CN102909474B - Method for welding transparent material - Google Patents
Method for welding transparent material Download PDFInfo
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- CN102909474B CN102909474B CN201210410704.7A CN201210410704A CN102909474B CN 102909474 B CN102909474 B CN 102909474B CN 201210410704 A CN201210410704 A CN 201210410704A CN 102909474 B CN102909474 B CN 102909474B
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Abstract
A method for welding transparent material includes: selecting two types of laser capable of transmitting the transparent material to be welded, one being ultrashort pulse laser and the other being long pulse laser, and synchronizing the two laser beams and combining the beams; stacking two blocks of transparent material to be welded; allowing the laser beams to focus on an interface of the two blocks of transparent material to be welded through an objective lens; when the energy (or power) of the ultrashort pulse laser is larger than or equal to multiphoton absorption threshold intensity, allowing occurrence of multiphoton absorption (ionization) near the focus center (of the two pulse laser beams) to generate free electrons which are seed electrons capable of absorbing the long pulse laser; and when the energy of the long pulse laser (absorbed by the seed electrons) reaches a melting threshold of the material to be welded, and allowing the material near the focus center to melt and fuse and connect together so as to achieve connecting or welding. Compared with the welding method using the ultrashort pulse laser only, the method has lowered cost and improved welding efficiency. Welding of the transparent material is achieved.
Description
Technical field
The present invention relates to the welding to material, particularly a kind of method that transparent material is welded.
Background technology
Transparent material is in optics, electronic device, biological medicine and micro-optoelectronic mechanical system (MOEMS) field extensive application.But the connectivity problem of transparent material is never well solved, mainly utilize Chemical bonding agent or intermediate layer now, such connection, good mechanical performance can not be ensured, and good heat endurance and chemical stability.
There has been proposed ultra-short pulse laser welding method recently.Ultra-short pulse laser peak power is high, Multiphoton Absorbtion (ionization) can be realized, namely laser beam can permeable material surface, energy-flux density at laser spot place can meet or exceed Multiphoton Absorbtion (ionization) threshold value, material melts, if Laser Focusing is on two pieces of transparent material interfaces, with the movement of laser spot, material occurs to solidify again, realizes laser weld.But ultra-short pulse laser cost is high, power is less, and welding efficiency is restricted, become the bottleneck of practical application.
Long Pulse LASER technology maturation is applied to industrial production, but, peak power is lower, after transparent material internal focus, be not enough to realize Multiphoton Absorbtion (ionization), the metal impurities in transparent material can only be utilized to absorb Long Pulse LASER, and metal impurities distribution cannot be effectively controlled, therefore Long Pulse LASER is not when dosing absorbed layer, can not carry out effective material internal process, can only carry out material surface process.
Summary of the invention
The invention provides a kind of method that transparent material is welded, reduce cost, improve welding efficiency, described below:
To the method that transparent material welds, said method comprising the steps of:
(1) select two kinds of energy through the laser of transparent material to be welded, one is ultra-short pulse laser, and another kind is Long Pulse LASER, the power of two bundle laser match, and restraints after regulating two bundle laser synchronizations;
(2) be stacked together by two blocks of transparent materials to be welded, wherein, two blocks of transparent materials to be welded are identical or different;
(3) regulate laser optical path, make laser focus on the interface of two blocks of transparent materials to be welded by object lens;
(4) when ultra-short pulse laser energy (or power) is more than or equal to Multiphoton Absorbtion threshold value light intensity, Multiphoton Absorbtion (ionization) is there is near (two bundle of pulsed laser) focus center, produce free electron, i.e. seed electrons, seed electrons absorbs Long Pulse LASER;
(5) when the energy of the Long Pulse LASER that seed electrons absorbs reaches melting threshold, the material near focus center occurs melt and merge, and along with the movement of laser spot, the material cooling of fusing, solidifies, link together, and realizes connecting or welding.
Do not use absorbed layer between two blocks of transparent materials to be welded, transparent material comprises: glass, crystal or polymer, and two kinds of laser transmittances are all greater than 50%.
The beneficial effect of technical scheme provided by the invention is: utilize ultra-short pulse laser to produce Multiphoton Absorbtion (ionization) in transparent material inside, seed electrons being provided, utilizing seed electrons just can absorb Long Pulse LASER, when reaching melting threshold, realize ionization by collision, just can realize welding.Present approach reduces the cost only using ultra-short pulse laser, and improve welding efficiency, achieve the welding to material internal.
Accompanying drawing explanation
Fig. 1 is laser intensity distribution curve map;
Fig. 2 is the schematic diagram that the present invention adopts device;
Fig. 3 is a kind of flow chart to the method that transparent material welds provided by the invention.
In accompanying drawing, the list of parts representated by each label is as follows:
1: Multiphoton Absorbtion threshold value light intensity; 2: spot diameter;
3: laser intensity distribution curve; 4: femtosecond laser beam;
5: object lens; 6: first transparent material;
7: the second transparent materials; 8: weld zone.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, embodiment of the present invention is described further in detail.
In order to reduce costs, improve welding efficiency, embodiments provide a kind of method of welding transparent material, see Fig. 1, Fig. 2 and Fig. 3, the method comprises the following steps:
101: select two kinds of energy through the laser of transparent material to be welded, one is ultra-short pulse laser, and another kind is Long Pulse LASER, two bundle laser power match, regulate two bundle laser synchronizations after and restraint;
During specific implementation, determine the power of two kinds of laser according to the material require in practical application, it is femtosecond or picosecond level that ultra-short pulse laser chooses pulse width usually; Long Pulse LASER usually choose in nanosecond, microsecond, millisecond or continuous laser any one, the embodiment of the present invention does not limit this.
Wherein, transparent material comprises: glass, crystal and polymer, and have higher transmitance to two kinds of laser, percent of pass is greater than 50% usually.
Wherein, carry out adjustment make laser pulse synchronization to two kinds of pulse lasers, and the step of also restrainting is conventionally known to one of skill in the art, the embodiment of the present invention does not repeat at this.
102: be stacked together by two blocks of transparent materials 6 and 7 to be welded, wherein, two blocks of transparent materials 6 and 7 to be welded are identical or different;
103: regulate laser optical path, make laser focus on the interface of two blocks of transparent materials to be welded by object lens 5;
104: when the light intensity that ultra-short pulse laser energy (or power) is corresponding is more than or equal to Multiphoton Absorbtion threshold value light intensity 1, Multiphoton Absorbtion (ionization) is there is near the focus center of two bundle of pulsed laser, produce free electron, i.e. seed electrons, seed electrons absorbs Long Pulse LASER;
During specific implementation, when ultra-short pulse laser energy (or power) reaches (or exceeding) Multiphoton Absorbtion (ionization) threshold value, can be there is Multiphoton Absorbtion (ionization) in (the being greater than Multiphoton Absorbtion threshold value) subregion near focus center, in this region, produce free electron.
105: when the energy of the Long Pulse LASER that seed electrons absorbs reaches material melting threshold, the material near focus center occurs melt and merge, and along with the movement of laser spot, the material cooling of fusing, solidifies, link together, and realizes connecting or welding.
Wherein, melting threshold sets according to the material require in practical application, and during specific implementation, the embodiment of the present invention does not limit this.
With specific embodiment, this method is described in detail below:
Using quartz glass as transparent material 6 and 7 to be welded, first two panels quartz glass substrate is stacked, realize close contact.Secondly, ultra-short pulse laser adopts femtosecond or the picosecond laser oscillator (or amplifier) that pulse width is 1 ~ 10000 femtosecond, repetition rate is 0.001 ~ 100MHz, power is 0.01 ~ 100W, wavelength is 1040nm, long pulse (nanosecond/microsecond/millisecond/continuously) laser (repetition rate mate with ultra-short pulse laser, power is 1 ~ 1000W, wavelength is 1040nm), as lasing light emitter, after laser synchronizations are restrainted in adjustment two, and is restrainted, making and restrainting rear laser is that 0.01 ~ 2.0 object lens 5 focus on two pieces of quartz glass (substrate) interface to be welded by numerical aperture, laser energy is regulated to make to reach quartz glass multiphoton absorption ionization threshold value light intensity 1 near focus center place, produce free electron, i.e. seed electrons, these seed electrons absorb Long Pulse LASER, when the energy (or power) of the Long Pulse LASER absorbed is more than or equal to quartz glass melting threshold, near (quartz glass interface both sides) focus center, in (namely reaching Multiphoton Absorbtion threshold value) region, quartz glass occurs melt and merge, along with the movement of laser spot, the quartz glass of fusing is lowered the temperature rapidly, solidify, link together, realize connecting or welding.
It will be appreciated by those skilled in the art that accompanying drawing is the schematic diagram of a preferred embodiment, the invention described above embodiment sequence number, just to describing, does not represent the quality of embodiment.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (2)
1. to the method that transparent material welds, it is characterized in that, said method comprising the steps of:
(1) select two kinds of energy through the laser of transparent material to be welded, a kind of ultra-short pulse laser of to be pulse width be picosecond level, another kind is any one Long Pulse LASER in microsecond or millisecond, the power of two bundle laser match, and restraints after regulating two bundle laser synchronizations;
(2) be stacked together by two blocks of transparent materials to be welded, wherein, two blocks of transparent materials to be welded are different;
(3) regulate laser optical path, make laser focus on the interface of two blocks of transparent materials to be welded by object lens;
(4) when ultra-short pulse laser energy or power are more than or equal to Multiphoton Absorbtion threshold value light intensity, near the focus center of two bundle of pulsed laser, multiphoton absorption ionization occurs, produce free electron, i.e. seed electrons, seed electrons absorbs Long Pulse LASER;
(5) when the energy of the Long Pulse LASER that seed electrons absorbs reaches material melting threshold, the material near focus center occurs melt and merge, and along with the movement of laser spot, the material cooling of fusing, solidifies, link together, and realizes connecting.
2. a kind of method of welding transparent material according to claim 1, is characterized in that, do not use absorbed layer between two blocks of transparent materials to be welded, transparent material comprises: glass, crystal or polymer, and two kinds of laser transmittances are all greater than 50%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210410704.7A CN102909474B (en) | 2012-10-24 | 2012-10-24 | Method for welding transparent material |
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| CN201210410704.7A CN102909474B (en) | 2012-10-24 | 2012-10-24 | Method for welding transparent material |
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| CN102909474A CN102909474A (en) | 2013-02-06 |
| CN102909474B true CN102909474B (en) | 2015-05-13 |
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| CN201210410704.7A Expired - Fee Related CN102909474B (en) | 2012-10-24 | 2012-10-24 | Method for welding transparent material |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104889565A (en) * | 2015-05-27 | 2015-09-09 | 广东高聚激光有限公司 | Laser machining method and system |
| CN108520854A (en) * | 2018-04-25 | 2018-09-11 | 哈尔滨工业大学 | A method of the glass and other materials placed using UV activation bonding superposing type |
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| CN104360642B (en) * | 2014-11-17 | 2018-04-27 | 大族激光科技产业集团股份有限公司 | A kind of laser cutting machine digital control system |
| CN107199400B (en) * | 2017-07-06 | 2019-07-09 | 北京中科镭特电子有限公司 | A kind of laser soldering device |
| CN107892469A (en) * | 2017-12-15 | 2018-04-10 | 华中科技大学 | A kind of multi-laser beam closes the method and equipment of beam glass for bonding material |
| CN108581188B (en) * | 2018-06-21 | 2023-05-26 | 华中科技大学 | Method and device for welding transparent brittle material by composite laser |
| CN110788486B (en) * | 2019-11-07 | 2022-04-15 | 武汉华工激光工程有限责任公司 | Systematic precision machining method for brittle transparent material special-shaped 3D structure |
| CN111229733A (en) * | 2020-01-08 | 2020-06-05 | 天津大学 | Surface treatment method for fiber reinforced composite material |
| CN111153709A (en) * | 2020-01-16 | 2020-05-15 | 南京理工大学 | Method for connecting transparent ceramics by adopting ultra-narrow laser |
| CN111302609A (en) * | 2020-02-28 | 2020-06-19 | 江苏大学 | Method and device for double-laser-beam composite welding of glass |
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| JP2005028784A (en) * | 2003-07-07 | 2005-02-03 | Hamamatsu Photonics Kk | Laser welding method |
| EP1741510A1 (en) * | 2005-06-30 | 2007-01-10 | Samsung SDI Co., Ltd. | Glass-to-glass welding method using laser; vacuum envelope manufactured by the method; electron emission display comprising such vacuum envelope |
| CN101553340A (en) * | 2006-09-22 | 2009-10-07 | 国立大学法人大阪大学 | Substance joining method, substance joining device, joined body, and its manufacturing method |
| WO2011115243A1 (en) * | 2010-03-16 | 2011-09-22 | アイシン精機株式会社 | Pulse laser device, transparent member welding method, and transparent member welding device |
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| WO2001064591A1 (en) * | 2000-03-01 | 2001-09-07 | Heraeus Amersil, Inc. | Method, apparatus, and article of manufacture for determining an amount of energy needed to bring a quartz workpiece to a fusion weldable condition |
| DE112009001347T5 (en) * | 2008-06-11 | 2011-04-21 | Hamamatsu Photonics K.K., Hamamatsu | Melt bonding process for glass |
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2012
- 2012-10-24 CN CN201210410704.7A patent/CN102909474B/en not_active Expired - Fee Related
Patent Citations (4)
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| JP2005028784A (en) * | 2003-07-07 | 2005-02-03 | Hamamatsu Photonics Kk | Laser welding method |
| EP1741510A1 (en) * | 2005-06-30 | 2007-01-10 | Samsung SDI Co., Ltd. | Glass-to-glass welding method using laser; vacuum envelope manufactured by the method; electron emission display comprising such vacuum envelope |
| CN101553340A (en) * | 2006-09-22 | 2009-10-07 | 国立大学法人大阪大学 | Substance joining method, substance joining device, joined body, and its manufacturing method |
| WO2011115243A1 (en) * | 2010-03-16 | 2011-09-22 | アイシン精機株式会社 | Pulse laser device, transparent member welding method, and transparent member welding device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104889565A (en) * | 2015-05-27 | 2015-09-09 | 广东高聚激光有限公司 | Laser machining method and system |
| CN108520854A (en) * | 2018-04-25 | 2018-09-11 | 哈尔滨工业大学 | A method of the glass and other materials placed using UV activation bonding superposing type |
| CN108520854B (en) * | 2018-04-25 | 2020-03-31 | 哈尔滨工业大学 | Method for activating, bonding and stacking glass and other materials by utilizing ultraviolet light |
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| CN102909474A (en) | 2013-02-06 |
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