CN107892469A - A kind of multi-laser beam closes the method and equipment of beam glass for bonding material - Google Patents
A kind of multi-laser beam closes the method and equipment of beam glass for bonding material Download PDFInfo
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- CN107892469A CN107892469A CN201711350587.9A CN201711350587A CN107892469A CN 107892469 A CN107892469 A CN 107892469A CN 201711350587 A CN201711350587 A CN 201711350587A CN 107892469 A CN107892469 A CN 107892469A
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- 239000011521 glass Substances 0.000 title claims abstract description 101
- 239000000463 material Substances 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000003466 welding Methods 0.000 claims abstract description 39
- 230000003287 optical effect Effects 0.000 claims abstract description 18
- 238000010521 absorption reaction Methods 0.000 claims abstract description 8
- 230000000694 effects Effects 0.000 claims abstract description 8
- 238000002844 melting Methods 0.000 claims abstract description 8
- 230000008018 melting Effects 0.000 claims abstract description 8
- 238000002834 transmittance Methods 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims abstract description 7
- 230000008859 change Effects 0.000 claims abstract description 6
- 239000006060 molten glass Substances 0.000 claims abstract description 3
- 239000000156 glass melt Substances 0.000 claims abstract 2
- 230000009977 dual effect Effects 0.000 claims description 12
- 230000010287 polarization Effects 0.000 claims description 10
- 239000000155 melt Substances 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000007789 sealing Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 230000007423 decrease Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 241000931526 Acer campestre Species 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 210000001124 body fluid Anatomy 0.000 description 2
- 239000010839 body fluid Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical group [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 206010063493 Premature ageing Diseases 0.000 description 1
- 208000032038 Premature aging Diseases 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000001900 immune effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 231100000817 safety factor Toxicity 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/20—Uniting glass pieces by fusing without substantial reshaping
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/20—Uniting glass pieces by fusing without substantial reshaping
- C03B23/203—Uniting glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/20—Uniting glass pieces by fusing without substantial reshaping
- C03B23/24—Making hollow glass sheets or bricks
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses the method and equipment that a kind of multi-laser beam closes beam glass for bonding material.The laser beam to glass with transmittance wavelength that the present invention will be sent by ultrafast pulsed laser device, and the laser beam to glass with transmittance wavelength sent by continuous wave laser or long-pulse laser, close on beam to same optical axis, galvanometer is scanned through again and field scan focus lamp is focused at two pieces of glass contacts to be welded, ultrafast pulsed laser beam produces Nonlinear optical absorption in two blocks of glass melts the glass material near focal point region, the glass material of melting is significantly increased due to the change of absorptivity to continuous or Long Pulse LASER absorptivity, and more molten glass materials are produced by the further input of energy, to fill welded gaps without producing etching effect, complete the welding of focus area；Welding is scanned to glass material until completing welding job.The present invention improves laser welding efficiency, and can realize engineering application.
Description
Technical field
The invention belongs to laser processing application technical field, and in particular to a kind of multi-laser beam closes beam glass for bonding material
Method and equipment.
Background technology
Glass material is to be used to produce embedding microelectronic, solar cell, Organic Light Emitting Diode (OLED), micro-electro-mechanical systems
Unite (MEMS), the excellent material of the chip package such as microsensor and converter and opto-electronic device, the electronics core of glass-encapsulated
Piece is applied to the various applications of these key safety factors such as sensing rotation, acceleration and pressure, in automobile, train and other transports
The field such as industry and Aero-Space has extremely extensive and potential application value and market prospects.Such as in space, welding
Object, include encapsulation chip device imaging sensor, even if must also keep the reliable of height under the most severe conditions
Property and air-tightness.The electronic semi-conductor of rapid growth, biomedicine, many applications of area of solar cell exploitation are also same
Situation, this is due to that glass material has many advantages：Such as glass material can be regarded as a kind of " neutrality " for organism
Material, is implanted into preferable with the biocompatibility of human body fluid tissue during inside of human body, and immunological rejection will not occur.Its
It is secondary, glass material unlike the extra base material used in many adhesive or other welding processes can by corrosion in body fluid or from
Hair degraded, the service life length of glass, is unlimited for service life is substantial.Moreover, glass material is without interference with electromagnetism
Ripple, this electromagnetic wave for being advantageous to band signal penetrate the element of glass-encapsulated.It is calcium meanwhile glass has transmittance to sunshine
The preferred package material of titanium ore type and DSSC.
The glass material chips encapsulation being engineered at present substantially uses adhesive by two glass material surfaces sticks
Get up, reach encapsulation purpose.Although adhesive can connect different materials, adhesive encapsulation has following problem：First,
Adhesive release gas can cause peripheral devices to be contaminated, and cause chip performance to damage；Secondly, the easy photobleaching of adhesive
Cause premature aging so that sealing property declines, and causes chip stability to decline；Finally, it is being subjected to huge temperature change
In the case of, the stress accumulation of thermal degradation of adhesives and thermal expansion can reduce the service life of adhesive, cause the chip life-span to decline,
And glue bond strength character is low, the field application demands such as the high Aero-Space of intensity requirement are not used to.
Although laser welding technology has been widely applied in industrial processes manufacture, deposited in terms of glass for bonding material
In larger difficulty, reason is the optical maser wavelength that can be absorbed by glass, substantially acts on glass material surface, and can not be saturating
Glass material is crossed, is interacted between two panels glass material, thus laser package welding can not be carried out.If using length
Time local heating fusing glass is packaged, and because glass is hard and crisp, heat conduction ratio is lower than metal, can be because of inner tensions not
Crackle is uniformly caused to produce and rupture.But the optical maser wavelength of energy transmissive glass material, laser energy are difficult by glass material again
Absorb and interact.Once increase laser energy makes laser energy reach glass damage threshold value and interact
When, glass can increase sharply to the absorptivity of laser, and it is excessive compared with laser energy to cause that glass absorbs again, causes thermal accumlation mistake
Greatly, transmissive glass material is caused to cross thermal expansion and rupture.In addition, this fuel factor also can greatly influence brittle glass material
Transmissivity performance and cause laser package welding process bad stability so that the welding of glass material is widely regarded as one
Hang-up.
Chinese patent literature CN105377783A proposes a kind of " using low melt glass or thin absorbing film to clear glass
Piece carry out laser welding " method come realize glass medium encapsulate.But this method is only used for melting inorganic film material, without
It is fusing glass baseplate, therefore still category bonding, rather than welding, thus sealing strength performance is low, is not used to intensity requirement height
The field application demand such as Aero-Space.Further, since packed glass and the physical and chemical performance of addition inorganic material film
Have differences, cause laser package weldquality to decline because composition is different, the sealing property of encapsulation is influenceed, also due to physics
Chemical property, which has differences, causes residual stress be present because material coefficient of thermal expansion and contraction is different after laser package, is easy to split
Line and influence encapsulation service life.
Disclosed apply for a patent proposes to carry out laser welding to glass-chip using ultrafast laser in (CN 106449439A)
Encapsulation.Using the superpower intensity properties of ultra-short pulse laser, in transparent medium can produce Nonlinear optical absorption makes glass material
Melted in focal point, directly the contact position melten glass own material in two blocks of glass, realize and carried out in transparent material space
Selective microwelding.Simultaneously as laser and material interaction time are extremely short, the heat product that material is excessive can be effectively avoided
It is tired, thus transmissive glass material will not be caused to cross thermal expansion and rupture, it is favorably improved the precision and quality of welding encapsulation.Compare
Other encapsulation technologies such as bonding, the invention manufacture craft is simple, and chip thickness is unrestricted, is not required to add the filling of unlike material
Thing, strength character, stability, reliability and the service life of glass-chip encapsulation can be improved.
But at present due to this ultra-short pulse laser microwelding glass process melt glass material it is few, can not fill compared with
Big welded gaps；And increasing pulse energy can cause pulse peak power density too high and form etching and remove material effect
Should, cause glass material locally broken, good weld seam can not be formed, so will to glass surface flatness and smoothness quality
Ask very high, but also clamping glass must be fixed using fixture, make the gap of two blocks of glass less than quarter-wave (or
100nm) reach optical contact, and implementation welding is focused using the object lens of short focus, could be successfully welded.This method also has
There are focusing position and surge requirements harsh, it is necessary to realize welding by movable workbench, speed can only be maintained at several millimeters
It is per second, the shortcomings of efficiency is excessively low, it is difficult to realize engineering application.
The content of the invention
For problem above, the invention provides the method and equipment that a kind of multi-laser beam closes beam glass for bonding material, sheet
While invention can be achieved to improve glass material to the absorptivity of laser, reduce the accumulation of glass heat, and reduce glass surface
The requirement of quality, the gap of two blocks of glass is set to be less than quarter-wave without glass being fixed by fixture clamping
The larger welded gaps for being unsatisfactory for optical contact condition can be welded, and realize by the optical contact requirement of (or 100nm)
Vibration mirror scanning type laser welding, laser welding efficiency is improved, realize engineering application.
The method that a kind of multi-laser beam provided by the invention closes beam glass for bonding material, it is characterised in that：By ultrafast pulse
The laser beam to glass with transmittance wavelength that laser is sent, and sent by continuous wave laser or long-pulse laser
There is the laser beam of transmittance wavelength to glass, close on beam to same optical axis, then be scanned through galvanometer and field scan focus lamp
Focus at two pieces of glass contacts to be welded, ultrafast pulsed laser beam produces Nonlinear optical absorption in two blocks of glass to be made
The glass material melting near focal point region.The glass material of melting is because the change of absorptivity is to continuous or Long Pulse LASER
Absorptivity significantly increases, and further melts more glass materials by the energy of absorption, to fill welded gaps without producing
Etching effect, realize the welding of focus area；Glass material is carried out closing beam laser scanning welding to complete by scanning galvanometer
Whole welding job.
The laser beam sent by ultrafast pulsed laser device and by continuous wave laser or long-pulse laser send swash
Light beam wavelength is equal, and polarization direction is different；Or the laser beam sent by ultrafast pulsed laser device and by continuous laser
The laser beam wavelength that device or long-pulse laser are sent, polarization direction is similar and different, and the conjunction beam is closed using dual wavelength
Shu Jing, the scanning galvanometer and field scan focus lamp are dual wavelength.
A kind of multi-laser beam provided by the invention closes the equipment of beam glass for bonding material, it is characterised in that the equipment includes
First laser device, second laser, the first beam-expanding collimation mirror, the second beam-expanding collimation mirror, guide-lighting mirror, light combination mirror, scanning galvanometer, field
Scanning focused mirror, industrial computer and workbench；First laser device is ultrafast pulsed laser device, second laser be continuous wave laser or
Long-pulse laser, first laser device and second laser have transmittance wavelength to glass；First laser device, first expand
Collimating mirror, guide-lighting mirror and light combination mirror are located in same light path, and second laser, the second beam-expanding collimation mirror and light combination mirror are positioned at another
In light path, the same light path enters light combination mirror with another light path from mutually orthogonal direction；Scanning galvanometer is located at light combination mirror
On emitting light path, and above workbench, field scan focus lamp, industrial computer difference are provided between scanning galvanometer and workbench
It is connected with first laser device, second laser, scanning galvanometer and workbench electric signal and controls them to work；During work, by
The laser beam that one laser is sent passes through the light combination mirror that is reflected into of guide-lighting mirror, second laser again after the first beam-expanding collimation mirror
The laser beam that device is sent also enters light combination mirror after the first beam-expanding collimation mirror, and the two is closed on beam to same optical axis, then is passed through
Scanning galvanometer and field scan focus lamp are focused at two pieces of glass contacts to be welded, and ultrafast pulsed laser beam is in two blocks of glass
Producing Nonlinear optical absorption melts the glass material near focal point region, glass material the changing due to absorptivity of melting
Change significantly increases to continuous or Long Pulse LASER absorptivity, and further melts more glass materials by absorbing energy, comes
Welded gaps are filled without producing etching effect, realize the welding of focus area；Industrial computer controls scanning galvanometer or workbench to move
It is dynamic, complete the scanning welding to glass material.
The light combination mirror, scanning galvanometer and field scan focus lamp are Single wavelength, or are dual wavelength.
It is an advantage of the invention that using ultra-short pulse laser Shu Chaoqiang intensity properties, can be produced in transparent medium non-linear
Sink effect makes glass in the material molten near focal point area, and the material of molten condition is to continuous or Long Pulse LASER absorption
Rate can significantly increase, thus simply enter suitable low energy, the continuous or Long Pulse LASER power of low peak power can be direct
Interacted with the material being melted, so as to avoid low energy, low peak power and radioparent continuous or Long Pulse LASER
Shu Buneng interacts with glass, and reaching be able to can make with the high-energy and high-peak power of glass generation interaction threshold value
Glass is excessive compared with laser energy because absorbing, and causes thermal accumlation excessive, causes transmissive glass material to cross thermal expansion and asking for rupturing
Topic.On the other hand, because continuous or Long Pulse LASER peak power density is relatively low, continuous or long pulse laser input energy is increased
Amount only can expand fuel factor, without producing etching effect, thus can increase the melting amount of glass material.The glass being melted
Material is more, is filled into that the molten glass material of welded gaps is also more, is more advantageous to the glass solder of larger gap, forms weldering
The intensity and sealing property of seam are also better.Recombination laser beam can be quickly moved using bidimensional scanning galvanometer to sweep along welding track implementation
Welding is retouched, improves welding efficiency.
Brief description of the drawings
Fig. 1 is that multi-laser beam closes one of beam welding jig schematic diagram；
Fig. 2 is two schematic diagrames that multi-laser beam closes beam welding jig.
Embodiment
The embodiment of the present invention is described further below in conjunction with the accompanying drawings.Herein it should be noted that for
The explanation of these embodiments is used to help understand the present invention, but does not form limitation of the invention.It is in addition, disclosed below
As long as each embodiment of the invention in involved technical characteristic do not form conflict can each other and be mutually combined.
The structure of an example provided by the invention is as shown in figure 1, be that one kind can be more than 5 μm in two pieces of glass contact gaps
Shi Jinhang multi-laser beams close the equipment of beam welding.The equipment by first laser device 1, second laser 6, the first beam-expanding collimation mirror 3,
Second beam-expanding collimation mirror 8, guide-lighting mirror 4, light combination mirror 5, scanning galvanometer 10, field scan focus lamp 11, industrial computer 14 and workbench 15
Composition.
First laser device 1, the first beam-expanding collimation mirror 3, guide-lighting mirror 4 and light combination mirror 5 are located in same light path, second laser
6th, the second beam-expanding collimation mirror 8 and light combination mirror 5 are located in another light path, and the same light path and another light path are from orthogonal side
To entrance light combination mirror 5.Scanning galvanometer 10 is located on the emitting light path of light combination mirror 5, and positioned at the top of workbench 15, scanning galvanometer 10
Field scan focus lamp 11 is provided between workbench 15.Industrial computer 14 respectively with first laser device 1, second laser 6, scanning
Galvanometer 10 and/or the connection of the electric signal of workbench 15, for controlling them to work.
First laser device 1 is ultrafast pulsed laser device, and the wave-length coverage of output beam is 266-2000nm.Second laser
6 be continuous wave laser or long-pulse laser, and long pulse typically refers to be more than 1ns, the wavelength model of the output beam of second laser 6
Enclose for 266-2000nm.
During work, the scope (266-2000nm) of the output wavelength of first laser device 1 simultaneously has P (or S) polarized laser beam 2,
After the beam-expanding collimation of beam-expanding collimation mirror 3, laser beam 2 is imported into reflection of the light combination mirror 5 to P (or S) polarization laser by guide-lighting mirror 4
End；The scope (266-2000nm) of the output wavelength of second laser 6 simultaneously has S (or P) polarized laser beam 7, by beam-expanding collimation
After the beam-expanding collimation of mirror 8, transmission end of the input light combination mirror 5 to S (or P) polarization laser.After laser beam 2 and 7 has passed through light combination mirror 5,
The laser beam 9 with optical axis is synthesized, and inputs scanning galvanometer 10, the connection of glass 12 to be welded is focused on through field scan focus lamp 11
Place 13.Industrial computer 14 controls first laser device 1, second laser 6 and scanning galvanometer 10 or workbench 15 to glass for bonding 12
Scanning welding is implemented in junction 13, completes glass solder.
When light combination mirror 5 is from dual wavelength light combination mirror 16, scanning galvanometer 10 and field scan focus lamp 11 are correspondingly from double
Length scanning galvanometer 19 and dual wavelength field scan focus lamp 20, its structural representation is as shown in Figure 2.
During work, scope (266-2000nm) laser beam 2 of the output wavelength of first laser device 1, expand by beam-expanding collimation mirror 3
After beam collimation, laser beam 2 is imported into dual wavelength light combination mirror 16 by guide-lighting mirror 4 has the one side of reflection function to the wavelength laser；
The scope (266-2000nm) of the output wavelength of second laser 6 simultaneously has the laser beam 17 of different wave length, expands by beam-expanding collimation mirror 8
After beam collimation, input dual wavelength light combination mirror 16 has the one side of transmission function to the wavelength laser.Laser beam 2 and 17 has passed through double
After wavelength coupling mirror 16, the laser beam 18 of same optical axis is synthesized, and inputs double-wavelength scan galvanometer 19, is focused on through dual wavelength field scan
Mirror 20 focuses on the junction 13 of glass 12 to be welded.Industrial computer 14 controls first laser device 1, second laser 6 and dual wavelength
Scanning galvanometer 19 or workbench 15 implement scanning welding to the junction 13 of glass for bonding 12, complete glass solder.
Instantiation：
Example 1：Beam process unit is closed using the first multi-laser beam as shown in Figure 1, the use of pulsewidth is 10 psecs, wavelength
The ultrashort second for 1064nm and output P polarization direction laser beam rushes laser and wavelength is 1064nm and output S-polarization direction
The jointed fiber laser of laser beam.The ultrashort second rushes laser output power and repetition rate is respectively 15W and 10MHz, continuously
Optical fiber laser power output is 10W, scan rate of vibrating mirror 1000mm/s.Distance is 8 μm between two blocks of soda-lime glass, closes Shu Ji
Light beam focus point contact position between two blocks of soda-lime glass, carries out vibration mirror scanning welding, obtains sealing and intensity is good
Weld seam.
Example 2：Beam process unit is closed using the first multi-laser beam as shown in Figure 1, the use of pulsewidth is 10 psecs, wavelength
The ultrashort second for 1064nm and output P polarization direction laser beam rushes laser and wavelength is 1064nm and output S-polarization direction
The jointed fiber laser of laser beam.The ultrashort second rushes laser output power and repetition rate is respectively 20W and 10MHz, continuously
Optical fiber laser power output is 25W, scan rate of vibrating mirror 1000mm/s, and distance is 12 μm between two blocks of quartz glass, closes beam
Laser beam focus points contact position between two blocks of quartz glass, carries out vibration mirror scanning welding, obtains sealing and intensity is good
Good weld seam.
Example 3：Beam process unit is closed using second of multi-laser beam as shown in Figure 2, the use of pulsewidth is 10 psecs, wavelength
The ultrashort second for 532nm and output P polarization direction laser beam rushes laser and wavelength is 1064nm and output random polarization side
To the jointed fiber laser of laser beam.The ultrashort second rushes laser output power and repetition rate is respectively 10W and 10MHz, connects
Continuous optical fiber laser power output be 20W, scan rate of vibrating mirror 1000mm/s, and distance is 10 μm between two pieces of white glasses, conjunction beam
Laser beam focus points contact position between two pieces of white glasses, carry out vibration mirror scanning and workbench and connect pattern welding, obtain
Large area sealing and the good weld seam of intensity.
Described above is presently preferred embodiments of the present invention, but the present invention should not be limited to the embodiment and accompanying drawing institute
Disclosure.So every do not depart from the lower equivalent or modification completed of spirit disclosed in this invention, guarantor of the present invention is both fallen within
The scope of shield.
Claims (6)
1. a kind of method that multi-laser beam closes beam glass for bonding material, it is characterised in that：Pair sent by ultrafast pulsed laser device
Glass has the laser beam of transmittance wavelength, and has transmission to glass by what continuous wave laser or long-pulse laser were sent
Property wavelength laser beam, close on beam to same optical axis, then be scanned through galvanometer and field scan focus lamp focus on it is to be welded
At two pieces of glass contacts, ultrafast pulsed laser beam produces Nonlinear optical absorption in two blocks of glass to be made near focal point region
Glass material melts, and the glass material of melting significantly increases due to the change of absorptivity to continuous or Long Pulse LASER absorptivity
By force, and by absorbing energy more glass materials are further melted, to fill welded gaps without producing etching effect, realized burnt
The welding in point region；Welding is scanned to glass material until completing welding job.
2. according to the method for claim 1, it is characterised in that the laser beam sent by ultrafast pulsed laser device and by
The laser beam wavelength that continuous wave laser or long-pulse laser are sent is equal, and polarization direction is different.
3. according to the method for claim 1, it is characterised in that the laser beam sent by ultrafast pulsed laser device and by
The laser beam wavelength that continuous wave laser or long-pulse laser are sent, polarization direction is similar and different, and the conjunction beam uses
Dual wavelength light combination mirror, the scanning galvanometer and field scan focus lamp are dual wavelength.
4. a kind of multi-laser beam closes the equipment of beam glass for bonding material, it is characterised in that the equipment includes first laser device, second
Laser, the first beam-expanding collimation mirror, the second beam-expanding collimation mirror, guide-lighting mirror, light combination mirror, scanning galvanometer, field scan focus lamp, industry control
Machine and workbench；
First laser device is ultrafast pulsed laser device, and second laser is continuous wave laser or long-pulse laser, first laser
Device and second laser have transmittance wavelength to glass；First laser device, the first beam-expanding collimation mirror, guide-lighting mirror and light combination mirror
In same light path, second laser, the second beam-expanding collimation mirror and light combination mirror are located in another light path, the same light path with
Another light path enters light combination mirror from mutually orthogonal direction；Scanning galvanometer is located on the emitting light path of light combination mirror, and is located at work
Above platform, be provided with field scan focus lamp between scanning galvanometer and workbench, industrial computer respectively with first laser device, second laser
Device, scanning galvanometer connect with workbench electric signal and control them to work；
During work, by the laser beam that first laser device is sent after the first beam-expanding collimation mirror being reflected into by guide-lighting mirror again
Light combination mirror, the laser beam that second laser is sent also enter light combination mirror after the first beam-expanding collimation mirror, and the two closes beam to same
On individual optical axis, then it is scanned through galvanometer and field scan focus lamp is focused at two pieces of glass contacts to be welded, ultrafast pulse swashs
Light beam produces Nonlinear optical absorption in two blocks of glass melts the glass material near focal point region, the glass material of melting
Material produces because the change of absorptivity significantly increases to continuous or Long Pulse LASER absorptivity, and by the further input of energy
Raw more molten glass materials, to fill welded gaps without producing etching effect, complete the welding of focus area；Industrial computer control
Scanning galvanometer processed or movable workbench, complete the scanning welding to glass material.
5. equipment according to claim 4, it is characterised in that the light combination mirror, scanning galvanometer and field scan focus lamp are equal
For Single wavelength.
6. equipment according to claim 4, it is characterised in that the light combination mirror, scanning galvanometer and field scan focus lamp are equal
For dual wavelength.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711350587.9A CN107892469A (en) | 2017-12-15 | 2017-12-15 | A kind of multi-laser beam closes the method and equipment of beam glass for bonding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711350587.9A CN107892469A (en) | 2017-12-15 | 2017-12-15 | A kind of multi-laser beam closes the method and equipment of beam glass for bonding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107892469A true CN107892469A (en) | 2018-04-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711350587.9A Pending CN107892469A (en) | 2017-12-15 | 2017-12-15 | A kind of multi-laser beam closes the method and equipment of beam glass for bonding material |
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| CN (1) | CN107892469A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108581188A (en) * | 2018-06-21 | 2018-09-28 | 华中科技大学 | A kind of recombination laser welds the method and device of transparent fragile material |
| CN109719088A (en) * | 2019-01-24 | 2019-05-07 | 武汉锐科光纤激光技术股份有限公司 | Laser cleaner |
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| CN110303257A (en) * | 2019-07-30 | 2019-10-08 | 华中科技大学 | A kind of laser compound cuts separate the method and device of transparent fragile material |
| CN110422993A (en) * | 2019-07-03 | 2019-11-08 | 大族激光科技产业集团股份有限公司 | Method for laser welding and device |
| CN110560896A (en) * | 2019-08-23 | 2019-12-13 | 大族激光科技产业集团股份有限公司 | laser welding device and welding method thereof |
| CN110660919A (en) * | 2018-06-29 | 2020-01-07 | 湖北万度光能有限责任公司 | Packaging method of perovskite solar cell |
| CN111302609A (en) * | 2020-02-28 | 2020-06-19 | 江苏大学 | Method and device for double-laser-beam composite welding of glass |
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| WO2023278239A1 (en) * | 2021-07-02 | 2023-01-05 | Corning Incorporated | Glass substrate joining method |
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| CN108581188A (en) * | 2018-06-21 | 2018-09-28 | 华中科技大学 | A kind of recombination laser welds the method and device of transparent fragile material |
| CN110660919B (en) * | 2018-06-29 | 2023-04-28 | 湖北万度光能有限责任公司 | Encapsulation method of perovskite solar cell |
| CN110660919A (en) * | 2018-06-29 | 2020-01-07 | 湖北万度光能有限责任公司 | Packaging method of perovskite solar cell |
| CN109719088A (en) * | 2019-01-24 | 2019-05-07 | 武汉锐科光纤激光技术股份有限公司 | Laser cleaner |
| CN109719088B (en) * | 2019-01-24 | 2023-10-24 | 武汉锐科光纤激光技术股份有限公司 | Laser cleaning device |
| CN110076450A (en) * | 2019-05-10 | 2019-08-02 | 华中科技大学 | Double light beam laser processing optical system |
| CN110422993A (en) * | 2019-07-03 | 2019-11-08 | 大族激光科技产业集团股份有限公司 | Method for laser welding and device |
| CN110303257A (en) * | 2019-07-30 | 2019-10-08 | 华中科技大学 | A kind of laser compound cuts separate the method and device of transparent fragile material |
| CN110303257B (en) * | 2019-07-30 | 2024-02-02 | 华中科技大学 | Method and device for separating transparent brittle material by laser composite cutting |
| CN110560896A (en) * | 2019-08-23 | 2019-12-13 | 大族激光科技产业集团股份有限公司 | laser welding device and welding method thereof |
| CN111302609A (en) * | 2020-02-28 | 2020-06-19 | 江苏大学 | Method and device for double-laser-beam composite welding of glass |
| CN111515526A (en) * | 2020-05-15 | 2020-08-11 | 广东正业科技股份有限公司 | Multi-beam processing device and method |
| CN113340814A (en) * | 2021-05-20 | 2021-09-03 | 武汉大学 | Material increase manufacturing laser ultrasonic online detection device and method based on receiving coaxiality |
| US20230010132A1 (en) * | 2021-07-02 | 2023-01-12 | Corning Incorporated | Glass substrate joining method |
| WO2023278239A1 (en) * | 2021-07-02 | 2023-01-05 | Corning Incorporated | Glass substrate joining method |
| CN114261100A (en) * | 2021-12-17 | 2022-04-01 | 北京工业大学 | Method for welding transparent hard and brittle material and metal by ultrafast laser |
| CN114261100B (en) * | 2021-12-17 | 2024-03-26 | 北京工业大学 | Method for ultra-fast laser welding of transparent hard and brittle material and metal |
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