CN102680322A - Silicon wafer detector - Google Patents
Silicon wafer detector Download PDFInfo
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- CN102680322A CN102680322A CN2012101648563A CN201210164856A CN102680322A CN 102680322 A CN102680322 A CN 102680322A CN 2012101648563 A CN2012101648563 A CN 2012101648563A CN 201210164856 A CN201210164856 A CN 201210164856A CN 102680322 A CN102680322 A CN 102680322A
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Abstract
The invention discloses a silicon wafer detector which comprises a support, a dial indicator and weights. The support is provided with a supporting part with a horizontal supporting surface, and the supporting part supports the periphery of a silicon wafer to be detected; positioning parts are arranged on the outer side of the supporting part, the inner sides of the positioning parts contact with the silicon wafer to be detected, and each edge of the silicon wafer to be detected contacts with at least one positioning part; the dial indicator is positioned in the support, and a center line of a pointer of the dial indicator penetrates through the geometrical center of the silicon wafer to be detected; and the weights can be combined into a preset weight and are placed in the center of the silicon wafer to be detected. When the silicon wafer detector detects the silicon wafer, the silicon wafer is placed on the supporting part and positioned by the positioning parts, a contact of the dial indicator is abutted to the center of the silicon wafer, the dial indicator is set to zero, and the weights with the preset weight are placed in the center of the silicon wafer, at the moment, the reading of the dial indicator can reflect actual deformation of the center of the silicon wafer, and if the actual deformation is larger than the minimum value of qualified deformation, the silicon wafer is qualified. The silicon wafer detector is simple in structure and convenient to operate, and is more applicable to production lines as compared with the prior art.
Description
Technical field
The present invention relates to the silicon chip detection range, particularly relate to a kind of silicon chip detector.
Background technology
Silicon is a kind of nonmetal semiconductor material, is the main raw material(s) of solar battery sheet, also is used to make semiconductor devices and integrated circuit.Along with the development of photovoltaic industry, the silicon wafer thickness that is used for manufacturing solar cells is more and more thinner, and is also increasingly high to the requirement of its mechanical and physical performance.
Silicon chip is obtained by the silicon ingot cutting usually; Silicon ingot is anticipated to solidifying by silicon and is formed, and usually the silicon material is melted in ingot furnace, generates silicon ingot through series of processes; And then use broken ingot machine that silicon ingot is carried out cutting processing to obtain silico briquette, use slicing machines that silico briquette is carried out slice processing at last and obtain silicon chip.
The silicon ingot that different processes is produced, mechanical property is different, and inner stress distribution is also inequality; If silicon ingot inside exists stress to concentrate; When silicon ingot processing became silicon chip, the silicon chip toughness that silicon ingot stress concentrates bigger position to cut into was relatively poor, in the following process to silicon chip; The relatively poor silicon chip of toughness is easy to fragmentation, thereby influences following process.
So, before the further processing of silicon chip, the mechanical property of silicon chip is detected, pick out underproof silicon chip, reduced silicon chip broken probability in following process.
A kind of device of typical test silicon wafer bending strength comprises at present: control module; The drive motor that links to each other with control module; The thrust meter that links to each other with drive motor, said thrust meter connects the measuring head mounting rod; Be arranged on the upper pressing ball head on the said measuring head mounting rod; Be positioned at the end support disk of said upper pressing ball head below; Be arranged on the following support bulb and the guide-localization post that is used to prevent that silicon chip from tilting that are used to support silicon chip on the support disk of the said end.
This device, bending strength, maximum crushing force and maximum distortion displacement that can test silicon wafer.But this apparatus structure is complicated, and cost is expensive, and is higher to operator's technical requirement, inapplicable production line.
Therefore, those skilled in the art press for a kind of simple in structure easy to operate, are applicable to the silicon chip pick-up unit of production line.
Summary of the invention
The purpose of this invention is to provide a kind of silicon chip detector, this silicon chip detector easy to operate production line that is applicable to simple in structure.
In order to realize above-mentioned technical purpose, the invention provides a kind of silicon chip detector, comprise supporter, clock gauge and counterweight; Said supporter has the support member of supporting surface level, the perimembranous of said supports support silicon slice under test; The outside of said support member has keeper, the said silicon slice under test of interior side contacts of said keeper, and the every edge joint of said silicon slice under test touches at least one said keeper; It is inner that said clock gauge is positioned at said supporter, and the center line of said clock gauge pointer passes the geometric center of said silicon slice under test; The combination of said counterweight can be formed predetermined weight, and is placed on the central authorities of said silicon slice under test.
Preferably, said support member is evenly distributed on the perimembranous of said silicon slice under test at least three support columns, said support column.
Preferably, said support member is set to four said support columns, and four said support columns lay respectively at four jiaos of said silicon slice under test.
Preferably, the every edge joint of said silicon slice under test touches two said keepers, and two said keepers in the outside, every limit of said silicon slice under test all are positioned at the two ends on this limit.
Preferably, said keeper is a locating piece, the inboard form right angle structure of the said locating piece of adjacent side.
Preferably, said keeper is a reference column.
Preferably, the support end of said support column is a sphere.
Preferably, the support end of said support column is the plane.
Preferably, said support member is a support frame, and said keeper is a positioning framework.
Preferably, said support frame and said positioning framework are structure as a whole.
Silicon chip detector provided by the invention comprises supporter, clock gauge and counterweight; Supporter has the support member of supporting surface level, the perimembranous of supports support silicon slice under test; The outside of support member has keeper, the inboard contact measured silicon chip of keeper, and the every edge joint of silicon slice under test touches at least one keeper; Clock gauge is positioned at supporter inside, and the center line of clock gauge pointer passes the geometric center of silicon slice under test; The combination of counterweight can be formed predetermined weight, and is placed on the central authorities of silicon slice under test.
When the silicon chip detector detected silicon chip, silicon chip was placed on the support member, prevented landing by the keeper location; The central authorities of silicon chip are replaced in the contact of clock gauge, and the zeroing clock gauge is placed on the counterweight of predetermined weight the central authorities of silicon chip; At this moment; The reading of clock gauge can reflect the practical distortion amount of silicon chip central authorities, if this practical distortion amount greater than the minimum value of qualified deflection, then this silicon chip is qualified.This silicon chip detector is simple in structure easy to operate, compared with prior art, more is applicable to the production line.
The qualified deflection of silicon chip can obtain through detecting; Get the deflection that one group of less counterweight of predetermined weight detects silicon chip earlier; Increase the weight of counterweight then gradually and write down the deflection of silicon chip, can obtain the stress-strain diagram of silicon chip, through detecting several groups of silicon chips; Can analyze the range of strain that draws the pairing silicon chip of counterweight that applies constant weight, range of strain multiply by safety coefficient and promptly draws qualified deflection.
Before the clock gauge zeroing, certain reading arranged, can explain that the contact of clock gauge is seamless with contacting of silicon chip, can reduce the detection error of silicon chip strain.
Counterweight comprises the counterweight of some various weight, and the counterweight combination can obtain any predetermined weight.
In a kind of mode, said support member is evenly distributed on the perimembranous of said silicon slice under test at least three support columns, said support column.
When support member was made up of support column, at least three support columns can satisfy the horizontal support to silicon chip.When detecting silicon chip, counterweight is placed on the central authorities of silicon chip usually, when support column is evenly distributed in the perimembranous of silicon chip, detects the best results of strain.
Further in the mode, said support member is set to four said support columns, and four said support columns lay respectively at four jiaos of said silicon slice under test; The every edge joint of said silicon slice under test touches two said keepers, and two said keepers in the outside, every limit of said silicon slice under test all are positioned at the two ends on this limit; Said keeper is a locating piece, the inboard form right angle structure of the said locating piece of adjacent side.
Silicon chip is generally quadrilateral structure, can be set to four support columns that are positioned at four jiaos of silicon chips by support member, and the anchorage force that the support member of this structure receives silicon chip is more even.The silicon chip landing can be avoided in four jiaos of locating piece location that the form right angle structure is all arranged of silicon chip.
In the another kind of mode, said support member is a support frame, and said keeper is a positioning framework; Said support frame and said positioning framework are structure as a whole.
Support member can be set to framed structure, and by the support frame supports silicon chip, support frame can also have positioning framework for supporting the frame on silicon chip four limits in the support frame outside.Support frame and positioning framework can be structure as a whole, and on same framework, not only supporting frame are set but also the location frame is set.
Description of drawings
Fig. 1 is the skeleton view that is used to detect a kind of embodiment of detector of silicon chip bending strength provided by the present invention;
Fig. 2 detects the front view of the detector of silicon chip bending strength for shown in Figure 1 being used to;
Fig. 3 detects the axonometric drawing of the detector of silicon chip bending strength for shown in Figure 1 being used to;
Fig. 4 detects the cut-open view of the detector of silicon chip bending strength for shown in Figure 1 being used to.
Embodiment
Core of the present invention provides a kind of silicon chip detector, this silicon chip detector easy to operate production line that is applicable to simple in structure.
In order to make those skilled in the art person understand the present invention program better, the present invention is done further detailed description below in conjunction with accompanying drawing and embodiment.
Please refer to Fig. 1 to Fig. 4; Fig. 1 is the skeleton view that is used to detect a kind of embodiment of detector of silicon chip bending strength provided by the present invention; Fig. 2 detects the front view of the detector of silicon chip bending strength for shown in Figure 1 being used to; Fig. 3 is the axonometric drawing that shown in Figure 1 being used to detects the detector of silicon chip bending strength, and Fig. 4 detects the cut-open view of the detector of silicon chip bending strength for shown in Figure 1 being used to.
In a kind of concrete embodiment, the invention provides a kind of silicon chip detector, comprise supporter 1, clock gauge 2 and counterweight 3; Said supporter 1 has the support member 11 of supporting surface level, and said support member 11 supports the perimembranous of silicon slice under test 4; The outside of said support member 11 has keeper 12, the said silicon slice under test 4 of the interior side contacts of said keeper 12, and said silicon slice under test 4 every edge joints touch at least one said keeper 12; Said clock gauge 2 is positioned at said supporter 1 inside, the geometric center that the center line of said clock gauge 2 pointers passes said silicon slice under test 4; The combination of said counterweight 3 can be formed predetermined weight, and is placed on the central authorities of said silicon slice under test 4.
When the silicon chip detector detected silicon chip 4, silicon chip was placed on the support member 11, located and prevent landing by keeper 12; The central authorities of silicon chip 4 are replaced in the contact 21 of clock gauge 2, and clock gauge 2 returns to zero, and the counterweight 3 of predetermined weight is placed on the central authorities of silicon chip 4; At this moment; The reading of clock gauge 2 can reflect the practical distortion amount of silicon chip 4 central authorities, if this practical distortion amount greater than the minimum value of qualified deflection, then this silicon chip 4 is qualified.This silicon chip detector is simple in structure easy to operate, compared with prior art, more is applicable to the production line.
The qualified deflection of silicon chip 4 can obtain through detecting; Get the deflection that one group of less counterweight 3 of predetermined weight detects silicon chip 4 earlier; Increase the weight of counterweight 3 then gradually and write down the deflection of corresponding silicon chip 4, can obtain the stress-strain diagram of silicon chip 4, through detecting several groups of silicon chips 4; Can analyze the range of strain that draws the counterweight 3 pairing silicon chips 4 that apply constant weight, range of strain multiply by safety coefficient can draw qualified deflection.The qualified distortion scale that the counterweight 3 of the silicon chip 4 that can be earlier draws different-thickness through test and different predetermined weights is corresponding detects according to this table then.If it is the practical distortion amount, explains then that the toughness of this silicon chip 4 is lower less than qualified deflection, broken easily.
Before clock gauge 2 zeroings certain reading to be arranged, can explain that the contact 21 of clock gauge 2 is seamless with contacting of silicon chip 4, can reduce the detection error of silicon chip 4 strains.Clock gauge 2 is positioned at supporter 1 inside, need satisfy simultaneously, and the central authorities of silicon chip 4 are replaced in the contact 21 of clock gauge 2.
This silicon chip detector also can detect the bending strength of silicon chip 4, maximum crushing force and maximum distortion displacement.Support member 11 is positioned at the perimembranous of silicon chip 4, and counterweight 3 is placed on the central authorities of silicon chip 4, and then the strains that produce of silicon chip 4 central authorities are maximum, the maximum deformation quantity of silicon chip 4 when promptly obtaining to apply a certain predetermined weight.
This silicon chip detector is highly suitable for the screening of production line to the silicon chip 4 that meets the stress requirement; Can obtain the practical distortion amount of silicon chip 4 very intuitively through the reading of clock gauge; Qualified deflection with the test acquisition compares then; Can judge whether silicon chip to be detected 4 is qualified, and whole testing process is simple, directly perceived.
Silicon chip detector of the present invention is simple in structure not to have precise part, is easy to manufacture, and is easy to maintaining, low to operating personnel's technical requirement, and environment is not had specific (special) requirements, can in Workshop Production, use whenever and wherever possible.
Further in the embodiment, said support member 11 is at least three support columns, and said support column is evenly distributed on the perimembranous of said silicon slice under test 4.
When support member 11 was made up of support column, at least three support columns can satisfy and support silicon chip 4, and when support column was evenly distributed on the perimembranous of silicon chip 4, it was best to detect effect.When detecting silicon chip, counterweight 3 is placed on the central authorities of silicon chip 4 usually, and support column can obtain best detection effect in the even distribution of perimembranous of silicon chip 4.
In the embodiment further, said support member 11 is set to four said support columns, and four said support columns lay respectively at four jiaos of said silicon slice under test 4.
Obviously, when support member 11 was support column, the quantity of support column and distribution situation not only were confined to the described situation of the foregoing description, and wherein, the quantity of preferred support column is four multiple and the symmetrical arrangement of distribution situation.
A kind of preferred embodiment in, said silicon slice under test 4 every edge joints touch two said keepers 12, two said keepers 12 in the outside, said silicon slice under test 4 every limit all are positioned at the two ends on this limit.
The keeper 12 that aforesaid way distributes can further guarantee the accurate location of silicon chip 4, and is practical and attractive in appearance.
Certainly, the quantity of the keeper 12 that silicon slice under test 4 every edge joints touch not is absolute, and the quantity of the keeper 12 on each limit also can be inequality; Keeper 12 can be positioned at the optional position on silicon slice under test 4 every limits, also can regular distribution; Obviously, can avoid the distribution form of its landing to use in the present invention for silicon chip 4 location.
Further in the embodiment, said keeper 12 is a locating piece, the inboard form right angle structure of the said locating piece of adjacent side.
In the another kind of further embodiment, said keeper 12 is a reference column.
In a kind of concrete embodiment, the said support end that supports is a sphere, and then support column contacts for point with silicon chip 4, and the contact point of support column and silicon chip 4 distributes on silicon chip 4 symmetrically, and silicon chip 4 can obtain uniform anchorage force.
In the another kind of concrete embodiment, the support end of said support column is the plane, and then support column and silicon chip 4 are for face contacts, and the area of each supporting surface is identical, the symmetry that is evenly distributed on silicon chip 4, and silicon chip 4 also can obtain uniform anchorage force.
Certainly, the support end of support column can also be other structures, can guarantee that the support end of other versions of the supporting surface level that each support end constitutes also can be used in the present invention, for example arc surface.
In a kind of preferred concrete embodiment, said support member 11 is a support frame, and said keeper 12 is a positioning framework.
In the further concrete embodiment, said support frame and said positioning framework are structure as a whole, and can on same framework, not only supporting frame be set but also the location frame is set.
Obviously, the support member 11 of silicon chip detector and the version of keeper 12 are not limited only to the described situation of the foregoing description, and other can also can be used in the present invention the version of silicon chip 4 realization supports and location.
In sum, the inboard that occurs among this paper and the outside are to confirm that with respect to the center of silicon chip 4 the nearer side in parts and silicon chip 4 centers is the inboard, are the outside with silicon chip 4 a centers side far away.
More than silicon chip detector provided by the present invention has been carried out detailed introduction.Used concrete example among this paper principle of the present invention and embodiment are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof.Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention, can also carry out some improvement and modification to the present invention, these improvement and modification also fall in the protection domain of claim of the present invention.
Claims (10)
1. a silicon chip detector is characterized in that, comprises supporter (1), clock gauge (2) and counterweight (3); Said supporter (1) has the support member (11) of supporting surface level, and said support member (11) supports the perimembranous of silicon slice under test (4); The outside of said support member (11) has keeper (12), the said silicon slice under test of interior side contacts (4) of said keeper (12), and the every edge joint of said silicon slice under test (4) touches at least one said keeper (12); Said clock gauge (2) is positioned at said supporter (1) inside, the geometric center that the center line of said clock gauge (2) pointer passes said silicon slice under test (4); The combination of said counterweight (3) can be formed predetermined weight, and is placed on the central authorities of said silicon slice under test (4).
2. silicon chip detector as claimed in claim 1 is characterized in that, said support member (11) is at least three support columns, and said support column is evenly distributed on the perimembranous of said silicon slice under test (4).
3. silicon chip detector as claimed in claim 2 is characterized in that, said support member (11) is set to four said support columns, and four said support columns lay respectively at four jiaos of said silicon slice under test (4).
4. silicon chip detector as claimed in claim 3 is characterized in that, the every edge joint of said silicon slice under test (4) touches two said keepers (12), and two said keepers (12) in the outside, every limit of said silicon slice under test (4) all are positioned at the two ends on this limit.
5. silicon chip detector as claimed in claim 4 is characterized in that, said keeper (12) is a locating piece, the inboard form right angle structure of the said locating piece of adjacent side.
6. silicon chip detector as claimed in claim 4 is characterized in that, said keeper (12) is a reference column.
7. like each described silicon chip detector of claim 1 to 6, it is characterized in that the support end of said support column is a sphere.
8. like each described silicon chip detector of claim 1 to 6, it is characterized in that the support end of said support column is the plane.
9. silicon chip detector as claimed in claim 1 is characterized in that, said support member (11) is a support frame, and said keeper (12) is a positioning framework.
10. silicon chip detector as claimed in claim 9 is characterized in that, said support frame and said positioning framework are structure as a whole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2012101648563A CN102680322A (en) | 2012-05-24 | 2012-05-24 | Silicon wafer detector |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012101648563A CN102680322A (en) | 2012-05-24 | 2012-05-24 | Silicon wafer detector |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103968746A (en) * | 2013-01-25 | 2014-08-06 | 上海华虹宏力半导体制造有限公司 | Detection device for detecting deformation of quartz boat |
| CN105181462A (en) * | 2015-10-19 | 2015-12-23 | 中国电子科技集团公司第四十六研究所 | Mechanical strength test device for monocrystal chip and detection method |
| CN108987296A (en) * | 2018-08-14 | 2018-12-11 | 长江存储科技有限责任公司 | Wafer elastic strain measuring device, measurement method and wafer bonding method |
| CN114062133A (en) * | 2021-11-12 | 2022-02-18 | 横店集团东磁股份有限公司 | Method and device for testing mechanical strength of solar cell |
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| CN85201254U (en) * | 1985-04-01 | 1986-06-25 | 复旦大学 | Mechanical measuring device for bending intensity of single crystal material |
| CN200996920Y (en) * | 2007-01-23 | 2007-12-26 | 上海新三思计量仪器制造有限公司 | Stress deformation measuring equipment of hard brittle material |
| CN101603904A (en) * | 2009-07-20 | 2009-12-16 | 大连海事大学 | The unconfined compression fluid deformation of solution environmental action rock mass proving installation |
| CN101762229A (en) * | 2009-12-10 | 2010-06-30 | 大连海事大学 | Rock uniaxial compression testing device in corrosion environment |
| CN201909739U (en) * | 2010-12-29 | 2011-07-27 | 长沙理工大学 | Arch structure test device |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN85201254U (en) * | 1985-04-01 | 1986-06-25 | 复旦大学 | Mechanical measuring device for bending intensity of single crystal material |
| CN200996920Y (en) * | 2007-01-23 | 2007-12-26 | 上海新三思计量仪器制造有限公司 | Stress deformation measuring equipment of hard brittle material |
| CN101603904A (en) * | 2009-07-20 | 2009-12-16 | 大连海事大学 | The unconfined compression fluid deformation of solution environmental action rock mass proving installation |
| CN101762229A (en) * | 2009-12-10 | 2010-06-30 | 大连海事大学 | Rock uniaxial compression testing device in corrosion environment |
| CN201909739U (en) * | 2010-12-29 | 2011-07-27 | 长沙理工大学 | Arch structure test device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103968746A (en) * | 2013-01-25 | 2014-08-06 | 上海华虹宏力半导体制造有限公司 | Detection device for detecting deformation of quartz boat |
| CN103968746B (en) * | 2013-01-25 | 2017-06-06 | 上海华虹宏力半导体制造有限公司 | A kind of detection means for detecting quartz boat deformation |
| CN105181462A (en) * | 2015-10-19 | 2015-12-23 | 中国电子科技集团公司第四十六研究所 | Mechanical strength test device for monocrystal chip and detection method |
| CN105181462B (en) * | 2015-10-19 | 2017-12-01 | 中国电子科技集团公司第四十六研究所 | A kind of single-chip mechanical strength testing device and detection method |
| CN108987296A (en) * | 2018-08-14 | 2018-12-11 | 长江存储科技有限责任公司 | Wafer elastic strain measuring device, measurement method and wafer bonding method |
| CN108987296B (en) * | 2018-08-14 | 2024-04-02 | 长江存储科技有限责任公司 | Wafer elastic strain measuring device, measuring method and wafer bonding method |
| CN114062133A (en) * | 2021-11-12 | 2022-02-18 | 横店集团东磁股份有限公司 | Method and device for testing mechanical strength of solar cell |
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Application publication date: 20120919 |