WO2015159405A1 - Machine for performing work on board, system for performing work on board, and method for performing work on board - Google Patents

Machine for performing work on board, system for performing work on board, and method for performing work on board Download PDF

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Publication number
WO2015159405A1
WO2015159405A1 PCT/JP2014/060927 JP2014060927W WO2015159405A1 WO 2015159405 A1 WO2015159405 A1 WO 2015159405A1 JP 2014060927 W JP2014060927 W JP 2014060927W WO 2015159405 A1 WO2015159405 A1 WO 2015159405A1
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WO
WIPO (PCT)
Prior art keywords
information
work
board
identification information
circuit board
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Application number
PCT/JP2014/060927
Other languages
French (fr)
Japanese (ja)
Inventor
光彦 柴田
正明 永田
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2014/060927 priority Critical patent/WO2015159405A1/en
Priority to JP2016513581A priority patent/JP6377136B2/en
Publication of WO2015159405A1 publication Critical patent/WO2015159405A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level

Definitions

  • the present invention relates to a substrate working machine that performs a predetermined operation on a circuit board, a substrate working system including the substrate working machine and a management device, and a substrate working method.
  • a first electronic component mounting apparatus for mounting an electronic component (small electronic component) by fixing a circuit board arranged on the upstream side of the line and flowing through the line
  • a second electronic component mounting device for mounting an electronic component (large electronic component or odd-shaped electronic component) by fixing the circuit board that has been arranged on the downstream side of the line and has flowed from the upstream side of the line
  • a device including a system control device (management device) for managing these devices has been proposed (see, for example, Patent Document 1).
  • the circuit board is a multi-board (aggregate board) having a plurality of work areas (child boards), and a child board position reference mark is attached to each of the plurality of work areas (child boards) and selectively mounted. Impossible mark (skip mark) is added.
  • the circuit board is also provided with a board ID mark for identifying the board.
  • the board imaging apparatus images the position of the circuit board where the board ID mark, the sub board position reference mark, and the mounting impossible mark are attached, and the obtained image is displayed. Based on the position of the sub-board recognized by the picked-up image of the sub-board position reference mark for the work area that is determined not to be attached.
  • the electronic component is mounted, and the electronic component is not mounted on the work area that is determined to have a mounting impossible mark. Further, the first electronic component mounting apparatus transfers the child board position and the mounting failure determination information for each of the plurality of work areas to the system control apparatus in association with the board ID.
  • the second electronic component mounting apparatus fixes the circuit board flowing from the upstream side of the line, then images the board ID mark of the circuit board by the board imaging device, and based on the board ID recognized by the obtained image. By acquiring communication from the system control device, each of the plurality of work areas, and determining whether or not to mount the electronic component based on the acquired mounting failure determination information, and determining whether the electronic component is mounted or not Based on this, electronic parts are mounted. JP 2003-101300 A
  • the above-described board-to-board working system reads the circuit board board ID, child board position, and mounting failure determination information by the first electronic component mounting apparatus on the upstream side of the line and associates them with each other to the system control apparatus.
  • the board ID is read by the second electronic component mounting apparatus on the downstream side of the line, whereby the slave board position and the mounting impossible information can be acquired from the system control apparatus by communication.
  • the above-described on-board working system no consideration is given to the case where reading of the board ID fails in the second electronic component mounting apparatus.
  • the main object of the present invention is to appropriately deal with the occurrence of problems when reading various types of information attached to a circuit board and to suppress a decrease in productivity.
  • the present invention adopts the following means in order to achieve the main object described above.
  • the substrate working machine of the present invention is A circuit board working machine that performs a predetermined work on a circuit board provided with an identification information output unit that outputs identification information and a work information output unit that outputs work information related to work,
  • the identification information can be read from the identification information output unit of the circuit board and the work information can be read from the work information output unit of the circuit board, and the time required for reading the work information is Information reading means longer than the time required for reading; and Work information acquisition means capable of acquiring work information associated with the identification information based on the identification information;
  • the information reading unit is controlled to read the identification information from the identification information output unit of the circuit board, and when the information reading unit successfully reads the identification information, the information reading unit When the work information corresponding to the identification information is obtained by the work information obtaining means, the predetermined work is performed on the circuit board based on the obtained work information, and reading of the identification information fails
  • a work execution unit that controls the information reading unit to read the work information from the work information output unit of the circuit board and performs the predetermined
  • the information reading means that controls the information reading means that takes longer time to read the work information than the time required to read the identification information reads the identification information from the identification information output unit of the circuit board, and reads the information. If the identification information is successfully read by the means, a predetermined work is performed on the circuit board based on the work information obtained after obtaining the work information corresponding to the identification information based on the read identification information, When the reading of the identification information fails, the information reading unit is controlled to read the work information from the work information output unit of the circuit board, and a predetermined work is performed on the circuit board based on the read work information.
  • the work information can be acquired based on the identification information and the predetermined work can be performed without reading the work information. Since the reading of the work information takes longer than the reading of the identification information, the work time can be further shortened by omitting the reading of the work information. On the other hand, even if the reading of the identification information fails, the predetermined work can be continued without stopping by reading the work information again. That is, by reading the work information only when the reading of the identification information has failed, it is possible to improve productivity while preventing the work from being stopped due to the reading failure of the identification information.
  • the circuit board has a plurality of work areas
  • the work information output unit is provided in each of the plurality of work areas
  • the information reading means includes the plurality of work areas.
  • the work information may be read from the work information output unit of each work area.
  • the work information output unit may output determination information for determining the presence or absence of work as the work information.
  • the work information output unit may output position information indicating the position of the work area with respect to the circuit board as the work information.
  • the on-board working system of the present invention is A substrate work machine that performs a predetermined work on a circuit board provided with an identification information output unit that outputs identification information and a work information output unit that outputs work information related to work, and manages the board work machine
  • An on-board working system comprising a management device, The management device Storage means for storing the work information in association with the identification information;
  • the substrate working machine is The identification information can be read from the identification information output unit of the circuit board and the work information can be read from the work information output unit of the circuit board, and the time required for reading the work information is Information reading means longer than the time required for reading; and A communication means capable of communicating with the management device;
  • the information reading unit is controlled to read the identification information from the identification information output unit of the circuit board, and when the information reading unit successfully reads the identification information, the information reading unit is configured to read the identification information based on the read identification information.
  • the work information corresponding to the identification information is obtained from the management device via the communication means, and then the predetermined work is performed on the circuit board based on the obtained work information, and reading of the identification information has failed.
  • the information reading unit is controlled to read the work information from the work information output unit of the circuit board, and the predetermined work is performed on the circuit board based on the read work information.
  • the gist is to provide execution means.
  • the management device stores the work information in the storage means in association with the identification information.
  • the on-board work machine capable of communicating with the management device controls the information reading means whose time required for reading the work information is longer than the time required for reading the identification information, and the identification information is output from the identification information output unit of the circuit board.
  • the circuit based on the work information obtained after obtaining the work information corresponding to the identification information from the management device by communication based on the read identification information.
  • the circuit board is controlled based on the read work information by controlling the information reading means so as to read the work information from the work information output unit of the circuit board when the predetermined work is performed on the board and reading of the identification information fails.
  • the predetermined work is performed. Thereby, when the reading of the identification information is successful, the work information can be acquired based on the identification information and the predetermined work can be performed without reading the work information. Since the reading of the work information takes longer than the reading of the identification information, the work time can be further shortened by omitting the reading of the work information. On the other hand, even if the reading of the identification information fails, the predetermined work can be continued without stopping by reading the work information again. That is, by reading the work information only when the reading of the identification information has failed, it is possible to improve productivity while preventing the work from being stopped due to the reading failure of the identification information.
  • the method for working with a substrate of the present invention is as follows.
  • a circuit board working method for performing a predetermined work on a circuit board provided with an identification information output part for outputting identification information and a work information output part for outputting work information on work The work information is stored in association with the identification information, When the identification information is read from the identification information output unit of the circuit board and the identification information is successfully read, the work information corresponding to the identification information is stored based on the read identification information.
  • the work information is obtained from the work information on the circuit board based on the obtained work information, and when the reading of the identification information fails, the work information is output from the work information output unit of the circuit board. And performing a predetermined operation on the circuit board based on the read operation information.
  • the work information is stored in association with the identification information, the identification information is read from the identification information output unit of the circuit board, and the identification information is successfully read by the information reading means.
  • Reads out the identification information by performing predetermined work on the circuit board based on the acquired work information after acquiring the work information corresponding to the identification information based on the read identification information. If the operation fails, the work information is read from the work information output unit of the circuit board, and a predetermined work is performed on the circuit board based on the read work information. Thereby, when the reading of the identification information is successful, the work information can be acquired based on the identification information and the predetermined work can be performed without reading the work information.
  • the work information can be acquired based on the identification information and the predetermined work can be performed without reading the work information. Since the reading of the work information takes longer than the reading of the identification information, the work time can be further shortened by omitting the reading of the work information. On the other hand, even if the reading of the identification information fails, the predetermined work can be continued without stopping by reading the work information again. That is, by reading the work information only when the reading of the identification information has failed, it is possible to improve productivity while preventing the work from being stopped due to the reading failure of the identification information.
  • FIG. 1 is a configuration diagram showing an outline of the configuration of a component mounting system 1.
  • FIG. 1 is a configuration diagram showing an outline of the configuration of a component mounter 10.
  • 3 is an explanatory diagram showing an electrical connection relationship between a control device 70 and a management device 80 of the component mounter 10.
  • FIG. 2 is a configuration diagram showing an outline of a configuration of a circuit board 60.
  • FIG. It is a flowchart which shows an example of a 1st component mounting process. It is a flowchart which shows an example of a work information reading process.
  • 7 is an explanatory diagram illustrating an example of work information stored in an HDD 83 of the management apparatus 80.
  • FIG. It is a flowchart which shows an example of a 2nd component mounting process. It is a flowchart which shows an example of a work information acquisition process.
  • FIG. 1 is a configuration diagram showing an outline of the configuration of the component mounting system 1
  • FIG. 2 is a configuration diagram showing an overview of the configuration of one component mounting machine 10 constituting the component mounting system 1
  • FIG. 3 is an explanatory diagram showing an electrical connection relationship between a control device 70 and a management device 80 of one component mounter 10.
  • the left-right direction in FIG. 2 is the X-axis direction
  • the front-rear direction is the Y-axis direction
  • the up-down direction is the Z-axis direction.
  • the component mounting system 1 pushes the solder on the screen into a pattern hole formed in the screen while rolling the solder on the screen by means of a squeegee, thereby passing the circuit board 60 (hereinafter simply “A plurality of screen printing machines 2 for printing a wiring pattern on the substrate) and an electronic component P (not shown) supplied by the component supply device 16 (hereinafter simply referred to as “component”).
  • a plurality of component mounters 10 mounted on the wiring pattern and a management device 80 for managing the entire component mounting system are provided.
  • the plurality of component mounting machines 10 have a head (multi-nozzle head) that can mount a large number of suction nozzles and mounts a relatively small component P at a high speed, and a head that can mount a small number of suction nozzles ( A multi-function head) and a relatively large component P or an irregular component P are mounted, and the component P is mounted on the substrate 60 by a sharing operation.
  • the component mounter 10 backs up the component supply device 16 that supplies the component P, the substrate transport device 20 that transports the substrate 60, and the substrate 60 transported by the substrate transport device 20 from the back side.
  • the backup device 30 for picking up the component P by the suction nozzle 51 and mounting it on the substrate 60, the XY robot 40 for moving the head 50 in the XY direction, and various marks attached to the substrate 60. Controls the mark camera 46 that can be imaged, the parts camera 48 that can image the component sucked by the suction nozzle 51, the nozzle station 49 for stocking the plurality of suction nozzles 51, and the entire component mounting machine. And a control device 70 (see FIG. 3).
  • the substrate transfer device 20, the backup device 30, the head 50, and the XY robot 40 are accommodated in a main body frame 12 installed on the base 11.
  • the component supply device 16 includes a feeder 18 that is arranged on the feeder base 14 formed on the front surface of the main body frame 12 so as to be aligned in the left-right direction (X-axis direction).
  • the feeder 18 is a tape feeder that sends out a carrier tape containing the components P at a predetermined pitch to a component supply position where the suction nozzle 51 can pick up.
  • the carrier tape is comprised by the bottom tape in which the cavity (recessed part) was formed with the predetermined pitch, and the top film which covers a bottom tape in the state in which the components P were accommodated in each cavity. .
  • the feeder 18 pulls out the carrier tape wound around the reel, feeds it to the component supply position, and peels off the top film from the bottom tape before the component supply position, so that the component P is exposed at the component supply position, that is, the pickup. Make it possible.
  • the substrate transfer device 20 is configured as a dual lane transfer device provided with two substrate transfer paths, and is arranged on a support base 13 provided in the middle portion of the main body frame 12.
  • Each substrate conveyance path is provided with a belt conveyor device 22, and the substrate 60 is conveyed from left to right (substrate conveyance direction) in FIG. 2 by driving the belt conveyor device 22.
  • the backup device 30 includes a backup plate 32 that can be moved up and down by a lifting device (not shown), and a plurality of backup pins 34 that are erected on the backup plate 32.
  • the backup device 30 backs up the substrate 60 from the back side by raising the backup plate 32 in a state where the substrate 60 is transported above the backup plate 32 by the substrate transport device 20.
  • the XY robot 40 includes a Y-axis guide rail 43 provided in the upper stage portion of the main body frame 12 along the Y-axis direction, and a Y-axis slider capable of moving along the Y-axis guide rail 43. 44, an X-axis guide rail 41 provided along the X-axis direction on the lower surface of the Y-axis slider 44, and an X-axis slider 42 movable along the X-axis guide rail 41.
  • the aforementioned mark camera 46 is attached to the lower surface of the X-axis slider 42.
  • the mark camera 46 can image an arbitrary position on the surface of the substrate 60 backed up by the backup device 30 by driving and controlling the XY robot 40.
  • FIG. 4 is a configuration diagram showing an outline of the configuration of the substrate 60.
  • the substrate 60 is a collective substrate having a plurality of sub-substrates 65 (blocks) separated by dividing grooves.
  • the component mounting system 1 prints a wiring pattern on the plurality of sub-boards 65 by the screen printer 2, mounts the component P on the wiring pattern of each sub-board 65 by the component mounting machine 10, and then follows the dividing grooves.
  • a plurality of sub boards 65 on which the component P is mounted can be manufactured.
  • the plurality of sub boards 65 constitute a plurality of work areas in the board 60.
  • the substrate 60 is provided with substrate position reference marks 62 at two diagonal corners (upper left and lower right in FIG. 4). These substrate position reference marks 62 are for acquiring position information of the substrate 60 when the substrate 60 is positioned by the backup device 30. That is, the component mounter 10 controls the XY robot 40 to move the X-axis slider 42 and the Y-axis slider 44 so that one of the two board position reference marks 62 is within the field of view of the mark camera 46. 46 is driven to image one of the substrate position reference marks 62 and the XY robot 40 is controlled so that the other of the two substrate position reference marks 62 is within the field of view of the mark camera 46 and the Y axis slider 42 and the Y axis.
  • the slider 44 is moved to drive the mark camera 46 to image the other of the substrate position reference marks 62, and the obtained images are processed to detect the amount of positional displacement of the substrate 60 in the XY plane parallel to the surface of the substrate 60 ( ⁇ xs, ⁇ ys, ⁇ s) is calculated.
  • ⁇ xs indicates a positional deviation amount in the X-axis direction with respect to a reference position defined in advance in the XY plane
  • ⁇ ys indicates a positional deviation amount in the Y-axis direction with respect to the reference position in the XY plane
  • “ ⁇ s” indicates the amount of positional deviation in the rotational direction in the XY plane.
  • the substrate 60 has a substrate ID mark 64 at the corner (upper left portion in FIG. 4).
  • the substrate ID mark 64 is identification information for identifying the substrate 60, and may be a two-dimensional code, for example.
  • the substrate ID mark 64 is attached so as to be adjacent to one of the substrate position reference marks 62. For this reason, the mark camera 46 can collectively store one of the substrate position reference marks 62 and the substrate ID mark 64 within the field of view, and image one of the substrate position reference marks 62 and the substrate ID mark 64 at a time. It is possible.
  • the plurality of sub-boards 65 are provided with sub-board position reference marks 66 at two diagonal corners (upper left and lower right in FIG. 4). These sub-board position reference marks 66 are for acquiring position information of the sub-board 65 when the board 60 is positioned by the backup device 30. That is, the component mounter 10 controls the XY robot 40 to move the X-axis slider 42 and the Y-axis slider 44 so that one of the two daughter board position reference marks 66 is within the field of view of the mark camera 46. The camera 46 is driven to image one of the sub board position reference marks 66, and the XY robot 40 is controlled so that the other of the two sub board position reference marks 66 falls within the field of view of the mark camera 46.
  • the Y-axis slider 44 is moved to drive the mark camera 46 to image the other of the child board position reference marks 66, and the obtained images are processed to obtain the child board in the XY plane parallel to the surface of the child board 65.
  • the amount of misregistration 65 ( ⁇ x_i, ⁇ y_i, ⁇ _i) is calculated.
  • the component mounter 10 performs these operations and processes on each of the plurality of sub boards 65.
  • ⁇ x_i indicates a positional deviation amount in the X-axis direction with respect to the reference position in the XY plane
  • ⁇ y_i indicates a positional deviation amount in the Y-axis direction with respect to the reference position in the XY plane
  • “ ⁇ _i” indicates XY.
  • the amount of positional deviation in the rotational direction on the plane is shown.
  • “i” is a number for specifying the sub board 65 and is an integer value of 1 to n when n sub boards 65 are included in one board 60.
  • each of the plurality of sub-boards 65 is provided with a skip mark 68 at a specific position (upper right part of FIG. 4).
  • This skip mark 68 is for instructing not to perform work (no component P is mounted) on the sub board 65 in which a defect has occurred, and is selectively given to each sub board 65 in advance.
  • the component mounter 10 controls the XY robot 40 so that the specific position (position where the skip mark 68 may be attached) is within the field of view of the mark camera 46. 44 is moved, the mark camera 46 is driven to capture a specific position, and the obtained image is processed to determine whether or not the skip mark 68 is attached to the specific position.
  • the component mounter 10 performs these operations and processes on each of the plurality of sub boards 65. Then, the component mounter 10 mounts the component P on the child board 65 determined not to have the skip mark 68 attached, and to the child board 65 determined to have the skip mark 68 attached. The component P is not mounted.
  • the time required for reading these marks is compared with the time required for reading the substrate position reference mark 62 and the substrate ID mark 64. It is getting longer.
  • the sub-board position information obtained by reading the sub-board position reference mark 66 and the skip information obtained by reading the skip mark 68 correspond to “work information”.
  • the control device 70 is configured as a microprocessor centered on the CPU 71, and includes a ROM 72, an HDD 73, a RAM 74, and an input / output interface 75 in addition to the CPU 71, and these are electrically connected via a bus 76. It is connected.
  • the control device 70 includes a position signal from the X-axis position sensor 42 a that detects the position of the X-axis slider 42, a position signal from the Y-axis position sensor 44 a that detects the position of the Y-axis slider 44, and an image from the mark camera 46. Signals, image signals from the parts camera 48, and the like are input via the input / output interface 75.
  • control device 70 a control signal to the component supply device 16, a control signal to the substrate transfer device 20, a control signal to the backup device 30, a drive signal to the X-axis actuator 42 b that moves the X-axis slider 42, A drive signal for the Y-axis actuator 44b for moving the Y-axis slider 44, a drive signal for the Z-axis actuator 52 for moving the suction nozzle 51 in the Z-axis direction, a drive signal for the ⁇ -axis actuator 54 for rotating the suction nozzle 51, etc. Is output via the input / output interface 75.
  • the control device 70 is connected to the management device 80 via the communication network 90 so as to be capable of bidirectional communication, and exchanges data and control signals with each other.
  • the management device 80 is, for example, a general-purpose computer, and includes a CPU 81, a ROM 82, an HDD 83, a RAM 84, an input / output interface 85, and the like, which are electrically connected via a bus 86.
  • An input signal is input to the management device 80 from an input device 87 such as a mouse or a keyboard via an input / output interface 85, and an image signal to the display 88 is output from the management device 80 via the input / output interface 85.
  • the HDD 83 stores a production plan for the substrate 60.
  • the production plan of the board 60 means that the wiring pattern is printed on which board 60 in the screen printing machine 2, which parts P are mounted on the board 60 in which order in each component mounting machine 10, and A plan that defines how many boards 60 on which the component P is mounted is determined.
  • This production plan includes head information regarding the head 50 to be used, nozzle information regarding the suction nozzle 51 to be used, component information regarding the component P to be mounted, mounting position information regarding the mounting position (x, y, ⁇ ) of each component P, and the like. include.
  • mark position information indicating which position of the substrate position reference mark 62 and the substrate ID mark 64 is attached to which position of the substrate 60 to be produced, and at which position of each sub-board 65 included in the substrate 60 Also included is mark position information indicating whether the sub-board position reference mark 66 and the skip mark 68 are added.
  • the mark position information is used for determining the position of the mark camera 46 when the mark camera 46 images these marks.
  • This production plan is input to the management apparatus 80 by the operator operating the input device 87.
  • the management device 80 outputs a command signal to the screen printing machine 2 so that a wiring pattern is printed on each child board 65 of the board 60 according to the production plan, and a component P is placed on the wiring pattern of each child board 65.
  • a command signal is output to each component mounting machine 10 so as to be mounted.
  • FIG. 5 is a flowchart illustrating an example of the first component mounting process executed by the control device 70 of the leading component mounter 10. This process is executed when a command signal is received from the management device 80 based on the production plan.
  • the CPU 71 of the control device 70 first controls the substrate transfer device 20 to carry the substrate 60 above the backup device 30 and then backs up the back side of the substrate 60.
  • the backup device 30 is controlled (step S100).
  • the substrate 60 is positioned by the backup device 30.
  • the CPU 71 executes a substrate ID reading process for reading the substrate ID from the substrate 60 (step S102), and a substrate position information reading process for reading the substrate position information (step S104).
  • the substrate ID reading process after moving the mark camera 46 so that the substrate ID mark 64 is within the field of view of the mark camera 46 based on the positional information of the substrate ID mark 64 included in the received production plan, This is performed by imaging the substrate 60 (substrate ID mark 64) with the camera 46 and extracting the substrate ID from the obtained image.
  • the substrate position information reading process is performed so that one of the two substrate position reference marks 62 fits within the field of view of the mark camera 46 based on the mark position information of the substrate position reference mark 62 included in the received production plan. 46, the mark camera 46 images the substrate 60 (one of the substrate position reference marks 62), and the mark camera 46 is moved so that the other of the substrate position reference marks 62 is within the visual field of the mark camera 46.
  • the substrate 60 (the other of the substrate position reference marks 62) is imaged by the mark camera 46, and the obtained images are processed to calculate the amount of displacement ( ⁇ xs, ⁇ ys, ⁇ s) of the substrate 60 with respect to a predetermined reference position. Is done.
  • One of the two substrate position reference marks 62 is provided adjacent to the substrate ID mark 64, and the mark camera 46 can simultaneously capture these two marks in the field of view. is there. Therefore, the CPU 71 can also read the substrate position reference mark 62 based on an image obtained by imaging the substrate 60 (substrate ID mark 64) by the mark camera 46 in the substrate ID reading process. It can be performed more efficiently.
  • the CPU 71 executes a work information reading process for reading work information (sub board position information and skip information) for each sub board 65 (step S106).
  • the work information reading process is performed by sequentially switching the child boards 65 to be read from the child board 65 until the reading of the work information for all the child boards 65 is completed. This can be performed by repeatedly executing a sub-board position information reading process for reading information and a skip information reading process for reading skip information (steps S150 to S154).
  • one of the two sub-board position reference marks 66 is included in the field of view of the mark camera 46 based on the mark position information of the sub-board position reference mark 66 included in the received production plan.
  • the mark camera 46 is moved until the mark camera 46 is moved, and then the child board 65 (one of the child board position reference marks 66) is imaged by the mark camera 46.
  • the mark camera 46 is marked until the other one of the child board position reference marks 66 is within the field of view of the mark camera 46.
  • the child board 65 (the other of the child board position reference marks 66) is imaged by the mark camera 46, and the obtained images are processed to shift the position of the child board 65 with respect to a predetermined reference position.
  • the skip information reading process after the mark camera 46 moves the mark camera 46 to a specific position where the skip mark 68 may be attached based on the position information of the skip mark 68 included in the received production plan.
  • the mark camera 46 images the specific position, and the skip mark 68 is extracted from the obtained image.
  • the skip mark information indicating that the skip mark 68 is attached to the sub board 65 is stored in the RAM 74 as skip information, and the image is captured. If the skip mark 68 cannot be extracted from the image, the skip mark no-information indicating that the skip mark 68 has not been added to the child board 65 is stored in the RAM 74 as skip information.
  • the CPU 71 corresponds to the currently mounted child board 65 (the child board 65 whose child board number is “i”) among the plurality of child boards 65. It is determined whether the skip information is skip mark information (step S108). If the CPU 71 determines that the skip information is information with a skip mark, that is, determines that the skip mark 68 has been read by the skip information reading process in step S152 for the sub-board 65 to be mounted, steps S110 to S110 described later are performed. The process proceeds to step S120 without performing the component mounting operation of S118.
  • the CPU 71 determines that the skip information is information without a skip mark, that is, determines that the skip mark 68 could not be read by the skip information reading process in step S152 for the sub board 65 to be mounted
  • the XY robot. 40 and the Z-axis actuator 52 are controlled and a negative pressure is applied to the suction port of the suction nozzle 51 to suck the component P to the suction nozzle 51 (step S110), and the XY robot 40 is controlled to suck to the suction nozzle 51.
  • the part P thus moved is moved above the part camera 48 and the part P is imaged by the part camera 48 (step S112).
  • the CPU 71 When the CPU 71 captures an image of the component P, the CPU 71 processes the obtained image and performs an adsorption displacement amount of the component P (position displacement amount ⁇ xp in the X-axis direction, displacement amount ⁇ yp in the Y-axis direction, displacement amount ⁇ p in the rotation direction). , And the mounting position designated in advance by the production plan based on the positional deviation amount ( ⁇ x_i, ⁇ y_i, ⁇ _i) and the calculated adsorption deviation amount ( ⁇ xp, ⁇ yp, ⁇ p) of the sub board 65 read in step S152. (X, y, ⁇ ) is corrected (step S114).
  • the CPU 71 drives and controls the XY robot 40 (X-axis actuator 42b and Y-axis actuator 44b), the Z-axis actuator 52, and the ⁇ -axis actuator 54 so that the component P is mounted at the corrected mounting position. (Step S116). Then, the CPU 71 determines whether or not all the components P have been mounted (step S118). If the CPU 71 determines that all the components P have not been mounted, the CPU 71 returns to step S110, and steps S110 to S116. If it is determined that the mounting of all the components P has been completed, it is determined whether or not the component mounting operation (including the child substrate 65 for which the operation has been skipped) has been completed for all the child substrates 65. (Step S120).
  • step S108 the CPU 71 determines that the component mounting operation has not been completed for all the sub-boards 65. If the CPU 71 determines that the component mounting operation has not been completed for all the sub-boards 65, the CPU 71 returns to step S108, designates the next sub-board 65 as a mounting target, and repeats the processing of steps S108 to S118. On the other hand, when the CPU 71 determines that the component mounting operation has been completed for all the sub-boards 65, the CPU 71 derives the relative position information of the sub-board 65 on the board 60 (the collective board) (step S122) and read it in step S102. The board ID, the skip information read in step S152, and the derived relative position information are transmitted to the management device 80 (step S124).
  • the relative position information defines the relative position (dx_i, dy_i, d ⁇ _i) of each child substrate 65 with respect to the substrate position reference mark 62 of the substrate 60, and is estimated based on the substrate position. It can be derived by taking the difference between the position and the position of the child board actually read in step S150.
  • the management device 80 that has received the board ID, the skip information, and the relative position information transmitted from the control device 70 in step S124 associates the skip information and the relative position information with the board ID as shown in FIG. It is stored in the HDD 83. Then, the CPU 71 controls the backup device 30 to cancel the backup of the substrate 60, and then controls the substrate transfer device 20 to pay out the substrate 60 (step S126), thereby completing the first component mounting process.
  • FIG. 8 is a flowchart illustrating an example of the second component mounting process executed by the control device 70 of the downstream component mounter 10. This process is executed when a command signal is received from the management device 80 based on the production plan.
  • the CPU 71 of the control device 70 first loads the board 60 and then backs up the back side of the board 60 (steps S100 to S104 of the first component mounting process) (Ste S200), a board ID reading process for reading the board ID from the board 60 (step S202), and a board position information reading process for reading the board position information (step S204).
  • the CPU 71 executes a work information acquisition process for acquiring work information for each child board 65 from the management device 80 based on the read board ID (step S206).
  • the work information acquisition process can be performed by executing the flowchart shown in FIG. In the work information acquisition process, the CPU 71 first determines whether or not the substrate ID has been successfully read in step S202 (step S250).
  • the CPU 71 determines that the reading of the board ID is successful, the CPU 71 acquires the relative position information and the skip information related to the board ID from the management device 80 based on the read board ID (step S252), and step S204.
  • the sub-board position information is derived based on the board position information read in step S3 and the acquired sub-board relative position information (step S254), and the work information acquisition process is terminated.
  • the sub-board relative position represents the relative position of the sub-board 65 with respect to the board position reference mark 62
  • the sub-board position is determined from the board position information and the sub-board relative position information read in step S204. Can be derived.
  • the mark camera 46 sets the child board position reference mark 66 for all the child boards 65 in the same process as the work information reading process of FIG.
  • Sub-board information reading processing for picking up and reading sub-board information and skip information reading processing for picking up the skip mark 68 with the mark camera 46 and reading skip information are executed, and the work information reading processing is terminated (step S256-). S260).
  • the CPU 71 When the CPU 71 acquires the work information for all the sub-boards 65 in this way, as with the processes of steps S108 to S120 of the first component mounting process, the CPU 71 sets the sub-board 65 associated with the information without skip mark as skip information. In this case, the component mounting operation is performed, and the component mounting operation is not performed for the child board 65 associated with the skip mark information as skip information (steps S208 to S220). If the CPU 71 determines in step S220 that the component mounting operation has been completed for all the sub-boards 65, the CPU 71 releases the backup of the board 60, then pays out the board 60 (step S222), and the second component mounting. The process ends.
  • the board ID of the board 60 read in advance by the mark camera 46 in the upstream (first) component mounting machine 10 among the plurality of component mounting machines 10 constituting the mounting line.
  • the work information (skip information, child board relative position information) of each child board 65 are stored in advance in the management device 80 in association with each other.
  • the downstream component mounter 10 reads the board ID of the board 60 conveyed from the upstream component mounter 10 with the mark camera 46, and if the board ID is successfully read, it corresponds to the read board ID.
  • the component mounting operation is performed on each child board 65 based on the obtained work information after the work information to be obtained is obtained from the management device 80.
  • the component mounting operation is performed on each child substrate 65 based on the operation information read by reading the operation information for each substrate 65.
  • the operation of reading the work information that requires a relatively long time can be omitted, and the work time can be further shortened.
  • the component mounting work can be continuously executed without stopping by reading the work information again. That is, by reading the work information for each sub board 65 only when the board ID reading fails, the productivity of the board can be improved while preventing the component mounting work from being stopped due to the board ID reading failure. Can be improved.
  • the child board position reference mark 66 and the skip mark 68 are included as marks for displaying the work information of each child board 65, but only one of them may be included. However, other marks other than these may be included.
  • various marks are attached to the board 60, and these marks are marked with the mark camera 46.
  • various information is acquired based on the obtained image by imaging, the present invention is not limited to this, and information output from the substrate 60 such as light, magnetism, and sound can be read. Any medium may be used as long as it is suitable.
  • the board ID read by the upstream component mounter 10 among the plurality of component mounters 10 and the work information of each child board 65 are transmitted to the management device 80 and stored. Then, the board ID is read from the board 60 transported from the upstream side by the downstream component mounting machine 10, the work information is acquired from the management device 80 based on the read board ID, and the part mounting work for each child board 65 is performed.
  • the present invention is not limited to this. For example, the operator inputs the board ID and the work information of each child board 65 in association with the management apparatus 80 before starting production. Also good.
  • the first component mounter 10 among the plurality of component mounters 10 configuring the component mount line 1 also reads the board ID of the board 60 that has been carried in, so that the management device 80 is based on the read board ID. Therefore, the work information of each child board 65 can be acquired.
  • the process of reading the work information of each child board 65 by the mark camera 46 may be performed using a reader installed upstream of the component mounter 10 instead of the head component mounter 10.
  • the present invention is applied to the component mounting machine 10, but the present invention is not limited to this.
  • the screen printing machine 2 that prints a wiring pattern on the board 60 or the board 60.
  • the present invention may be applied to other on-board working machines such as an inspection machine that inspects whether or not the component P is mounted at a normal position.
  • the inspection apparatus captures the substrate 60 with a camera, reads the substrate ID and the substrate position information, and controls the relative position of the child substrate from the management device 80 based on the read substrate ID. Get location information and skip information.
  • the inspection apparatus derives the child board position based on the acquired child board relative position information and the read board position information, and derives the acquired child board information with respect to the child board 65 associated with no skip mark information. After the normal mounting position defined in advance is corrected based on the position of the slave board, it is inspected whether or not the mounting position of the component P is normal.
  • the component mounter 10 corresponds to the “board work machine”
  • the board ID mark 64 corresponds to the “identification information output unit”
  • the sub board position reference mark 66 and the skip mark 68 serve as the “work information output unit”.
  • the mark camera 46 corresponds to “information reading means”
  • the CPU 71 of the control device 70 that executes the second component mounting process in FIG. 8 and the work information acquisition process in FIG. 9 corresponds to “work execution means”.
  • the HDD 83 of the management device 80 corresponds to “storage means”
  • the communication network 90 corresponds to “communication means”.
  • the present invention can be used in the manufacturing industry of a substrate working machine.

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Abstract

An upstream (top) component mounting machine (10) among a plurality of component mounting machines (10) constituting a mounting line stores the board ID of a board (60) and the work information (skip information and daughter board relative position information) of each daughter board (65), which are previously read by a mark camera (46), into a management device (80) in association with each other. A downstream component mounting machine (10) then reads the board ID of the board (60) carried from the upstream component mounting machine (10) using the mark camera (46). When succeeding in reading the board ID, the downstream component mounting machine (10) obtains the work information corresponding to the read board ID from the management device (80) and then performs component mounting work on each daughter board (65) on the basis of the obtained work information. When failing in reading the board ID, the downstream component mounting machine (10) reads again the work information of each daughter board (65) using the mark camera (46) and performs the component mounting work on each daughter board (65) on the basis of the read work information.

Description

対基板作業機および対基板作業システム並びに対基板作業方法Anti-substrate working machine, anti-substrate working system, and anti-substrate working method
　本発明は、回路基板に対して所定の作業を行う対基板作業機および対基板作業機と管理装置とを備える対基板作業システム並びに対基板作業方法に関する。 The present invention relates to a substrate working machine that performs a predetermined operation on a circuit board, a substrate working system including the substrate working machine and a management device, and a substrate working method.
　従来、この種の対基板作業システムとしては、ライン上流側に配置されラインを流れる回路基板を固定して電子部品（小型の電子部品）を装着するための第１の電子部品装着装置（部品実装機）と、ライン下流側に配置されライン上流側から流れてきた回路基板を固定して電子部品（大型の電子部品や異形の電子部品）を装着するための第２の電子部品装着装置と、これら装置を管理するためのシステム制御装置（管理装置）とを備えるものが提案されている（例えば、特許文献１参照）。回路基板は、複数の作業領域（子基板）を有するマルチ基板（集合基板）であり、複数の作業領域（子基板）のそれぞれに対して子基板位置基準マークが付されると共に選択的に装着不可マーク（スキップマーク）が付されている。また、回路基板は、当該基板を識別するための基板ＩＤマークも付されている。第１の電子部品装着装置は、回路基板を固定した後、基板撮像装置によって回路基板の基板ＩＤマークや子基板位置基準マーク、装着不可マークが付される位置を撮像し、得られた画像に基づいて装着不可マークが付されているか否かを判定し、装着不可マークが付されていないと判定した作業領域に対しては子基板位置基準マークの撮像画像によって認識される子基板位置に基づいて電子部品を装着し、装着不可マークが付されていると判定した作業領域に対しては電子部品を装着しない。また、第１の電子部品装着装置は、複数の作業領域のそれぞれに対する子基板位置や装着不可判定情報を基板ＩＤと関連付けてシステム制御装置へ転送する。第２の電子部品装着装置は、ライン上流側から流れてきた回路基板を固定した後、基板撮像装置によって回路基板の基板ＩＤマークを撮像し、得られた画像によって認識される基板ＩＤに基づいてシステム制御装置から通信によって複数の作業領域のそれぞれの子基板位置や装着不可判定情報を取得し、取得した装着不可判定情報に基づいて電子部品の装着の有無を決定すると共に取得した子基板位置に基づいて電子部品の装着を行う。
特開２００３－１０１３００号公報 Conventionally, as this type of on-board working system, a first electronic component mounting apparatus (component mounting) for mounting an electronic component (small electronic component) by fixing a circuit board arranged on the upstream side of the line and flowing through the line And a second electronic component mounting device for mounting an electronic component (large electronic component or odd-shaped electronic component) by fixing the circuit board that has been arranged on the downstream side of the line and has flowed from the upstream side of the line, A device including a system control device (management device) for managing these devices has been proposed (see, for example, Patent Document 1). The circuit board is a multi-board (aggregate board) having a plurality of work areas (child boards), and a child board position reference mark is attached to each of the plurality of work areas (child boards) and selectively mounted. Impossible mark (skip mark) is added. The circuit board is also provided with a board ID mark for identifying the board. In the first electronic component mounting apparatus, after fixing the circuit board, the board imaging apparatus images the position of the circuit board where the board ID mark, the sub board position reference mark, and the mounting impossible mark are attached, and the obtained image is displayed. Based on the position of the sub-board recognized by the picked-up image of the sub-board position reference mark for the work area that is determined not to be attached. The electronic component is mounted, and the electronic component is not mounted on the work area that is determined to have a mounting impossible mark. Further, the first electronic component mounting apparatus transfers the child board position and the mounting failure determination information for each of the plurality of work areas to the system control apparatus in association with the board ID. The second electronic component mounting apparatus fixes the circuit board flowing from the upstream side of the line, then images the board ID mark of the circuit board by the board imaging device, and based on the board ID recognized by the obtained image. By acquiring communication from the system control device, each of the plurality of work areas, and determining whether or not to mount the electronic component based on the acquired mounting failure determination information, and determining whether the electronic component is mounted or not Based on this, electronic parts are mounted.
JP 2003-101300 A
　このように、上述した対基板作業システムは、ライン上流側の第１の電子部品装着装置にて回路基板の基板ＩＤと子基板位置と装着不可判定情報とを読み取って互いに関連付けてシステム制御装置に記憶させておくことで、ライン下流側の第２の電子部品装着装置にて基板ＩＤを読み取ることにより、子基板位置と装着不可情報とをシステム制御装置から通信によって取得することができる。しかしながら、上述した対基板作業システムでは、第２の電子部品装着装置にて基板ＩＤの読み取りが失敗した場合については何ら考慮されていない。基板ＩＤの読み取りが失敗した場合、オペレータが基板上の基板ＩＤマークの汚れを掃除してから撮像装置に基板ＩＤマークを再度読み取らせたり、オペレータがシステム制御装置を操作して子基板位置や装着不可判定情報を直接入力したりして復旧することも考えられる。しかしながら、これらの復旧方法は、ラインストップの原因ともなり、生産性を低下させる結果となる。 In this way, the above-described board-to-board working system reads the circuit board board ID, child board position, and mounting failure determination information by the first electronic component mounting apparatus on the upstream side of the line and associates them with each other to the system control apparatus. By storing the information, the board ID is read by the second electronic component mounting apparatus on the downstream side of the line, whereby the slave board position and the mounting impossible information can be acquired from the system control apparatus by communication. However, in the above-described on-board working system, no consideration is given to the case where reading of the board ID fails in the second electronic component mounting apparatus. If reading of the board ID fails, the operator cleans the board ID mark on the board and then causes the imaging device to read the board ID mark again, or the operator operates the system control device to place the child board position It is also conceivable to recover by directly entering the impossibility determination information. However, these recovery methods also cause line stops and result in reduced productivity.
　本発明は、回路基板に付される各種情報を読み取る際の不具合の発生に対して適切に対処し、生産性の低下を抑制することを主目的とする。 The main object of the present invention is to appropriately deal with the occurrence of problems when reading various types of information attached to a circuit board and to suppress a decrease in productivity.
　本発明は、上述の主目的を達成するために以下の手段を採った。 The present invention adopts the following means in order to achieve the main object described above.
　本発明の対基板作業機は、
　識別情報を出力する識別情報出力部と作業に関する作業情報を出力する作業情報出力部とが設けられた回路基板に対して、所定の作業を行う対基板作業機であって、
　前記回路基板の前記識別情報出力部から前記識別情報を読み取り可能で且つ前記回路基板の前記作業情報出力部から前記作業情報を読み取り可能であり、前記作業情報の読み取りに要する時間が前記識別情報の読み取りに要する時間よりも長い情報読取手段と、
　前記識別情報に基づいて該識別情報と対応付けられた作業情報を取得可能な作業情報取得手段と、
　前記回路基板の前記識別情報出力部から前記識別情報を読み取るよう前記情報読取手段を制御し、前記情報読取手段により前記識別情報の読み取りが成功した場合には、前記読み取った識別情報に基づいて該識別情報に対応する作業情報を前記作業情報取得手段により取得した上で該取得した作業情報に基づいて前記回路基板に対して前記所定の作業を行い、前記識別情報の読み取りが失敗した場合には、前記回路基板の前記作業情報出力部から前記作業情報を読み取るよう前記情報読取手段を制御して該読み取った作業情報に基づいて前記回路基板に対して前記所定の作業を行う作業実行手段と
　を備えることを要旨とする。 The substrate working machine of the present invention is
A circuit board working machine that performs a predetermined work on a circuit board provided with an identification information output unit that outputs identification information and a work information output unit that outputs work information related to work,
The identification information can be read from the identification information output unit of the circuit board and the work information can be read from the work information output unit of the circuit board, and the time required for reading the work information is Information reading means longer than the time required for reading; and
Work information acquisition means capable of acquiring work information associated with the identification information based on the identification information;
The information reading unit is controlled to read the identification information from the identification information output unit of the circuit board, and when the information reading unit successfully reads the identification information, the information reading unit When the work information corresponding to the identification information is obtained by the work information obtaining means, the predetermined work is performed on the circuit board based on the obtained work information, and reading of the identification information fails A work execution unit that controls the information reading unit to read the work information from the work information output unit of the circuit board and performs the predetermined work on the circuit board based on the read work information. The gist is to provide.
　この本発明の対基板作業機では、作業情報の読み取りに要する時間が識別情報の読み取りに要する時間よりも長い情報読取手段を制御して回路基板の識別情報出力部から識別情報を読み取り、情報読取手段により識別情報の読み取りが成功した場合には、読み取った識別情報に基づいて識別情報に対応する作業情報を取得した上で取得した作業情報に基づいて回路基板に対して所定の作業を行い、識別情報の読み取りが失敗した場合には、回路基板の作業情報出力部から作業情報を読み取るよう情報読取手段を制御して読み取った作業情報に基づいて回路基板に対して所定の作業を行う。これにより、識別情報の読み取りが成功した場合には、作業情報を読み取ることなく、識別情報に基づいて作業情報を取得して所定の作業を行うことができる。作業情報の読み取りは識別情報の読み取りよりも長い時間を要するため、作業情報の読み取りを省略することで、作業時間をより短縮することができる。一方、識別情報の読み取りが失敗した場合でも、改めて作業情報を読み取ることで所定の作業を停止することなく継続することができる。即ち、作業情報の読み取りを、識別情報の読み取りが失敗した場合に限って行うことで、識別情報の読み取り失敗に伴う作業の停止を防止しながら、生産性をより向上させることができる。 In the substrate work machine according to the present invention, the information reading means that controls the information reading means that takes longer time to read the work information than the time required to read the identification information reads the identification information from the identification information output unit of the circuit board, and reads the information. If the identification information is successfully read by the means, a predetermined work is performed on the circuit board based on the work information obtained after obtaining the work information corresponding to the identification information based on the read identification information, When the reading of the identification information fails, the information reading unit is controlled to read the work information from the work information output unit of the circuit board, and a predetermined work is performed on the circuit board based on the read work information. Thereby, when the reading of the identification information is successful, the work information can be acquired based on the identification information and the predetermined work can be performed without reading the work information. Since the reading of the work information takes longer than the reading of the identification information, the work time can be further shortened by omitting the reading of the work information. On the other hand, even if the reading of the identification information fails, the predetermined work can be continued without stopping by reading the work information again. That is, by reading the work information only when the reading of the identification information has failed, it is possible to improve productivity while preventing the work from being stopped due to the reading failure of the identification information.
　こうした本発明の対基板作業機において、前記回路基板は、複数の作業領域を有し、前記作業情報出力部は、前記複数の作業領域のそれぞれに設けられ、前記情報読取手段は、前記複数の作業領域のそれぞれの前記作業情報出力部から前記作業情報を読み取るものとすることもできる。この態様の本発明の対基板作業機において、前記作業情報出力部は、前記作業情報として作業の有無を判定するための判定情報を出力するものとすることもできる。これらの態様の本発明の対基板作業機において、前記作業情報出力部は、前記作業情報として前記回路基板に対する前記作業領域の位置を示す位置情報を出力するものとすることもできる。 In such a substrate working machine of the present invention, the circuit board has a plurality of work areas, the work information output unit is provided in each of the plurality of work areas, and the information reading means includes the plurality of work areas. The work information may be read from the work information output unit of each work area. In the substrate work machine according to this aspect of the present invention, the work information output unit may output determination information for determining the presence or absence of work as the work information. In the substrate work machine of the present invention of these aspects, the work information output unit may output position information indicating the position of the work area with respect to the circuit board as the work information.
　本発明の対基板作業システムは、
　識別情報を出力する識別情報出力部と作業に関する作業情報を出力する作業情報出力部とが設けられた回路基板に対して所定の作業を行う対基板作業機と、該対基板作業機を管理する管理装置とを備える対基板作業システムであって、
　前記管理装置は、
　前記作業情報を前記識別情報と対応付けて記憶する記憶手段を備え、
　前記対基板作業機は、
　前記回路基板の前記識別情報出力部から前記識別情報を読み取り可能で且つ前記回路基板の前記作業情報出力部から前記作業情報を読み取り可能であり、前記作業情報の読み取りに要する時間が前記識別情報の読み取りに要する時間よりも長い情報読取手段と、
　前記管理装置と通信が可能な通信手段と、
　前記回路基板の前記識別情報出力部から前記識別情報を読み取るよう前記情報読取手段を制御し、前記情報読取手段により前記識別情報の読み取りが成功した場合には、前記読み取った識別情報に基づいて該識別情報に対応する作業情報を前記通信手段を介して前記管理装置から取得した上で該取得した作業情報に基づいて前記回路基板に対して前記所定の作業を行い、前記識別情報の読み取りが失敗した場合には、前記回路基板の前記作業情報出力部から前記作業情報を読み取るよう前記情報読取手段を制御して該読み取った作業情報に基づいて前記回路基板に対して前記所定の作業を行う作業実行手段と
　を備えることを要旨とする。 The on-board working system of the present invention is
A substrate work machine that performs a predetermined work on a circuit board provided with an identification information output unit that outputs identification information and a work information output unit that outputs work information related to work, and manages the board work machine An on-board working system comprising a management device,
The management device
Storage means for storing the work information in association with the identification information;
The substrate working machine is
The identification information can be read from the identification information output unit of the circuit board and the work information can be read from the work information output unit of the circuit board, and the time required for reading the work information is Information reading means longer than the time required for reading; and
A communication means capable of communicating with the management device;
The information reading unit is controlled to read the identification information from the identification information output unit of the circuit board, and when the information reading unit successfully reads the identification information, the information reading unit is configured to read the identification information based on the read identification information. The work information corresponding to the identification information is obtained from the management device via the communication means, and then the predetermined work is performed on the circuit board based on the obtained work information, and reading of the identification information has failed. In this case, the information reading unit is controlled to read the work information from the work information output unit of the circuit board, and the predetermined work is performed on the circuit board based on the read work information. The gist is to provide execution means.
　この本発明の対基板作業システムでは、管理装置は作業情報を識別情報と対応付けて記憶手段に記憶させる。一方、管理装置と通信が可能な対基板作業機は、作業情報の読み取りに要する時間が識別情報の読み取りに要する時間よりも長い情報読取手段を制御して回路基板の識別情報出力部から識別情報を読み取り、情報読取手段により識別情報の読み取りが成功した場合には、読み取った識別情報に基づいて識別情報に対応する作業情報を通信によって管理装置から取得した上で取得した作業情報に基づいて回路基板に対して所定の作業を行い、識別情報の読み取りが失敗した場合には、回路基板の作業情報出力部から作業情報を読み取るよう情報読取手段を制御して読み取った作業情報に基づいて回路基板に対して所定の作業を行う。これにより、識別情報の読み取りが成功した場合には、作業情報を読み取ることなく、識別情報に基づいて作業情報を取得して所定の作業を行うことができる。作業情報の読み取りは識別情報の読み取りよりも長い時間を要するため、作業情報の読み取りを省略することで、作業時間をより短縮することができる。一方、識別情報の読み取りが失敗した場合でも、改めて作業情報を読み取ることで所定の作業を停止することなく継続することができる。即ち、作業情報の読み取りを、識別情報の読み取りが失敗した場合に限って行うことで、識別情報の読み取り失敗に伴う作業の停止を防止しながら、生産性をより向上させることができる。 In the on-board work system of the present invention, the management device stores the work information in the storage means in association with the identification information. On the other hand, the on-board work machine capable of communicating with the management device controls the information reading means whose time required for reading the work information is longer than the time required for reading the identification information, and the identification information is output from the identification information output unit of the circuit board. When the identification information is successfully read by the information reading means, the circuit based on the work information obtained after obtaining the work information corresponding to the identification information from the management device by communication based on the read identification information. The circuit board is controlled based on the read work information by controlling the information reading means so as to read the work information from the work information output unit of the circuit board when the predetermined work is performed on the board and reading of the identification information fails. The predetermined work is performed. Thereby, when the reading of the identification information is successful, the work information can be acquired based on the identification information and the predetermined work can be performed without reading the work information. Since the reading of the work information takes longer than the reading of the identification information, the work time can be further shortened by omitting the reading of the work information. On the other hand, even if the reading of the identification information fails, the predetermined work can be continued without stopping by reading the work information again. That is, by reading the work information only when the reading of the identification information has failed, it is possible to improve productivity while preventing the work from being stopped due to the reading failure of the identification information.
　本発明の対基板作業方法は、
　識別情報を出力する識別情報出力部と作業に関する作業情報を出力する作業情報出力部とが設けられた回路基板に対して、所定の作業を行う対基板作業方法であって、
　前記作業情報を前記識別情報と対応付けて記憶しておき、
　前記回路基板の前記識別情報出力部から前記識別情報を読み取り、前記識別情報の読み取りが成功した場合には、前記読み取った識別情報に基づいて該識別情報に対応する作業情報を前記記憶した作業情報の中から取得した上で該取得した作業情報に基づいて前記回路基板に対して作業を行い、前記識別情報の読み取りが失敗した場合には、前記回路基板の前記作業情報出力部から前記作業情報を読み取って該読み取った作業情報に基づいて前記回路基板に対して所定の作業を行う
　を備えることを要旨とする。 The method for working with a substrate of the present invention is as follows.
A circuit board working method for performing a predetermined work on a circuit board provided with an identification information output part for outputting identification information and a work information output part for outputting work information on work,
The work information is stored in association with the identification information,
When the identification information is read from the identification information output unit of the circuit board and the identification information is successfully read, the work information corresponding to the identification information is stored based on the read identification information. The work information is obtained from the work information on the circuit board based on the obtained work information, and when the reading of the identification information fails, the work information is output from the work information output unit of the circuit board. And performing a predetermined operation on the circuit board based on the read operation information.
　この本発明の対基板作業方法では、作業情報を識別情報と対応付けて記憶しておき、回路基板の識別情報出力部から識別情報を読み取り、情報読取手段により識別情報の読み取りが成功した場合には、読み取った識別情報に基づいて識別情報に対応する作業情報を記憶した作業情報の中から取得した上で取得した作業情報に基づいて回路基板に対して所定の作業を行い、識別情報の読み取りが失敗した場合には、回路基板の作業情報出力部から作業情報を読み取って読み取った作業情報に基づいて回路基板に対して所定の作業を行う。これにより、識別情報の読み取りが成功した場合には、作業情報を読み取ることなく、識別情報に基づいて作業情報を取得して所定の作業を行うことができる。これにより、識別情報の読み取りが成功した場合には、作業情報を読み取ることなく、識別情報に基づいて作業情報を取得して所定の作業を行うことができる。作業情報の読み取りは識別情報の読み取りよりも長い時間を要するため、作業情報の読み取りを省略することで、作業時間をより短縮することができる。一方、識別情報の読み取りが失敗した場合でも、改めて作業情報を読み取ることで所定の作業を停止することなく継続することができる。即ち、作業情報の読み取りを、識別情報の読み取りが失敗した場合に限って行うことで、識別情報の読み取り失敗に伴う作業の停止を防止しながら、生産性をより向上させることができる。 In the substrate-to-board working method of the present invention, the work information is stored in association with the identification information, the identification information is read from the identification information output unit of the circuit board, and the identification information is successfully read by the information reading means. Reads out the identification information by performing predetermined work on the circuit board based on the acquired work information after acquiring the work information corresponding to the identification information based on the read identification information. If the operation fails, the work information is read from the work information output unit of the circuit board, and a predetermined work is performed on the circuit board based on the read work information. Thereby, when the reading of the identification information is successful, the work information can be acquired based on the identification information and the predetermined work can be performed without reading the work information. Thereby, when the reading of the identification information is successful, the work information can be acquired based on the identification information and the predetermined work can be performed without reading the work information. Since the reading of the work information takes longer than the reading of the identification information, the work time can be further shortened by omitting the reading of the work information. On the other hand, even if the reading of the identification information fails, the predetermined work can be continued without stopping by reading the work information again. That is, by reading the work information only when the reading of the identification information has failed, it is possible to improve productivity while preventing the work from being stopped due to the reading failure of the identification information.
部品実装システム１の構成の概略を示す構成図である。1 is a configuration diagram showing an outline of the configuration of a component mounting system 1. FIG. 部品実装機１０の構成の概略を示す構成図である。1 is a configuration diagram showing an outline of the configuration of a component mounter 10. 部品実装機１０の制御装置７０と管理装置８０との電気的な接続関係を示す説明図である。3 is an explanatory diagram showing an electrical connection relationship between a control device 70 and a management device 80 of the component mounter 10. FIG. 回路基板６０の構成の概略を示す構成図である。2 is a configuration diagram showing an outline of a configuration of a circuit board 60. FIG. 第１部品実装処理の一例を示すフローチャートである。It is a flowchart which shows an example of a 1st component mounting process. 作業情報読取処理の一例を示すフローチャートである。It is a flowchart which shows an example of a work information reading process. 管理装置８０のＨＤＤ８３に記憶される作業情報の一例を示す説明図である。7 is an explanatory diagram illustrating an example of work information stored in an HDD 83 of the management apparatus 80. FIG. 第２部品実装処理の一例を示すフローチャートである。It is a flowchart which shows an example of a 2nd component mounting process. 作業情報取得処理の一例を示すフローチャートである。It is a flowchart which shows an example of a work information acquisition process.
　次に、本発明を実施するための形態について説明する。 Next, a mode for carrying out the present invention will be described.
　図１は、部品実装システム１の構成の概略を示す構成図であり、図２は、部品実装システム１を構成する一の部品実装機１０の構成の概略を示す構成図であり、図３は、一の部品実装機１０の制御装置７０と管理装置８０との電気的な接続関係を示す説明図である。なお、本実施形態において、図２の左右方向がＸ軸方向であり、前後方向がＹ軸方向であり、上下方向がＺ軸方向である。 FIG. 1 is a configuration diagram showing an outline of the configuration of the component mounting system 1, FIG. 2 is a configuration diagram showing an overview of the configuration of one component mounting machine 10 constituting the component mounting system 1, and FIG. FIG. 3 is an explanatory diagram showing an electrical connection relationship between a control device 70 and a management device 80 of one component mounter 10. In the present embodiment, the left-right direction in FIG. 2 is the X-axis direction, the front-rear direction is the Y-axis direction, and the up-down direction is the Z-axis direction.
　部品実装システム１は、図１に示すように、スキージによりスクリーン上のはんだをローリングさせながらスクリーンに形成されたパターン孔に押し込むことでそのパターン孔を介して下方の回路基板６０（以下、単に「基板」と呼ぶ）に配線パターンを印刷する複数台のスクリーン印刷機２と、部品供給装置１６により供給される図示しない電子部品Ｐ（以下、単に「部品」と呼ぶ）をピックアップして基板６０の配線パターンに実装する複数台の部品実装機１０と、部品実装システム全体を管理する管理装置８０とを備える。 As shown in FIG. 1, the component mounting system 1 pushes the solder on the screen into a pattern hole formed in the screen while rolling the solder on the screen by means of a squeegee, thereby passing the circuit board 60 (hereinafter simply “ A plurality of screen printing machines 2 for printing a wiring pattern on the substrate) and an electronic component P (not shown) supplied by the component supply device 16 (hereinafter simply referred to as “component”). A plurality of component mounters 10 mounted on the wiring pattern and a management device 80 for managing the entire component mounting system are provided.
　複数台の部品実装機１０は、多数の吸着ノズルを装着可能なヘッド（多ノズルヘッド）を有し比較的小型の部品Ｐを高速で実装するものと、少数の吸着ノズルを装着可能なヘッド（多機能ヘッド）を有し比較的大型の部品Ｐや異形の部品Ｐを実装するものとが配置されており、それぞれ分担作業によって基板６０に部品Ｐを実装する。部品実装機１０は、図２に示すように、部品Ｐを供給する部品供給装置１６と、基板６０を搬送する基板搬送装置２０と、基板搬送装置２０により搬送された基板６０を裏面側からバックアップするバックアップ装置３０と、吸着ノズル５１によって部品Ｐをピックアップして基板６０上へ実装するためのヘッド５０と、ヘッド５０をＸＹ方向へ移動させるＸＹロボット４０と、基板６０に付された各種マークを撮像可能なマークカメラ４６と、吸着ノズル５１に吸着された部品を撮像可能なパーツカメラ４８と、複数の吸着ノズル５１をストックしておくためのノズルステーション４９と、部品実装機全体の制御を司る制御装置７０（図３参照）とを備える。基板搬送装置２０とバックアップ装置３０とヘッド５０とＸＹロボット４０とは、基台１１上に設置された本体枠１２内に収容されている。 The plurality of component mounting machines 10 have a head (multi-nozzle head) that can mount a large number of suction nozzles and mounts a relatively small component P at a high speed, and a head that can mount a small number of suction nozzles ( A multi-function head) and a relatively large component P or an irregular component P are mounted, and the component P is mounted on the substrate 60 by a sharing operation. As shown in FIG. 2, the component mounter 10 backs up the component supply device 16 that supplies the component P, the substrate transport device 20 that transports the substrate 60, and the substrate 60 transported by the substrate transport device 20 from the back side. The backup device 30 for picking up the component P by the suction nozzle 51 and mounting it on the substrate 60, the XY robot 40 for moving the head 50 in the XY direction, and various marks attached to the substrate 60. Controls the mark camera 46 that can be imaged, the parts camera 48 that can image the component sucked by the suction nozzle 51, the nozzle station 49 for stocking the plurality of suction nozzles 51, and the entire component mounting machine. And a control device 70 (see FIG. 3). The substrate transfer device 20, the backup device 30, the head 50, and the XY robot 40 are accommodated in a main body frame 12 installed on the base 11.
　部品供給装置１６は、本体枠１２の前面部に形成されたフィーダ台１４に、左右方向（Ｘ軸方向）に並ぶように整列配置されたフィーダ１８を備える。フィーダ１８は、部品Ｐが所定ピッチで収容されたキャリアテープを吸着ノズル５１がピックアップ可能な部品供給位置まで送り出すテープフィーダである。なお、キャリアテープは、図示しないが、所定ピッチでキャビティー（凹部）が形成されたボトムテープと、各キャビティーに部品Ｐが収容された状態でボトムテープを覆うトップフィルムとにより構成されている。フィーダ１８は、リールに巻回されたキャリアテープを引き出して部品供給位置へ送り出し、部品供給位置の手前でボトムテープからトップフィルムを剥がすことにより、部品供給位置にて部品Ｐを露出状態、即ちピックアップ可能な状態とする。 The component supply device 16 includes a feeder 18 that is arranged on the feeder base 14 formed on the front surface of the main body frame 12 so as to be aligned in the left-right direction (X-axis direction). The feeder 18 is a tape feeder that sends out a carrier tape containing the components P at a predetermined pitch to a component supply position where the suction nozzle 51 can pick up. In addition, although not shown in figure, the carrier tape is comprised by the bottom tape in which the cavity (recessed part) was formed with the predetermined pitch, and the top film which covers a bottom tape in the state in which the components P were accommodated in each cavity. . The feeder 18 pulls out the carrier tape wound around the reel, feeds it to the component supply position, and peels off the top film from the bottom tape before the component supply position, so that the component P is exposed at the component supply position, that is, the pickup. Make it possible.
　基板搬送装置２０は、図２に示すように、２つの基板搬送路が設けられたデュアルレーン方式の搬送装置として構成されており、本体枠１２の中段部に設けられた支持台１３上に配置されている。各基板搬送路には、ベルトコンベア装置２２を備えており、ベルトコンベア装置２２の駆動により基板６０を図２の左から右（基板搬送方向）へと搬送する。 As shown in FIG. 2, the substrate transfer device 20 is configured as a dual lane transfer device provided with two substrate transfer paths, and is arranged on a support base 13 provided in the middle portion of the main body frame 12. Has been. Each substrate conveyance path is provided with a belt conveyor device 22, and the substrate 60 is conveyed from left to right (substrate conveyance direction) in FIG. 2 by driving the belt conveyor device 22.
　バックアップ装置３０は、図示しない昇降装置により昇降可能に設置されたバックアッププレート３２と、バックアッププレート３２に立設された複数のバックアップピン３４とを備える。このバックアップ装置３０は、基板搬送装置２０によりバックアッププレート３２の上方に基板６０が搬送された状態でバックアッププレート３２を上昇させることで基板６０を裏面側からバックアップする。 The backup device 30 includes a backup plate 32 that can be moved up and down by a lifting device (not shown), and a plurality of backup pins 34 that are erected on the backup plate 32. The backup device 30 backs up the substrate 60 from the back side by raising the backup plate 32 in a state where the substrate 60 is transported above the backup plate 32 by the substrate transport device 20.
　ＸＹロボット４０は、図２に示すように、本体枠１２の上段部にＹ軸方向に沿って設けられたＹ軸ガイドレール４３と、Ｙ軸ガイドレール４３に沿って移動が可能なＹ軸スライダ４４と、Ｙ軸スライダ４４の下面にＸ軸方向に沿って設けられたＸ軸ガイドレール４１と、Ｘ軸ガイドレール４１に沿って移動が可能なＸ軸スライダ４２とを備える。Ｘ軸スライダ４２の下面には、前述したマークカメラ４６が取り付けられている。マークカメラ４６は、ＸＹロボット４０を駆動制御することにより、バックアップ装置３０によりバックアップされた基板６０表面の任意の位置を撮像可能となっている。 As shown in FIG. 2, the XY robot 40 includes a Y-axis guide rail 43 provided in the upper stage portion of the main body frame 12 along the Y-axis direction, and a Y-axis slider capable of moving along the Y-axis guide rail 43. 44, an X-axis guide rail 41 provided along the X-axis direction on the lower surface of the Y-axis slider 44, and an X-axis slider 42 movable along the X-axis guide rail 41. The aforementioned mark camera 46 is attached to the lower surface of the X-axis slider 42. The mark camera 46 can image an arbitrary position on the surface of the substrate 60 backed up by the backup device 30 by driving and controlling the XY robot 40.
　図４は、基板６０の構成の概略を示す構成図である。基板６０は、本実施形態では、分割溝によって区切られた複数の子基板６５（ブロック）を有する集合基板である。部品実装システム１は、スクリーン印刷機２により複数の子基板６５に対して配線パターンを印刷し、部品実装機１０により各子基板６５の配線パターン上に部品Ｐを実装した後、分割溝に沿って基板６０を分割することにより部品Ｐが実装された複数の子基板６５を作製することができる。なお、複数の子基板６５は、基板６０における複数の作業領域を構成する。 FIG. 4 is a configuration diagram showing an outline of the configuration of the substrate 60. In this embodiment, the substrate 60 is a collective substrate having a plurality of sub-substrates 65 (blocks) separated by dividing grooves. The component mounting system 1 prints a wiring pattern on the plurality of sub-boards 65 by the screen printer 2, mounts the component P on the wiring pattern of each sub-board 65 by the component mounting machine 10, and then follows the dividing grooves. By dividing the board 60, a plurality of sub boards 65 on which the component P is mounted can be manufactured. The plurality of sub boards 65 constitute a plurality of work areas in the board 60.
　基板６０は、対角をなす２つの隅部（図４の左上部と右下部）に基板位置基準マーク６２が付されている。これらの基板位置基準マーク６２は、バックアップ装置３０によって基板６０が位置決めされた際に、基板６０の位置情報を取得するためのものである。即ち、部品実装機１０は、ＸＹロボット４０を制御してマークカメラ４６の視野内に２つの基板位置基準マーク６２の一方が収まるようにＸ軸スライダ４２およびＹ軸スライダ４４を移動させてマークカメラ４６を駆動して基板位置基準マーク６２の一方を撮像し、ＸＹロボット４０を制御してマークカメラ４６の視野内に２つの基板位置基準マーク６２の他方が収まるようにＸ軸スライダ４２およびＹ軸スライダ４４を移動させてマークカメラ４６を駆動して基板位置基準マーク６２の他方を撮像し、それぞれ得られた画像を処理して基板６０の表面に平行なＸＹ平面における基板６０の位置ずれ量（Δｘｓ，Δｙｓ，Δθｓ）を算出する。ここで、「Δｘｓ」はＸＹ平面内において予め規定された基準位置に対するＸ軸方向の位置ずれ量を示し、「Δｙｓ」はＸＹ平面内の基準位置に対するＹ軸方向の位置ずれ量を示し、「Δθｓ」はＸＹ平面内における回転方向の位置ずれ量を示す。 The substrate 60 is provided with substrate position reference marks 62 at two diagonal corners (upper left and lower right in FIG. 4). These substrate position reference marks 62 are for acquiring position information of the substrate 60 when the substrate 60 is positioned by the backup device 30. That is, the component mounter 10 controls the XY robot 40 to move the X-axis slider 42 and the Y-axis slider 44 so that one of the two board position reference marks 62 is within the field of view of the mark camera 46. 46 is driven to image one of the substrate position reference marks 62 and the XY robot 40 is controlled so that the other of the two substrate position reference marks 62 is within the field of view of the mark camera 46 and the Y axis slider 42 and the Y axis. The slider 44 is moved to drive the mark camera 46 to image the other of the substrate position reference marks 62, and the obtained images are processed to detect the amount of positional displacement of the substrate 60 in the XY plane parallel to the surface of the substrate 60 ( Δxs, Δys, Δθs) is calculated. Here, “Δxs” indicates a positional deviation amount in the X-axis direction with respect to a reference position defined in advance in the XY plane, “Δys” indicates a positional deviation amount in the Y-axis direction with respect to the reference position in the XY plane, and “ “Δθs” indicates the amount of positional deviation in the rotational direction in the XY plane.
　また、基板６０は、隅部（図４の左上部）に基板ＩＤマーク６４が付されている。基板ＩＤマーク６４は、基板６０を識別するための識別情報であり、例えば、２次元コードとすることができる。基板ＩＤマーク６４は、基板位置基準マーク６２の一つと隣接するように付されている。このため、マークカメラ４６は、基板位置基準マーク６２の一つおよび基板ＩＤマーク６４をまとめて視野内に収めることができ、基板位置基準マーク６２の一つおよび基板ＩＤマーク６４を一度に撮像することが可能である。 The substrate 60 has a substrate ID mark 64 at the corner (upper left portion in FIG. 4). The substrate ID mark 64 is identification information for identifying the substrate 60, and may be a two-dimensional code, for example. The substrate ID mark 64 is attached so as to be adjacent to one of the substrate position reference marks 62. For this reason, the mark camera 46 can collectively store one of the substrate position reference marks 62 and the substrate ID mark 64 within the field of view, and image one of the substrate position reference marks 62 and the substrate ID mark 64 at a time. It is possible.
　複数の子基板６５は、対角をなす２つの隅部（図４の左上部と右下部）に子基板位置基準マーク６６がそれぞれ付されている。これらの子基板位置基準マーク６６は、バックアップ装置３０によって基板６０が位置決めされた際に、子基板６５の位置情報を取得するためのものである。即ち、部品実装機１０は、ＸＹロボット４０を制御してマークカメラ４６の視野内に２つの子基板位置基準マーク６６の一方が収まるようにＸ軸スライダ４２およびＹ軸スライダ４４を移動させてマークカメラ４６を駆動して子基板位置基準マーク６６の一方を撮像し、ＸＹロボット４０を制御してマークカメラ４６の視野内に２つの子基板位置基準マーク６６の他方が収まるようにＸ軸スライダ４２およびＹ軸スライダ４４を移動させてマークカメラ４６を駆動して子基板位置基準マーク６６の他方を撮像し、それぞれ得られた画像を処理して子基板６５の表面に平行なＸＹ平面における子基板６５の位置ずれ量（Δｘ＿ｉ，Δｙ＿ｉ，Δθ＿ｉ）を算出する。部品実装機１０は、これらの動作および処理を複数の子基板６５のそれぞれに対して行う。ここで、「Δｘ＿ｉ」はＸＹ平面内の基準位置に対するＸ軸方向の位置ずれ量を示し、「Δｙ＿ｉ」はＸＹ平面内の基準位置に対するＹ軸方向の位置ずれ量を示し、「Δθ＿ｉ」はＸＹ平面における回転方向の位置ずれ量を示す。なお、「ｉ」は子基板６５を特定するための番号であり、１つの基板６０に対して子基板６５がｎ個含まれる場合、１～ｎのいずれかの整数値となる。 The plurality of sub-boards 65 are provided with sub-board position reference marks 66 at two diagonal corners (upper left and lower right in FIG. 4). These sub-board position reference marks 66 are for acquiring position information of the sub-board 65 when the board 60 is positioned by the backup device 30. That is, the component mounter 10 controls the XY robot 40 to move the X-axis slider 42 and the Y-axis slider 44 so that one of the two daughter board position reference marks 66 is within the field of view of the mark camera 46. The camera 46 is driven to image one of the sub board position reference marks 66, and the XY robot 40 is controlled so that the other of the two sub board position reference marks 66 falls within the field of view of the mark camera 46. The Y-axis slider 44 is moved to drive the mark camera 46 to image the other of the child board position reference marks 66, and the obtained images are processed to obtain the child board in the XY plane parallel to the surface of the child board 65. The amount of misregistration 65 (Δx_i, Δy_i, Δθ_i) is calculated. The component mounter 10 performs these operations and processes on each of the plurality of sub boards 65. Here, “Δx_i” indicates a positional deviation amount in the X-axis direction with respect to the reference position in the XY plane, “Δy_i” indicates a positional deviation amount in the Y-axis direction with respect to the reference position in the XY plane, and “Δθ_i” indicates XY. The amount of positional deviation in the rotational direction on the plane is shown. Note that “i” is a number for specifying the sub board 65 and is an integer value of 1 to n when n sub boards 65 are included in one board 60.
　また、複数の子基板６５は、それぞれ特定位置（図４の右上部）にスキップマーク６８が付される。このスキップマーク６８は、不具合が生じている子基板６５に対して作業を行わない（部品Ｐを実装しない）ことを指示するためのものであり、予め子基板６５毎に選択的に付される。即ち、部品実装機１０は、ＸＹロボット４０を制御してマークカメラ４６の視野内に特定位置（スキップマーク６８が付される可能性のある位置）が収まるようにＸ軸スライダ４２およびＹ軸スライダ４４を移動させ、マークカメラ４６を駆動して特定位置を撮像し、得られた画像を処理して特定位置にスキップマーク６８が付されているか否かを判定する。部品実装機１０は、これらの動作および処理を複数の子基板６５のそれぞれに対して行う。そして、部品実装機１０は、スキップマーク６８が付されていないと判断した子基板６５に対しては部品Ｐを実装し、スキップマーク６８が付されていると判断した子基板６５に対しては部品Ｐを実装しない。 Further, each of the plurality of sub-boards 65 is provided with a skip mark 68 at a specific position (upper right part of FIG. 4). This skip mark 68 is for instructing not to perform work (no component P is mounted) on the sub board 65 in which a defect has occurred, and is selectively given to each sub board 65 in advance. . That is, the component mounter 10 controls the XY robot 40 so that the specific position (position where the skip mark 68 may be attached) is within the field of view of the mark camera 46. 44 is moved, the mark camera 46 is driven to capture a specific position, and the obtained image is processed to determine whether or not the skip mark 68 is attached to the specific position. The component mounter 10 performs these operations and processes on each of the plurality of sub boards 65. Then, the component mounter 10 mounts the component P on the child board 65 determined not to have the skip mark 68 attached, and to the child board 65 determined to have the skip mark 68 attached. The component P is not mounted.
　子基板位置基準マーク６６およびスキップマーク６８は子基板６５毎に付されるため、これらのマークの読み取りに要する時間は、基板位置基準マーク６２および基板ＩＤマーク６４の読み取りに要する時間に比して長くなっている。ここで、子基板位置基準マーク６６を読み取って得られる子基板位置情報とスキップマーク６８を読み取って得られるスキップ情報とが「作業情報」に相当する。 Since the child substrate position reference mark 66 and the skip mark 68 are attached to each child substrate 65, the time required for reading these marks is compared with the time required for reading the substrate position reference mark 62 and the substrate ID mark 64. It is getting longer. Here, the sub-board position information obtained by reading the sub-board position reference mark 66 and the skip information obtained by reading the skip mark 68 correspond to “work information”.
　制御装置７０は、ＣＰＵ７１を中心としたマイクロプロセッサとして構成されており、ＣＰＵ７１の他に、ＲＯＭ７２と、ＨＤＤ７３と、ＲＡＭ７４と、入出力インターフェース７５とを備え、これらはバス７６を介して電気的に接続されている。制御装置７０には、Ｘ軸スライダ４２の位置を検知するＸ軸位置センサ４２ａからの位置信号やＹ軸スライダ４４の位置を検知するＹ軸位置センサ４４ａからの位置信号、マークカメラ４６からの画像信号、パーツカメラ４８からの画像信号などが入出力インターフェース７５を介して入力されている。一方、制御装置７０からは、部品供給装置１６への制御信号や基板搬送装置２０への制御信号、バックアップ装置３０への制御信号、Ｘ軸スライダ４２を移動させるＸ軸アクチュエータ４２ｂへの駆動信号、Ｙ軸スライダ４４を移動させるＹ軸アクチュエータ４４ｂへの駆動信号、吸着ノズル５１をＺ軸方向へ移動させるＺ軸アクチュエータ５２への駆動信号、吸着ノズル５１を回転させるθ軸アクチュエータ５４への駆動信号などが入出力インターフェース７５を介して出力されている。また、制御装置７０は、管理装置８０と通信ネットワーク９０を介して双方向通信可能に接続されており、互いにデータや制御信号のやり取りを行っている。 The control device 70 is configured as a microprocessor centered on the CPU 71, and includes a ROM 72, an HDD 73, a RAM 74, and an input / output interface 75 in addition to the CPU 71, and these are electrically connected via a bus 76. It is connected. The control device 70 includes a position signal from the X-axis position sensor 42 a that detects the position of the X-axis slider 42, a position signal from the Y-axis position sensor 44 a that detects the position of the Y-axis slider 44, and an image from the mark camera 46. Signals, image signals from the parts camera 48, and the like are input via the input / output interface 75. On the other hand, from the control device 70, a control signal to the component supply device 16, a control signal to the substrate transfer device 20, a control signal to the backup device 30, a drive signal to the X-axis actuator 42 b that moves the X-axis slider 42, A drive signal for the Y-axis actuator 44b for moving the Y-axis slider 44, a drive signal for the Z-axis actuator 52 for moving the suction nozzle 51 in the Z-axis direction, a drive signal for the θ-axis actuator 54 for rotating the suction nozzle 51, etc. Is output via the input / output interface 75. The control device 70 is connected to the management device 80 via the communication network 90 so as to be capable of bidirectional communication, and exchanges data and control signals with each other.
　管理装置８０は、例えば、汎用のコンピュータであり、ＣＰＵ８１とＲＯＭ８２とＨＤＤ８３とＲＡＭ８４と入出力インターフェース８５などを備え、これらはバス８６を介して電気的に接続されている。この管理装置８０には、マウスやキーボード等の入力デバイス８７から入力信号が入出力インターフェース８５を介して入力され、管理装置８０からは、ディスプレイ８８への画像信号が入出力インターフェース８５を介して出力されている。ＨＤＤ８３は、基板６０の生産計画を記憶している。ここで、基板６０の生産計画とは、スクリーン印刷機２においてどの基板６０に配線パターンを印刷するか、各部品実装機１０においてどの部品Ｐをどの順番で基板６０へ実装するか、また、そのように部品Ｐを実装した基板６０を何枚作製するかなどを定めた計画をいう。この生産計画には、使用するヘッド５０に関するヘッド情報や使用する吸着ノズル５１に関するノズル情報、実装する部品Ｐに関する部品情報、各部品Ｐの実装位置（ｘ，ｙ，θ）に関する実装位置情報などが含まれている。また、生産計画には、これから生産する基板６０のどの位置に基板位置基準マーク６２や基板ＩＤマーク６４が付されているかのマーク位置情報や、基板６０に含まれる各子基板６５のどの位置に子基板位置基準マーク６６やスキップマーク６８が付されているかのマーク位置情報なども含まれている。マーク位置情報は、マークカメラ４６でこれらのマークを撮像する際のマークカメラ４６の位置決定に用いられる。この生産計画は、作業者が入力デバイス８７を操作することにより管理装置８０に入力される。管理装置８０は、生産計画にしたがって基板６０の各子基板６５に対して配線パターンが印刷されるようスクリーン印刷機２へ指令信号を出力すると共に、各子基板６５の配線パターン上に部品Ｐが実装されるよう各部品実装機１０へ指令信号を出力する。 The management device 80 is, for example, a general-purpose computer, and includes a CPU 81, a ROM 82, an HDD 83, a RAM 84, an input / output interface 85, and the like, which are electrically connected via a bus 86. An input signal is input to the management device 80 from an input device 87 such as a mouse or a keyboard via an input / output interface 85, and an image signal to the display 88 is output from the management device 80 via the input / output interface 85. Has been. The HDD 83 stores a production plan for the substrate 60. Here, the production plan of the board 60 means that the wiring pattern is printed on which board 60 in the screen printing machine 2, which parts P are mounted on the board 60 in which order in each component mounting machine 10, and A plan that defines how many boards 60 on which the component P is mounted is determined. This production plan includes head information regarding the head 50 to be used, nozzle information regarding the suction nozzle 51 to be used, component information regarding the component P to be mounted, mounting position information regarding the mounting position (x, y, θ) of each component P, and the like. include. Further, in the production plan, mark position information indicating which position of the substrate position reference mark 62 and the substrate ID mark 64 is attached to which position of the substrate 60 to be produced, and at which position of each sub-board 65 included in the substrate 60 Also included is mark position information indicating whether the sub-board position reference mark 66 and the skip mark 68 are added. The mark position information is used for determining the position of the mark camera 46 when the mark camera 46 images these marks. This production plan is input to the management apparatus 80 by the operator operating the input device 87. The management device 80 outputs a command signal to the screen printing machine 2 so that a wiring pattern is printed on each child board 65 of the board 60 according to the production plan, and a component P is placed on the wiring pattern of each child board 65. A command signal is output to each component mounting machine 10 so as to be mounted.
　次に、こうして構成された本実施形態の部品実装システム１において、複数台の部品実装機１０のうち先頭の部品実装機１０による実装動作について説明する。図５は、先頭の部品実装機１０の制御装置７０により実行される第１部品実装処理の一例を示すフローチャートである。この処理は、管理装置８０から生産計画に基づいて指令信号を受信したときに実行される。 Next, in the component mounting system 1 of the present embodiment configured as described above, a mounting operation by the leading component mounter 10 among the plurality of component mounters 10 will be described. FIG. 5 is a flowchart illustrating an example of the first component mounting process executed by the control device 70 of the leading component mounter 10. This process is executed when a command signal is received from the management device 80 based on the production plan.
　第１部品実装処理が実行されると、制御装置７０のＣＰＵ７１は、まず、基板搬送装置２０を制御して基板６０をバックアップ装置３０の上方まで搬入した後、基板６０の裏面側をバックアップするようバックアップ装置３０を制御する（ステップＳ１００）。これにより、基板６０はバックアップ装置３０にて位置決めされることとなる。続いて、ＣＰＵ７１は、基板６０から基板ＩＤを読み取る基板ＩＤ読取処理と（ステップＳ１０２）、基板位置情報を読み取る基板位置情報読取処理と（ステップＳ１０４）を実行する。ここで、基板ＩＤ読取処理は、受信した生産計画に含まれる基板ＩＤマーク６４の位置情報に基づいてマークカメラ４６の視野内に基板ＩＤマーク６４が収まるようマークカメラ４６を移動させた後、マークカメラ４６により基板６０（基板ＩＤマーク６４）を撮像し、得られた画像から基板ＩＤを抽出することにより行われる。また、基板位置情報読取処理は、受信した生産計画に含まれる基板位置基準マーク６２のマーク位置情報に基づいて、マークカメラ４６の視野内に２つの基板位置基準マーク６２の一方が収まるようマークカメラ４６を移動させてからマークカメラ４６により基板６０（基板位置基準マーク６２の一方）を撮像し、マークカメラ４６の視野内に基板位置基準マーク６２の他方が収まるようマークカメラ４６を移動させてからマークカメラ４６により基板６０（基板位置基準マーク６２の他方）を撮像し、それぞれ得られた画像を処理して予め規定された基準位置に対する基板６０の位置ずれ量（Δｘｓ，Δｙｓ，Δθｓ）を算出することにより行われる。なお、２つの基板位置基準マーク６２のうちの１つは基板ＩＤマーク６４に隣接して設けられており、マークカメラ４６はこれら２つのマークを同時に視野内に収めて同時に撮像することが可能である。したがって、ＣＰＵ７１は、基板ＩＤ読取処理でマークカメラ４６により基板６０（基板ＩＤマーク６４）を撮像して得られた画像に基づいて、基板位置基準マーク６２も読み取ることが可能であり、読取処理をより効率よく行うことができる。 When the first component mounting process is executed, the CPU 71 of the control device 70 first controls the substrate transfer device 20 to carry the substrate 60 above the backup device 30 and then backs up the back side of the substrate 60. The backup device 30 is controlled (step S100). As a result, the substrate 60 is positioned by the backup device 30. Subsequently, the CPU 71 executes a substrate ID reading process for reading the substrate ID from the substrate 60 (step S102), and a substrate position information reading process for reading the substrate position information (step S104). Here, in the substrate ID reading process, after moving the mark camera 46 so that the substrate ID mark 64 is within the field of view of the mark camera 46 based on the positional information of the substrate ID mark 64 included in the received production plan, This is performed by imaging the substrate 60 (substrate ID mark 64) with the camera 46 and extracting the substrate ID from the obtained image. In addition, the substrate position information reading process is performed so that one of the two substrate position reference marks 62 fits within the field of view of the mark camera 46 based on the mark position information of the substrate position reference mark 62 included in the received production plan. 46, the mark camera 46 images the substrate 60 (one of the substrate position reference marks 62), and the mark camera 46 is moved so that the other of the substrate position reference marks 62 is within the visual field of the mark camera 46. The substrate 60 (the other of the substrate position reference marks 62) is imaged by the mark camera 46, and the obtained images are processed to calculate the amount of displacement (Δxs, Δys, Δθs) of the substrate 60 with respect to a predetermined reference position. Is done. One of the two substrate position reference marks 62 is provided adjacent to the substrate ID mark 64, and the mark camera 46 can simultaneously capture these two marks in the field of view. is there. Therefore, the CPU 71 can also read the substrate position reference mark 62 based on an image obtained by imaging the substrate 60 (substrate ID mark 64) by the mark camera 46 in the substrate ID reading process. It can be performed more efficiently.
　こうして基板ＩＤ読取処理と基板位置情報読取処理とを実行すると、ＣＰＵ７１は、各子基板６５に対する作業情報（子基板位置情報およびスキップ情報）を読み取る作業情報読取処理を実行する（ステップＳ１０６）。作業情報読取処理は、図６のフローチャートに示すように、全ての子基板６５に対して作業情報の読み取りが完了するまで、読み取り対象の子基板６５を順次切り替えながら、子基板６５から子基板位置情報を読み取る子基板位置情報読取処理と、スキップ情報を読み取るスキップ情報読取処理とを繰り返し実行することにより行うことができる（ステップＳ１５０～Ｓ１５４）。ここで、子基板位置情報読取処理は、受信した生産計画に含まれる子基板位置基準マーク６６のマーク位置情報に基づいて、マークカメラ４６の視野内に２つの子基板位置基準マーク６６の一方が収まるまでマークカメラ４６を移動させてからマークカメラ４６により子基板６５（子基板位置基準マーク６６の一方）を撮像し、マークカメラ４６の視野内に子基板位置基準マーク６６の他方が収まるまでマークカメラ４６を移動させてからマークカメラ４６により子基板６５（子基板位置基準マーク６６の他方）を撮像し、それぞれ得られた画像を処理して予め規定された基準位置に対する子基板６５の位置ずれ量（Δｘ＿ｉ，Δｙ＿ｉ，Δθ＿ｉ）を算出することにより行われる。また、スキップ情報読取処理は、受信した生産計画に含まれるスキップマーク６８の位置情報に基づいてマークカメラ４６がスキップマーク６８が付される可能性のある特定位置までマークカメラ４６を移動させた後、マークカメラ４６により特定位置を撮像し、得られた画像からスキップマーク６８を抽出することにより行われる。スキップ情報読取処理は、撮像された画像からスキップマーク６８が抽出できた場合には子基板６５にスキップマーク６８が付されていたことを示すスキップマークあり情報をスキップ情報としてＲＡＭ７４に記憶し、撮像された画像からスキップマーク６８が抽出できなかった場合には子基板６５にスキップマーク６８が付されていなかったことを示すスキップマークなし情報をスキップ情報としてＲＡＭ７４に記憶する。 Thus, when the board ID reading process and the board position information reading process are executed, the CPU 71 executes a work information reading process for reading work information (sub board position information and skip information) for each sub board 65 (step S106). As shown in the flowchart of FIG. 6, the work information reading process is performed by sequentially switching the child boards 65 to be read from the child board 65 until the reading of the work information for all the child boards 65 is completed. This can be performed by repeatedly executing a sub-board position information reading process for reading information and a skip information reading process for reading skip information (steps S150 to S154). Here, in the sub-board position information reading process, one of the two sub-board position reference marks 66 is included in the field of view of the mark camera 46 based on the mark position information of the sub-board position reference mark 66 included in the received production plan. The mark camera 46 is moved until the mark camera 46 is moved, and then the child board 65 (one of the child board position reference marks 66) is imaged by the mark camera 46. The mark camera 46 is marked until the other one of the child board position reference marks 66 is within the field of view of the mark camera 46. After the camera 46 is moved, the child board 65 (the other of the child board position reference marks 66) is imaged by the mark camera 46, and the obtained images are processed to shift the position of the child board 65 with respect to a predetermined reference position. This is done by calculating quantities (Δx_i, Δy_i, Δθ_i). Further, in the skip information reading process, after the mark camera 46 moves the mark camera 46 to a specific position where the skip mark 68 may be attached based on the position information of the skip mark 68 included in the received production plan. The mark camera 46 images the specific position, and the skip mark 68 is extracted from the obtained image. In the skip information reading process, when the skip mark 68 can be extracted from the captured image, the skip mark information indicating that the skip mark 68 is attached to the sub board 65 is stored in the RAM 74 as skip information, and the image is captured. If the skip mark 68 cannot be extracted from the image, the skip mark no-information indicating that the skip mark 68 has not been added to the child board 65 is stored in the RAM 74 as skip information.
　こうして作業情報（子基板位置情報とスキップ情報）を読み取ると、ＣＰＵ７１は、複数の子基板６５のうち今回の実装対象の子基板６５（子基板番号が「ｉ」の子基板６５）に対応するスキップ情報がスキップマークあり情報であるか否かを判定する（ステップＳ１０８）。ＣＰＵ７１は、スキップ情報がスキップマークあり情報であると判定、即ち、実装対象の子基板６５につき、ステップＳ１５２のスキップ情報読取処理によりスキップマーク６８を読み取ることができたと判定すると、後述するステップＳ１１０～Ｓ１１８の部品実装作業を行うことなく、ステップＳ１２０の処理に進む。一方、ＣＰＵ７１は、スキップ情報がスキップマークなし情報であると判定、即ち、実装対象の子基板６５につき、ステップＳ１５２のスキップ情報読取処理によりスキップマーク６８を読み取ることができなかったと判定すると、ＸＹロボット４０とＺ軸アクチュエータ５２とを制御すると共に吸着ノズル５１の吸引口に負圧を作用させて吸着ノズル５１に部品Ｐを吸着させ（ステップＳ１１０）、ＸＹロボット４０を制御して吸着ノズル５１に吸着させた部品Ｐをパーツカメラ４８の上方へ移動させてパーツカメラ４８により部品Ｐを撮像する（ステップＳ１１２）。ＣＰＵ７１は、部品Ｐを撮像すると、得られた画像を処理して部品Ｐの吸着ずれ量（Ｘ軸方向の位置ずれ量Δｘｐ，Ｙ軸方向の位置ずれ量Δｙｐ，回転方向の位置ずれ量Δθｐ）を算出し、ステップＳ１５２で読み取った子基板６５の位置ずれ量（Δｘ＿ｉ，Δｙ＿ｉ，Δθ＿ｉ）と算出した吸着ずれ量（Δｘｐ，Δｙｐ，Δθｐ）とに基づいて、生産計画によって予め指定された実装位置（ｘ，ｙ，θ）を補正する（ステップＳ１１４）。 When the work information (child board position information and skip information) is read in this way, the CPU 71 corresponds to the currently mounted child board 65 (the child board 65 whose child board number is “i”) among the plurality of child boards 65. It is determined whether the skip information is skip mark information (step S108). If the CPU 71 determines that the skip information is information with a skip mark, that is, determines that the skip mark 68 has been read by the skip information reading process in step S152 for the sub-board 65 to be mounted, steps S110 to S110 described later are performed. The process proceeds to step S120 without performing the component mounting operation of S118. On the other hand, if the CPU 71 determines that the skip information is information without a skip mark, that is, determines that the skip mark 68 could not be read by the skip information reading process in step S152 for the sub board 65 to be mounted, the XY robot. 40 and the Z-axis actuator 52 are controlled and a negative pressure is applied to the suction port of the suction nozzle 51 to suck the component P to the suction nozzle 51 (step S110), and the XY robot 40 is controlled to suck to the suction nozzle 51. The part P thus moved is moved above the part camera 48 and the part P is imaged by the part camera 48 (step S112). When the CPU 71 captures an image of the component P, the CPU 71 processes the obtained image and performs an adsorption displacement amount of the component P (position displacement amount Δxp in the X-axis direction, displacement amount Δyp in the Y-axis direction, displacement amount Δθp in the rotation direction). , And the mounting position designated in advance by the production plan based on the positional deviation amount (Δx_i, Δy_i, Δθ_i) and the calculated adsorption deviation amount (Δxp, Δyp, Δθp) of the sub board 65 read in step S152. (X, y, θ) is corrected (step S114).
　ＣＰＵ７１は、実装位置を補正すると、補正した実装位置に部品Ｐが実装されるようＸＹロボット４０（Ｘ軸アクチュエータ４２ｂおよびＹ軸アクチュエータ４４ｂ）とＺ軸アクチュエータ５２とθ軸アクチュエータ５４とを駆動制御する（ステップＳ１１６）。そして、ＣＰＵ７１は、全ての部品Ｐの実装が完了したか否かを判定し（ステップＳ１１８）、全ての部品Ｐの実装が完了していないと判定すると、ステップＳ１１０に戻って、ステップＳ１１０～Ｓ１１６の部品実装作業を繰り返し、全ての部品Ｐの実装が完了したと判定すると、全ての子基板６５に対して部品実装作業（作業をスキップした子基板６５も含む）が完了したか否かを判定する(ステップＳ１２０）。ＣＰＵ７１は、全ての子基板６５に対して部品実装作業が完了していないと判定すると、ステップＳ１０８に戻って、次の子基板６５を実装対象に指定してステップＳ１０８～Ｓ１１８の処理を繰り返す。一方、ＣＰＵ７１は、全ての子基板６５に対して部品実装作業が完了したと判定すると、基板６０（集合基板）における子基板６５の相対位置情報を導出し(ステップＳ１２２）、ステップＳ１０２で読み取った基板ＩＤとステップＳ１５２で読み取ったスキップ情報と導出した相対位置情報とを管理装置８０へ送信する（ステップＳ１２４）。ここで、相対位置情報は、基板６０の基板位置基準マーク６２を基準とした各子基板６５の相対位置（ｄｘ＿ｉ，ｄｙ＿ｉ，ｄθ＿ｉ）を規定するものであり、基板位置に基づき推定される子基板位置とステップＳ１５０にて実際に読み取った子基板位置との差分をとることにより導出することができる。また、ステップＳ１２４で制御装置７０から送信された基板ＩＤとスキップ情報と相対位置情報とを受信した管理装置８０は、図７に示すように、スキップ情報と相対位置情報とを基板ＩＤと関連付けてＨＤＤ８３に記憶させる。そして、ＣＰＵ７１は、バックアップ装置３０を制御して基板６０のバックアップを解除した後、基板搬送装置２０を制御して基板６０を払い出して（ステップＳ１２６）、第１部品実装処理を終了する。 When the mounting position is corrected, the CPU 71 drives and controls the XY robot 40 (X-axis actuator 42b and Y-axis actuator 44b), the Z-axis actuator 52, and the θ-axis actuator 54 so that the component P is mounted at the corrected mounting position. (Step S116). Then, the CPU 71 determines whether or not all the components P have been mounted (step S118). If the CPU 71 determines that all the components P have not been mounted, the CPU 71 returns to step S110, and steps S110 to S116. If it is determined that the mounting of all the components P has been completed, it is determined whether or not the component mounting operation (including the child substrate 65 for which the operation has been skipped) has been completed for all the child substrates 65. (Step S120). If the CPU 71 determines that the component mounting operation has not been completed for all the sub-boards 65, the CPU 71 returns to step S108, designates the next sub-board 65 as a mounting target, and repeats the processing of steps S108 to S118. On the other hand, when the CPU 71 determines that the component mounting operation has been completed for all the sub-boards 65, the CPU 71 derives the relative position information of the sub-board 65 on the board 60 (the collective board) (step S122) and read it in step S102. The board ID, the skip information read in step S152, and the derived relative position information are transmitted to the management device 80 (step S124). Here, the relative position information defines the relative position (dx_i, dy_i, dθ_i) of each child substrate 65 with respect to the substrate position reference mark 62 of the substrate 60, and is estimated based on the substrate position. It can be derived by taking the difference between the position and the position of the child board actually read in step S150. In addition, the management device 80 that has received the board ID, the skip information, and the relative position information transmitted from the control device 70 in step S124 associates the skip information and the relative position information with the board ID as shown in FIG. It is stored in the HDD 83. Then, the CPU 71 controls the backup device 30 to cancel the backup of the substrate 60, and then controls the substrate transfer device 20 to pay out the substrate 60 (step S126), thereby completing the first component mounting process.
　次に、複数台の部品実装機１０のうち先頭よりも後方（下流）の部品実装機１０の実装動作について説明する。図８は、下流の部品実装機１０の制御装置７０により実行される第２部品実装処理の一例を示すフローチャートである。この処理は、管理装置８０から生産計画に基づいて指令信号を受信したときに実行される。 Next, the mounting operation of the component mounter 10 behind (downstream) from the top of the plurality of component mounters 10 will be described. FIG. 8 is a flowchart illustrating an example of the second component mounting process executed by the control device 70 of the downstream component mounter 10. This process is executed when a command signal is received from the management device 80 based on the production plan.
　第２部品実装処理が実行されると、制御装置７０のＣＰＵ７１は、まず、第１部品実装処理のステップＳ１００～Ｓ１０４と同様に、基板６０を搬入した後、基板６０の裏面側をバックアップし（ステップＳ２００）、基板６０から基板ＩＤを読み取る基板ＩＤ読取処理と（ステップＳ２０２）、基板位置情報を読み取る基板位置情報読取処理と（ステップＳ２０４）を実行する。次に、ＣＰＵ７１は、読み取った基板ＩＤに基づいて管理装置８０から各子基板６５に対する作業情報を取得する作業情報取得処理を実行する（ステップＳ２０６）。ここで、作業情報取得処理は、図９に示すフローチャートを実行することにより行うことができる。作業情報取得処理では、ＣＰＵ７１は、まず、ステップＳ２０２による基板ＩＤの読み取りが成功したか否かを判定する（ステップＳ２５０）。ＣＰＵ７１は、基板ＩＤの読み取りが成功したと判定すると、読み取った基板ＩＤに基づいて管理装置８０から基板ＩＤに関連付けられた子基板相対位置情報とスキップ情報とを取得し（ステップＳ２５２）、ステップＳ２０４で読み取った基板位置情報と取得した子基板相対位置情報とに基づいて子基板位置情報を導出して（ステップＳ２５４）、作業情報取得処理を終了する。前述したように、子基板相対位置は基板位置基準マーク６２を基準とした子基板６５の相対位置を表すことから、ステップＳ２０４で読み取った基板位置情報と子基板相対位置情報とから子基板位置を導出することができる。一方、ＣＰＵ７１は、基板ＩＤの読み取りが失敗したと判定すると、図６の作業情報読取処理と同様の処理、即ち、全ての子基板６５に対して、子基板位置基準マーク６６をマークカメラ４６で撮像して子基板情報を読み取る子基板情報読取処理と、スキップマーク６８をマークカメラ４６で撮像してスキップ情報を読み取るスキップ情報読取処理とを実行して作業情報読取処理を終了する（ステップＳ２５６～Ｓ２６０）。 When the second component mounting process is executed, the CPU 71 of the control device 70 first loads the board 60 and then backs up the back side of the board 60 (steps S100 to S104 of the first component mounting process) ( Step S200), a board ID reading process for reading the board ID from the board 60 (step S202), and a board position information reading process for reading the board position information (step S204). Next, the CPU 71 executes a work information acquisition process for acquiring work information for each child board 65 from the management device 80 based on the read board ID (step S206). Here, the work information acquisition process can be performed by executing the flowchart shown in FIG. In the work information acquisition process, the CPU 71 first determines whether or not the substrate ID has been successfully read in step S202 (step S250). If the CPU 71 determines that the reading of the board ID is successful, the CPU 71 acquires the relative position information and the skip information related to the board ID from the management device 80 based on the read board ID (step S252), and step S204. The sub-board position information is derived based on the board position information read in step S3 and the acquired sub-board relative position information (step S254), and the work information acquisition process is terminated. As described above, since the sub-board relative position represents the relative position of the sub-board 65 with respect to the board position reference mark 62, the sub-board position is determined from the board position information and the sub-board relative position information read in step S204. Can be derived. On the other hand, when the CPU 71 determines that the reading of the board ID has failed, the mark camera 46 sets the child board position reference mark 66 for all the child boards 65 in the same process as the work information reading process of FIG. Sub-board information reading processing for picking up and reading sub-board information and skip information reading processing for picking up the skip mark 68 with the mark camera 46 and reading skip information are executed, and the work information reading processing is terminated (step S256-). S260).
　ＣＰＵ７１は、こうして全ての子基板６５に対して作業情報を取得すると、第１部品実装処理のステップＳ１０８～Ｓ１２０の処理と同様に、スキップ情報としてスキップマークなし情報が関連付けられた子基板６５に対しては部品実装作業を行い、スキップ情報としてスキップマークあり情報が関連付けられた子基板６５に対しては部品実装作業を行わない（ステップＳ２０８～Ｓ２２０）。そして、ＣＰＵ７１は、ステップＳ２２０にて全ての子基板６５に対して部品実装作業が完了したと判定すると、基板６０のバックアップを解除した後、基板６０を払い出して（ステップＳ２２２）、第２部品実装処理を終了する。 When the CPU 71 acquires the work information for all the sub-boards 65 in this way, as with the processes of steps S108 to S120 of the first component mounting process, the CPU 71 sets the sub-board 65 associated with the information without skip mark as skip information. In this case, the component mounting operation is performed, and the component mounting operation is not performed for the child board 65 associated with the skip mark information as skip information (steps S208 to S220). If the CPU 71 determines in step S220 that the component mounting operation has been completed for all the sub-boards 65, the CPU 71 releases the backup of the board 60, then pays out the board 60 (step S222), and the second component mounting. The process ends.
　以上説明した本実施形態の部品実装機１０によれば、実装ラインを構成する複数の部品実装機１０のうち上流（先頭）の部品実装機１０において予めマークカメラ４６で読み取った基板６０の基板ＩＤと各子基板６５の作業情報（スキップ情報，子基板相対位置情報）とを関連付けて管理装置８０に予め記憶しておく。そして、下流の部品実装機１０は、上流の部品実装機１０から搬送されてきた基板６０の基板ＩＤをマークカメラ４６で読み取り、基板ＩＤの読み取りが成功した場合には、読み取った基板ＩＤに対応する作業情報を管理装置８０から取得した上で取得した作業情報に基づいて各子基板６５に対して部品実装作業を行い、基板ＩＤの読み取りが失敗した場合には、改めてマークカメラ４６で各子基板６５毎の作業情報を読み取って読み取った作業情報に基づいて各子基板６５に対して部品実装作業を行う。これにより、基板ＩＤの読み取りが成功した場合には、比較的長い時間を要する作業情報の読み取り動作を省略することができ、作業時間をより短縮することができる。一方、基板ＩＤの読み取りが失敗した場合でも、改めて作業情報を読み取ることで部品実装作業を停止することなく継続して実行することができる。即ち、各子基板６５毎の作業情報の読み取りを、基板ＩＤの読み取りが失敗した場合に限って行うことで、基板ＩＤの読み取り失敗に伴う部品実装作業の停止を防止しながら、生産性をより向上させることができる。 According to the component mounting machine 10 of the present embodiment described above, the board ID of the board 60 read in advance by the mark camera 46 in the upstream (first) component mounting machine 10 among the plurality of component mounting machines 10 constituting the mounting line. And the work information (skip information, child board relative position information) of each child board 65 are stored in advance in the management device 80 in association with each other. Then, the downstream component mounter 10 reads the board ID of the board 60 conveyed from the upstream component mounter 10 with the mark camera 46, and if the board ID is successfully read, it corresponds to the read board ID. The component mounting operation is performed on each child board 65 based on the obtained work information after the work information to be obtained is obtained from the management device 80. The component mounting operation is performed on each child substrate 65 based on the operation information read by reading the operation information for each substrate 65. Thereby, when the reading of the substrate ID is successful, the operation of reading the work information that requires a relatively long time can be omitted, and the work time can be further shortened. On the other hand, even if the reading of the board ID fails, the component mounting work can be continuously executed without stopping by reading the work information again. That is, by reading the work information for each sub board 65 only when the board ID reading fails, the productivity of the board can be improved while preventing the component mounting work from being stopped due to the board ID reading failure. Can be improved.
　本実施形態の部品実装機１０では、各子基板６５の作業情報を表示するマークとして子基板位置基準マーク６６とスキップマーク６８とを含めるものとしたが、何れか一方だけを含めるものとしてもよいし、これら以外の他のマークを含めるものとしてもよい。 In the component mounter 10 of the present embodiment, the child board position reference mark 66 and the skip mark 68 are included as marks for displaying the work information of each child board 65, but only one of them may be included. However, other marks other than these may be included.
　本実施形態の部品実装機１０では、基板６０に各種マーク（基板位置基準マーク６２，基板ＩＤマーク６４，子基板位置基準マーク６６，スキップマーク６８）を付し、これらのマークをマークカメラ４６で撮像することにより、得られた画像に基づいて各種情報を取得するものとしたが、これに限定されるものではなく、光や磁気、音など、基板６０から出力される情報を読み取ることができるものであれば、如何なる媒体を用いるものとしてもよい。 In the component mounter 10 of the present embodiment, various marks (board position reference mark 62, board ID mark 64, child board position reference mark 66, skip mark 68) are attached to the board 60, and these marks are marked with the mark camera 46. Although various information is acquired based on the obtained image by imaging, the present invention is not limited to this, and information output from the substrate 60 such as light, magnetism, and sound can be read. Any medium may be used as long as it is suitable.
　本実施形態の部品実装機１０では、複数台の部品実装機１０のうち上流の部品実装機１０で読み取った基板ＩＤと各子基板６５の作業情報とを管理装置８０へ送信して記憶させておき、下流の部品実装機１０にて上流側から搬送された基板６０から基板ＩＤを読み取り、読み取った基板ＩＤに基づいて管理装置８０から作業情報を取得して各子基板６５に対する部品実装作業を行うものとしたが、これに限定されるものではなく、例えば、生産開始前に、オペレータが管理装置８０に対して基板ＩＤと各子基板６５の作業情報とを関連付けて入力しておくものとしてもよい。この場合、部品実装ライン１を構成する複数台の部品実装機１０のうち先頭の部品実装機１０も、搬入された基板６０の基板ＩＤを読み取ることで、読み取った基板ＩＤに基づいて管理装置８０から各子基板６５の作業情報を取得することができる。また、マークカメラ４６によって各子基板６５の作業情報を読み取る処理を、先頭の部品実装機１０ではなく、これよりも上流に設置された読取機を用いて行うものとしてもよい。 In the component mounter 10 of this embodiment, the board ID read by the upstream component mounter 10 among the plurality of component mounters 10 and the work information of each child board 65 are transmitted to the management device 80 and stored. Then, the board ID is read from the board 60 transported from the upstream side by the downstream component mounting machine 10, the work information is acquired from the management device 80 based on the read board ID, and the part mounting work for each child board 65 is performed. However, the present invention is not limited to this. For example, the operator inputs the board ID and the work information of each child board 65 in association with the management apparatus 80 before starting production. Also good. In this case, the first component mounter 10 among the plurality of component mounters 10 configuring the component mount line 1 also reads the board ID of the board 60 that has been carried in, so that the management device 80 is based on the read board ID. Therefore, the work information of each child board 65 can be acquired. In addition, the process of reading the work information of each child board 65 by the mark camera 46 may be performed using a reader installed upstream of the component mounter 10 instead of the head component mounter 10.
　本実施形態では、本発明を部品実装機１０に適用して説明したが、これに限定されるものではなく、例えば、基板６０に配線パターンを印刷するスクリーン印刷機２や、基板６０に対して部品Ｐが正常な位置に実装されているか否かを検査する検査機などの他の対基板作業機に適用するものとしてもよい。なお、本発明を検査機に適用する場合、検査装置は、例えば、基板６０をカメラで撮像して基板ＩＤと基板位置情報とを読み取り、読み取った基板ＩＤに基づいて管理装置８０から子基板相対位置情報とスキップ情報とを取得する。そして、検査装置は、取得した子基板相対位置情報と読み取った基板位置情報とに基づいて子基板位置を導出し、取得したスキップ情報としてスキップマークなし情報が関連付けられた子基板６５に対して導出した子基板位置に基づいて予め規定された正常な実装位置を修正した上で部品Ｐの実装位置が正常であるか否かを検査する。 In the present embodiment, the present invention is applied to the component mounting machine 10, but the present invention is not limited to this. For example, the screen printing machine 2 that prints a wiring pattern on the board 60 or the board 60. The present invention may be applied to other on-board working machines such as an inspection machine that inspects whether or not the component P is mounted at a normal position. When the present invention is applied to an inspection machine, for example, the inspection apparatus captures the substrate 60 with a camera, reads the substrate ID and the substrate position information, and controls the relative position of the child substrate from the management device 80 based on the read substrate ID. Get location information and skip information. Then, the inspection apparatus derives the child board position based on the acquired child board relative position information and the read board position information, and derives the acquired child board information with respect to the child board 65 associated with no skip mark information. After the normal mounting position defined in advance is corrected based on the position of the slave board, it is inspected whether or not the mounting position of the component P is normal.
　ここで、本実施形態の主要な要素と発明の概要の欄に記載した発明の主要な要素との対応関係について説明する。即ち、部品実装機１０が「対基板作業機」に相当し、基板ＩＤマーク６４が「識別情報出力部」に相当し、子基板位置基準マーク６６やスキップマーク６８が「作業情報出力部」に相当し、マークカメラ４６が「情報読取手段」に相当し、図８の第２部品実装処理と図９の作業情報取得処理とを実行する制御装置７０のＣＰＵ７１が「作業実行手段」に相当する。また、管理装置８０のＨＤＤ８３が「記憶手段」に相当し、通信ネットワーク９０が「通信手段」に相当する。 Here, the correspondence between the main elements of the present embodiment and the main elements of the invention described in the summary section of the invention will be described. In other words, the component mounter 10 corresponds to the “board work machine”, the board ID mark 64 corresponds to the “identification information output unit”, and the sub board position reference mark 66 and the skip mark 68 serve as the “work information output unit”. The mark camera 46 corresponds to “information reading means”, and the CPU 71 of the control device 70 that executes the second component mounting process in FIG. 8 and the work information acquisition process in FIG. 9 corresponds to “work execution means”. . Further, the HDD 83 of the management device 80 corresponds to “storage means”, and the communication network 90 corresponds to “communication means”.
　なお、本発明は上述した実施形態に何ら限定されることはなく、本発明の技術的範囲に属する限り種々の態様で実施し得ることはいうまでもない。 It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.
　本発明は、対基板作業機の製造産業などに利用可能である。 The present invention can be used in the manufacturing industry of a substrate working machine.
　１　部品実装システム、２　スクリーン印刷機、１０　部品実装機、１１  台座、１２　本体枠、１３　支持台、１４　フィーダー台、１６　部品供給装置、１８　フィーダ、２０　基板搬送装置、２２　ベルトコンベヤ装置、３０　バックアップ装置、３２　バックアッププレート、３４　バックアップピン、４０　ＸＹロボット、４１　Ｘ軸ガイドレール、４２　Ｘ軸スライダ、４２ａ　Ｘ軸位置センサ、４２ｂ　Ｘ軸アクチュエータ、４３　Ｙ軸ガイドレール、４４　Ｙ軸スライダ、４４ａ　Ｙ軸位置センサ、４４ｂ　Ｙ軸アクチュエータ、４６　マークカメラ、４８　パーツカメラ、４９　ノズルステーション、５０　ヘッド、５１　吸着ノズル、５２　Ｚ軸アクチュエータ、５４　θ軸アクチュエータ、６０　回路基板、６２　基板位置基準マーク、６４　基板ＩＤマーク、６５　子基板、６６　子基板位置基準マーク、６８　スキップマーク、７０　制御装置、７１　ＣＰＵ、７２　ＲＯＭ、７３　ＨＤＤ、７４ ＲＡＭ、７５　入出力インターフェース、７６　バス、８０　管理装置、８１　ＣＰＵ、８２　ＲＯＭ、８３　ＨＤＤ、８４　ＲＡＭ、８５　入出力インターフェース、８６　バス、８７　入力デバイス、８８　ディスプレイ、９０　通信ネットワーク。 1 component mounting system, 2 screen printer, 10 component mounter, 11 base, 12 body frame, 13 support base, 14 feeder base, 16 component feeder, 18 feeder, 20 substrate transport device, 22 belt conveyor device, 30 backup Equipment, 32 Backup plate, 34 Backup pin, 40 XY robot, 41 X axis guide rail, 42 X axis slider, 42a X axis position sensor, 42b X axis actuator, 43 Y axis guide rail, 44 Y axis slider, 44a Y axis Position sensor, 44b Y-axis actuator, 46 mark camera, 48 parts camera, 49 nozzle station, 50 head, 51 suction nozzle, 52 Z-axis actuator, 54 θ-axis actuator, 60 circuit board, 62 Board position reference mark, 64 board ID mark, 65 child board, 66 child board position reference mark, 68 skip mark, 70 control device, 71 CPU, 72 ROM, 73 HDD, 74 RAM, 75 I / O interface, 76 bus, 80 Management device, 81 CPU, 82 ROM, 83 HDD, 84 RAM, 85 I / O interface, 86 bus, 87 input device, 88 display, 90 communication network.

Claims (6)

  1. 　識別情報を出力する識別情報出力部と作業に関する作業情報を出力する作業情報出力部とが設けられた回路基板に対して、所定の作業を行う対基板作業機であって、
    　前記回路基板の前記識別情報出力部から前記識別情報を読み取り可能で且つ前記回路基板の前記作業情報出力部から前記作業情報を読み取り可能であり、前記作業情報の読み取りに要する時間が前記識別情報の読み取りに要する時間よりも長い情報読取手段と、
    　前記識別情報に基づいて該識別情報と対応付けられた作業情報を取得可能な作業情報取得手段と、
    　前記回路基板の前記識別情報出力部から前記識別情報を読み取るよう前記情報読取手段を制御し、前記情報読取手段により前記識別情報の読み取りが成功した場合には、前記読み取った識別情報に基づいて該識別情報に対応する作業情報を前記作業情報取得手段により取得した上で該取得した作業情報に基づいて前記回路基板に対して前記所定の作業を行い、前記識別情報の読み取りが失敗した場合には、前記回路基板の前記作業情報出力部から前記作業情報を読み取るよう前記情報読取手段を制御して該読み取った作業情報に基づいて前記回路基板に対して前記所定の作業を行う作業実行手段と
    　を備えることを特徴とする対基板作業機。     A circuit board working machine that performs a predetermined work on a circuit board provided with an identification information output unit that outputs identification information and a work information output unit that outputs work information related to work,
    The identification information can be read from the identification information output unit of the circuit board and the work information can be read from the work information output unit of the circuit board, and the time required for reading the work information is Information reading means longer than the time required for reading; and
    Work information acquisition means capable of acquiring work information associated with the identification information based on the identification information;
    The information reading unit is controlled to read the identification information from the identification information output unit of the circuit board, and when the information reading unit successfully reads the identification information, the information reading unit When the work information corresponding to the identification information is obtained by the work information obtaining means, the predetermined work is performed on the circuit board based on the obtained work information, and reading of the identification information fails A work execution unit that controls the information reading unit to read the work information from the work information output unit of the circuit board and performs the predetermined work on the circuit board based on the read work information. An anti-substrate working machine comprising:
  2. 　請求項１記載の対基板作業機であって、
    　前記回路基板は、複数の作業領域を有し、
    　前記作業情報出力部は、前記複数の作業領域のそれぞれに設けられ、
    　前記情報読取手段は、前記複数の作業領域のそれぞれの前記作業情報出力部から前記作業情報を読み取る
    　ことを特徴とする対基板作業機。     The machine for working a substrate according to claim 1,
    The circuit board has a plurality of work areas,
    The work information output unit is provided in each of the plurality of work areas,
    The information reading unit reads the work information from the work information output unit of each of the plurality of work areas.
  3. 　請求項２記載の対基板作業機であって、
    　前記作業情報出力部は、前記作業情報として作業の有無を判定するための判定情報を出力する
    　ことを特徴とする対基板作業機。     The substrate working machine according to claim 2,
    The work information output unit outputs determination information for determining the presence or absence of work as the work information.
  4. 　請求項２または３記載の対基板作業機であって、
    　前記作業情報出力部は、前記作業情報として前記回路基板に対する前記作業領域の位置を示す位置情報を出力する
    　ことを特徴とする対基板作業機。     It is a substrate work machine according to claim 2 or 3,
    The work information output unit outputs position information indicating a position of the work area with respect to the circuit board as the work information.
  5. 　識別情報を出力する識別情報出力部と作業に関する作業情報を出力する作業情報出力部とが設けられた回路基板に対して所定の作業を行う対基板作業機と、該対基板作業機を管理する管理装置とを備える対基板作業システムであって、
    　前記管理装置は、
    　前記作業情報を前記識別情報と対応付けて記憶する記憶手段を備え、
    　前記対基板作業機は、
    　前記回路基板の前記識別情報出力部から前記識別情報を読み取り可能で且つ前記回路基板の前記作業情報出力部から前記作業情報を読み取り可能であり、前記作業情報の読み取りに要する時間が前記識別情報の読み取りに要する時間よりも長い情報読取手段と、
    　前記管理装置と通信が可能な通信手段と、
    　前記回路基板の前記識別情報出力部から前記識別情報を読み取るよう前記情報読取手段を制御し、前記情報読取手段により前記識別情報の読み取りが成功した場合には、前記読み取った識別情報に基づいて該識別情報に対応する作業情報を前記通信手段を介して前記管理装置から取得した上で該取得した作業情報に基づいて前記回路基板に対して前記所定の作業を行い、前記識別情報の読み取りが失敗した場合には、前記回路基板の前記作業情報出力部から前記作業情報を読み取るよう前記情報読取手段を制御して該読み取った作業情報に基づいて前記回路基板に対して前記所定の作業を行う作業実行手段と
    　を備えることを特徴とする対基板作業システム。     A substrate work machine that performs a predetermined work on a circuit board provided with an identification information output unit that outputs identification information and a work information output unit that outputs work information related to work, and manages the board work machine An on-board working system comprising a management device,
    The management device
    Storage means for storing the work information in association with the identification information;
    The substrate working machine is
    The identification information can be read from the identification information output unit of the circuit board and the work information can be read from the work information output unit of the circuit board, and the time required for reading the work information is Information reading means longer than the time required for reading; and
    A communication means capable of communicating with the management device;
    The information reading unit is controlled to read the identification information from the identification information output unit of the circuit board, and when the information reading unit successfully reads the identification information, the information reading unit is configured to read the identification information based on the read identification information. The work information corresponding to the identification information is obtained from the management device via the communication means, and then the predetermined work is performed on the circuit board based on the obtained work information, and reading of the identification information has failed. In this case, the information reading unit is controlled to read the work information from the work information output unit of the circuit board, and the predetermined work is performed on the circuit board based on the read work information. An on-board working system comprising: an execution means.
  6. 　識別情報を出力する識別情報出力部と作業に関する作業情報を出力する作業情報出力部とが設けられた回路基板に対して、所定の作業を行う対基板作業方法であって、
    　前記作業情報を前記識別情報と対応付けて記憶しておき、
    　前記回路基板の前記識別情報出力部から前記識別情報を読み取り、前記識別情報の読み取りが成功した場合には、前記読み取った識別情報に基づいて該識別情報に対応する作業情報を前記記憶した作業情報の中から取得した上で該取得した作業情報に基づいて前記回路基板に対して作業を行い、前記識別情報の読み取りが失敗した場合には、前記回路基板の前記作業情報出力部から前記作業情報を読み取って該読み取った作業情報に基づいて前記回路基板に対して所定の作業を行う
    　ことを特徴とする対基板作業方法。     A circuit board working method for performing a predetermined work on a circuit board provided with an identification information output part for outputting identification information and a work information output part for outputting work information on work,
    The work information is stored in association with the identification information,
    When the identification information is read from the identification information output unit of the circuit board and the identification information is successfully read, the work information corresponding to the identification information is stored based on the read identification information. The work information is obtained from the work information on the circuit board based on the obtained work information, and when the reading of the identification information fails, the work information is output from the work information output unit of the circuit board. A predetermined work is performed on the circuit board based on the read work information.
PCT/JP2014/060927 2014-04-17 2014-04-17 Machine for performing work on board, system for performing work on board, and method for performing work on board WO2015159405A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110913606A (en) * 2018-09-17 2020-03-24 昌硕科技(上海)有限公司 Method for producing printed circuit board

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04262598A (en) * 1991-02-18 1992-09-17 Matsushita Electric Ind Co Ltd Circuit board production type switching device
JP4847956B2 (en) * 2006-01-11 2011-12-28 パナソニック株式会社 Electronic component mounting system and electronic component mounting method
JP2012028655A (en) * 2010-07-26 2012-02-09 Hitachi High-Tech Instruments Co Ltd Management method for electronic component mounting line and management system therefor
JP2013045940A (en) * 2011-08-25 2013-03-04 Yamaha Motor Co Ltd Method for detecting identification information, substrate processing apparatus, substrate processing system and computer program

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04262598A (en) * 1991-02-18 1992-09-17 Matsushita Electric Ind Co Ltd Circuit board production type switching device
JP4847956B2 (en) * 2006-01-11 2011-12-28 パナソニック株式会社 Electronic component mounting system and electronic component mounting method
JP2012028655A (en) * 2010-07-26 2012-02-09 Hitachi High-Tech Instruments Co Ltd Management method for electronic component mounting line and management system therefor
JP2013045940A (en) * 2011-08-25 2013-03-04 Yamaha Motor Co Ltd Method for detecting identification information, substrate processing apparatus, substrate processing system and computer program

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110913606A (en) * 2018-09-17 2020-03-24 昌硕科技(上海)有限公司 Method for producing printed circuit board

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