CN103002726B - Electronic part mounting and electronic component mounting method - Google Patents
Electronic part mounting and electronic component mounting method Download PDFInfo
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- CN103002726B CN103002726B CN201210330352.4A CN201210330352A CN103002726B CN 103002726 B CN103002726 B CN 103002726B CN 201210330352 A CN201210330352 A CN 201210330352A CN 103002726 B CN103002726 B CN 103002726B
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- 238000000034 method Methods 0.000 title claims abstract description 52
- 229910000679 solder Inorganic materials 0.000 claims abstract description 255
- 238000002372 labelling Methods 0.000 claims abstract description 240
- 239000000758 substrate Substances 0.000 claims abstract description 156
- 238000003466 welding Methods 0.000 claims abstract description 31
- 238000009434 installation Methods 0.000 claims description 29
- 238000011900 installation process Methods 0.000 claims description 25
- 238000004364 calculation method Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 description 19
- 238000003860 storage Methods 0.000 description 13
- 230000033228 biological regulation Effects 0.000 description 10
- 230000001276 controlling effect Effects 0.000 description 7
- 238000012790 confirmation Methods 0.000 description 6
- 238000007689 inspection Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 4
- 230000002596 correlated effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 210000001364 upper extremity Anatomy 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Abstract
A kind of electronic part mounting and electronic component mounting method, even if being difficult to solder labelling, it is also possible to installs electronic component.Electronic part mounting (1) installs electronic component (P) on substrate (8), described substrate have welding disk (800), solder portion (81) and welding disk the same coordinate system pad labelling (M1, M2) and with the solder labelling (m1, m2) of solder portion the same coordinate system.Electronic part mounting can be installed on substrate on the basis of the position by solder labelling and switch between the solder marking mode of electronic component and the pad marking mode at least installing electronic component on the basis of the position of pad labelling on substrate.When confirming the position of substrate, in the case of solder labelling is fitted without electronic component, perform solder marking mode.In the case of solder labelling installs electronic component, perform pad marking mode.
Description
Technical field
The present invention relates to a kind of electronic part mounting installing electronic component on substrate and electronics
Component mounting method.
Background technology
Fig. 8 represents the top view of the substrate being printed with solder.For convenience of description, in solder portion
Hacures it are marked with on 103.As shown in Figure 8, the upper surface of substrate 100 is configured with pad mark
Note 101, wiring pattern 102 and solder portion 103.Pad labelling 101 and wiring pattern 102 shape
Become the upper surface of substrate 100.Pad labelling 101 and welding disk 102a are configured at same coordinate
System.Pad labelling 101 is configured with two altogether at the diagonal position of substrate 100.Solder portion 103
It is printed on the upper surface of welding disk 102a of wiring pattern 102.
Fig. 9 represents the enlarged drawing in the frame IX of Fig. 8.As it is shown in figure 9, electronic component 104 is pacified
It is loaded on the solder portion 103 of the mounting coordinate of regulation.Between welding disk 102a and solder portion 103
In the case of there is no position deviation, it is possible to by by pad labelling 101 (the i.e. pad shown in Fig. 8
Portion 102a) as the benchmark of mounting coordinate, the mounting coordinate in regulation correctly installs electronic component
104。
But, exist and produce between welding disk 102a and solder portion 103 due to printing skew
The situation of position deviation.Figure 10 represents the top view of the substrate that solder prints with being shifted by.Figure 11
Represent the enlarged drawing in the frame XI of Figure 10.As shown in Figure 10, Figure 11, at welding disk 102a
And create position deviation between solder portion 103.Now, if using pad labelling 101 as peace
The benchmark of dress coordinate, then electronic component 104 is correctly installed relative to welding disk 102a.Another
Aspect, electronic component 104 is installed relative to solder portion 103 with being shifted by.
If in this condition substrate 100 being moved into reflow ovens, then solder portion 103 is melted forms
For aqueous.Figure 12 represents the enlarged drawing in the frame XI after backflow.Such as Figure 12 hollow core arrow institute
Showing, aqueous solder portion 103 is to central authorities' flowing of welding disk 102a.Now, from the electricity of heavy and light
Sub-element 104 flows together with solder portion 103.Therefore, upon reflowing, electronic component 104
From the mounting coordinate skew of regulation.
As its countermeasure, as shown in Figure 8, have not on the basis of pad labelling 101, but with
The method installing electronic component 104 on the basis of solder labelling 103a.Solder labelling 103a is at substrate
The diagonal position of 100 is configured with two altogether.Two solder labelling 103a are respectively by 4 solder portion
103 are constituted.Figure 13 represents with putting that solder is labeled as in frame XI when benchmark installs electronic component
Big figure.As shown in figure 13, electronic component 104 is mounted on the basis of solder labelling 103a.
That is, electronic component 104 is correctly installed relative to solder portion 103.On the other hand, electronics unit
Part 104 is installed relative to welding disk 102a with being shifted by.
If in this condition substrate 100 being moved into reflow ovens, then solder portion 103 is melted forms
For aqueous.Figure 14 represents the enlarged drawing in the frame XI after backflow.Such as Figure 14 hollow core arrow institute
Showing, solder portion 103 and electronic component 104 are to central authorities' flowing of welding disk 102a.Therefore, exist
After backflow, electronic component 104 is correctly installed on the mounting coordinate of regulation.
So, as the method installing electronic component 104 on the substrate 100, including with pad
The method installed on the basis of labelling 101 and the method installed on the basis of solder labelling 103a.Especially
It, easily flow when backflow from electronic component 104 grade of heavy and light together with solder portion 103
Electronic component 104 is preferably installed on substrate 100 on the basis of solder labelling 103a.
Patent documentation 1: Japanese Unexamined Patent Publication 7-22791 publication
Here, solder labelling 103a's is identified by use filming apparatus 4 solder portion of shooting
103 are carried out.When shooting solder labelling 103a, it is desirable to read 4 by filming apparatus
The shape of solder portion 103.On the contrary, cannot read 4 solder portion by filming apparatus
In the case of the shape of 103, it is difficult to identify solder labelling 103a.
As the concrete example of the situation of the shape that cannot read 4 solder portion 103, it is included in knowledge
The situation of electronic component 104 has been installed before other solder labelling 103a in solder portion 103.
That is, the shooting of solder labelling 103a, identification are the (electronic components when the production of substrate 100 starts
When the installation of 104 starts) substrate 100 positioned on electronic part mounting is performed.
One identified after solder labelling 103a use until produce terminate.
But, exist production midway substrate 100 temporarily after electronic part mounting is pulled down again
It is installed on the situation of electronic part mounting.Now, there is the substrate 100 after again installing
The possibility of deviation is there is in position relative to the position of the substrate 100 produced when starting.Therefore, need
Again to shoot and to identify solder labelling 103a.But, in the solder portion of solder labelling 103a
In the case of installing electronic component 104 on 103, the shape of solder portion 103 is indefinite.Therefore,
Solder labelling 103a cannot be read by filming apparatus.
Patent document 1 discloses that and use pad labelling 101 and solder labelling 103a at substrate simultaneously
The method installing electronic component 104 on 100.Described document discloses and described solder labelling
The problem that the shooting of 103a, identification are correlated with.Additionally, according to method described in described document,
Installation to all electronic components 104 uses pad labelling 101 and solder labelling 103a simultaneously.
Therefore, although installation accuracy improves, but the contrary kind needed with electronic component 104 independently
Shoot and identify pad labelling 101 and solder labelling 103a one by one.Pad labelling 101, solder
The shooting of labelling 103a, identification operation are the operations that the production with substrate 100 is not directly dependent upon.
Therefore, according to method described in described document, the production efficiency of substrate 100 reduces.
Summary of the invention
The electronic part mounting of the present invention and electronic component mounting method are in view of described problem
Complete.Even if it is an object of the invention to provide a kind of in the situation being difficult to solder labelling
Under also be able to the electronic part mounting of electronic component and electronic component mounting method are installed.
(1) in order to solve described problem, a kind of electronic part mounting of the present invention, positioning
Substrate on electronic component is installed, described substrate have multiple welding disk, be printed on multiple described
Multiple solder portion on welding disk and multiple described welding disk are in the pad mark of the same coordinate system
Remember and be in the solder labelling of the same coordinate system, described electronic component with multiple described solder portion
Fitting machine is characterised by, described solder labelling selects from multiple described solder portion, energy
Enough switchings between solder marking mode and pad marking mode, described solder marking mode is with institute
On the basis of stating the position of solder labelling, described electronic component is installed on the substrate, described weldering
Dish marking mode at least installs institute on the basis of the position of described pad labelling on the substrate
State electronic component, when the position of oriented described substrate is confirmed, at described solder
In the case of being fitted without described electronic component on labelling, perform described solder marking mode,
In the case of having installed described electronic component on described solder labelling, perform described pad labelling
Pattern.
The electronic part mounting of the present invention can solder marking mode and pad marking mode it
Between switch.Before electronic component is installed, perform the location of substrate.Additionally, after performing location
The location confirmation of substrate.Described location confirmation is to use in solder labelling and pad labelling extremely
A few side performs.When carrying out described confirmation, solder labelling is fitted without electronic component
In the case of, perform solder marking mode.And on solder labelling, install the feelings of electronic component
Under condition, perform pad marking mode.That is, as solder labelling in selected solder portion
In the case of installing electronic component, at least it is labeled as benchmark with pad, substrate is installed
Electronic component.So, according to the electronic part mounting of the present invention, it is possible to according at solder mark
Whether there is electronic component in note, distinguish and use solder labelling and pad labelling that electronic component is installed.
Therefore, even if in the case of being difficult to solder labelling, it is also possible to install electronic component.
(2) preferably, in the structure of described (1), installing on described solder labelling
State and install after the installation process of described electronic component is interrupted again on the described substrate of electronic component
In the case of beginning, perform described pad marking mode.
Solder labelling installs electronic component, and installation process be interrupted after restart
In the case of, it is assumed that substrate when restarting is in any one state in following (A), (B).
(A) state being again positioned after substrate is temporarily released.
(B) substrate be not released and before interrupting the state that is positioned constantly of beginning.
In the case of (A), it is difficult to shoot and identify the solder labelling after again positioning.Therefore,
Need to perform pad marking mode.In the case of (B), it is possible to proceed installation process by
Pattern (solder marking mode or pad marking mode) before Duan.I.e., it is not necessary to need to perform weldering
Dish marking mode.But, the judgement operation of (A), (B) is numerous and diverse.About this point, according to
This structure, it is possible to the most whether be released with substrate, again position and perform weldering the most without exception
Dish marking mode.Therefore, there is no need to the judgement operation of (A), (B).
(3) preferably, in the structure of described (2), at described substrate likely in described installation
Processing the period before restarting after being interrupted temporarily is released and the feelings that again carried out positioning
Under condition, perform described pad marking mode.
According to this structure, it is possible to there is the probability that again positions after substrate is temporarily released
In the case of, in the case of i.e. there is the probability of (A), perform pad marking mode.Here, be
No " probability again positioned " having substrate, such as when can install according to electronic component
Carry out the device (clamping device etc.) of the location of substrate, carrying substrate until the device of position location
The driving resume etc. of (Handling device etc.) judge.
(4) preferably, in the structure of described (2) or (3), including: clamping device, it is possible to right
Described substrate carries out positioning, discharging；Filming apparatus, it is possible to shooting is positioned by described clamping device
The described pad labelling of described substrate, described solder labelling；Suction nozzle, by described clamping dress
Put and described electronic component is installed on the described substrate of location；And control device, control described folder
Tight device, described filming apparatus and described suction nozzle, in the situation performing described pad marking mode
Under, before described pad marking mode, described control device performs following steps: first welds
Dish mark position acquisition step, uses described filming apparatus to obtain described installation process and is interrupted it
The position of front described pad labelling；Solder mark position acquisition step, uses described shooting dress
Put the position obtaining the described solder labelling before described installation process is interrupted；Departure calculates
Step, calculates the departure between the position of described pad labelling and the position of described solder labelling；
And the second pad mark position acquisition step, use described filming apparatus to obtain and restart institute
State the position of the described pad labelling after installation process, in described pad marking mode, with logical
Cross described second pad mark position acquisition step obtain described pad labelling position with pass through
On the basis of the described departure that described departure calculation procedure calculates, described suction nozzle is used to install
Described electronic component.
According to this structure, control device and performing the first pad mark position acquisition step, solder
Mark position acquisition step, departure calculation procedure and the second pad mark position acquisition step it
After, perform pad marking mode.
In pad marking mode, (the feelings of the structure of described (3) after restarting according to installation process
Under condition for again location after) the position of pad labelling, installation process be interrupted before (the knot of described (3)
In the case of structure for release before) pad labelling position and the position of solder labelling between deviation
Amount, in other words according to the position of the solder labelling being labeled as benchmark with pad, installs electronic component.
According to this structure, it is possible to according to position and the departure of pad labelling, restore due to electronic component
Installation and the solder labelling that cannot shoot and identify.
(5) in order to solve described problem, a kind of electronic component mounting method of the present invention, the most fixed
Installing electronic component on the substrate of position, described substrate has multiple welding disk, is printed on multiple institute
State the multiple solder portion on welding disk and multiple described welding disk is in the pad of the same coordinate system
Labelling and be in the solder labelling of the same coordinate system with multiple described solder portion, described electronics unit
Part installation method is characterised by, described solder labelling selects from multiple described solder portion,
Can switch between solder marking mode and pad marking mode, described solder marking mode with
On the basis of the position of described solder labelling, described electronic component is installed on the substrate, described
Pad marking mode is at least installed on the basis of the position of described pad labelling on the substrate
Described electronic component, when confirming the position of oriented described substrate, in described weldering
In the case of being fitted without described electronic component on material labelling, perform described solder marking mode,
In the case of described solder labelling has installed described electronic component, perform described pad mark
Note pattern.
The electronic component mounting method of the present invention can be at solder marking mode and pad marking mode
Between switch.Before electronic component is installed, perform the location of substrate.Additionally, perform location
After the location confirmation of substrate.Described location confirmation is to use in solder labelling and pad labelling
At least one party performs.When carrying out described confirmation, solder labelling is fitted without electronics unit
In the case of part, perform solder marking mode.And install electronic component on solder labelling
In the case of, perform pad marking mode.That is, in the selected solder portion as solder labelling
On install electronic component in the case of, be at least labeled as benchmark with pad, on substrate pacify
Electronic components.So, according to the electronic component mounting method of the present invention, it is possible to according in weldering
Whether there is electronic component on material labelling, distinguish and use solder labelling and pad labelling that electronics is installed
Element.Therefore, even if in the case of being difficult to solder labelling, it is also possible to install electronics unit
Part.
(6) preferably, in the method for described (5), installing on described solder labelling
State and install after the installation process of described electronic component is interrupted again on the described substrate of electronic component
In the case of beginning, perform described pad marking mode.
Solder labelling installs electronic component, and installation process be interrupted after restart
In the case of, it is assumed that substrate when restarting is in any one state in following (A), (B).
(A) state being again positioned after substrate is temporarily released.
(B) substrate be not released and before interrupting the state that is positioned constantly of beginning.
In the case of (A), it is difficult to shoot and identify the solder labelling after again positioning.Therefore,
Need to perform pad marking mode.In the case of (B), it is possible to proceed installation process by
Pattern (solder marking mode or pad marking mode) before Duan.I.e., it is not necessary to need to perform weldering
Dish marking mode.But, the judgement operation of (A), (B) is numerous and diverse.About this point, according to
This method, it is possible to the most whether be released with substrate, again position and perform weldering the most without exception
Dish marking mode.Therefore, there is no need to the judgement operation of (A), (B).
(7) preferably, in the method for described (6), at described substrate likely in described installation
Processing the period before restarting after being interrupted temporarily is released and the feelings that again carried out positioning
Under condition, perform described pad marking mode.
According to this method, it is possible to there is the probability that again positions after substrate is temporarily released
In the case of, in the case of i.e. there is the probability of (A), perform pad marking mode.Here, be
No " probability again positioned " having substrate, such as when can install according to electronic component
Carry out the device (clamping device etc.) of the location of substrate, carrying substrate until the device of position location
The driving resume etc. of (Handling device etc.) judge.
(8) preferably, in the method for described (6) or (7), described pad marking mode is being performed
In the case of, before described pad marking mode, execution following steps: the first pad labelling
Position acquisition step, obtains the position of described pad labelling before described installation process is interrupted；
Solder mark position acquisition step, obtains the described solder mark before described installation process is interrupted
The position of note；Departure calculation procedure, calculates the position of described pad labelling and described solder mark
Departure between the position of note；And the second pad mark position acquisition step, obtain again
Start the position of the described pad labelling after described installation process, in described pad marking mode,
With by described second pad mark position acquisition step obtain described pad labelling position with
By on the basis of the described departure that described departure calculation procedure calculates, described electronics is installed
Element.
According to this method, performing the first pad mark position acquisition step, solder mark position
After acquisition step, departure calculation procedure and the second pad mark position acquisition step, perform
Pad marking mode.
In pad marking mode, (the feelings of the structure of described (7) after restarting according to installation process
Under condition for again location after) the position of pad labelling, installation process be interrupted before (the knot of described (7)
In the case of structure for release before) pad labelling position and the position of solder labelling between deviation
Amount, in other words according to the position of the solder labelling being labeled as benchmark with pad, installs electronic component.
According to this structure, it is possible to according to position and the departure of pad labelling, restore due to electronic component
Installation and the solder labelling that cannot shoot and identify.
Even if in accordance with the invention it is possible to provide a kind of in the case of being difficult to solder labelling also
Electronic part mounting and the electronic component mounting method of electronic component can be installed.
Accompanying drawing explanation
Fig. 1 is equipped with the production line of the electronic part mounting of an embodiment of the invention
Schematic diagram.
Fig. 2 is the axonometric chart of described electronic part mounting.
Fig. 3 is the block figure of described electronic part mounting.
Fig. 4 is near the Handling device of the module of described electronic part mounting and clamping device
Axonometric chart.
Fig. 5 is the flow chart of the electronic component mounting method of an embodiment of the invention.
Fig. 6 is the top view of the substrate of the electronic part mounting being moved to most downstream side.
Fig. 7 is the bowing of substrate during emergent stopping in production process in described electronic part mounting
View.
Fig. 8 is the top view of the substrate being printed with solder.
Fig. 9 is the enlarged drawing in the frame IX of Fig. 8.
Figure 10 is the top view of the substrate that solder prints with being shifted by.
Figure 11 is the enlarged drawing in the frame XI of Figure 10.
Figure 12 is the enlarged drawing in the frame XI after backflow.
Figure 13 is the enlarged drawing being labeled as in frame XI during benchmark installation electronic component with solder.
Figure 14 is the enlarged drawing in the frame XI after backflow.
Detailed description of the invention
Hereinafter, the electronic part mounting of the present invention and the enforcement of electronic component mounting method are described
Mode.
<electronic part mounting>
First, the electronic part mounting of present embodiment is described.Fig. 1 represents and is configured with this reality
Execute the schematic diagram of the production line of the electronic part mounting of mode.As it is shown in figure 1, production line 9
Including host control device 90, multiple electronic part mounting 1, substrate appearance inspection machine 91 and
Reflow ovens 92.Multiple electronic part mountings 1, substrate appearance inspection machine 91 and reflow ovens 92
(direction of transfer of substrate) arrangement in left-right direction.Multiple electronic part mountings 1 are in the weldering of substrate
Material part stage installs electronic component.Substrate appearance inspection machine 91 checks that electronic component is on substrate
Installment state.Reflow ovens 92 heats, cools down substrate, so that solder portion is melted, solidification.
That is, via solder portion connecting electronic component on substrate.Host control device 90 Comprehensive Control electricity
Sub-component mounter 1, substrate appearance inspection machine 91 and reflow ovens 92.
Fig. 2 represents the axonometric chart of the electronic part mounting of present embodiment.It addition, through mould
The shell of block 3 and be indicated.Fig. 3 represents the block figure of described electronic part mounting.As Fig. 2,
Shown in Fig. 3, electronic part mounting 1 include base 2, module 3, component supplying apparatus 4,
Image processing apparatus 5 and control device 7.
Module 3 can be arranged on the upper surface of base 2 with changing.Module 3 includes carrying dress
Put 30, XY mechanical arm 31, mounting head 32, filming apparatus 33, base portion 34, clamping device
35 and device pallet (device pallet) 36.X-direction corresponds to left and right directions, and Y-direction is corresponding
In fore-and-aft direction.
Device pallet 36 is installed on the front surface opening of the shell of module 3.Base portion 34 is module
The diapire of 3.Upper surface at base portion 34 is configured with a pair Y-axis guide rail 340.A pair Y-axis is led
Rail 340 extends in the longitudinal direction.
Fig. 4 represents Handling device and the clamping of the module of the electronic part mounting of present embodiment
Axonometric chart near device.It addition, be indicated through substrate 8.As shown in Figure 1 to 4,
Handling device 30 includes fixing wall portion 300, movable wall part 301, a pair conveyer belt 302 and removes
Fortune motor 303.Fixing wall portion 300 extends in the lateral direction.Fixing wall portion 300 blocks a pair
The front end of Y-axis guide rail 340.Movable wall part 301 extends in the lateral direction.Movable wall part 301
It is configured at the rear of fixing wall portion 300.Movable wall part 301 is relative to a pair Y-axis guide rail 340
Can slide in the longitudinal direction.The rear surface of a pair conveyer belt 302 and fixing wall portion 300 and
The front surface relative configuration of movable wall part 301.A pair conveyer belt 302 extends in the lateral direction.
A pair conveyer belt 302 is added is provided with substrate 8.A pair conveyer belt 302 is carried out by carrying motor 303
Rotate and drive.By making movable wall part 301 move in the longitudinal direction, it is possible to scale a pair biography
Send with the width i.e. carrying amplitude of substrate 8 between 302.
Clamping device 35 includes supporting platform (backup table) 350, multiple support sells (backup
Pin) 351, a pair clamp clip 352 and lift motor 353.Support platform 350 and be configured at fixing wall portion
Between 300 and movable wall part 301.Lift motor 353 can make support platform 350 vertically
Move back and forth.Multiple support pins 351 are configured at the upper surface supporting platform 350.At substrate 8
During upper installation electronic component, multiple support pins 351 support the lower surface of substrate 8.A pair clamping
Sheet 352 is configured at fixing wall portion 300 and the upper limb of movable wall part 301.Install on the substrate 8
During electronic component, a pair clamp clip 352 presses two edges before and after the upper surface of substrate 8.
That is, when installing electronic component, substrate 8 is clamped from top by a pair clamp clip 352 and fixes,
Clamped from below by multiple support pins 351 and fixed.By described fixing, determine substrate 8
Position.
As shown in Figure 2 and Figure 3, XY mechanical arm 31 includes a pair X-axis guide rail 310, X-axis
Slide block 311, a pair Y-axis guide rail 312, Y-axis slide block 313, X-axis motor 314 and Y-axis horse
Reach 315.A pair Y-axis guide rail 312 is configured at the lower surface of the shell of module 3.A pair Y
Axis rail 312 extends in the longitudinal direction.Y-axis slide block 313 can be led relative to a pair Y-axis
Rail 312 slides in front-rear direction.Before a pair X-axis guide rail 310 is configured at Y-axis slide block 313
Surface.A pair X-axis guide rail 310 extends in the lateral direction.X-axis slide block 311 can be relative
Slide in the lateral direction in a pair X-axis guide rail 310.X-axis motor 314 can drive X-axis sliding
Block 311, Y-axis motor 315 can drive Y-axis slide block 313.By X-axis motor 314 and Y
The driving force of axle motor 315, X-axis slide block 311 can move by left and right directions forwards, backwards.
Mounting head 32 can be installed on X-axis slide block 311 with changing.Mounting head 32 includes suction nozzle
320, Z axis motor 321 and θ axle motor 322.Suction nozzle 320 can be installed on installation with changing
32.Suction nozzle 320 vertically can be moved relative to mounting head 32 by Z axis motor 321
Dynamic, can be moved relative to the mounting head 32 direction of rotation in horizontal plane by θ axle motor 322
Dynamic.Malleation, negative pressure are supplied to suction nozzle 320 with allowing hand over.By negative pressure, suction nozzle 320 is fixed
Electronic component.By malleation, suction nozzle 320 discharges electronic component.
Filming apparatus 33 is installed on X-axis slide block 311.Filming apparatus 33 is so-called
CCD (Charge-Coupled Device) surface imaging sensor.Filming apparatus 33 has joins with two dimension
It is equipped with the shooting face of multiple photo detector.Filming apparatus 33 shoots subject from surface.This
Sample, mounting head 32 and filming apparatus 33 are installed on X-axis slide block 311 together.Therefore, install
32 and filming apparatus 33 can move by left and right directions forwards, backwards.
Component supplying apparatus 4 can be installed on device pallet 36 with changing.Component supplying apparatus 4
Including multiple tape feeders 40.Multiple tape feeders 40 arrange in the lateral direction.Belt
Loader 40 includes band.Multiple electronic component alongst it is configured with in band.Electronics unit
Part is taken out from band by suction nozzle 320.
As it is shown on figure 3, control device 7 to include computer 70 and multiple drive circuit.Control dress
Put 7 to electrically connect with the host control device 90 shown in Fig. 1.Computer 70 includes input and output
Interface 700, operational part 701 and storage part 702.Computer 70 is via drive circuit and carrying
Motor 303, lift motor 353, X-axis motor 314, Y-axis motor 315, Z axis motor 321,
θ axle motor 322 and filming apparatus 33 electrically connect.Control device 7 and control described equipment.Additionally,
Computer 70 electrically connects with image processing apparatus 5.From filming apparatus 33 to image processing apparatus 5
Transmit photographed data.
<electronic component mounting method>
Then, the electronic component mounting method of present embodiment is described.The electronics unit of following description
Part installation method performs in all electronic part mountings 1 shown in Fig. 1 respectively.Fig. 5 table
Show the flow chart of the electronic component mounting method of present embodiment.
First, start, as production, the Operational preparation that (step 1 (S1)) is front, upper from shown in Fig. 1
Level control device 90 transmits production routine to the control device 7 of each electronic part mounting 1.Raw
Stages of labor sequence comprises the distribution of electronic component to each electronic part mounting 1.Additionally, comprise
Electronic component mounting coordinate on the substrate 8.Additionally, production routine comprises and pad labelling
Shape, the shape of the relevant pad flag data such as position and solder labelling, the phase such as position
The solder flag data closed.Pad flag data, solder flag data are pacified at all electronic components
Installation 1 shares.The production routine transmitted is stored in the storage of the computer 70 shown in Fig. 3
Portion 702.
Fig. 6 represents the top view of the substrate of the electronic part mounting being moved to most downstream side.For
It is easy to explanation, solder portion 81 is marked with hacures.As shown in Figure 6, upper at substrate 8
Two pad labelling M1 and M2, two solder labelling m1 and m2, wirings it are configured with on surface
Pattern 80 and multiple solder portion 81.Pad labelling M1, M2 and wiring pattern 80 are formed at base
The upper surface of plate 8.Pad labelling M1, M2 and wiring pattern 80 are i.e. as wiring pattern 80
The welding disk 800 of a part concurrently form on the substrate 8.Pad labelling M1, M2 and cloth
Line chart case 80 i.e. welding disk 800 as a part for wiring pattern 80 is configured at same coordinate
System.Pad labelling M1, M2 are configured with altogether at the diagonal position (left-front corner, right relief angle) of substrate 8
Two.
Multiple solder portion 81 are to be printed on wiring pattern 80 by not shown screen printer
On the upper surface of welding disk 800.Screen printer is configured at the multiple electronics unit shown in Fig. 1
The upstream side of part fitting machine 1.By production routine, 4 of the left-front corner in multiple solder portion 81
Individual solder portion 81 is chosen to solder labelling m1, and 4 solder portion 81 of right relief angle are chosen to
Solder labelling m2.Solder labelling m1, m2 and solder portion 81 are configured at the same coordinate system.
[step 1 (S1), step 2 (S2)]
In step 1, step 2, carry out the location of substrate 8.Specifically, at each electronics
In component mounter 1, the most as shown in Figure 2 and Figure 3, control device 7 and drive carrying motor
303, make a pair conveyer belt 302 rotate.Further, substrate 8 is moved into electronic part mounting 1.
Then, control device 7 and drive lift motor 353, make the support platform 350 shown in Fig. 4 increase.
Further, multiple support pins 351 substrate 8 is lifted from a pair conveyer belt 302.Afterwards, multiple
Support and clamp and fix substrate 8 between pin 351 and a pair clamp clip 352.That is, substrate 8 is carried out
Location.
[step 3 (S3)]
In all electronic part mountings 1 shown in Fig. 1 the solder labelling m1 shown in Fig. 6,
What m2 installed electronic component P is only the electricity of most downstream side (upstream side of substrate appearance inspection machine 91)
Sub-component mounter 1.In remaining electronic part mounting 1, on solder labelling m1, m2
Uneasy electronic components P.
In step 3, it is judged that whether each electronic part mounting 1 is at solder labelling m1, m2
Upper installation electronic component.That is, the production journey of the storage part 702 controlling device 7 shown in Fig. 3
Sequence is included in electronic part mounting 1 mounting coordinate of the electronic component P of predetermined installation.
In this step, device 7 is controlled with reference to this production routine.And, it may be judged whether have at solder
Labelling m1, m2 upper installation electronic component P's is predetermined.
As shown in Figure 6, the electronic part mounting 1 of the most downstream side stage after moving into,
Constitute, in the solder portion 81 of solder labelling m1, m2, electronic component P is not yet installed.Most downstream side
Electronic part mounting 1 electronic component P is installed in these solder portion 81.Thus,
In the case of the electronic part mounting 1 in downstream, control device 7 and select "Yes".And
In the case of remaining electronic part mounting 1, control device 7 and select "No".
[step 4 (S4)]
Situation (the electronics unit of most downstream side of "Yes" is have selected at the device 7 that controls shown in Fig. 3
The situation of part fitting machine 1) under, perform step 4.Step 4 is contained in " first weldering of the present invention
Dish mark position acquisition step " concept.In this step, obtain and the pad shown in Fig. 6
The data that the position of labelling M1, M2 is relevant.That is, the position of oriented substrate 8 is confirmed.
Specifically, first, as shown in Figure 2 and Figure 3, control device 7 and drive X-axis motor
314, Y-axis motor 315.Further, filming apparatus 33 is configured at the substrate 8 shown in Fig. 6
The surface of pad labelling M1.Then, control device 7 and shoot pad by filming apparatus 33
Labelling M1.Afterwards, device 7 is controlled by identical step shooting pad labelling M2.Pad
The view data of labelling M1, M2 is sent to image procossing dress from filming apparatus 33 as shown in Figure 3
Put 5.These view data are implemented the image procossing of regulation by image processing apparatus 5.Image procossing
Device 5 sends the position (horizontal direction coordinate) with pad labelling M1, M2 to controlling device 7
Relevant data.Control device 7 and these data are stored in storage part 702.
[step 5 (S5)]
Step 5 is contained in the concept of " the solder mark position acquisition step " of the present invention.At this
In step, obtain the data relevant to the position of solder labelling m1, the m2 shown in Fig. 6.That is,
Confirm the position of oriented substrate 8.
Specifically, first, as shown in Figure 2 and Figure 3, control device 7 and drive X-axis motor
314, Y-axis motor 315.Further, filming apparatus 33 is configured at the substrate 8 shown in Fig. 6
The surface of solder labelling m1.Then, control device 7 and shoot solder by filming apparatus 33
Labelling m1.Afterwards, device 7 is controlled by identical step shooting solder labelling m2.Solder
The view data of labelling m1, m2 is sent to image procossing dress from filming apparatus 33 as shown in Figure 3
Put 5.These view data are implemented the image procossing of regulation by image processing apparatus 5.Image procossing
Device 5 sends the position (horizontal direction coordinate) with solder labelling m1, m2 to controlling device 7
Relevant data.Control device 7 and described data are stored in storage part 702.
[step 6 (S6)]
Step 6 is contained in the concept of " the departure calculation procedure " of the present invention.Electronic component is pacified
Installation 1 is installed in principle on the basis of solder labelling m1, the m2 shown in Fig. 6 on the substrate 8
Electronic component P (solder marking mode).But, also there is exception, at step 12 (pad described later
Marking mode) in, with the position of solder labelling m1, m2 of pad labelling M1, M2 benchmark it is
Benchmark, installs electronic component P on the substrate 8.With step 12 accordingly, in this step,
Control device 7 shown in Fig. 3 stores and pad labelling M1, M2 benchmark in storage part 702
The relevant data in the position of solder labelling m1, m2.
Specifically, first, control device 7 operational part 701 according to storage part 702 with
Pad labelling M1, the relevant data in position of solder labelling m1, calculate pad labelling M1 with
Departure between solder labelling m1.Then, control device 7 store in storage part 702 and
The data that the position of the solder labelling m1 of pad labelling M1 benchmark is relevant.Afterwards, device is controlled
7 by identical step, storage and the solder mark of pad labelling M2 benchmark in storage part 702
The data being correlated with in the position of note m2.
[step 7 (S7)]
Step 7 is contained in the concept of " the solder marking mode " of the present invention.In this step,
As shown in Figure 2 and Figure 3, control device 7 suitably drive X-axis motor 314, Y-axis motor 315,
Z axis motor 321 and θ axle motor 322, carries electronic component P to base from tape feeder 40
Plate 8.Further, the mounting coordinate in the regulation of substrate 8 installs electronic component P.
Here, the mounting coordinate of electronic component P be with in step 5 obtain solder labelling m1,
Set on the basis of the position of m2.Therefore, as shown in Figure 6, electronic component P without respect to
Welding disk 800, but correctly install relative to solder portion 81.Therefore, even if in solder portion
81 in the case of welding disk 800 offsets, it is also possible to by electronic component P and liquid when backflow
The solder portion 81 of shape flows to the central authorities of welding disk 800 together, and in the mounting coordinate specified just
Really configure electronic component P.
[step 8 (S8)]
Below step 8～step 12 are that way substrate 8 is temporarily installed from electronic component aborning
Machine 1 is pulled down, and is again installed on and performs in the case of electronic part mounting 1.In other words,
Perform in the case of needing to re-recognize the datum mark of the installation of electronic component P.On the contrary,
In the case of production is successfully carried out, do not perform step 8～step 12.By the weldering of step 7
Material marking mode, all electronic component P are installed on substrate 8.
In step 8, as in figure 2 it is shown, operator's emergent stopping electronic part mounting 1.
Operator, in order to check, temporarily pulls down substrate 8 from electronic part mounting 1.
Fig. 7 represents in the electronic part mounting of most downstream side in production process during emergent stopping
The top view of substrate.As it is shown in fig. 7, in 4 solder portion 81 constituting solder labelling m2
Electronic component P has been installed.Additionally, in 4 solder portion 81 constituting solder labelling m1
Two solder portion 81 on electronic component P has been installed.
[step 9 (S9), step 10 (S10)]
In step 9, step 10, restart to produce.That is, as in figure 2 it is shown, operator
Substrate 8 after checking outside equipment is set up in a pair conveyer belt 302 again.By with step 2
Identical step, the control device 7 shown in Fig. 3 uses multiple support pin 351, a pair clamp clip
352 clamping fixing substrates 8.
[step 11 (S11)]
The position of the most fixing substrate 8 and base the most fixing in step 2
The situation of the position deviation of plate 8 is more.Therefore, in order to electronic component P is installed on substrate 8,
Need again to re-recognize the datum mark of the installation of electronic component P.That is, it needs to reaffirm
The position of the substrate 8 of location.
But, as it is shown in fig. 7, pacify in 4 solder portion 81 constituting solder labelling m2
Equipped with electronic component P.Additionally, constitute solder labelling m1 4 solder portion 81 in two
In individual solder portion 81, electronic component P is installed.Accordingly, it is difficult to use filming apparatus 33 to obtain
The data relevant to the position of solder labelling m1, m2.
On the other hand, pad labelling M1, M2 are fitted without electronic component P.Additionally,
In step 6 achieved with the position with solder labelling m1, m2 of pad labelling M1, M2 benchmark
Put relevant data.
Therefore, in a step 11, on the basis of pad labelling M1, M2, in order to restore weldering
The position of material labelling m1, m2, obtains the data relevant to the position of pad labelling M1, M2.
Step 11 is contained in the concept of " the second pad mark position acquisition step " of the present invention.
Specifically, by the step identical with step 4, control device 7 and pass through filming apparatus
33 shooting pad labelling M1, M2.The view data of pad labelling M1, M2 is as shown in Figure 3
It is sent to image processing apparatus 5 from filming apparatus 33.Image processing apparatus 5 is to controlling device 7
Send the data relevant to the position of pad labelling M1, M2.Control device 7 by described data
It is stored in storage part 702.
[step 12 (S12)]
Step 12 is contained in the concept of " the pad marking mode " of the present invention.Control shown in Fig. 3
Device 7 processed in step 6 achieved with the solder labelling m1 of pad labelling M1, M2 benchmark,
The data that the position of m2 is relevant.Additionally, in a step 11, achieved with pad labelling M1,
The data that the position of M2 is relevant.Therefore, controlling device 7 can be according to these data recovery solder
The position of labelling m1, m2.In this step, with solder labelling m1, the m2's after restoring
On the basis of position, set the mounting coordinate of electronic component P.Specifically, by with step 7
Identical step, the mounting coordinate in the regulation of substrate 8 installs electronic component P.
[step 13 (S13), step 14 (S14)]
In step 13, step 14, send from electronic part mounting 1 and be mounted with all electricity
The substrate 8 of sub-element P.Specifically, first, as shown in Figure 2 and Figure 3, device 7 is controlled
Drive lift motor 353, make the support platform 350 shown in Fig. 4 decline.Further, from multiple supports
Pin 351 is to a pair conveyer belt 302 transfer base substrate 8.Then, control device 7 and drive carrying motor
303, make a pair conveyer belt 302 rotate.Then, substrate 8 is taken out of.As it is shown in figure 1, removed
The substrate 8 gone out is by substrate appearance inspection machine 91, reflow ovens 92.
[step 15 (S15)]
In step 3, have selected the situation of "No" (under at the device 7 that controls shown in Fig. 3
The situation of the electronic part mounting 1 beyond trip side) under, perform step 15.In this step,
Obtain the data relevant to the position of solder labelling m1, the m2 shown in Fig. 6.That is, confirmed
The position of the substrate 8 of location.
Specifically, by the step identical with step 5, control device 7 and pass through filming apparatus
33 shooting solder labelling m1, m2.The view data of solder labelling m1, m2 is as shown in Figure 3
It is sent to image processing apparatus 5 from filming apparatus 33.Image processing apparatus 5 is to controlling device 7
Send the data relevant to the position of solder labelling m1, m2.Control device 7 these data to be deposited
It is stored in storage part 702.
[step 16 (S16)]
Step 16 is contained in the concept of " the solder marking mode " of the present invention.In this step,
By the step identical with step 7, with solder labelling m1, m2's of obtaining in step 15
On the basis of position, the mounting coordinate in the regulation of substrate 8 installs electronic component P.
[step 17 (S17)～step 19 (S19)]
Below step 17～step 21 are that way substrate 8 is temporarily installed from electronic component aborning
Machine 1 is pulled down, and is again installed on and performs in the case of electronic part mounting 1.In other words,
Perform in the case of needing to re-recognize the datum mark of the installation of electronic component P.On the contrary,
In the case of production is successfully carried out, do not perform step 17～step 21.By step 16
Solder marking mode, all electronic component P are installed on substrate 8.
In step 17～step 19, by the step identical with step 8～step 10, perform
The emergent stopping of electronic part mounting 1, the pulling down of substrate 8, restarting and base of producing
Again fixing of plate 8.
[step 20 (S20)]
The position of substrate 8 again fixing in step 19 and base the most fixing in step 2
The situation of the position deviation of plate 8 is more.Therefore, in order to electronic component P is installed on substrate 8,
Need again to re-recognize the datum mark of the installation of electronic component P.That is, it needs to reaffirm
The position of the substrate 8 of location.
Here, in the case of the control device 7 shown in Fig. 3 have selected "No" in step 3,
4 solder portion 81 constituting solder labelling m1, m2 shown in Fig. 7 are not installed electronics unit
Part P.Therefore, in this step, the data relevant to the position of solder labelling m1, m2 are obtained.
Specifically, by the step identical with step 15, control device 7 and pass through filming apparatus
33 shooting solder labelling m1, m2.The view data of solder labelling m1, m2 is as shown in Figure 3
It is sent to image processing apparatus 5 from filming apparatus 33.Image processing apparatus 5 is to controlling device 7
Send the data relevant to the position of solder labelling m1, m2.Control device 7 these data to be deposited
It is stored in storage part 702.
[step 21 (S21)]
Step 21 is contained in the concept of " the solder marking mode " of the present invention.In this step,
By the step identical with step 16, with solder labelling m1, m2 of obtaining in step 20
Position on the basis of, substrate 8 regulation mounting coordinate install electronic component P.
[step 22 (S22), step 23 (S23)]
In step 22, step 23, by with step 13, step that step 14 is identical, release
Put and take out of substrate 8.As it is shown in figure 1, the substrate 8 taken out of is transferred to the electronics in downstream
Component mounter 1.
<action effect>
Then, electronic part mounting 1 and the electronic component mounting method of present embodiment are described
Action effect.The electronic part mounting 1 of present embodiment and electronic component mounting method energy
Solder marking mode shown in enough steps 7 at Fig. 5, step 16, step 21 and step 12
Switch between shown pad marking mode.At solder labelling m1, the m2 shown in Fig. 6, Fig. 7
In the case of upper uneasy electronic components P, perform solder marking mode.And solder labelling m1,
In the case of m2 upper installation electronic component P, perform pad marking mode.That is, as solder
Labelling m1, m2 and in the case of electronic component P being installed in selected solder portion 81,
Electronics is at least installed on the basis of pad labelling M1, M2 (electronic component P is not installed) on substrate
Element P.So, according to the electronic part mounting 1 of present embodiment, it is possible to according to solder mark
Whether there is electronic component P on note m1, m2, distinguish and use solder labelling m1, m2 and pad mark
Remember that M1, M2 install electronic component P.Therefore, even if being difficult to solder labelling m1, m2,
It also is able to electronic component P is installed on the substrate 8.
Additionally, according to the electronic part mounting 1 of present embodiment and electronic component mounting method,
Solder labelling m1, m2 install electronic component P (Fig. 7), and substrate 8 has temporarily been released
After be again positioned in the case of (step 8 of Fig. 5～step 10), it is possible to perform pad labelling mould
Formula (step 12 of Fig. 5).That is, solder labelling m1, m2 have installed electronic component P, and
In the case of substrate 8 is positioned after being temporarily released again, it is difficult to shoot and identify and again position
After solder labelling m1, m2.Even if in this case, it is also possible at least with pad labelling
Electronic component P is installed on the basis of M1, M2 on the substrate 8.
Additionally, according to the electronic part mounting 1 of present embodiment and electronic component mounting method,
Control device 7 shown in Fig. 3 is performing the first pad mark position acquisition step (step of Fig. 5
4), solder mark position acquisition step (step 5 of Fig. 5), the departure calculation procedure (step of Fig. 5
Rapid 6) and after the second pad mark position acquisition step (step 11 of Fig. 5), pad mark is performed
Note pattern (step 12 of Fig. 5).In pad marking mode, according to the pad labelling shown in Fig. 7
The position of M1, M2, the position of pad labelling M1, M2 and the position of solder labelling m1, m2
Departure between putting, in other words according to the solder labelling on the basis of pad labelling M1, M2
The position of m1, m2, installs electronic component P.Electronic part mounting according to present embodiment
1 and electronic component mounting method, it is possible to according to position and the departure of pad labelling M1, M2,
Restore solder labelling m1, the m2 that cannot shoot due to the installation of electronic component P and identify.
<other>
This concludes the description of the electronic part mounting of the present invention and the reality of electronic component mounting method
Execute mode.But, embodiment is not particularly limited in described mode.Can also be with this area skill
Various modes of texturing, mode of ameliorating that art personnel can implement are implemented.
In said embodiment, using all electronic part mountings 1 shown in Fig. 1 as this
The electronic part mounting 1 of invention but it also may only by the electronic part mounting 1 of most downstream side
Electronic part mounting as the present invention.I.e., it is also possible to only will be as shown in Figure 7 at solder mark
The electronic part mounting 1 of note m1, m2 upper installation electronic component P is as the electronics of the present invention
Component mounter.In addition it is also possible to only will be at substrate 8 on the basis of solder labelling m1, m2
The electronic part mounting 1 of upper installation electronic component P is as the electronic part mounting of the present invention.
In said embodiment, in the step 12 of Fig. 5, with the pad labelling shown in Fig. 7
On the basis of solder labelling m1, m2 of M1, M2 benchmark, electronic component P is installed on the substrate 8.
However, it is also possible to only on the basis of pad labelling M1, M2, install electronics unit on the substrate 8
Part P.Now, it is possible to omit step 4, step 6.Such as, when on the substrate 8 backflow being installed
It is difficult to the feelings of the electronic component P (the electronic component P etc. from great) flowed together with solder portion 81
Under condition, on the basis of pad labelling M1, M2 (i.e. welding disk 800), electronics is installed on the substrate 8
Element P is preferable.
In said embodiment, by the pad flag data in production routine, solder reference numerals
According to being common to all electronic part mountings 1 but it also may do not share.For example, it is also possible to according to
Each electronic part mounting 1, or multiple electronic part mountings 1 are divided into multiple groups and according to
Each group, different solder portion 81 is identified as solder labelling m1, m2.
In said embodiment, in the step 4, step 5 of Fig. 5, shoot Fig. 6 respectively
Shown pad labelling M1, M2 and solder labelling m1, m2.But, entering shooting dress
In the case of putting the visual field of 33, it is also possible to disposable shooting pad labelling M1 and solder labelling m1,
Pad labelling M2 and solder labelling m2.I.e., it is also possible to perform step 4, step 5 simultaneously.This
Outward, it is also possible to first carry out step 5, rear execution step 4.
Additionally, without particular limitation of pad labelling M1, M2, the position of solder labelling m1, m2,
Configuration quantity and shape.Pad labelling M1, M2 and welding disk 800 are at the same coordinate system.
Solder labelling m1, m2 and solder portion 81 are at the same coordinate system.
Claims (8)
1. an electronic part mounting, installs electronic component on oriented substrate, described
Substrate has multiple welding disk, multiple solder portion being printed on multiple described welding disk and many
Individual described welding disk is in the pad labelling of the same coordinate system and is in multiple described solder portion
The solder labelling of the same coordinate system,
Described electronic part mounting is characterised by,
Including controlling device, described control device is configured to be carried out as follows control:
Described solder labelling selects from multiple described solder portion,
Can switch between solder marking mode and pad marking mode, described solder labelling mould
Formula installs described electronic component on the basis of the position of described solder labelling on the substrate,
Described pad marking mode at least on the basis of the position of described pad labelling on the substrate
Described electronic component is installed,
When the position of oriented described substrate is confirmed, described solder labelling does not has
In the case of having the described electronic component of installation, perform described solder marking mode,
In the case of described solder labelling has installed described electronic component, perform described weldering
Dish marking mode.
Electronic part mounting the most according to claim 1, it is characterised in that
Described control device is configured to be carried out as follows control: be provided with on described solder labelling
Weight after the installation process of described electronic component is interrupted is installed on the described substrate of described electronic component
In the case of newly starting, perform described pad marking mode.
Electronic part mounting the most according to claim 2, it is characterised in that
Described control device is configured to be carried out as follows control: at described substrate in described installation process
In the case of period before restarting after being interrupted temporarily is released and is again fixed, hold
The described pad marking mode of row.
4. according to the electronic part mounting described in Claims 2 or 3, it is characterised in that
Including:
Clamping device, it is possible to described substrate is positioned, discharges；
Filming apparatus, it is possible to the described pad of the described substrate that shooting is positioned by described clamping device
Labelling, described solder labelling；
Suction nozzle, installs described electronic component on the described substrate positioned by described clamping device；
And
Described control device, controls described clamping device, described filming apparatus and described suction nozzle,
In the case of performing described pad marking mode, before described pad marking mode,
Described control device execution following steps:
First pad mark position acquisition step, uses described filming apparatus to obtain described installation place
Reason be interrupted before the position of described pad labelling；
Solder mark position acquisition step, uses described filming apparatus to obtain described installation process quilt
The position of the described solder labelling before interruption；
Departure calculation procedure, calculates the position of described pad labelling and the position of described solder labelling
Departure between putting；And
Second pad mark position acquisition step, uses described filming apparatus to obtain and restarts institute
State the position of the described pad labelling after installation process,
In described pad marking mode, with by described second pad mark position acquisition step
Obtain described pad labelling position with calculated by described departure calculation procedure described in
On the basis of departure, use described suction nozzle that described electronic component is installed.
5. an electronic component mounting method, installs electronic component, institute on oriented substrate
State substrate have multiple welding disk, the multiple solder portion being printed on multiple described welding disk and
Multiple described welding disks be in the same coordinate system pad labelling and with multiple described solder portion at
In the solder labelling of the same coordinate system,
Described electronic component mounting method is characterised by,
Described solder labelling selects from multiple described solder portion,
Can switch between solder marking mode and pad marking mode, described solder labelling mould
Formula installs described electronic component on the basis of the position of described solder labelling on the substrate,
Described pad marking mode at least on the basis of the position of described pad labelling on the substrate
Described electronic component is installed,
When the position of oriented described substrate is confirmed, described solder labelling does not has
In the case of having the described electronic component of installation, perform described solder marking mode,
In the case of described solder labelling has installed described electronic component, perform described weldering
Dish marking mode.
Electronic component mounting method the most according to claim 5, it is characterised in that
Described being provided with on the described substrate of described electronic component installation on described solder labelling
In the case of the installation process of electronic component restarts after being interrupted, perform described pad labelling
Pattern.
Electronic component mounting method the most according to claim 6, it is characterised in that
Period before described substrate restarts after described installation process is interrupted temporarily quilt
Release and again by the case of fixing, perform described pad marking mode.
8. according to the electronic component mounting method described in claim 6 or 7, it is characterised in that
In the case of performing described pad marking mode, before described pad marking mode,
Execution following steps:
First pad mark position acquisition step, obtains the institute before described installation process is interrupted
State the position of pad labelling；
Solder mark position acquisition step, obtains the described weldering before described installation process is interrupted
The position of material labelling；
Departure calculation procedure, calculates the position of described pad labelling and the position of described solder labelling
Departure between putting；And
Second pad mark position acquisition step, obtains the institute after restarting described installation process
State the position of pad labelling,
In described pad marking mode, with by described second pad mark position acquisition step
Obtain described pad labelling position with calculated by described departure calculation procedure described in
Described electronic component is installed on the basis of departure.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2011-196003 | 2011-09-08 | ||
| JP2011196003A JP5767918B2 (en) | 2011-09-08 | 2011-09-08 | Electronic component mounting machine and electronic component mounting method |
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| CN103002726B true CN103002726B (en) | 2016-12-21 |
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| JP6466960B2 (en) * | 2014-11-13 | 2019-02-06 | 株式会社Ｆｕｊｉ | Mounting machine and electronic component suction posture inspection method using mounting machine |
| CN111447822B (en) * | 2015-11-17 | 2021-05-07 | 株式会社富士 | Mounting processing method, mounting system and component mounting machine |
| WO2017130372A1 (en) | 2016-01-29 | 2017-08-03 | 富士機械製造株式会社 | Electronic component mounting apparatus and production line |
| JP6890694B2 (en) * | 2016-01-29 | 2021-06-18 | 株式会社Ｆｕｊｉ | How to decide and how to wear |
| CN116636321A (en) * | 2020-12-22 | 2023-08-22 | 雅马哈发动机株式会社 | Component mounting apparatus and component mounting method |
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| JPH0722791A (en) * | 1993-06-29 | 1995-01-24 | Sony Corp | Apparatus and method for mounting surface component |
| JP2003332798A (en) * | 2002-05-09 | 2003-11-21 | Fuji Mach Mfg Co Ltd | Board work system and its method for detecting presence of circuit board |
| JP2006019554A (en) * | 2004-07-02 | 2006-01-19 | Matsushita Electric Ind Co Ltd | Apparatus and method for mounting electronic parts |
| CN101312137A (en) * | 2007-05-22 | 2008-11-26 | 松下电器产业株式会社 | Electronic component mounting system and electronic component mounting method |
| CN101971722A (en) * | 2008-03-14 | 2011-02-09 | 松下电器产业株式会社 | Substrate inspection device and substrate inspection method |
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|---|---|---|---|---|
| JP2004200224A (en) * | 2002-12-16 | 2004-07-15 | Yamagata Casio Co Ltd | Defective recognition solving method and electronic-part loading device using it |
| JP3983274B2 (en) * | 2007-01-29 | 2007-09-26 | 松下電器産業株式会社 | Electronic component mounting method and apparatus |
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2011
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0722791A (en) * | 1993-06-29 | 1995-01-24 | Sony Corp | Apparatus and method for mounting surface component |
| JP2003332798A (en) * | 2002-05-09 | 2003-11-21 | Fuji Mach Mfg Co Ltd | Board work system and its method for detecting presence of circuit board |
| JP2006019554A (en) * | 2004-07-02 | 2006-01-19 | Matsushita Electric Ind Co Ltd | Apparatus and method for mounting electronic parts |
| CN101312137A (en) * | 2007-05-22 | 2008-11-26 | 松下电器产业株式会社 | Electronic component mounting system and electronic component mounting method |
| CN101971722A (en) * | 2008-03-14 | 2011-02-09 | 松下电器产业株式会社 | Substrate inspection device and substrate inspection method |
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| CN103002726A (en) | 2013-03-27 |
| JP2013058605A (en) | 2013-03-28 |
| JP5767918B2 (en) | 2015-08-26 |
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