm the position of oriented substrate 8.
Particularly, by the step identical with step 5, control device 7 is taken scolder mark m1, m2 by filming apparatus 33.The view data of scolder mark m1, m2 is sent to image processing apparatus 5 from filming apparatus 33 as shown in Figure 3.Image processing apparatus 5 sends the data relevant with the position of scolder mark m1, m2 to control device 7.Control device 7 is stored in storage part 702 with these data.
[step 16 (S16)]
The concept that step 16 is contained in " scolder marking mode " of the present invention.In this step, by the step identical with step 7, take the position of the scolder mark m1, the m2 that in step 15, obtain as benchmark, at the installation coordinate installing electronic elements P of the regulation of substrate 8.
[step 17 (S17) ~ step 19 (S19)]
Following step 17 ~ step 21 is that way substrate 8 is temporarily pulled down from electronic part mounting 1 aborning, and again is installed on and carries out in the situation of electronic part mounting 1.In other words, under identifying the situation of datum mark of installation of electronic component P again, carry out by needs.Say on the contrary it, producing in the situation of successfully carrying out, not execution in step 17 ~ step 21.By the scolder marking mode of step 16, all electronic component P are installed on substrate 8.
In step 17 ~ step 19, by the step identical with step 8 ~ step 10, carry out electronic part mounting 1 emergent stopping, substrate 8 pull down, produce restart and substrate 8 again fixing.
[step 20 (S20)]
The position of fixing substrate 8 is more with the situation of the position deviation of the initial substrate 8 of fixing in step 2 again in step 19.Therefore, for electronic component P is installed on substrate 8, need again again to identify the datum mark of the installation of electronic component P.That is, need to reaffirm the position of oriented substrate 8.
At this, control device 7 shown in Figure 3 has been selected in the situation of "No" in step 3, installing electronic elements P not on 4 solder portion 81 of formation scolder mark m1, m2 shown in Figure 7.Therefore, in this step, obtain the data relevant with the position of scolder mark m1, m2.
Particularly, by the step identical with step 15, control device 7 is taken scolder mark m1, m2 by filming apparatus 33.The view data of scolder mark m1, m2 is sent to image processing apparatus 5 from filming apparatus 33 as shown in Figure 3.Image processing apparatus 5 sends the data relevant with the position of scolder mark m1, m2 to control device 7.Control device 7 is stored in storage part 702 with these data.
[step 21 (S21)]
The concept that step 21 is contained in " scolder marking mode " of the present invention.In this step, by the step identical with step 16, take the position of the scolder mark m1, the m2 that in step 20, obtain as benchmark, at the installation coordinate installing electronic elements P of the regulation of substrate 8.
[step 22 (S22), step 23 (S23)]
In step 22, step 23, by with step 13, step that step 14 is identical, discharge and take out of substrate 8.The substrate 8 of taking out of as shown in Figure 1, is transferred to the electronic part mounting 1 in downstream.
＜action effect 〉
Then, the electronic part mounting 1 of present embodiment and the action effect of electronic component mounting method are described.The electronic part mounting 1 of present embodiment and electronic component mounting method can switch between the scolder marking mode shown in the step 7 of Fig. 5, step 16, the step 21 and the pad marking mode shown in the step 12.On Fig. 6, scolder mark m1, the m2 shown in Figure 7 not in the situation of installing electronic elements P, carry out the scolder marking mode.And in the situation of installing electronic elements P on scolder mark m1, the m2, carry out the pad marking mode.That is, being equipped with on the selecteed solder portion 81 in the situation of electronic component P as scolder mark m1, m2, at least take pad mark M1, M2 (not installing electronic elements P) as benchmark installing electronic elements P on substrate.Like this, according to the electronic part mounting 1 of present embodiment, can according on scolder mark m1, the m2 whether electronic component P being arranged, distinguish use scolder mark m1, m2 and pad mark M1, M2 and installing electronic elements P.Therefore, even be difficult to identify scolder mark m1, m2, also can be on substrate 8 installing electronic elements P.
In addition, electronic part mounting 1 and electronic component mounting method according to present embodiment, installing electronic elements P (Fig. 7) on scolder mark m1, m2, and in the situation that substrate 8 is positioned after temporarily being released again (step 8 of Fig. 5 ~ step 10), can carry out pad marking mode (step 12 of Fig. 5).That is, installing electronic elements P on scolder mark m1, m2, and in substrate 8 situation about again being positioned after temporarily being released is difficult to take and identify again scolder mark m1, m2 behind the location.Even under these circumstances, also can be at least take pad mark M1, M2 as benchmark on substrate 8 installing electronic elements P.
In addition, electronic part mounting 1 and electronic component mounting method according to present embodiment, control device 7 shown in Figure 3 is obtained step (step 4 of Fig. 5) in execution the first pad mark position, the scolder mark position obtains step (step 5 of Fig. 5), departure calculation procedure (step 6 of Fig. 5) and the second pad mark position and obtains step (step 11 of Fig. 5) afterwards, carries out pad marking mode (step 12 of Fig. 5).In the pad marking mode, according to the departure between the position of the position of the position of pad mark M1, M2 shown in Figure 7, pad mark M1, M2 and scolder mark m1, m2, in other words according to the scolder mark m1 take pad mark M1, M2 as benchmark, the position of m2, installing electronic elements P.According to electronic part mounting 1 and the electronic component mounting method of present embodiment, can according to position and the departure of pad mark M1, M2, restore scolder mark m1, the m2 that can't take and identify owing to the installation of electronic component P.
＜other 〉
More than, the execution mode of electronic part mounting of the present invention and electronic component mounting method has been described.Yet execution mode is without particular limitation of in described mode.Can also implement with various modes of texturing, mode of ameliorating that those skilled in the art can implement.
In said embodiment, with all electronic part mountings 1 shown in Figure 1 as electronic part mounting 1 of the present invention, but also can be only with the electronic part mounting 1 in downstream as electronic part mounting of the present invention.That is, also can be only with as shown in Figure 7 on scolder mark m1, m2 the electronic part mounting 1 of installing electronic elements P as electronic part mounting of the present invention.In addition, also can be only with the electronic part mounting 1 take scolder mark m1, m2 as benchmark installing electronic elements P on substrate 8 as electronic part mounting of the present invention.
In said embodiment, in the step 12 of Fig. 5, take scolder mark m1, the m2 of pad mark M1 shown in Figure 7, M2 benchmark as benchmark, installing electronic elements P on substrate 8.Yet, also can be only take pad mark M1, M2 as benchmark, installing electronic elements P on substrate 8.At this moment, can omit step 4, step 6.For example, install in the situation of the electronic component P that is difficult to when refluxing to flow with solder portion 81 (from great electronic component P etc.) at substrate 8, better take pad mark M1, M2 (being welding disk 800) as benchmark installing electronic elements P on substrate 8.
In said embodiment, the pad flag data in the production routine, scolder flag data are common to all electronic part mountings 1, but also can share.For example, also can be according to each electronic part mounting 1, perhaps a plurality of electronic part mountings 1 are divided into a plurality of groups and according to each group, different solder portion 81 is identified as scolder mark m1, m2.
In said embodiment, in the step 4 of Fig. 5, step 5, take respectively pad mark M1, M2 shown in Figure 6 and scolder mark m1, m2.Yet, in the situation of the visual field that enters filming apparatus 33, also can disposable shooting pad mark M1 and scolder mark m1, pad mark M2 and scolder mark m2.That is, also simultaneously execution in step 4, step 5.In addition, also can first execution in step 5, rear execution in step 4.
In addition, without particular limitation of the position of pad mark M1, M2, scolder mark m1, m2, configuration quantity and shape.Pad mark M1, M2 and welding disk 800 get final product at the same coordinate system.Scolder mark m1, m2 and solder portion 81 get final product at the same coordinate system.
Claims (8)
1. electronic part mounting, installing electronic elements on oriented substrate, described substrate has a plurality of welding disks, be printed on a plurality of solder portion on a plurality of described welding disks, be in the pad mark of the same coordinate system and be in the scolder mark of the same coordinate system with a plurality of described solder portion with a plurality of described welding disks
Described electronic part mounting is characterised in that,
Described scolder mark is selected from a plurality of described solder portion,
Can between scolder marking mode and pad marking mode, switch, described scolder marking mode is installed described electronic component take the position of described scolder mark as benchmark at described substrate, described pad marking mode is installed described electronic component take the position of described pad mark as benchmark at described substrate at least
When the position of oriented described substrate is confirmed, on described scolder mark, do not install in the situation of described electronic component, carry out described scolder marking mode,
On described scolder mark, installed in the situation of described electronic component, carried out described pad marking mode.
2. electronic part mounting according to claim 1 is characterized in that,
In the situation of after the installation process of the described electronic component of described substrate installation that described electronic component is installed to described scolder mark is interrupted, restarting, carry out described pad marking mode.
3. electronic part mounting according to claim 2 is characterized in that,
Temporarily be released during before described substrate might restart after described installation process is interrupted and again be carried out in the situation of location, carry out described pad marking mode.
4. according to claim 2 or 3 described electronic part mountings, it is characterized in that,
Comprise:
Clamping device can position, discharge described substrate;
Filming apparatus can be taken the described pad mark of the described substrate of being located by described clamping device, described scolder mark;
Suction nozzle is installed described electronic component at the described substrate of being located by described clamping device; And
Control device is controlled described clamping device, described filming apparatus and described suction nozzle,
In the situation of carrying out described pad marking mode, before described pad marking mode, described control device is carried out following steps:
The first pad mark position obtains step, uses described filming apparatus to obtain the position that described installation process is interrupted described pad mark before;
The scolder mark position obtains step, uses described filming apparatus to obtain the position that described installation process is interrupted described scolder mark before;
The departure calculation procedure is calculated the departure between the position of the position of described pad mark and described scolder mark; And
The second pad mark position obtains step, uses described filming apparatus to obtain to restart the position of the described pad mark after the described installation process,
In described pad marking mode, take the position of obtaining the described pad mark that step obtains by described the second pad mark position and the described departure that calculates by described departure calculation procedure as benchmark, use described suction nozzle that described electronic component is installed.
5. electronic component mounting method, installing electronic elements on oriented substrate, described substrate has a plurality of welding disks, be printed on a plurality of solder portion on a plurality of described welding disks, be in the pad mark of the same coordinate system and be in the scolder mark of the same coordinate system with a plurality of described solder portion with a plurality of described welding disks
Described electronic component mounting method is characterised in that,
Described scolder mark is selected from a plurality of described solder portion,
Can between scolder marking mode and pad marking mode, switch, described scolder marking mode is installed described electronic component take the position of described scolder mark as benchmark at described substrate, described pad marking mode is installed described electronic component take the position of described pad mark as benchmark at described substrate at least
When the position of oriented described substrate is confirmed, on described scolder mark, do not install in the situation of described electronic component, carry out described scolder marking mode,
On described scolder mark, installed in the situation of described electronic component, carried out described pad marking mode.
6. electronic component mounting method according to claim 5 is characterized in that,
In the situation of after the installation process of the described electronic component of described substrate installation that described electronic component is installed to described scolder mark is interrupted, restarting, carry out described pad marking mode.
7. electronic component mounting method according to claim 6 is characterized in that,
Temporarily be released during before described substrate might restart after described installation process is interrupted and again be carried out in the situation of location, carry out described pad marking mode.
8. according to claim 6 or 7 described electronic component mounting methods, it is characterized in that,
In the situation of carrying out described pad marking mode, before described pad marking mode, carry out following steps:
The first pad mark position obtains step, obtains the position that described installation process is interrupted described pad mark before;
The scolder mark position obtains step, obtains the position that described installation process is interrupted described scolder mark before;
The departure calculation procedure is calculated the departure between the position of the position of described pad mark and described scolder mark; And
The second pad mark position obtains step, obtains the position of restarting the described pad mark after the described installation process,
In described pad marking mode, take the position of obtaining the described pad mark that step obtains by described the second pad mark position and the described departure that calculates by described departure calculation procedure as benchmark described electronic component is installed.
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| JP2011196003A JP5767918B2 (en) | 2011-09-08 | 2011-09-08 | Electronic component mounting machine and electronic component mounting method |
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| CN107079620A (en) * | 2014-11-13 | 2017-08-18 | 富士机械制造株式会社 | Fitting machine and used fitting machine electronic component absorption posture inspection method |
| CN111447823A (en) * | 2015-11-17 | 2020-07-24 | 株式会社富士 | Replacement control device |
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| WO2017130372A1 (en) | 2016-01-29 | 2017-08-03 | 富士機械製造株式会社 | Electronic component mounting apparatus and production line |
| JP6890694B2 (en) * | 2016-01-29 | 2021-06-18 | 株式会社Ｆｕｊｉ | How to decide and how to wear |
| CN116636321A (en) * | 2020-12-22 | 2023-08-22 | 雅马哈发动机株式会社 | Component mounting apparatus and component mounting method |
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| JP2013058605A (en) | 2013-03-28 |
| CN103002726B (en) | 2016-12-21 |
| JP5767918B2 (en) | 2015-08-26 |
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