CN102931160A - 半导体器件去除残胶的平脚结构 - Google Patents

半导体器件去除残胶的平脚结构 Download PDF

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Publication number
CN102931160A
CN102931160A CN2012104324532A CN201210432453A CN102931160A CN 102931160 A CN102931160 A CN 102931160A CN 2012104324532 A CN2012104324532 A CN 2012104324532A CN 201210432453 A CN201210432453 A CN 201210432453A CN 102931160 A CN102931160 A CN 102931160A
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China
Prior art keywords
semiconductor device
flat foot
foot structure
flat
gum
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Pending
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CN2012104324532A
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English (en)
Inventor
朱坤恒
郭建武
郭裕亮
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DUNNAN MICROELECTRONIC (WUXI) Co Ltd
Shanghai Seefull Electronic Co Ltd
Original Assignee
DUNNAN MICROELECTRONIC (WUXI) Co Ltd
Shanghai Seefull Electronic Co Ltd
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Application filed by DUNNAN MICROELECTRONIC (WUXI) Co Ltd, Shanghai Seefull Electronic Co Ltd filed Critical DUNNAN MICROELECTRONIC (WUXI) Co Ltd
Priority to CN2012104324532A priority Critical patent/CN102931160A/zh
Publication of CN102931160A publication Critical patent/CN102931160A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

本发明公开一种采用CLIP连接片的半导体器件去除残胶的平脚结构，半导体器件的平脚引线水平方向的端部形成90°直角的垂直段。本发明的优点是攻克了产品在塑封过程中存在残胶的堡垒，提高了产品的优良率；提高了生产效率，降低了生产成本。

Description

半导体器件去除残胶的平脚结构
技术领域
本发明涉及一种半导体器件的平脚结构，特别涉及一种采用CLIP连接片的半导体器件去除残胶的平脚结构。
背景技术
现有采用CLIP连接片的半导体器件，广泛使用金属材料框架LDF作为引出脚，在平脚引线结构上采用圆角折弯，平脚引线水平方向的端部为圆弧段4，如图1和图2所示，该平脚结构的缺点是：在产品塑封过程中封胶为液态，封胶在受到注塑的压力而四处流动，通过框架水平方向底部外溢，在圆弧段4容易堆积残胶，成型后的胶体在引脚上呈不规则现象，电镀后部分胶体脱落造成露铜的致命缺谄，产品报废，生产成本上升。
发明内容
本发明所要解决的技术问题是要提供一种在塑封过程中防止残胶堆积的半导体器件去除残胶的平脚结构。
为了解决以上的技术问题，本发明提供了一种半导体器件去除残胶的平脚结构，半导体器件的平脚引线水平方向的端部形成900直角的垂直段，形成一个垂直的阻隔端面，使封胶无法再沿框架底部方向流动，克服了残胶的技术难题。
本发明的优越功效在于：
1）本发明攻克了产品在塑封过程中存在残胶的堡垒，提高了产品的优良率；
2）提高了生产效率，降低了生产成本。
附图说明
图1为现有引脚结构示意图；
图2为图1的放大图；
图3为本发明的结构示意图；
图4为图3的局部放大图；
图中标号说明
1—平脚引线；                       2—垂直段；
3—封胶；                           4—圆弧段。
具体实施方式
请参阅附图所示，对本发明作进一步的描述。
如图3和图4所示，本发明提供了一种半导体器件去除残胶的平脚结构，所述半导体器件的平脚引线1水平方向的端部形成900直角的垂直段2，形成一个垂直的阻隔端面，使封胶3无法再沿框架底部方向流动，克服了残胶的技术难题。

Claims (1)

1.一种半导体器件去除残胶的平脚结构，其特征在于：半导体器件的平脚引线水平方向的端部形成900直角的垂直段。
CN2012104324532A 2012-11-02 2012-11-02 半导体器件去除残胶的平脚结构 Pending CN102931160A (zh)

Priority Applications (1)

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CN2012104324532A CN102931160A (zh) 2012-11-02 2012-11-02 半导体器件去除残胶的平脚结构

Applications Claiming Priority (1)

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CN2012104324532A CN102931160A (zh) 2012-11-02 2012-11-02 半导体器件去除残胶的平脚结构

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CN102931160A true CN102931160A (zh) 2013-02-13

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1428830A (zh) * 2001-12-27 2003-07-09 威宇科技测试封装（上海）有限公司 一种具有散热片的半导体封装
CN102082099A (zh) * 2009-11-30 2011-06-01 万国半导体有限公司 引脚外露的半导体封装的工艺方法
CN202816927U (zh) * 2012-08-31 2013-03-20 杰群电子科技（东莞）有限公司 防止注塑时溢胶的半导体引线框架

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1428830A (zh) * 2001-12-27 2003-07-09 威宇科技测试封装（上海）有限公司 一种具有散热片的半导体封装
CN102082099A (zh) * 2009-11-30 2011-06-01 万国半导体有限公司 引脚外露的半导体封装的工艺方法
CN202816927U (zh) * 2012-08-31 2013-03-20 杰群电子科技（东莞）有限公司 防止注塑时溢胶的半导体引线框架

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Application publication date: 20130213