CN102931151A - Heat dissipation device for reactive compensation device - Google Patents

Heat dissipation device for reactive compensation device Download PDF

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Publication number
CN102931151A
CN102931151A CN2012104491357A CN201210449135A CN102931151A CN 102931151 A CN102931151 A CN 102931151A CN 2012104491357 A CN2012104491357 A CN 2012104491357A CN 201210449135 A CN201210449135 A CN 201210449135A CN 102931151 A CN102931151 A CN 102931151A
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CN
China
Prior art keywords
reactive power
heat dissipation
power compensator
radiator
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012104491357A
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Chinese (zh)
Inventor
王国华
许明君
许锡海
谷霄飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WUXI XIRONG ELECTRIC APPLIANCE Co Ltd
Original Assignee
WUXI XIRONG ELECTRIC APPLIANCE Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WUXI XIRONG ELECTRIC APPLIANCE Co Ltd filed Critical WUXI XIRONG ELECTRIC APPLIANCE Co Ltd
Priority to CN2012104491357A priority Critical patent/CN102931151A/en
Publication of CN102931151A publication Critical patent/CN102931151A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a heat dissipation device for a reactive compensation device. The heat dissipation device comprises a heat dissipation body made from thermal-sensitive materials, wherein the size of the heat dissipation body is matched with the size of a functional device, a plurality of heat dissipating fins extend on one side of the heat dissipation body, the heat dissipating fins are arranged in parallel and at intervals on a heat exchange channel between every two adjacent heat dissipating fins, a plurality of installation holes are arranged on the heat dissipation body, and the installation holes enable the heat dissipation device to be arranged on the functional device on the reactive compensation device. The heat dissipation device for the reactive compensation device can timely dissipate heat of the functional device of the reactive compensation device, ensures the functional device to have good work reliability, good heat dissipation property and good insulating property, prolongs service life of the functional device, and improves quality of the whole reactive compensation device.

Description

A kind of radiator for reactive power compensator
Technical field
The present invention relates to a kind of radiator, especially relate to a kind of radiator for reactive power compensator.
Background technology
At present, reactive power compensator has become and has improved power supply situation, improve the effective measures of utilization rate of electrical, department of the State Grid every place that low-tension transformer and large-scale electric equipment are installed of regulation all should be equipped with reactive power compensator, in simulation electric power circuit design process, can use power device unavoidably, it is extremely important for the designer how to process and solve these power device heat dissipation problems, because the working temperature of these power devices will directly have influence on job stability and the fail safe of whole circuit, if the heat-sinking capability of device is limited, then the dissipation of power then can cause device inside chip active area temperature to rise and the junction temperature rising, so that device reliability reduces.
In the existing part reactive power compensator a large amount of source of heat releases is arranged, wherein the insulated gate bipolar transistor functional module is the most important, can can it effective temperature-reducing be related to package unit be in good working order for a long time, poor because of function element heat dispersion wherein in traditional reactive power compensator, cause a whole set of reactive power compensator to have that functional reliability is low, thermal resistance is high and bulky shortcoming.
Summary of the invention
The object of the present invention is to provide a kind of radiator for reactive power compensator, it can in time implement heat radiation to the functional part of reactive power compensator, guarantee the good functional reliability of this functional part, heat radiation and good insulation preformance have solved effectively that there is the problem that heat dispersion is poor, thermal resistance is high in reactive power compensator in the prior art.
The objective of the invention is to be achieved through the following technical solutions:
A kind of radiator for reactive power compensator, it comprises the heat radiator body of being made by temperature-sensitive material, the size of described heat radiator body cooperates the size setting of function element, and a side of described heat radiator body is extended with most radiating fins, and described radiating fin parallel interval is arranged between adjacent two radiating fins and forms heat exchanger channels.
Especially, described heat radiator body is by the aluminum alloy plate materials extrusion modling.
Especially, offer several installing holes on the described heat radiator body, by installing hole radiator is installed on the function element on the reactive power compensator.
Especially, the surface of described heat radiator body and radiating fin all is covered with black oxide layer.
Especially, described radiating fin is the board-like structure of rectangle.
Especially, described heat radiator body is square structure.
Beneficial effect of the present invention is, described radiator for reactive power compensator compared with prior art has following advantage: first, effectively controlled the temperature of the function element of reactive power compensator, improved its service behaviour, second, have at function element under the prerequisite of excellent heat dispersion performance, can dwindle the volume of reactive power compensator, the 3rd, quick and easy for installation, the function element of the reactive power compensator of directly fitting, collocation rationally, the 4th, in the useful life of having improved function element, improve the quality of a whole set of reactive power compensator.
Description of drawings
Fig. 1 is the perspective view of the radiator that is used for reactive power compensator that provides of the specific embodiment of the invention 1;
Fig. 2 is the profile of the radiator that is used for reactive power compensator that provides of the specific embodiment of the invention 1;
Fig. 3 is the upward view of the radiator that is used for reactive power compensator that provides of the specific embodiment of the invention 1.
Embodiment
Further specify technical scheme of the present invention below in conjunction with accompanying drawing and by embodiment.
See also Fig. 1 to shown in Figure 3, in the present embodiment, a kind of radiator for reactive power compensator comprises the square heat radiator body 1 of being made by aluminum alloy plate materials, the size of described heat radiator body 1 cooperates the size setting of function element, and a side of described heat radiator body 1 is extended with the radiating fin 2 of most the board-like structures of rectangle, described radiating fin 2 parallel interval are arranged, and form heat exchanger channels 3 between adjacent two radiating fins 2, and offer two installing holes 4 on the described heat radiator body 1, by installing hole 4 radiator is installed on the function element on the reactive power compensator, the heat that produces during function element work, pass on the heat radiator body 1, dispel the heat by radiating fin 2.
The surface of above-mentioned heat radiator body 1 and radiating fin 2 all is covered with black oxide layer 5, to improve radiating efficiency and the insulation property of radiator.
Above-mentioned radiator for reactive power compensator not only can in time be implemented heat radiation to the functional part of reactive power compensator, guarantee the good functional reliability of this functional part, heat radiation and good insulation preformance, and have at function element under the prerequisite of excellent heat dispersion performance, can dwindle the volume of reactive power compensator, quick and easy for installation, the function element of the reactive power compensator of directly fitting, collocation is rationally.
Above embodiment has just set forth basic principle of the present invention and characteristic; the present invention is not limited by above-mentioned example; without departing from the spirit and scope of the present invention, the present invention also has various variations and change, and these variations and change all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.

Claims (6)

1. radiator that is used for reactive power compensator, it is characterized in that: it comprises the heat radiator body of being made by temperature-sensitive material, the size of described heat radiator body cooperates the size setting of function element, and a side of described heat radiator body is extended with most radiating fins, and described radiating fin parallel interval is arranged between adjacent two radiating fins and forms heat exchanger channels.
2. the radiator for reactive power compensator according to claim 1; It is characterized in that: described heat radiator body is by the aluminum alloy plate materials extrusion modling.
3. each described radiator for reactive power compensator according to claim 1 and 2; It is characterized in that: offer several installing holes on the described heat radiator body, by installing hole radiator is installed on the function element on the reactive power compensator.
4. the radiator that is used for reactive power compensator of stating according to claim 2; It is characterized in that: the surface of described heat radiator body and radiating fin all is covered with black oxide layer.
5. the radiator for reactive power compensator according to claim 1; It is characterized in that: described radiating fin is the board-like structure of rectangle.
6. the radiator for reactive power compensator according to claim 1; It is characterized in that: described heat radiator body is square structure.
CN2012104491357A 2012-11-09 2012-11-09 Heat dissipation device for reactive compensation device Pending CN102931151A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012104491357A CN102931151A (en) 2012-11-09 2012-11-09 Heat dissipation device for reactive compensation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012104491357A CN102931151A (en) 2012-11-09 2012-11-09 Heat dissipation device for reactive compensation device

Publications (1)

Publication Number Publication Date
CN102931151A true CN102931151A (en) 2013-02-13

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012104491357A Pending CN102931151A (en) 2012-11-09 2012-11-09 Heat dissipation device for reactive compensation device

Country Status (1)

Country Link
CN (1) CN102931151A (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6180436B1 (en) * 1998-05-04 2001-01-30 Delco Electronics Corporation Method for removing heat from a flip chip semiconductor device
CN2419724Y (en) * 2000-02-25 2001-02-14 刘倬云 Distribution style contactless switch assembly
CN1379465A (en) * 2001-02-07 2002-11-13 古河电气工业株式会社 Fin type heat radiator
CN201282341Y (en) * 2008-10-23 2009-07-29 上海久创电气自动化设备有限公司 Contactless controlled silicon module for compensation apparatus
CN101828268A (en) * 2006-12-11 2010-09-08 阳光模块公司 Solar roof tile and module with heat exchange
CN101924098A (en) * 2009-06-09 2010-12-22 富准精密工业(深圳)有限公司 Light-emitting diode module
CN201717252U (en) * 2010-04-26 2011-01-19 杭州铁城信息科技有限公司 Fixed heat radiator of charger power tube
CN102208814A (en) * 2011-05-17 2011-10-05 林洁 Capacitance compensation fling-cut switch

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6180436B1 (en) * 1998-05-04 2001-01-30 Delco Electronics Corporation Method for removing heat from a flip chip semiconductor device
CN2419724Y (en) * 2000-02-25 2001-02-14 刘倬云 Distribution style contactless switch assembly
CN1379465A (en) * 2001-02-07 2002-11-13 古河电气工业株式会社 Fin type heat radiator
CN101828268A (en) * 2006-12-11 2010-09-08 阳光模块公司 Solar roof tile and module with heat exchange
CN201282341Y (en) * 2008-10-23 2009-07-29 上海久创电气自动化设备有限公司 Contactless controlled silicon module for compensation apparatus
CN101924098A (en) * 2009-06-09 2010-12-22 富准精密工业(深圳)有限公司 Light-emitting diode module
CN201717252U (en) * 2010-04-26 2011-01-19 杭州铁城信息科技有限公司 Fixed heat radiator of charger power tube
CN102208814A (en) * 2011-05-17 2011-10-05 林洁 Capacitance compensation fling-cut switch

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Application publication date: 20130213