CN102965539A - 轧制铜箔 - Google Patents
轧制铜箔 Download PDFInfo
- Publication number
- CN102965539A CN102965539A CN2012100408007A CN201210040800A CN102965539A CN 102965539 A CN102965539 A CN 102965539A CN 2012100408007 A CN2012100408007 A CN 2012100408007A CN 201210040800 A CN201210040800 A CN 201210040800A CN 102965539 A CN102965539 A CN 102965539A
- Authority
- CN
- China
- Prior art keywords
- quality
- copper foil
- rolled copper
- comparative example
- rolled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 129
- 239000011889 copper foil Substances 0.000 title claims abstract description 93
- 239000010949 copper Substances 0.000 claims abstract description 46
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- 229910052796 boron Inorganic materials 0.000 claims abstract description 36
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000001301 oxygen Substances 0.000 claims abstract description 35
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 35
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 23
- 239000012535 impurity Substances 0.000 claims abstract description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000010703 silicon Substances 0.000 claims abstract description 18
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 17
- 229910052709 silver Inorganic materials 0.000 claims description 21
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 19
- 239000004332 silver Substances 0.000 claims description 19
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 16
- 239000005864 Sulphur Substances 0.000 claims description 16
- 239000000956 alloy Substances 0.000 claims description 15
- 238000005096 rolling process Methods 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 238000009826 distribution Methods 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 abstract description 2
- 238000005452 bending Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 58
- 238000000034 method Methods 0.000 description 57
- 238000005097 cold rolling Methods 0.000 description 31
- 238000004519 manufacturing process Methods 0.000 description 31
- 238000000137 annealing Methods 0.000 description 22
- 230000033228 biological regulation Effects 0.000 description 16
- 239000000463 material Substances 0.000 description 16
- 238000001953 recrystallisation Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 13
- 239000000654 additive Substances 0.000 description 12
- 239000002184 metal Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 238000007669 thermal treatment Methods 0.000 description 11
- 229910052717 sulfur Inorganic materials 0.000 description 9
- 238000004381 surface treatment Methods 0.000 description 6
- 238000005266 casting Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000010875 treated wood Substances 0.000 description 4
- 238000002441 X-ray diffraction Methods 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000009616 inductively coupled plasma Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- -1 JISH3100 Chemical compound 0.000 description 2
- 210000002469 basement membrane Anatomy 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000005482 strain hardening Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- SXAMGRAIZSSWIH-UHFFFAOYSA-N 2-[3-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-1,2,4-oxadiazol-5-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1=NOC(=N1)CC(=O)N1CC2=C(CC1)NN=N2 SXAMGRAIZSSWIH-UHFFFAOYSA-N 0.000 description 1
- IHCCLXNEEPMSIO-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)CC(=O)N1CC2=C(CC1)NN=N2 IHCCLXNEEPMSIO-UHFFFAOYSA-N 0.000 description 1
- JJPWJEGNCRGGGA-UHFFFAOYSA-N 4-[[2-[5-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-1,3,4-oxadiazol-2-yl]acetyl]amino]benzoic acid Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1=NN=C(O1)CC(=O)NC1=CC=C(C(=O)O)C=C1 JJPWJEGNCRGGGA-UHFFFAOYSA-N 0.000 description 1
- 206010021703 Indifference Diseases 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000000634 powder X-ray diffraction Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
- B21B2003/005—Copper or its alloys
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Metal Rolling (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-190592 | 2011-09-01 | ||
JP2011190592A JP5177268B2 (ja) | 2011-09-01 | 2011-09-01 | 圧延銅箔 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102965539A true CN102965539A (zh) | 2013-03-13 |
Family
ID=47795975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012100408007A Pending CN102965539A (zh) | 2011-09-01 | 2012-02-21 | 轧制铜箔 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5177268B2 (ja) |
KR (1) | KR20130025317A (ja) |
CN (1) | CN102965539A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110392485A (zh) * | 2019-06-18 | 2019-10-29 | 昆山维嘉益材料科技有限公司 | 一种lp316l sta高阶摄像头模组fpc基板加工方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10190225B2 (en) | 2017-04-18 | 2019-01-29 | Chang Chun Petrochemical Co., Ltd. | Electrodeposited copper foil with low repulsive force |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001011550A (ja) * | 1999-06-30 | 2001-01-16 | Kobe Steel Ltd | 銅合金圧延箔 |
JP2001152267A (ja) * | 1999-11-18 | 2001-06-05 | Kobe Steel Ltd | 銅合金圧延箔 |
JP2008088492A (ja) * | 2006-09-29 | 2008-04-17 | Nikko Kinzoku Kk | 銅合金箔および銅−樹脂有機物フレキシブル積層体 |
JP5235080B2 (ja) * | 2007-09-28 | 2013-07-10 | Jx日鉱日石金属株式会社 | 銅合金箔及びそれを用いたフレキシブルプリント基板 |
-
2011
- 2011-09-01 JP JP2011190592A patent/JP5177268B2/ja not_active Expired - Fee Related
- 2011-12-21 KR KR1020110138759A patent/KR20130025317A/ko not_active Application Discontinuation
-
2012
- 2012-02-21 CN CN2012100408007A patent/CN102965539A/zh active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110392485A (zh) * | 2019-06-18 | 2019-10-29 | 昆山维嘉益材料科技有限公司 | 一种lp316l sta高阶摄像头模组fpc基板加工方法 |
CN110392485B (zh) * | 2019-06-18 | 2022-04-12 | 淮安维嘉益集成科技有限公司 | 一种lp316l sta高阶摄像头模组fpc基板加工方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20130025317A (ko) | 2013-03-11 |
JP2013053323A (ja) | 2013-03-21 |
JP5177268B2 (ja) | 2013-04-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: SH COPPER INDUSTRY CO., LTD. Free format text: FORMER OWNER: HITACHI CABLE CO., LTD. Effective date: 20130808 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20130808 Address after: Ibaraki Applicant after: Sh Copper Products Co Ltd Address before: Tokyo, Japan, Japan Applicant before: Hitachi Cable Co., Ltd. |
|
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130313 |