CN202869626U - Silicon chip automatic counting device based on electronic balance - Google Patents
Silicon chip automatic counting device based on electronic balance Download PDFInfo
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- CN202869626U CN202869626U CN 201220522905 CN201220522905U CN202869626U CN 202869626 U CN202869626 U CN 202869626U CN 201220522905 CN201220522905 CN 201220522905 CN 201220522905 U CN201220522905 U CN 201220522905U CN 202869626 U CN202869626 U CN 202869626U
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 97
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 97
- 239000010703 silicon Substances 0.000 title claims abstract description 97
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 230000001186 cumulative effect Effects 0.000 claims description 4
- 238000012545 processing Methods 0.000 abstract description 7
- 230000000704 physical effect Effects 0.000 abstract 1
- 238000005303 weighing Methods 0.000 description 14
- 238000004364 calculation method Methods 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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Abstract
The utility model discloses a silicon chip automatic counting device based on an electronic balance. The silicon chip automatic counting device based on the electronic balance comprises the electronic balance. The electronic balance comprises an input and display panel. The electronic balance is internally provided with an internal signal processing device. A numerical value input device, a silicon chip thickness selection and display device, a silicon chip specification selection device, a silicon chip size selection device, and a counting result display device are arranged on the input and display panel. Information is inputted into the input and display panel and is processed by the internal signal processing device, and then the silicon chip counting result is displayed. The silicon chip automatic counting device is developed based on the ordinary electronic balance, mainly uses the inherent physical properties between weight and density to realize the chip counting, can highly effectively realize the silicon chip counting, and has the advantages of convenience, practicality and low cost.
Description
Technical field
The utility model belongs to integrated circuit to be supported industry semi-conductor silicon chip processing and manufacturing field and is particularly related to a kind of silicon chip based on electronic balance and automatically counts sheet devices, is applicable to the semi-conductor silicon chip counting of weighing.
Background technology
The semi-conductor silicon chip manufacturing belongs to integrated circuit and supports industry, all the time, all be to support industry and strategic new industry as emphasis, and the sheet number of semi-conductor silicon chip statistics, add up to by artificial spot film for a long time and finish, artificial spot film inevitably can produce error in data, and this produces extremely rigorous field at semicon industry, and sheet miscounts mistake greatly affects image product; Also review for production data and have a negative impact; In addition, artificial spot film also can increase the silicon chip surface scratch, increases the check loss.
Photovoltaic industry is fast-developing in recent years industry, and its emphasis base material-silicon chip of solar cell is because relating to production line circulation etc., and each link all needs to add up to the sheet number, and sheet number statistics the earliest also is to adopt artificial spot film to finish.The spot film machine based on photovoltaic principals also occurs at present, utilized image processing means to carry out sheet number statistics.But this series products is because technology realizes difficulty, and the factors such as cost of development height all have price higher, and it is large to popularize difficulty.
Simultaneously, semi-conductor silicon chip belongs to and is circle, and edge curvature is larger, and optical focal length is difficult to adjust, and edge image is difficult to be gathered or the effective image pixel is few, and image focusing difficulty or effective image are not enough, can't realize counting.In addition, for semi-conductor silicon chip, because conduction type, crystal do not have different reference surface differences simultaneously to equal-specification, sometimes also need carry out reference surface processing according to the client.At present conventional processing is mainly by disk, single reference surface, double reference surface; There are 3 cun, 4 cun, 5 cun, 6 cun, 8 cun, 12 cun according to size; The silicon chip of different size has clear to position and the length of reference surface, and consistance is strong.For the silicon chip that reference surface is arranged, photo-electric spot film machine can't be realized the edge image focusing, can't carry out the sheet number and calculate, in addition, in actual production, also can there be the silicon chip of asymmetric chamfering, in this case, the silicon chip edge shape is asymmetric, and photo-electric spot film machine can't be realized spot film more.Therefore so far, also do not have formal photo-electric spot film machine to be applied to the semi-conductor silicon chip manufacturing, still adopt the Traditional Man spot film in the production.
For silicon chip processing, because product requirement is higher, product all has more consistent thickness and consistent diameter dimension in the general process of manufacture, simultaneously for test silicon wafer resistivity, the thickness of silicon chip need to be carried out first stepping, be generally 5 microns one grade, guarantee that namely consistency of thickness just can carry out resistivity measurement, so just guaranteed the silicon wafer thickness consistance, simultaneously because silicon chip shape and diameter dimension all have good consistance.
In the actual production link, especially OQC link, checking of sheet number is vital, and the Traditional Man spot film can't satisfy the existing high request of producing product quality, and photo-electric spot film machine is used to have in the semi-conductor silicon chip manufacturing industry and can't be avoided the born defective in ground.How to realize that convenience, practical, cheap spot film device and method are the subject matter of puzzlement silicon chip spot film counting.
The utility model content
Technical problem to be solved in the utility model just provides a kind of silicon chip based on electronic balance and automatically counts sheet devices, efficiently realizes silicon chip spot film counting, has conveniently, practical, cheap advantage.
For solving the problems of the technologies described above, the utility model adopts following technical scheme: a kind of silicon chip based on electronic balance is counted sheet devices automatically, comprise electronic balance, described electronic balance comprises input and display panel, be provided with the internal signal treating apparatus in the electronic balance, it is characterized in that: described input and display panel are provided with the numerical value input media, silicon wafer thickness is selected and display device, silicon chip specification selecting arrangement, the die size selecting arrangement, the metering device displaying result, described input and display panel input message also show silicon chip sheet number metering result after the internal signal treating apparatus is processed.
Preferably, described input and display panel are provided with " accumulative total " button and reach " stopping accumulative total " button for the switching between single counting and the stored count.
Preferably, described metering device displaying result is provided with " weight " display panel, " sheet number " display panel, " accumulative total sheet number " display panel and " cumulative number " display panel.
Preferably, described silicon wafer thickness is selected and display device is provided with " thickness is reached the standard grade " button, " thickness rolls off the production line " button, " single maximum number " button, and corresponding " thickness is reached the standard grade " button, " thickness rolls off the production line " button, " single maximum number " button are respectively equipped with display panel.
Preferably, described silicon chip specification selecting arrangement comprises " disk " button, " single reference surface " button, " double reference surface " button and " square sheet " button.
Preferably, described die size selecting arrangement comprises " 3 cun " button, " 4 cun " button, " 5 cun " button, " 6 cun " button.
The utility model is developed based on general electronic balance, utilizes mainly that intrinsic physical characteristics realizes that the sheet number calculates between weight and the density, can efficiently realize silicon chip spot film counting, has conveniently, practical, cheap advantage.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is further described:
Fig. 1 is the utility model external structure synoptic diagram;
Fig. 2 is the utility model inner structure synoptic diagram;
Fig. 3 is input and display panel synoptic diagram;
Fig. 4 is the utility model counting principle synoptic diagram.
Embodiment
As shown in Figures 1 to 4, be specific embodiment of the utility model, at first, the utlity model has the structure of general balance, comprise microscope carrier 1, day flat structure 8, sensor 9, chassis 16, accumulator 7, switch 2, power supply input port 3, internal signal treating apparatus 10, input and display panel 5, level meter 6, horizontal adjustment pin 4.
Different from existing day flat structure is that at first, described input and display panel 5 are provided with numerical value input media 13, silicon wafer thickness selection and display device 14, silicon chip specification selecting arrangement 17, die size selecting arrangement 15, metering device displaying result 11.
Wherein, numerical value input media 13 is identical with the numerical value input panel of conventional balance, and it is used for input thickness numerical value.
Silicon wafer thickness is selected and display device 14 is provided with " thickness is reached the standard grade " button, " thickness rolls off the production line " button, " single maximum number " button, and corresponding " thickness is reached the standard grade " button, " thickness rolls off the production line " button, " single maximum number " button are respectively equipped with display panel.Select " thickness is reached the standard grade " button and " thickness rolls off the production line " button, and the corresponding one-tenth-value thickness 1/10 of input namely can be internal signal treating apparatus 10 thickness parameter is provided in numerical value input media 13, and obtain the single maximum number by internal signal treating apparatus 10, and show at the corresponding display panel of " single maximum number " button.
Silicon chip specification selecting arrangement 17 bags expand " disk " button, " single reference surface " button, " double reference surface " button and " square sheet " button.Die size selecting arrangement 15 comprises " 3 cun " button, " 4 cun " button, " 5 cun " button, " 6 cun " button.The specification of selection silicon chip and the size of silicon chip namely can be the internal signal treating apparatus provides the area calculating parameter.Metering device displaying result 11 is provided with " weight " display panel, " sheet number " display panel, " accumulative total sheet number " display panel and " cumulative number " display panel.Described input and display panel 5 are provided with function key area 12 in metering below the device displaying result 11, and described function key area 12 is provided with peeling ", " accumulative total " reach " stopping totally " button.
Described internal signal treating apparatus comprises weighing device, silicon area calculation element, silicon chip volume calculation element, silicon chip sheet are counted calculation element, the silicon area calculation element calculates silicon area according to die size and specification, silicon chip volume calculation element calculates the weight of single silicon chip according to silicon area and silicon wafer thickness, and sheet is counted weighing scale that calculation element calculates the silicon chip gross weight that obtains and single silicon chip according to weighing device and calculated silicon chip sheet number and show at the metering device displaying result.
Described internal signal treating apparatus also is provided with single maximum count calculation element, and this single maximum count calculation element calculates the single maximum count value according to the silicon wafer thickness of selecting and judges whether to surpass and changes the single maximum count value.At first, this single maximum count value can show at the corresponding display panel of " single maximum number " button, secondly, change the single maximum count value if surpass, the corresponding display panel of " single maximum number " button can show " exceeding " or other alarms, and prompting reduces the sheet number of weighing.
Described internal signal treating apparatus 10 has comprised that also an accumulative total sheet counts statistic device, and this accumulative total sheet counts statistic device record single count value and addition shows the result at last at " totally sheet number " display panel." accumulative total " reaches " stopping accumulative total " button for the switching between single counting and the stored count.
At first, select and display device 14, silicon chip specification selecting arrangement 17 at silicon wafer thickness, the silicon chip of on the die size selecting arrangement 15 needs being weighed makes a choice, secondly, described internal signal treating apparatus relies on weighing device, silicon area calculation element, silicon chip volume calculation element, silicon chip sheet to count calculation element to process and calculate silicon chip sheet number and show at " sheet number " display panel at last.
If select " accumulative total " button of described input and display panel 5, then described accumulative total sheet is counted statistic device work, the counting of can repeatedly weighing, described accumulative total sheet counts statistic device record single count value and addition shows the result at last at " sheet number " display panel, if select " stopping accumulative total " button, then described accumulative total sheet is counted statistic device and is quit work.
Principle of the present utility model mainly is based on the inherent characteristic of monocrystalline silicon density and weight conversion.General silicon chip has the shape of formulation, such as disk, square sheet, single reference surface, double reference surface etc.Silicon chip can be regarded the regular circle cylinder as, that is, as long as know silicon wafer thickness, diameter dimension, shape can transform the quantity that obtains silicon chip by weight.Formula is as follows:
nρν=nρsh=m
N=m/ ρ sh(wherein n is silicon chip sheet number, and ρ is that monocrystalline silicon density s is silicon area, and h is silicon wafer thickness, and m is the weight of weighing.）
Can find out from upper formula, just can weigh and carry out the conversion of sheet number as long as silicon chip diameter dimension and thickness have better consistance.
The utility model counting principle is as follows:
1, designs silicon wafer thickness gear inputting interface, and can calculate single maximum count amount.5 microns one grade of silicon wafer thickness, the once metering that the different-thickness silicon chip at first is set in software is rolled off the production line, and prevents that the sheet number that test error causes is inaccurate, when namely weighing, rolls off the production line weight less than single silicon chip weight on the same shelves thickness silicon chip.Suppose that certain gear silicon chip is in (h2-h1=5 and h1＜h2), it is n that the sheet of this specification of single weighing is counted maximum number, and then n＜h1/ (h2-h1)=h1/5(n is integer) between h1～h2.Single maximum count such as 295-300 micron thickness shelves is that 58pcs is each.
2, have diameter dimension input, specification, area computing function.Can input by diameter dimension, specification selects to calculate silicon area s, it is m that electronic balance obtains weight.Counting principle m/ ρ sh1＜n＜m/ ρ sh2, n＜h1/5(n is integer), satisfy simultaneously above condition and obtain counting n.
3, sheet is counted statistical function, has designed sheet and count statistical function in software, has the single counting, stored count, directly function of weighing.If single sheet number surpasses range, then show " no to scale " prompting, to remind and reduce several pieces numbers of single poidometer, the counting of weighing for the first time is n1, is n2 for the second time, is n3 for the third time.Count sheet and count n=n1+n2+n3.Have simultaneously Protection Counter Functions, can again add up.
Electronic balance of the present utility model has the AC power input port, can directly connect the 220v AC power and use; In addition, electronic balance of the present utility model has been equipped with accumulator as the off-line power supply, guarantees the convenience that device shifts and uses in the use procedure.
The utility model device also possesses the Presentation Function of weighing, and can separately as weighing use, increase the diversity of functions of the equipments.
The actual use of the utility model step: (with 285-290,3 cun circular silicon chips, 211pcs wait acknowledge.According to principle, single maximum count n=56.)
1. the device for opening switch is placed on the basket that holds silicon chip on the balance.
2. to be shown stable, click peeling.
3. the verification counterweight is placed on the basket, it is consistent with the counterweight sign to confirm that weight shows.
4. input silicon wafer thickness 285-290, and selection " 3 cun ", " disk ".
5. silicon chip to be counted is put into basket in batches, and click " accumulative total ".
6. if it is too much once to put into slice, thin piece, then can shows " exceeding ", and be not counted in accumulative total sheet number.
7. repeat the 5-6 step and can obtain final total sheet number.Obtain respectively " exceeding ", " 56 ", " 55 ", " exceeding ", " 55 ", " 45 ".
8. " accumulative total sheet number " shows 211pcs; " cumulative number " shows 4 times.
9. by " stopping accumulative total ", can stop accumulative total.
OQC, N14, the 295-300 micron, 501pcs, disk, every 50pcs interval 1pcs filter paper, it is 51pcs that 1 cutter silicon chip is wherein arranged, and inspection sheet number is entirely examined and is used the utility model device eventually, and inspection requires 500pcs/ box, 50pcs/ cutter eventually.
The check situation is as follows:
| Testing time | Weight (g) | Sheet number (pcs) | |
| 1 | 272.5 | 50 | |
| 2 | 273.3 | 50 | |
| 3 | 272.8 | 50 | |
| 4 | 277.5 | 51 | Unusually |
| 5 | 273.1 | 50 | |
| 6 | 272.6 | 50 | Normally |
| 7 | 272.5 | 50 | |
| 8 | 273.3 | 50 | |
| 9 | 273.4 | 50 | |
| 10 | 272.8 | 50 | Normally |
5 cun single reference surface, asymmetric chamfering silicon chip, thickness 525-530 micron.The sheet number is unknown, uses the utility model device and method to carry out the sheet number and calculates.
1. roll off the production line on the input thickness, obtain single maximum count value n=104pcs.
2. select size " 5 cun ", " single reference surface ", and count by " accumulative total ".
3. count several times, be respectively altogether 253pcs of " 52 ", " 46 ", " 68 ", " 42 ", " 45 ".
4. adopt artificial several pieces modes to check, be 253pcs, the result is consistent with piece counting apparatus.
Claims (6)
1. the silicon chip based on electronic balance is counted sheet devices automatically, comprise electronic balance, described electronic balance comprises input and display panel (5), be provided with the internal signal treating apparatus in the electronic balance, it is characterized in that: described input and display panel (5) are provided with numerical value input media (13), silicon wafer thickness is selected and display device (14), silicon chip specification selecting arrangement (17), die size selecting arrangement (15), metering device displaying result (11), described internal signal treating apparatus calculate according to the input of input and display panel (5) and show that silicon chip sheet number measures the result.
2. silicon chip according to claim 1 is counted sheet devices automatically, it is characterized in that: described input and display panel (5) are provided with " accumulative total " button and " stopping to add up " button is used for the switching between single counting and the stored count.
3. silicon chip according to claim 2 is counted sheet devices automatically, it is characterized in that: described metering device displaying result (11) is provided with " weight " display panel, " sheet number " display panel, " accumulative total sheet number " display panel and " cumulative number " display panel.
4. silicon chip according to claim 1 is counted sheet devices automatically, it is characterized in that: described silicon wafer thickness is selected and display device is provided with " thickness is reached the standard grade " button, " thickness rolls off the production line " button, " single maximum number " button, and corresponding " thickness is reached the standard grade " button, " thickness rolls off the production line " button, " single maximum number " button are respectively equipped with display panel.
5. silicon chip according to claim 1 is counted sheet devices automatically, it is characterized in that: described silicon chip specification selecting arrangement comprises " disk " button, " single reference surface " button, " double reference surface " button and " square sheet " button.
6. silicon chip according to claim 1 is counted sheet devices automatically, it is characterized in that: described die size selecting arrangement comprises " 3 cun " button, " 4 cun " button, " 5 cun " button, " 6 cun " button.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220522905 CN202869626U (en) | 2012-10-12 | 2012-10-12 | Silicon chip automatic counting device based on electronic balance |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220522905 CN202869626U (en) | 2012-10-12 | 2012-10-12 | Silicon chip automatic counting device based on electronic balance |
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| CN202869626U true CN202869626U (en) | 2013-04-10 |
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| CN 201220522905 Expired - Fee Related CN202869626U (en) | 2012-10-12 | 2012-10-12 | Silicon chip automatic counting device based on electronic balance |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103033247A (en) * | 2012-10-12 | 2013-04-10 | 孙新利 | Silicon slice automatic slice counting device based on electronic balance |
| CN104457943A (en) * | 2014-12-18 | 2015-03-25 | 常熟市意欧仪器仪表有限公司 | Electronic balance with recording function |
-
2012
- 2012-10-12 CN CN 201220522905 patent/CN202869626U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103033247A (en) * | 2012-10-12 | 2013-04-10 | 孙新利 | Silicon slice automatic slice counting device based on electronic balance |
| CN103033247B (en) * | 2012-10-12 | 2014-11-12 | 浙江长兴众成电子有限公司 | Silicon slice automatic slice counting device based on electronic balance |
| CN104457943A (en) * | 2014-12-18 | 2015-03-25 | 常熟市意欧仪器仪表有限公司 | Electronic balance with recording function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ZHEJIANG COWIN ELECTRONICS CO., LTD. Free format text: FORMER OWNER: SUN XINLI Effective date: 20130716 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 313199 HUZHOU, ZHEJIANG PROVINCE TO: 313100 HUZHOU, ZHEJIANG PROVINCE |
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| TR01 | Transfer of patent right |
Effective date of registration: 20130716 Address after: 313100, No. 1299, front East Street, Changxing County Economic Development Zone, Zhejiang, Huzhou Patentee after: Zhejiang Cowin Electronics Co., Ltd. Address before: 313199 Zhejiang city of Huzhou province Changxing County City Lijing Building 2 pheasant town 41 unit 102 room Patentee before: Sun Xinli |
|
| C56 | Change in the name or address of the patentee |
Owner name: ZHEJIANG ZHONGJING TECHNOLOGY CO., LTD. Free format text: FORMER NAME: ZHEJIANG COWIN ELECTRONICS CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 313100, No. 1299, front East Street, Changxing County Economic Development Zone, Zhejiang, Huzhou Patentee after: ZHEJIANG ZHONGJING TECHNOLOGY CO., LTD. Address before: 313100, No. 1299, front East Street, Changxing County Economic Development Zone, Zhejiang, Huzhou Patentee before: Zhejiang Cowin Electronics Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130410 Termination date: 20151012 |
|
| EXPY | Termination of patent right or utility model |