CN102916111B - Led集成光源基板及其制作方法 - Google Patents
Led集成光源基板及其制作方法 Download PDFInfo
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- CN102916111B CN102916111B CN201210404772.2A CN201210404772A CN102916111B CN 102916111 B CN102916111 B CN 102916111B CN 201210404772 A CN201210404772 A CN 201210404772A CN 102916111 B CN102916111 B CN 102916111B
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- 239000000758 substrate Substances 0.000 title claims abstract description 34
- 230000003287 optical effect Effects 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 title description 5
- 238000003825 pressing Methods 0.000 claims abstract description 30
- 238000003475 lamination Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000008033 biological extinction Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- 229910000906 Bronze Inorganic materials 0.000 description 4
- 239000010974 bronze Substances 0.000 description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000005619 thermoelectricity Effects 0.000 description 1
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CN201210404772.2A CN102916111B (zh) | 2012-10-19 | 2012-10-19 | Led集成光源基板及其制作方法 |
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CN201210404772.2A CN102916111B (zh) | 2012-10-19 | 2012-10-19 | Led集成光源基板及其制作方法 |
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CN102916111A CN102916111A (zh) | 2013-02-06 |
CN102916111B true CN102916111B (zh) | 2016-09-28 |
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CN201210404772.2A Active CN102916111B (zh) | 2012-10-19 | 2012-10-19 | Led集成光源基板及其制作方法 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103682045B (zh) * | 2013-12-04 | 2016-09-14 | 北京国联万众半导体科技有限公司 | 一种led封装杯体的加工方法及相应模具 |
CN104979451A (zh) * | 2015-06-30 | 2015-10-14 | 深圳雷曼光电科技股份有限公司 | Led封装方法、电路板的制作方法以及显示屏 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201725812U (zh) * | 2010-06-22 | 2011-01-26 | 福建闽威电路板实业有限公司 | 一种高散热led集成电路板 |
CN202084545U (zh) * | 2011-06-03 | 2011-12-21 | 刘世全 | Led集成模块 |
CN202134572U (zh) * | 2011-06-20 | 2012-02-01 | 联茂电子股份有限公司 | 用于结合背光模组的led散热基板 |
CN202142531U (zh) * | 2011-06-17 | 2012-02-08 | 杭州华普永明光电股份有限公司 | 一种基于金属基pcb板的led模组 |
CN102364684A (zh) * | 2011-06-17 | 2012-02-29 | 杭州华普永明光电股份有限公司 | 一种led模组及其制造工艺 |
CN102412246A (zh) * | 2011-06-17 | 2012-04-11 | 杭州华普永明光电股份有限公司 | 一种基于金属基pcb板的led模组及其制造工艺 |
CN202282384U (zh) * | 2011-10-20 | 2012-06-20 | 珠海市嘉益电子有限公司 | 一种led高密度集成封装用高反光铝基线路板 |
CN202308048U (zh) * | 2011-10-28 | 2012-07-04 | 深圳路明半导体照明有限公司 | 一种led光源模组基板 |
CN202487569U (zh) * | 2011-11-04 | 2012-10-10 | 杭州华普永明光电股份有限公司 | Led模组 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100782798B1 (ko) * | 2006-02-22 | 2007-12-05 | 삼성전기주식회사 | 기판 패키지 및 그 제조 방법 |
KR20110092809A (ko) * | 2010-02-10 | 2011-08-18 | 주식회사 아이에스티 | Led 모듈용 기판 및 led 모듈용 기판 제조 방법 |
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2012
- 2012-10-19 CN CN201210404772.2A patent/CN102916111B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201725812U (zh) * | 2010-06-22 | 2011-01-26 | 福建闽威电路板实业有限公司 | 一种高散热led集成电路板 |
CN202084545U (zh) * | 2011-06-03 | 2011-12-21 | 刘世全 | Led集成模块 |
CN202142531U (zh) * | 2011-06-17 | 2012-02-08 | 杭州华普永明光电股份有限公司 | 一种基于金属基pcb板的led模组 |
CN102364684A (zh) * | 2011-06-17 | 2012-02-29 | 杭州华普永明光电股份有限公司 | 一种led模组及其制造工艺 |
CN102412246A (zh) * | 2011-06-17 | 2012-04-11 | 杭州华普永明光电股份有限公司 | 一种基于金属基pcb板的led模组及其制造工艺 |
CN202134572U (zh) * | 2011-06-20 | 2012-02-01 | 联茂电子股份有限公司 | 用于结合背光模组的led散热基板 |
CN202282384U (zh) * | 2011-10-20 | 2012-06-20 | 珠海市嘉益电子有限公司 | 一种led高密度集成封装用高反光铝基线路板 |
CN202308048U (zh) * | 2011-10-28 | 2012-07-04 | 深圳路明半导体照明有限公司 | 一种led光源模组基板 |
CN202487569U (zh) * | 2011-11-04 | 2012-10-10 | 杭州华普永明光电股份有限公司 | Led模组 |
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CN102916111A (zh) | 2013-02-06 |
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Effective date of registration: 20201104 Address after: No. 201, Xinsheng street, Wangbao Town, Qidong City, Nantong City, Jiangsu Province, 226000 Patentee after: Qidong ouchang New Material Co., Ltd Address before: 518100 room 126, building 41, Baoan District District, Shenzhen,, Guangdong Patentee before: Yang Yongping |
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Effective date of registration: 20220331 Address after: 226000 Wang Bao Zhen Xin Gang Cun, Qidong City, Nantong City, Jiangsu Province Patentee after: Jiangsu Xintong new energy Co.,Ltd. Address before: 226000 No. 201, Xinsheng street, Wangbao Town, Qidong City, Nantong City, Jiangsu Province Patentee before: Qidong ouchang New Material Co.,Ltd. |