CN102965539A - 轧制铜箔 - Google Patents

轧制铜箔 Download PDF

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Publication number
CN102965539A
CN102965539A CN2012100408007A CN201210040800A CN102965539A CN 102965539 A CN102965539 A CN 102965539A CN 2012100408007 A CN2012100408007 A CN 2012100408007A CN 201210040800 A CN201210040800 A CN 201210040800A CN 102965539 A CN102965539 A CN 102965539A
Authority
CN
China
Prior art keywords
quality
copper foil
rolled copper
comparative example
rolled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012100408007A
Other languages
English (en)
Chinese (zh)
Inventor
室贺岳海
关聪至
萩原登
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SH Copper Products Co Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Publication of CN102965539A publication Critical patent/CN102965539A/zh
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B1/00Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/40Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B21B2003/005Copper or its alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Metal Rolling (AREA)
CN2012100408007A 2011-09-01 2012-02-21 轧制铜箔 Pending CN102965539A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-190592 2011-09-01
JP2011190592A JP5177268B2 (ja) 2011-09-01 2011-09-01 圧延銅箔

Publications (1)

Publication Number Publication Date
CN102965539A true CN102965539A (zh) 2013-03-13

Family

ID=47795975

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012100408007A Pending CN102965539A (zh) 2011-09-01 2012-02-21 轧制铜箔

Country Status (3)

Country Link
JP (1) JP5177268B2 (ja)
KR (1) KR20130025317A (ja)
CN (1) CN102965539A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110392485A (zh) * 2019-06-18 2019-10-29 昆山维嘉益材料科技有限公司 一种lp316l sta高阶摄像头模组fpc基板加工方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10190225B2 (en) 2017-04-18 2019-01-29 Chang Chun Petrochemical Co., Ltd. Electrodeposited copper foil with low repulsive force

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001011550A (ja) * 1999-06-30 2001-01-16 Kobe Steel Ltd 銅合金圧延箔
JP2001152267A (ja) * 1999-11-18 2001-06-05 Kobe Steel Ltd 銅合金圧延箔
JP2008088492A (ja) * 2006-09-29 2008-04-17 Nikko Kinzoku Kk 銅合金箔および銅−樹脂有機物フレキシブル積層体
JP5235080B2 (ja) * 2007-09-28 2013-07-10 Jx日鉱日石金属株式会社 銅合金箔及びそれを用いたフレキシブルプリント基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110392485A (zh) * 2019-06-18 2019-10-29 昆山维嘉益材料科技有限公司 一种lp316l sta高阶摄像头模组fpc基板加工方法
CN110392485B (zh) * 2019-06-18 2022-04-12 淮安维嘉益集成科技有限公司 一种lp316l sta高阶摄像头模组fpc基板加工方法

Also Published As

Publication number Publication date
KR20130025317A (ko) 2013-03-11
JP2013053323A (ja) 2013-03-21
JP5177268B2 (ja) 2013-04-03

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
ASS Succession or assignment of patent right

Owner name: SH COPPER INDUSTRY CO., LTD.

Free format text: FORMER OWNER: HITACHI CABLE CO., LTD.

Effective date: 20130808

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20130808

Address after: Ibaraki

Applicant after: Sh Copper Products Co Ltd

Address before: Tokyo, Japan, Japan

Applicant before: Hitachi Cable Co., Ltd.

WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130313