CN102918461A - 用于去除污染物粒子的系统、光刻设备、用于去除污染物粒子的方法以及用于制造器件的方法 - Google Patents

用于去除污染物粒子的系统、光刻设备、用于去除污染物粒子的方法以及用于制造器件的方法 Download PDF

Info

Publication number
CN102918461A
CN102918461A CN2011800133737A CN201180013373A CN102918461A CN 102918461 A CN102918461 A CN 102918461A CN 2011800133737 A CN2011800133737 A CN 2011800133737A CN 201180013373 A CN201180013373 A CN 201180013373A CN 102918461 A CN102918461 A CN 102918461A
Authority
CN
China
Prior art keywords
voltage
contaminant particles
electrode
pair
phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011800133737A
Other languages
English (en)
Chinese (zh)
Inventor
V·伊万诺夫
P·安齐费罗夫
Y·西杰尔尼科夫
L·斯卡克卡巴拉兹
H·尼尔霍夫
A·亚库宁
埃里克·伦洛夫·卢布斯卓
V·Y·拜尼恩
R·J·布鲁尔斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Publication of CN102918461A publication Critical patent/CN102918461A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2026—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05G—X-RAY TECHNIQUE
    • H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
    • H05G2/001—Production of X-ray radiation generated from plasma

Landscapes

  • Atmospheric Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Cleaning In General (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • X-Ray Techniques (AREA)
CN2011800133737A 2010-03-12 2011-03-03 用于去除污染物粒子的系统、光刻设备、用于去除污染物粒子的方法以及用于制造器件的方法 Pending CN102918461A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US31350710P 2010-03-12 2010-03-12
US61/313,507 2010-03-12
US34852110P 2010-05-26 2010-05-26
US61/348,521 2010-05-26
PCT/EP2011/053171 WO2011110467A2 (en) 2010-03-12 2011-03-03 System for removing contaminant particles, lithographic apparatus, method for removing contaminant particles and method for manufacturing a device

Publications (1)

Publication Number Publication Date
CN102918461A true CN102918461A (zh) 2013-02-06

Family

ID=44544069

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011800133737A Pending CN102918461A (zh) 2010-03-12 2011-03-03 用于去除污染物粒子的系统、光刻设备、用于去除污染物粒子的方法以及用于制造器件的方法

Country Status (6)

Country Link
US (1) US20130070218A1 (enExample)
JP (1) JP2013526004A (enExample)
KR (1) KR20130054945A (enExample)
CN (1) CN102918461A (enExample)
TW (1) TW201214060A (enExample)
WO (1) WO2011110467A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110945433A (zh) * 2017-07-28 2020-03-31 Asml荷兰有限公司 用于粒子抑制的粒子捕获器和阻挡件
CN113917786A (zh) * 2020-07-08 2022-01-11 卡尔蔡司Smt有限责任公司 用于从基板移除单一微粒的装置与方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130235357A1 (en) * 2012-03-12 2013-09-12 Kla-Tencor Corporation System and Method for Particle Control Near A Reticle
US20140253887A1 (en) * 2013-03-07 2014-09-11 Applied Materials, Inc. Contamination prevention for photomask in extreme ultraviolet lithography application
ES2655798T3 (es) * 2014-12-08 2018-02-21 Agfa Nv Sistema para reducir los residuos de ablación
US10678149B2 (en) 2015-06-24 2020-06-09 Diego Arturo Alvarado Castañeda Method and apparatus for maintaining the surface of a reticle free of particles
DE102015215223A1 (de) 2015-08-10 2017-02-16 Carl Zeiss Smt Gmbh EUV-Lithographiesystem
RU2623400C1 (ru) * 2015-12-24 2017-06-26 Федеральное государственное бюджетное учреждение науки Физико-технический институт им. А.Ф. Иоффе Российской академии наук Способ защиты литографического оборудования от пылевых металлических частиц
DE102016208850A1 (de) * 2016-05-23 2017-12-07 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage für die Halbleiterlithographie mit Elementen zur Plasmakonditionierung
US10149375B2 (en) * 2016-09-14 2018-12-04 Asml Netherlands B.V. Target trajectory metrology in an extreme ultraviolet light source
NL2024289B1 (en) * 2018-11-27 2020-09-25 Asml Netherlands Bv Membrane cleaning apparatus
CN113169047B (zh) 2018-12-10 2024-09-10 应用材料公司 在极紫外线光刻应用中从光掩模去除附接特征
IL294398A (en) * 2020-01-23 2022-08-01 Asml Holding Nv A lithographic system provided with a deflection mechanism to change the trajectory of particulate debris
WO2023217495A1 (en) * 2022-05-11 2023-11-16 Asml Netherlands B.V. Lithographic apparatus and associated methods

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1514305A (zh) * 2002-12-23 2004-07-21 Asml荷兰有限公司 具有残余物抑制装置的光刻装置和器件制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1008352C2 (nl) 1998-02-19 1999-08-20 Stichting Tech Wetenschapp Inrichting, geschikt voor extreem ultraviolet lithografie, omvattende een stralingsbron en een verwerkingsorgaan voor het verwerken van de van de stralingsbron afkomstige straling, alsmede een filter voor het onderdrukken van ongewenste atomaire en microscopische deeltjes welke door een stralingsbron zijn uitgezonden.
US6781673B2 (en) 2000-08-25 2004-08-24 Asml Netherlands B.V. Mask handling apparatus, lithographic projection apparatus, device manufacturing method and device manufactured thereby
EP1223468B1 (en) * 2001-01-10 2008-07-02 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method
US6614505B2 (en) * 2001-01-10 2003-09-02 Asml Netherlands B.V. Lithographic projection apparatus, device manufacturing method, and device manufactured thereby
US7230258B2 (en) * 2003-07-24 2007-06-12 Intel Corporation Plasma-based debris mitigation for extreme ultraviolet (EUV) light source
EP1726993A1 (de) * 2005-05-24 2006-11-29 Carl Zeiss SMT AG Optisches System und Verfahren zum Betreiben desselben
JP5758153B2 (ja) * 2010-03-12 2015-08-05 エーエスエムエル ネザーランズ ビー．ブイ． 放射源装置、リソグラフィ装置、放射発生および送出方法、およびデバイス製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1514305A (zh) * 2002-12-23 2004-07-21 Asml荷兰有限公司 具有残余物抑制装置的光刻装置和器件制造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110945433A (zh) * 2017-07-28 2020-03-31 Asml荷兰有限公司 用于粒子抑制的粒子捕获器和阻挡件
CN113917786A (zh) * 2020-07-08 2022-01-11 卡尔蔡司Smt有限责任公司 用于从基板移除单一微粒的装置与方法

Also Published As

Publication number Publication date
JP2013526004A (ja) 2013-06-20
KR20130054945A (ko) 2013-05-27
WO2011110467A2 (en) 2011-09-15
TW201214060A (en) 2012-04-01
US20130070218A1 (en) 2013-03-21
WO2011110467A3 (en) 2011-11-24

Similar Documents

Publication Publication Date Title
CN102918461A (zh) 用于去除污染物粒子的系统、光刻设备、用于去除污染物粒子的方法以及用于制造器件的方法
JP3972207B2 (ja) デブリ抑制手段を備えたリソグラフィ装置およびデバイス製造方法
TWI534553B (zh) 收集器鏡總成及產生極紫外光輻射之方法
CN102736442B (zh) 光刻设备和方法
US8368040B2 (en) Radiation system and lithographic apparatus
US9986628B2 (en) Method and apparatus for generating radiation
CN102612667A (zh) 光刻设备以及器件制造方法
US8547525B2 (en) EUV radiation generation apparatus
KR20120130321A (ko) 방사선 소스, 리소그래피 장치 및 디바이스 제조 방법
CN102918463A (zh) 多层反射镜
CN103019036A (zh) 辐射源
JP4058404B2 (ja) リソグラフィ投影装置およびリソグラフィ工程により集積構造を製造する方法
US20140218706A1 (en) Radiation source and lithographic apparatus
US7145631B2 (en) Lithographic apparatus, illumination system and method for mitigating debris particles
EP1434095A1 (en) Lithographic apparatus and device manufacturing method
CN106575085A (zh) 光刻设备和制造器件的方法
KR20160134648A (ko) Rf 플라즈마 필드를 이용한 euv 광학기기의 능동 세정 장치 및 방법
JP2017515136A5 (enExample)
JP4828985B2 (ja) リソグラフィ装置およびデバイス製造方法
CN120344913A (zh) 用于光刻设备的原位清洁
CN120435686A (zh) 用于使图案形成装置放电的系统和方法
NL2007861A (en) Radiation source and lithographic apparatus.

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130206