CN102997983A - Electronic-balance-based automatic silicon wafer counter - Google Patents
Electronic-balance-based automatic silicon wafer counter Download PDFInfo
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- CN102997983A CN102997983A CN2012103883924A CN201210388392A CN102997983A CN 102997983 A CN102997983 A CN 102997983A CN 2012103883924 A CN2012103883924 A CN 2012103883924A CN 201210388392 A CN201210388392 A CN 201210388392A CN 102997983 A CN102997983 A CN 102997983A
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Abstract
The invention discloses an electronic-balance-based automatic silicon wafer counter which comprises an electronic balance. The electronic balance comprises an input and display panel. An internal signal processing device is disposed in the electronic balance. The input and display panel is provided with a numeric input device, a silicon wafer thickness selection and display device, a silicon wafer specification selector, a silicon wafer size selector and a counting result display device. The counting result display device is provided with a 'weight' display panel and a 'number' display panel. The internal signal processing device processes input from the numeric input device, the silicon wafer thickness selection and display device, the silicon wafer specification selector and the silicon wafer size selector, and displays the silicon wafer weight and number counting result on the 'weight' display panel and the 'number' display panel. The electronic-balance-based automatic silicon wafer counter is developed based on a common electronic balance, is effective in counting silicon wafers and has the advantages of convenience, practicality and low cost.
Description
Technical field
The invention belongs to integrated circuit and support industry semi-conductor silicon chip processing and manufacturing field and be particularly related to a kind of silicon chip based on electronic balance and automatically count sheet devices, be applicable to the semi-conductor silicon chip counting of weighing.
Background technology
The semi-conductor silicon chip manufacturing belongs to integrated circuit and supports industry, all the time, all be to support industry and strategic new industry as emphasis, and the sheet number of semi-conductor silicon chip statistics, add up to by artificial spot film for a long time and finish, artificial spot film inevitably can produce error in data, and this produces extremely rigorous field at semicon industry, and sheet miscounts mistake greatly affects image product; Also review for production data and have a negative impact; In addition, artificial spot film also can increase the silicon chip surface scratch, increases the check loss.
Photovoltaic industry is fast-developing in recent years industry, and its emphasis base material-silicon chip of solar cell is because relating to production line circulation etc., and each link all needs to add up to the sheet number, and sheet number statistics the earliest also is to adopt artificial spot film to finish.The spot film machine based on photovoltaic principals also occurs at present, utilized image processing means to carry out sheet number statistics.But this series products is because technology realizes difficulty, and the factors such as cost of development height all have price higher, and it is large to popularize difficulty.
Simultaneously, semi-conductor silicon chip belongs to and is circle, and edge curvature is larger, and optical focal length is difficult to adjust, and edge image is difficult to be gathered or the effective image pixel is few, and image focusing difficulty or effective image are not enough, can't realize counting.In addition, for semi-conductor silicon chip, because conduction type, crystal do not have different reference surface differences simultaneously to equal-specification, sometimes also need carry out reference surface processing according to the client.At present conventional processing is mainly by disk, single reference surface, double reference surface; There are 3 cun, 4 cun, 5 cun, 6 cun, 8 cun, 12 cun according to size; The silicon chip of different size has clear to position and the length of reference surface, and consistance is strong.For the silicon chip that reference surface is arranged, photo-electric spot film machine can't be realized the edge image focusing, can't carry out the sheet number and calculate, in addition, in actual production, also can there be the silicon chip of asymmetric chamfering, in this case, the silicon chip edge shape is asymmetric, and photo-electric spot film machine can't be realized spot film more.Therefore so far, also do not have formal photo-electric spot film machine to be applied to the semi-conductor silicon chip manufacturing, still adopt the Traditional Man spot film in the production.
For silicon chip processing, because product requirement is higher, product all has more consistent thickness and consistent diameter dimension in the general process of manufacture, simultaneously for test silicon wafer resistivity, the thickness of silicon chip need to be carried out first stepping, be generally 5 microns one grade, guarantee that namely consistency of thickness just can carry out resistivity measurement, so just guaranteed the silicon wafer thickness consistance, simultaneously because silicon chip shape and diameter dimension all have good consistance.
In the actual production link, especially OQC link, checking of sheet number is vital, and the Traditional Man spot film can't satisfy the existing high request of producing product quality, and photo-electric spot film machine is used to have in the semi-conductor silicon chip manufacturing industry and can't be avoided the born defective in ground.How to realize that convenience, practical, cheap spot film device and method are the subject matter of puzzlement silicon chip spot film counting.
Summary of the invention
Technical matters to be solved by this invention just provides a kind of silicon chip based on electronic balance and automatically counts sheet devices, efficiently realizes silicon chip spot film counting, has conveniently, practical, cheap advantage.
For solving the problems of the technologies described above, the present invention adopts following technical scheme: the silicon chip based on electronic balance is counted sheet devices automatically, comprise electronic balance, described electronic balance comprises input and display panel, be provided with the internal signal treating apparatus in the electronic balance, it is characterized in that: described input and display panel are provided with the numerical value input media, silicon wafer thickness is selected and display device, silicon chip specification selecting arrangement, the die size selecting arrangement, the metering device displaying result, described metering device displaying result is provided with " weight " display panel, " sheet number " display panel, described internal signal treating apparatus is according to the numerical value input media, silicon wafer thickness is selected and display device, the input of silicon chip specification selecting arrangement and die size selecting arrangement is processed and is shown silicon chip weight and sheet number metering result at " weight " display panel and " sheet number " display panel.
As preferably, also be provided with " accumulative total sheet number " display panel and " cumulative number " display panel on the described metering device displaying result.
As preferably, described silicon wafer thickness is selected and display device is provided with " thickness is reached the standard grade " button, " thickness rolls off the production line " button, " single maximum number " button, and corresponding " thickness is reached the standard grade " button, " thickness rolls off the production line " button, " single maximum number " button are respectively equipped with display panel.
As preferably, described silicon chip specification selecting arrangement comprises " disk " button, " single reference surface " button, " double reference surface " button and " square sheet " button,
As preferably, described die size selecting arrangement comprises " 3 cun " button, " 4 cun " button, " 5 cun " button, " 6 cun " button.
As preferably, described internal signal treating apparatus comprises weighing device, the silicon area calculation element, silicon chip volume calculation element, the silicon chip sheet is counted calculation element, the silicon area calculation element calculates silicon area according to die size and specification, silicon chip volume calculation element calculates the weight of single silicon chip according to silicon area and silicon wafer thickness, and sheet counts that calculation element calculates the silicon chip gross weight that obtains according to weighing device and the weighing scale of single silicon chip is calculated silicon chip sheet number and finally shown silicon chip weight and sheet number metering result at " weight " display panel and " sheet number " display panel.
As preferably, described internal signal treating apparatus also is provided with single maximum count calculation element, and this single maximum count calculation element calculates the single maximum count value according to the silicon wafer thickness of selecting and judges whether to surpass this single maximum count value.
As preferably, described internal signal treating apparatus also comprised one accumulative total sheet count statistic device, this accumulative total sheet counts statistic device record single count value and addition shows the result at last at the metering device displaying result, and described input and display panel are provided with " accumulative total " button and " stopping to add up " button is used for the switching between single counting and the stored count.
The present invention is based on general electronic balance and develop, utilize mainly that intrinsic physical characteristics realizes that the sheet number calculates between weight and the density, can efficiently realize silicon chip spot film counting, have conveniently, practical, cheap advantage.
Description of drawings
The invention will be further described below in conjunction with the drawings and specific embodiments:
Fig. 1 is external structure synoptic diagram of the present invention;
Fig. 2 is inner structure synoptic diagram of the present invention;
Fig. 3 is input and display panel synoptic diagram;
Fig. 4 is counting principle synoptic diagram of the present invention.
Embodiment
As shown in Figures 1 to 4, be specific embodiments of the invention, at first, the present invention has the structure of general balance, comprises microscope carrier 1, day flat structure 8, sensor 9, chassis 16, accumulator 7, switch 2, power supply input port 3, internal signal treating apparatus 10, input and display panel 5, level meter 6, horizontal adjustment pin 4.
Different from existing day flat structure is that at first, described input and display panel 5 are provided with numerical value input media 13, silicon wafer thickness selection and display device 14, silicon chip specification selecting arrangement 17, die size selecting arrangement 15, metering device displaying result 11.
Wherein, numerical value input media 13 is identical with the numerical value input panel of conventional balance, and it is used for input thickness numerical value.
Silicon wafer thickness is selected and display device 14 is provided with " thickness is reached the standard grade " button, " thickness rolls off the production line " button, " single maximum number " button, and corresponding " thickness is reached the standard grade " button, " thickness rolls off the production line " button, " single maximum number " button are respectively equipped with display panel.Select " thickness is reached the standard grade " button and " thickness rolls off the production line " button, and the corresponding one-tenth-value thickness 1/10 of input namely can be internal signal treating apparatus 10 thickness parameter is provided in numerical value input media 13, and obtain the single maximum number by internal signal treating apparatus 10, and show at the corresponding display panel of " single maximum number " button.
Silicon chip specification selecting arrangement 17 bags expand " disk " button, " single reference surface " button, " double reference surface " button and " square sheet " button.Die size selecting arrangement 15 comprises " 3 cun " button, " 4 cun " button, " 5 cun " button, " 6 cun " button.The specification of selection silicon chip and the size of silicon chip namely can be the internal signal treating apparatus provides the area calculating parameter.
Metering device displaying result 11 is provided with " weight " display panel, " sheet number " display panel, " accumulative total sheet number " display panel and " cumulative number " display panel.Described input and display panel 5 are provided with function key area 12 in metering below the device displaying result 11, and described function key area 12 is provided with peeling ", " accumulative total " reach " stopping totally " button.
Described internal signal treating apparatus 10 comprises weighing device, silicon area calculation element, silicon chip volume calculation element, silicon chip sheet are counted calculation element, the silicon area calculation element calculates silicon area according to die size and specification, silicon chip volume calculation element calculates the weight of single silicon chip according to silicon area and silicon wafer thickness, and sheet is counted weighing scale that calculation element calculates the silicon chip gross weight that obtains and single silicon chip according to weighing device and calculated silicon chip sheet number and show at the metering device displaying result.
Described internal signal treating apparatus 10 also is provided with single maximum count calculation element, and this single maximum count calculation element calculates the single maximum count value according to the silicon wafer thickness of selecting and judges whether to surpass and changes the single maximum count value.At first, this single maximum count value can show at the corresponding display panel of " single maximum number " button, secondly, change the single maximum count value if surpass, the corresponding display panel of " single maximum number " button can show " exceeding " or other alarms, and prompting reduces the sheet number of weighing.
Described internal signal treating apparatus 10 has comprised that also an accumulative total sheet counts statistic device, and this accumulative total sheet counts statistic device record single count value and addition shows the result at last at " totally sheet number " display panel." accumulative total " reaches " stopping accumulative total " button for the switching between single counting and the stored count.
At first, select and display device 14, silicon chip specification selecting arrangement 17 at silicon wafer thickness, the silicon chip of on the die size selecting arrangement 15 needs being weighed makes a choice, secondly, described internal signal treating apparatus relies on weighing device, silicon area calculation element, silicon chip volume calculation element, silicon chip sheet to count calculation element to process and calculate silicon chip sheet number and show at " sheet number " display panel at last.
If select " accumulative total " button of described input and display panel 5, then described accumulative total sheet is counted statistic device work, the counting of can repeatedly weighing, described accumulative total sheet counts statistic device record single count value and addition shows the result at last at " sheet number " display panel, if select " stopping accumulative total " button, then described accumulative total sheet is counted statistic device and is quit work.
Principle of the present invention mainly is based on the inherent characteristic of monocrystalline silicon density and weight conversion.General silicon chip has the shape of formulation, such as disk, square sheet, single reference surface, double reference surface etc.Silicon chip can be regarded the regular circle cylinder as, that is, as long as know silicon wafer thickness, diameter dimension, shape can transform the quantity that obtains silicon chip by weight.Formula is as follows:
nρv＝nρsh＝m
N=m/ ρ sh(wherein n is silicon chip sheet number, and ρ is that monocrystalline silicon density s is silicon area, and h is silicon wafer thickness, and m is the weight of weighing.）
Can find out from upper formula, just can weigh and carry out the conversion of sheet number as long as silicon chip diameter dimension and thickness have better consistance.
Counting principle of the present invention is as follows:
1, designs silicon wafer thickness gear inputting interface, and can calculate single maximum count amount.5 microns one grade of silicon wafer thickness, the once metering that the different-thickness silicon chip at first is set in software is rolled off the production line, and prevents that the sheet number that test error causes is inaccurate, when namely weighing, rolls off the production line weight less than single silicon chip weight on the same shelves thickness silicon chip.Suppose that certain gear silicon chip is in (h2-h1=5 and h1＜h2), it is n that the sheet of this specification of single weighing is counted maximum number, and then n＜h1/ (h2-h1)=h1/5(n is integer) between h1～h2.Single maximum count such as 295-300 micron thickness shelves is that 58pcs is each.
2, have diameter dimension input, specification, area computing function.Can input by diameter dimension, specification selects to calculate silicon area s, it is m that electronic balance obtains weight.Counting principle m/ ρ sh1＜n＜m/ ρ sh2, n＜h1/5(n is integer), satisfy simultaneously above condition and obtain counting n.
3, sheet is counted statistical function, has designed sheet and count statistical function in software, has the single counting, stored count, directly function of weighing.If single sheet number surpasses range, then show " no to scale " prompting, to remind and reduce several pieces numbers of single poidometer, the counting of weighing for the first time is n1, is n2 for the second time, is n3 for the third time.Count sheet and count n=n1+n2+n3.Have simultaneously Protection Counter Functions, can again add up.
Electronic balance of the present invention has the AC power input port, can directly connect the 220v AC power and use; In addition, electronic balance of the present invention has been equipped with accumulator as the off-line power supply, guarantees the convenience that device shifts and uses in the use procedure.
Apparatus of the present invention also possess the Presentation Function of weighing, and can separately as weighing use, increase the diversity of functions of the equipments.
The actual use of the present invention step: (with 285-290,3 cun circular silicon chips, 211pcs wait acknowledge.According to principle, single maximum count n=56.)
1. the device for opening switch is placed on the basket that holds silicon chip on the balance.
2. to be shown stable, click peeling.
3. the verification counterweight is placed on the basket, it is consistent with the counterweight sign to confirm that weight shows.
4. input silicon wafer thickness 285-290, and selection " 3 cun ", " disk ".
5. silicon chip to be counted is put into basket in batches, and click " accumulative total ".
6. if it is too much once to put into slice, thin piece, then can shows " exceeding ", and be not counted in accumulative total sheet number.
7. repeat the 5-6 step and can obtain final total sheet number.Obtain respectively " exceeding ", " 56 ", " 55 ", " exceeding ", " 55 ", " 45 ".
8. " accumulative total sheet number " shows 211pcs; " cumulative number " shows 4 times.
9. by " stopping accumulative total ", can stop accumulative total.
OQC, N14, the 295-300 micron, 501pcs, disk, every 50pcs interval 1pcs filter paper, it is 51pcs that 1 cutter silicon chip is wherein arranged, and inspection sheet number is examined use apparatus of the present invention entirely eventually, and inspection requires 500pcs/ box, 50pcs/ cutter eventually.
The check situation is as follows:
| Testing time | Weight (g) | Sheet number (pcs) | |
| 1 | 272.5 | 50 | |
| 2 | 273.3 | 50 | |
| 3 | 272.8 | 50 | |
| 4 | 277.5 | 51 | Unusually |
| 5 | 273.1 | 50 | |
| 6 | 272.6 | 50 | |
| 7 | 272.5 | 50 | |
| 8 | 273.3 | 50 | |
| 9 | 273.4 | 50 | |
| 10 | 272.8 | 50 | Normally |
5 cun single reference surface, asymmetric chamfering silicon chip, thickness 525-530 micron.The sheet number is unknown, uses apparatus of the present invention and method to carry out the sheet number and calculates.
1. roll off the production line on the input thickness, obtain single maximum count value n=104pcs.
2. select size " 5 cun ", " single reference surface ", and count by " accumulative total ".
3. count several times, be respectively altogether 253pcs of " 52 ", " 46 ", " 68 ", " 42 ", " 45 ".
4. adopt artificial several pieces modes to check, be 253pcs, the result is consistent with piece counting apparatus.
Claims (8)
1. automatically count sheet devices based on the silicon chip of electronic balance, comprise electronic balance, described electronic balance comprises input and display panel (5), be provided with internal signal treating apparatus (10) in the electronic balance, it is characterized in that: described input and display panel (5) are provided with numerical value input media (13), silicon wafer thickness is selected and display device (14), silicon chip specification selecting arrangement (17), die size selecting arrangement (15), metering device displaying result (11), described metering device displaying result (11) is provided with " weight " display panel, " sheet number " display panel, described internal signal treating apparatus is according to numerical value input media (13), silicon wafer thickness is selected and display device (14), the input of silicon chip specification selecting arrangement (17) and die size selecting arrangement (15) is processed and is shown silicon chip weight and sheet number metering result at " weight " display panel and " sheet number " display panel.
2. silicon chip according to claim 1 is counted sheet devices automatically, it is characterized in that: also be provided with " accumulative total sheet number " display panel and " cumulative number " display panel on the described metering device displaying result (11).
3. silicon chip according to claim 2 is counted sheet devices automatically, it is characterized in that: described silicon wafer thickness is selected and display device is provided with " thickness is reached the standard grade " button, " thickness rolls off the production line " button, " single maximum number " button, and corresponding " thickness is reached the standard grade " button, " thickness rolls off the production line " button, " single maximum number " button are respectively equipped with display panel.
4. silicon chip according to claim 3 is counted sheet devices automatically, it is characterized in that: described silicon chip specification selecting arrangement comprises " disk " button, " single reference surface " button, " double reference surface " button and " square sheet " button.
5. silicon chip according to claim 4 is counted sheet devices automatically, it is characterized in that: described die size selecting arrangement comprises " 3 cun " button, " 4 cun " button, " 5 cun " button, " 6 cun " button.
6. silicon chip according to claim 5 is counted sheet devices automatically, it is characterized in that: described internal signal treating apparatus comprises weighing device, the silicon area calculation element, silicon chip volume calculation element, the silicon chip sheet is counted calculation element, the silicon area calculation element calculates silicon area according to die size and specification, silicon chip volume calculation element calculates the weight of single silicon chip according to silicon area and silicon wafer thickness, and sheet counts that calculation element calculates the silicon chip gross weight that obtains according to weighing device and the weighing scale of single silicon chip is calculated silicon chip sheet number and finally shown silicon chip weight and sheet number metering result at " weight " display panel and " sheet number " display panel.
7. silicon chip according to claim 6 is counted sheet devices automatically, it is characterized in that: described internal signal treating apparatus also is provided with single maximum count calculation element, and this single maximum count calculation element calculates the single maximum count value according to the silicon wafer thickness of selecting and judges whether to surpass this single maximum count value.
8. silicon chip according to claim 7 is counted sheet devices automatically, it is characterized in that: described internal signal treating apparatus also comprised one accumulative total sheet count statistic device, this adds up, and sheet is counted statistic device record single count value and addition shows the result at last at metering device displaying result (11), and described input and display panel (5) are provided with " accumulative total " button and " stopping to add up " button is used for the switching between single counting and the stored count.
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Cited By (4)
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| CN104215313A (en) * | 2014-09-11 | 2014-12-17 | 珠海格力电器股份有限公司 | Device and system for automatically counting standard work-pieces of air conditioner |
| CN104457943A (en) * | 2014-12-18 | 2015-03-25 | 常熟市意欧仪器仪表有限公司 | Electronic balance with recording function |
| CN108268930A (en) * | 2018-01-31 | 2018-07-10 | 华北理工大学 | Bar is weighed counter and method of counting of weighing |
| CN109145398A (en) * | 2018-07-30 | 2019-01-04 | 白杨 | A kind of item quantity calculation method based on weighing |
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