CN111153709A - Method for connecting transparent ceramics by adopting ultra-narrow laser - Google Patents
Method for connecting transparent ceramics by adopting ultra-narrow laser Download PDFInfo
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- CN111153709A CN111153709A CN202010048388.8A CN202010048388A CN111153709A CN 111153709 A CN111153709 A CN 111153709A CN 202010048388 A CN202010048388 A CN 202010048388A CN 111153709 A CN111153709 A CN 111153709A
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/001—Joining burned ceramic articles with other burned ceramic articles or other articles by heating directly with other burned ceramic articles
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/52—Pre-treatment of the joining surfaces, e.g. cleaning, machining
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/60—Forming at the joining interface or in the joining layer specific reaction phases or zones, e.g. diffusion of reactive species from the interlayer to the substrate or from a substrate to the joining interface, carbide forming at the joining interface
Abstract
The invention belongs to the field of transparent ceramic connection, and particularly relates to a method for connecting transparent ceramics by adopting ultra-narrow laser. Using a pulse width of 10‑12s to 10‑15And (3) scanning the positions to be connected of the transparent ceramics by the ultrashort pulse laser with the s scale to realize the connection of the transparent ceramics. The invention utilizes the ultra-narrow laser with ultra-strong light intensity characteristic to generate nonlinear absorption in the transparent ceramic, and the ultra-narrow laser and the transparent ceramic act because of threshold effect of multiphoton absorption and Gaussian characteristic of laser beams, so that the structure size of the ultra-narrow laser processing can break through the optical diffraction limit, even the nano-size precision processing smaller than the laser wavelength can be realized, and the selective micro-welding of the three-dimensional space of the transparent ceramic can be realized.
Description
Technical Field
The invention belongs to the field of transparent ceramic connection, and particularly relates to a method for connecting transparent ceramics by adopting ultra-narrow laser.
Background
Transparent ceramics are ceramics that are transparent to light. The transparent ceramic not only has good transparency and optical characteristics, but also keeps the high strength, corrosion resistance, high temperature resistance, good electrical insulation, high thermal conductivity and good dielectric property of the structural ceramic, so that the transparent ceramic is increasingly applied to the fields of novel lighting technology, observation windows under high temperature, high pressure and corrosive environment, windows for infrared detection, protective fairings for missiles, transparent armor for military use and the like, and continuously provides new requirements for the connection of the transparent ceramic.
The existing main modes for connecting the transparent ceramics include adhesive bonding, solid diffusion welding, laser micro-welding and the like.
Bonding is the use of an adhesive to join two surfaces, although adhesives can join dissimilar materials, the release of gases from the adhesive, photobleaching, premature aging, and potential contamination of surrounding devices, and stress build-up from thermal degradation and expansion of the adhesive can reduce the useful life of the adhesive in situations where large temperature changes are to be experienced, such as in aerospace applications and high power laser designs.
Solid state diffusion welding refers to a connection mode that materials are not melted and mainly depends on diffusion among atoms, different ceramic materials can be welded by diffusion welding, large-area welding can be achieved, but the preparation requirement of surfaces to be welded is high, and the welding time is long.
The laser micro-welding is a welding technology for realizing the dimension smaller than 100mm on at least one dimension by using laser, and is used as a substitute scheme of precision resistance spot welding, and the laser micro-welding has the advantages of high connection strength, high precision, flexibility, non-contact, small heat affected zone and heat distortion, less limitation on the shape of a workpiece, single-step operation and the like; however, the existing laser micro-welding mainly adopts continuous and long pulse laser, which can only process the medium surface which is not transparent to the wavelength of the laser, and the energy is difficult to be absorbed by the transparent material, meanwhile, the ceramic material is brittle, the ceramic material is easy to crack due to thermal expansion in the welding process, and in addition, the heat effect can also greatly influence the performances of the ceramic such as the transmissivity and the like, so that the micro-welding of the transparent ceramic is widely considered as a big problem.
Disclosure of Invention
The invention aims to provide a method for connecting transparent ceramics by adopting ultra-narrow laser.
The technical solution for realizing the purpose of the invention is as follows: a method for connecting transparent ceramics by ultra-narrow laser with pulse width of 10-12s to 10-15And (3) scanning the positions to be connected of the transparent ceramics by the ultrashort pulse laser with the s scale to realize the connection of the transparent ceramics.
Further, the energy density of the ultrashort pulse laser is 0.1J/cm2～2J/cm2。
Further, when the width of the to-be-connected part of the transparent ceramic is larger than 20mm, a time domain shaping light path and a plurality of paths of parallel light sources are adopted; when the width of the position to be connected is less than 20mm, a common light path and a single-path light source are adopted.
Further, the method specifically comprises the following steps:
step (1): pretreating the transparent ceramics to be connected;
step (2): fixing the treated transparent ceramic on a movable processing platform;
and (3): connecting the transparent ceramics by adopting ultrashort pulse laser scanning;
and (4): and after the connection is finished, taking down the transparent ceramic after the transparent ceramic is cooled to room temperature.
Further, the pretreatment in the step (1) specifically includes:
step (1-1): polishing treatment: sequentially polishing the parts to be connected by four kinds of abrasive paper with different roughness, and sequentially polishing the parts to be connected by two kinds of diamond polishing agents with different types;
step (1-2): ultrasonic cleaning: ultrasonic cleaning is carried out in a cleaning solution for 10-30 minutes, so that optical contact is realized at the joint surface of the transparent ceramic.
Further, the connecting the transparent ceramics by using ultrashort pulse laser scanning in the step (3) specifically comprises:
the laser transmission direction is opposite to the to-be-connected position of the transparent ceramics, the geometric shape of a welding line is preset, the pulse width, the repetition frequency, the pulse energy and the welding speed of the laser are adjusted, the moving speed, the scanning speed and the scanning track interval of the processing platform are changed, and the laser is focused on the to-be-connected position of the transparent ceramics to complete scanning connection.
Furthermore, the repetition frequency of the laser is 1 kHz-1 MHz, and the welding speed is 10 mm/s-90 mm/s.
Furthermore, the geometric shape of the preset welding line is a parallel straight line, a spiral shape, an S-shaped or a Z-shaped track which is arranged at intervals.
Compared with the prior art, the invention has the remarkable advantages that:
(1) the invention utilizes the ultra-narrow laser with ultra-strong light intensity characteristic to generate nonlinear absorption in the transparent ceramic, and the ultra-narrow laser and the transparent ceramic act because of threshold effect of multiphoton absorption and Gaussian characteristic of laser beams, so that the structure size of the ultra-narrow laser processing can break through the optical diffraction limit, even the nano-size precision processing smaller than the laser wavelength can be realized, and the selective micro-welding of the three-dimensional space of the transparent ceramic can be realized.
(2) The method has extremely short interaction time with the material, effectively avoids obvious thermal diffusion and thermal damage of the material, has small thermal stress and is not easy to generate cracks and sputtering;
(3) the method has the advantages that the processing range is only near the focal spot, the edge of a processing area is smooth, and the processing precision is extremely high;
(4) the method of the invention does not need to add filler or intermediate layer in the welding material, and the welding material has high connection strength and no pollution.
Drawings
FIG. 1 is a schematic view of femtosecond laser bonding between transparent ceramics according to the present invention.
Description of reference numerals:
1-lens, 2-femtosecond laser, 3-one piece of transparent ceramic, 4-clamp, 5-processing platform and 6-another piece of transparent ceramic.
Detailed Description
Ultra-narrow laser refers to a pulse width of picoseconds (10)-12s) to femtosecond (10)-15s) scale ofThe ultrashort pulse laser, femtosecond laser, is an ultranarrow laser, which has the outstanding advantages of high processing precision, small heat affected zone, difficult fracture, high connection strength, capability of space selective processing and the like, and has received more and more attention in the field of micro-welding in recent years. When the light intensity of the narrow laser exceeds a certain threshold value, nonlinear absorption can be generated inside the transparent medium, and materials are melted at a focus to realize micro-welding of the transparent medium, so that the method has important significance for connecting the transparent ceramics.
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further clarified with the attached drawings.
As shown in FIG. 1, the method for connecting transparent ceramics by ultra-narrow laser comprises the preparation of transparent ceramic workpieces to be connected and the pretreatment of polishing, cleaning and drying sequences of the surfaces to be connected, wherein instantaneous melting is induced by strong laser femtosecond laser to realize the connection and combination between the transparent ceramics.
The method comprises the following steps:
the first step is as follows: the transparent ceramics 3 and 6 are processed to ensure that the surfaces to be connected are completely the same and can be matched;
the second step is that: and then, performing surface pretreatment on the connecting surface of the transparent ceramics 3 and 6: firstly, polishing treatment is carried out, then surface cleaning is carried out, so that the optical contact with extremely small material gaps is realized at the joint of the transparent ceramic connecting surfaces, and impurities such as oil stains, dust and the like do not exist so as to ensure that the sample is effectively prevented from being broken and the connecting energy is enhanced;
the third step: two pieces of transparent ceramics 3 and 6 of which the surfaces are pretreated are placed on a connecting working platform 5 of a femtosecond fiber laser, and are fixed by a clamp 4 to ensure that no gap exists between the transparent ceramics and no change of spatial positions occurs in the connecting process;
the fourth step: a femtosecond laser welding gun is adopted to emit laser 2 for scanning connection, the laser transmission direction is over against the transparent ceramic, the geometric shape of a welding line is preset, laser parameters such as the pulse width, the repetition frequency and the pulse energy of the laser are adjusted, and process parameters such as the moving speed, the scanning speed and the scanning track interval of a processing platform are changed, so that the laser 2 is focused on a joint surface through a lens 1 to complete the scanning connection;
the fifth step: and after the laser connection is finished, waiting for a period of time until the workpieces 3 and 6 to be welded are completely cooled to room temperature, then dismounting the fixture 4 and taking out the workpieces.
The principle of the invention is as follows: when the ultra-narrow laser with higher intensity irradiates the transparent ceramic, a nonlinear process such as multiphoton absorption, tunnel ionization or avalanche ionization is a main mechanism for forming free carriers in the material, the multiphoton absorption or tunnel ionization excites free electrons from a valence band to a conduction band, seed electrons are further accelerated through reverse bremsstrahlung, if the kinetic energy of the seed electrons is large enough, the number of the electrons can be further and rapidly increased through avalanche ionization, when the density of the seed electrons reaches a critical density, plasma is formed, and the plasma absorbs laser energy in a mode of reverse bremsstrahlung; under the control of proper process reference, the femtosecond laser forms a light wire generated by the self-focusing balance of plasma diffraction and the Kerr effect in the transparent ceramics during welding, the focusing area is elongated along the optical axis, the high-intensity light wire induces the non-linear absorption field ionization (multiphoton absorption and tunnel ionization) and avalanche ionization, the non-linear absorption causes the electron ionization in the focal volume to generate plasma, the materials at the interface are melted to form a liquid pool, and the liquid pool is solidified after the gap between the materials is filled at the interface to connect the two transparent ceramics.
Claims (8)
1. A method for connecting transparent ceramics by adopting ultra-narrow laser is characterized in that the pulse width is 10-12s to 10- 15And (3) scanning the positions to be connected of the transparent ceramics by the ultrashort pulse laser with the s scale to realize the connection of the transparent ceramics.
2. The method of claim 1, wherein the energy density of the ultrashort pulse laser is 0.1J/cm2～2J/cm2。
3. The method according to claim 2, characterized in that when the width of the transparent ceramics to be connected is more than 20mm, a time-domain shaping light path and a plurality of parallel light sources are adopted; when the width of the position to be connected is less than 20mm, a common light path and a single-path light source are adopted.
4. The method according to claim 3, characterized in that it comprises in particular the steps of:
step (1): pretreating the transparent ceramics to be connected;
step (2): fixing the treated transparent ceramic on a movable processing platform;
and (3): connecting the transparent ceramics by adopting ultrashort pulse laser scanning;
and (4): and after the connection is finished, taking down the transparent ceramic after the transparent ceramic is cooled to room temperature.
5. The method according to claim 4, wherein the pre-treatment in step (1) comprises in particular:
step (1-1): polishing treatment: sequentially polishing the parts to be connected by four kinds of abrasive paper with different roughness, and sequentially polishing the parts to be connected by two kinds of diamond polishing agents with different types;
step (1-2): ultrasonic cleaning: ultrasonic cleaning is carried out in a cleaning solution for 10-30 minutes, so that optical contact is realized at the joint surface of the transparent ceramic.
6. The method according to claim 4, wherein the connecting the transparent ceramics by using ultrashort pulse laser scanning in the step (3) is specifically:
the laser transmission direction is opposite to the to-be-connected position of the transparent ceramics, the geometric shape of a welding line is preset, the pulse width, the repetition frequency, the pulse energy and the welding speed of the laser are adjusted, the moving speed, the scanning speed and the scanning track interval of the processing platform are changed, and the laser is focused on the to-be-connected position of the transparent ceramics to complete scanning connection.
7. The method of claim 6, wherein the laser has a repetition rate of 1kHz to 1MHz and a welding speed of 10mm/s to 90 mm/s.
8. The method of claim 6 wherein the predetermined weld line geometry is a spaced parallel straight, spiral, S-shaped or Z-shaped trace.
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| CN116041083A (en) * | 2022-12-20 | 2023-05-02 | 北京工业大学 | Ultrafast laser connection method for transparent ceramic and monocrystalline silicon |
| CN116768645A (en) * | 2022-03-09 | 2023-09-19 | 北京工业大学 | Ultrafast laser connection method for transparent ceramics and metal |
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Cited By (2)
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Application publication date: 20200515 |