CN102916092B - The device and method of detection and classification wafer - Google Patents
The device and method of detection and classification wafer Download PDFInfo
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- CN102916092B CN102916092B CN201110355513.0A CN201110355513A CN102916092B CN 102916092 B CN102916092 B CN 102916092B CN 201110355513 A CN201110355513 A CN 201110355513A CN 102916092 B CN102916092 B CN 102916092B
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Abstract
The present invention be a kind of in order to detect and classification wafer apparatus and method, this device comprises multiple card casket, a supply unit and a detecting unit.These card caskets are arranged at a district to be measured and respectively and measure district, and in order to carry these LED wafer.These LED wafer are moved to a detection zone from district to be measured by supply unit, and detecting unit is arranged in detection zone, to detect these LED wafer moving to detection zone.These LED wafer are after detection completes, and supply unit detects data according to after detection, these LED wafer moved to these card caskets measuring district.
Description
Technical field
The invention relates to a kind of device and method detecting LED wafer.Specifically, be about a kind of can in order to fast detecting and LED wafer of classifying checkout gear and detection method.
Background technology
Industry development in science and technology emphasis of new generation can have been become due to green, therefore every can in order to reduce electrical expenses, there is the product increasing computing or energy conversion effect simultaneously, all can be subject to the attention of industry and consumption group certain degree, and in green energy industry of many new generations, everybody attracting attention is subject to most again with the light-emitting diode (lightemittingdiode, LED) having low-power consumption and high brightness concurrently simultaneously.
LED is a kind of solid state light emitter, its field of applying, and except existing illumination market, proportion the best part is the backlight module being LCD TV and monitor in fact.Furthermore, because the volume of LED is small many compared with traditional tube, and all traditional tube is better than on brightness performance, useful life and power supply power consumption, thus cause information industry to produce tight demand to LED solid state light emitter, and also pay attention in relevant production capacity and yield jointly more.
For reducing encapsulation defect and promoting overall yield, LED wafer, before segmentation and encapsulation, first can detect for each wafer units in LED wafer, then carry out follow-up packaging operation.In the manually-operated detection mode of existing employing, be utilize manual type to be loaded in optical detecting instrument by LED wafer, to complete the detection of LED wafer unit.But, because this kind of detection mainly differentiates according to artificial mode, therefore consider detection speed and cross slow and cost of labor and cross high factor, mostly adopt the mode of sampling Detection to carry out in the later stage, thus, not only be helpless to the yield improving LED wafer, detection speed also still cannot effectively promote.
In addition, in prior art, still there is a kind of checkout gear utilizing automation equipment to carry out LED wafer detection, it can utilize mechanical arm the multiple LED wafer be arranged in the card casket in district to be measured to be delivered in optical detecting instrument and detect, then according to testing result, these LED wafer are transferred in the card casket in former district to be measured or are positioned at another and measure the card casket in district, and reach and utilize Aulomatizeted Detect to improve detection speed, reduce the object of testing cost simultaneously.
The aforementioned mode utilizing automation equipment to carry out LED wafer detection, though can in order to improve detection speed and to reduce testing cost, but measure the LED wafer of gained, only can be categorized as non-defective unit and defective products roughly, if further differentiation will be done for these non-defective units and defective products, just repeat aforesaid testing process again, this is the way of non-economy really.Further, along with the improvement of detection technique, when optical detecting instrument more promptly can carry out the testing process of LED wafer, instead the hardware setting of current used automation equipment can delay the detection speed of LED wafer.
In view of this, the non-defective unit of LED wafer of how classifying further and defective products, detect in time-histories in unit provides the LED wafer of greater number to give optical detecting instrument simultaneously, and to reach the device and method of classification and fast detecting LED wafer, this is this industry problem demanding prompt solution.
Summary of the invention
The object of the present invention is to provide a kind of apparatus and method detecting and classify wafer, with fast detecting and classification LED wafer.
For reaching above-mentioned purpose, the device of detection according to an aspect of the present invention and classification wafer, in order to detect and multiple LED wafer of classifying, this device comprises:
Multiple card casket, is arranged at a district to be measured and respectively and measures in district, in order to carry these LED wafer;
One supply unit, moves these LED wafer from these card caskets in this district to be measured; And
One detecting unit, is arranged in a detection zone, to receive from this supply unit and to detect these LED wafer;
Wherein, this supply unit by these LED wafer after these card caskets in this district to be measured move to this detection zone, this detecting unit carries out a detection operation for these LED wafer, these LED wafer, then according to the testing result that this detection operation obtains, move in these card caskets in this mensuration district by this supply unit.
The method of detection according to a further aspect of the invention and classification wafer, for detecting and multiple LED wafer of classifying, the method comprises the following step:
A these LED wafer are arranged at a district to be measured by ();
B these LED wafer are moved to a detection zone from this district to be measured by ();
C () carries out a detection operation to these LED wafer; And
D these LED wafer, according to the testing result measured by this detection operation, are moved to a mensuration district by ().
The invention has the beneficial effects as follows: at setting at least three card caskets after the mechanical arm coordinating supply unit to have, can in single testing process, complete detection operation and the sort program of LED wafer simultaneously, thus improve passing detection speed and cross slow and the disappearance of precise classification cannot be carried out, and shorten the stand-by period needed for detecting further.
Accompanying drawing explanation
Fig. 1 is the stereogram of checkout gear of the present invention;
Fig. 2 is the vertical view of checkout gear of the present invention;
Fig. 3 A is the card casket schematic diagram of checkout gear of the present invention;
Fig. 3 B is the schematic diagram that the card casket of Fig. 3 A carries multiple wafer; And
Fig. 4 is the flow chart of detection method of the present invention.
Main element symbol description
100 checkout gears
110 card caskets
111 wafer slots
120 supply units
121 first time arm
122 second time arms
130 detecting units
140 positioning units
150 buckle elements
200LED wafer
310 districts to be measured
320 measure district
321 non-defective unit districts
322 defective products districts
330 detection zones
340 positioning areas
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, below in conjunction with accompanying drawing, the specific embodiment of the present invention is elaborated.First it should be noted that, the present invention is not limited to following embodiment, and the spirit that those skilled in the art should embody from following execution mode is to understand the present invention, and each technical term can do the most wide in range understanding based on Spirit Essence of the present invention.In figure, same or analogous component uses the same reference numerals to represent.
As shown in Figures 1 and 2, checkout gear 100 of the present invention comprises multiple card casket 110, supply unit 120, detecting unit 130 and locating unit 140, and multiple card casket 110, detecting unit 130 and positioning unit 140 are with supply unit 120 for the center of circle, ring-type is arranged at the outside of supply unit 120.
As shown in the figure, in the present embodiment, multiple card casket 110 is preferably has five card caskets, and the district 310 and to be measured be arranged at respectively in checkout gear 100 measures district 320, in addition, positioning area 340 and a detection zone 330 is also provided with, to position and trace routine for multiple LED wafer 200 respectively in checkout gear 100.Specifically, in the present embodiment, be provided with three card caskets 110 in district 310 to be measured, it, in order to carry multiple LED wafer 200 to be detected, measures in district 320 and is then provided with two card caskets 110, and it detects complete multiple LED wafer 200 in order to carrying.
When detection operation for carrying out multiple LED wafer 200, first multiple LED wafer 200 in the three card caskets 110 in district 310 to be measured, sequentially can move in the positioning unit 140 being arranged at positioning area 340 and positions program by supply unit 120.And then, the LED wafer 200 of having located can be moved to the detecting unit 130 being arranged in detection zone 330, to carry out a detection operation by supply unit 120.Finally, supply unit 120 is just according to the testing result detecting operation gained, such as impurity, size, density, aberration, slight crack etc. data, judge whether LED wafer 200 is non-defective unit, and LED wafer 200 is placed in measures in a non-defective unit district 321 in district 320 or a defective products district 322 accordingly.
Because aforesaid detecting unit 130 is existing common equipments, a display unit (scheming not shown) and an input unit (scheming not shown) can be comprised, for user's instant preview or adjustment examination criteria, therefore seldom repeat in this.
Should be noted that, though aforesaid embodiment only discloses district 310 to be measured be provided with three card caskets 110, and measure the aspect that district 320 is provided with two card caskets 110, its set-up mode and quantity is not as limit.Such as, (scheme not shown) in another embodiment, the non-defective unit district 321 measuring district 320 can be further subdivided into a superfine district and excellent district, and be respectively arranged with a card casket 110, simultaneously, also defective products district 322 can be subdivided into further a recyclable district and a significant deficiency district, and a card casket 110 is set respectively, the district to be measured 310 of this embodiment is made to have three card caskets 110 and measure the aspect that district 320 has four card caskets 110 (namely having seven card caskets 110 altogether), with these LED wafer 200 of flexibly classifying.In the present invention, multiple card caskets 110 that checkout gear 100 has need be at least three card caskets 110, to be arranged at district 310 to be measured respectively, to measure the non-defective unit district 321 in district 320, and measure in the defective products district 322 in district 320, just carried out detection and the sorting operations of multiple LED wafer 200 accurately.
In the present embodiment, supply unit 120 is preferably a mechanical arm, and can comprise further one first time an arm 121 and second time arm 122.Thus, when first time arm 121 LED wafer 200 sent into carry out trace routine in the detecting unit 130 of detection zone 330 time, the positioning unit 140 that lower a slice moves to positioning area 340 for the LED wafer 200 detected in district 310 to be measured can be positioned program by second time arm 122, and after first time arm 121 Autonomous test district 330 shifts out the LED wafer 200 of anter, send into second LED wafer 200 at once and carry out trace routine.By this, checkout gear 100 of the present invention can reduce the empty window time of detecting unit 130 effectively, and improve overall detection rates.Certainly, user also can according to the detection speed of detecting unit 130, and the setting position of adjustment supply unit 120 and the quantity of arm had, do not limited in this.
In addition, in the embodiment shown in Fig. 1 and Fig. 2, though multiple card casket 110, detecting unit 130 and positioning unit 140 are centered by supply unit 120, ring-type is arranged at the periphery of supply unit 120, not as limit.Such as, multiple card casket 110 mode of linear array can also be arranged at the opposite side of detecting unit 130 relative to supply unit 120, and reach and multiple LED wafer 200 is orderly sent to positioning unit 140 and detecting unit 130, with the object positioning and detect.
As shown in Fig. 3 A and Fig. 3 B; multiple card caskets 110 of the present embodiment also can have multiple wafer slots 111 respectively; it is in order to carrying and protect multiple LED wafer 200; thus; by the setting of multiple card casket 110; user not only can transport these LED wafer 200 more expediently, and effectively can reduce the injury of external force collision to these LED wafer 200.
In addition, please again consult Fig. 1 and Fig. 2, multiple card casket 110 also respectively can comprise a buckle element 150, with firm multiple card casket 110.Further, buckle element 150 can have an inductor (scheming not shown) further, to detect and to guarantee that multiple card casket 110 is firmly arranged at district 310 to be measured and measures in district 320.
Fig. 4 is the overhaul flow chart of checkout gear 100 of the present invention.First, as shown in step 401, sequentially multiple LED wafer 200 is arranged in district 310 to be measured.Then as shown in step 402, utilize supply unit 120 that LED wafer 200 is delivered to positioning area 340, and as shown in step 403, after using positioning unit 140 LED wafer 200 to be positioned, as indicated by a step 404, utilize supply unit 120 to be moved in detection zone 330 in self-align for LED wafer 200 district 340, and as shown at 405, carry out detection operation for LED wafer 200.Afterwards, as shown at step 406, according to the testing result detecting operation gained, judge whether LED wafer 200 is non-defective unit.If testing result is "Yes", then as shown in step 407, supply unit 120 is utilized LED wafer 200 to be moved in the non-defective unit district 321 in mensuration district 320.On the contrary, if testing result is "No", then as denoted in step 408, supply unit 120 is utilized LED wafer 200 to be moved in the defective products district 322 in mensuration district 320.Like this, by the setting of checkout gear 100 of the present invention, this testing process while carrying out detecting, can complete follow-up thin portion classifying step in the lump, and reaches the object of fast detecting and effectively classification.
In sum, the present invention is in order to the checkout gear of fast detecting and multiple LED wafer of classifying, arrange at least three card caskets and coordinate supply unit to have first time arm and second time arm after, to be able in single testing process, complete detection operation and the sort program of LED wafer simultaneously, thus improve passing detection speed and cross slow and the disappearance of precise classification cannot be carried out, and shorten the stand-by period needed for detecting further.
The above embodiments are only used for exemplifying enforcement aspect of the present invention, and explain technical characteristic of the present invention, are not used for limiting protection category of the present invention.Anyly be familiar with this operator and the arrangement of unlabored change or isotropism can all belong to the scope that the present invention advocates, the scope of the present invention should be as the criterion with claim.
Claims (7)
1. a device for detection and classification wafer, in order to detect and multiple LED wafer of classifying, is characterized in that, comprise:
Multiple card casket, is arranged at a district to be measured and respectively and measures in district, in order to carry these LED wafer;
One supply unit, moves these LED wafer from these card caskets in this district to be measured;
One detecting unit, is arranged in a detection zone, to receive from this supply unit and to detect these LED wafer; And
Locating unit, is arranged at a positioning area, to locate these LED wafer;
Wherein, this mensuration district comprises a non-defective unit district and a defective products district, this supply unit by these LED wafer after these card caskets in this district to be measured move to this detection zone, this detecting unit carries out a detection operation for these LED wafer, this supply unit is then according to the testing result that this detection operation obtains, these LED wafer are moved in these card caskets in this mensuration district and detect these complete LED wafer to carry, and these card caskets, this detecting unit and this positioning unit are centered by this supply unit, ring-type is arranged at the outside of this supply unit.
2. the device detecting and classify wafer as claimed in claim 1, it is characterized in that, this supply unit is a mechanical arm.
3. as claimed in claim 2 to detect and the device of classification wafer, it is characterized in that, this mechanical arm have one first time an arm and second time arm.
4. the device detecting and classify wafer as claimed in claim 1, it is characterized in that, these card caskets are at least three card caskets, and are arranged at this district to be measured, this non-defective unit district and this defective products district respectively.
5. the device detecting and classify wafer as claimed in claim 1, is characterized in that, also comprise multiple buckle element, be arranged in this district to be measured and this mensuration district respectively, to fix these card caskets.
6. a method for detection and classification wafer, be used in the device detecting and classify chip as claimed in claim 1, for detection and multiple LED wafer of classifying, it is characterized in that, the method comprises the following step:
A these LED wafer are arranged at a district to be measured by ();
B these LED wafer are moved to a detection zone from this district to be measured by ();
C () carries out a detection operation to these LED wafer; And
D these LED wafer, according to the testing result measured by this detection operation, are moved to a mensuration district and detect these complete LED wafer to carry by ();
Wherein, this mensuration district comprises a non-defective unit district and a defective products district.
7. method as claimed in claim 6, it is characterized in that, step (b) also comprises:
(b1) these LED wafer are moved to a positioning area from this district to be measured;
(b2) these LED wafer are located; And
(b3) these LED wafer are moved to this detection zone from this positioning area.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161514955P | 2011-08-04 | 2011-08-04 | |
| US61/514,955 | 2011-08-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102916092A CN102916092A (en) | 2013-02-06 |
| CN102916092B true CN102916092B (en) | 2015-12-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110355513.0A Active CN102916092B (en) | 2011-08-04 | 2011-11-10 | The device and method of detection and classification wafer |
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| Country | Link |
|---|---|
| CN (1) | CN102916092B (en) |
| TW (1) | TWI579939B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI507677B (en) * | 2013-04-18 | 2015-11-11 | Cheng Mei Instr Technology Co Ltd | Assembly and method for testing and classifying led wafers |
| TWI534937B (en) * | 2013-09-09 | 2016-05-21 | 政美應用股份有限公司 | Assembly and method for algining wafers |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1294410A (en) * | 1999-10-26 | 2001-05-09 | 日本电气株式会社 | Semiconductor mfg. appts. |
| CN1481577A (en) * | 2000-11-29 | 2004-03-10 | ���������ƴ���ʽ���� | Reduced edge contac wafer handling system and method of retrofitting and using same |
| CN1515479A (en) * | 2003-01-06 | 2004-07-28 | 昶�科技股份有限公司 | Wafer transferring equipment |
| CN1707764A (en) * | 2004-10-11 | 2005-12-14 | 资重兴 | Method for testing wafer packaging |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11121579A (en) * | 1997-10-08 | 1999-04-30 | Mecs Corp | Carriage system for semiconductor wafer |
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2011
- 2011-11-07 TW TW100140456A patent/TWI579939B/en active
- 2011-11-10 CN CN201110355513.0A patent/CN102916092B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1294410A (en) * | 1999-10-26 | 2001-05-09 | 日本电气株式会社 | Semiconductor mfg. appts. |
| CN1481577A (en) * | 2000-11-29 | 2004-03-10 | ���������ƴ���ʽ���� | Reduced edge contac wafer handling system and method of retrofitting and using same |
| CN1515479A (en) * | 2003-01-06 | 2004-07-28 | 昶�科技股份有限公司 | Wafer transferring equipment |
| CN1707764A (en) * | 2004-10-11 | 2005-12-14 | 资重兴 | Method for testing wafer packaging |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201308460A (en) | 2013-02-16 |
| CN102916092A (en) | 2013-02-06 |
| TWI579939B (en) | 2017-04-21 |
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