CN102896106B - Ultrasonic cleaning device for silicon wafers - Google Patents
Ultrasonic cleaning device for silicon wafers Download PDFInfo
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- CN102896106B CN102896106B CN201110208933.6A CN201110208933A CN102896106B CN 102896106 B CN102896106 B CN 102896106B CN 201110208933 A CN201110208933 A CN 201110208933A CN 102896106 B CN102896106 B CN 102896106B
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- cell body
- pure water
- rinsing cell
- rinsing
- inlet manifold
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 59
- 239000010703 silicon Substances 0.000 title claims abstract description 59
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 58
- 238000004506 ultrasonic cleaning Methods 0.000 title claims abstract description 28
- 235000012431 wafers Nutrition 0.000 title abstract 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 78
- 210000005056 cell body Anatomy 0.000 claims description 119
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 9
- 230000007423 decrease Effects 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 24
- 239000002699 waste material Substances 0.000 abstract description 7
- 230000000875 corresponding effect Effects 0.000 description 19
- 238000000034 method Methods 0.000 description 14
- 210000004027 cell Anatomy 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 4
- 239000010865 sewage Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000005416 organic matter Substances 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 235000008216 herbs Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Abstract
An embodiment of the invention discloses an ultrasonic cleaning device for silicon wafers. The device comprises a plurality of sequentially arrayed rinsing tanks, ultrasonic devices, a pure water inlet manifold and a pure water switch electromagnetic valve, wherein each ultrasonic device is arranged on the corresponding rinsing tank, the pure water inlet manifold is connected with one of the sequentially arrayed rinsing tanks, the pure water switch electromagnetic valve is arranged on the pure water inlet manifold, and each two adjacent rinsing tanks are mutually communicated. Since each two adjacent rinsing tanks are mutually communicated, and the pure water inlet manifold is only connected with one rinsing tank, the utilization rate of pure water can be increased during cleaning of the silicon wafers in a large quantity, and waste of the pure water is avoided.
Description
Technical field
The present invention relates to semiconductor device fabrication process technical field, more particularly, relate to a kind of silicon chip ultrasonic cleaning equipment.
Background technology
Silicon chip is the carrier of solar cell, the quality of Si wafer quality directly determines the height of conversion efficiency of solar cell, and the key factor affecting Si wafer quality quality is the cleanliness factor of silicon chip surface, therefore, in order to make solar cell have higher conversion efficiency, first need to ensure that silicon chip surface has higher cleanliness factor.
In order to make silicon chip surface have higher cleanliness factor, need to clean silicon chip, wherein, cleaning process comprises chemical liquid cleaning and the pure water ultrasonic cleaning in later stage in early stage.After carrying out the cleaning of antecedent chemical liquid to silicon chip, silicon chip surface can residual acid, alkali or surfactant-based organic matter etc., and these materials remaining in silicon chip surface can produce harmful effect in follow-up process for etching, as color spot, turns white or non-making herbs into wool etc.; In addition, if silicon chip surface has the residual of metal ion or particle, the conversion efficiency of solar cell will be affected.Therefore, the later stage needs to carry out ultrasonic cleaning with a large amount of pure water to silicon chip, to remove silicon chip surface residual particle, metal and organic matter etc.
4., 5., 6. existing structural representation silicon chip being carried out to the device of pure water ultrasonic cleaning as shown in Figure 1, there is shown three rinsing cell bodies of ultrasonic cleaning equipment; 4., 5., 6. these three rinsing cell bodies connect independently inlet valve respectively, and 1., 2., 3., 10. 1., 2., 3. inlet valve be all communicated with pure water water inlet manifold; And 7., 8., 9. 4., 5., 6. these three rinsing cell bodies be respectively arranged with single-stage overflow area, in figure, arrow direction is the overflow direction of pure water in cell body; 4., 5., 6. corresponding rinsing cell body is gone up and is also respectively arranged with computer heating control switch and temperature controller A, C, E; In addition, 4., 5., 6. rinsing cell body is gone up and is also respectively arranged with ultrasonic gauge tap B, D, F.
When there being silicon chip to need cleaning in cell body, need the inlet valve of the corresponding cell body of manual rotation, and by the inlet valve that rotates corresponding cell body to the position of 45° angle to control flow of inlet water, can overflow from corresponding overflow area when the pure water in cell body reaches certain capacity; The ultrasonic gauge tap of the corresponding cell body of manual unlocking, computer heating control switch and temperature controller is also needed in cleaning process.After Wafer Cleaning being reached to the stipulated time (as 5min), silicon chip need be moved into the second rinsing cell body, now need to open inlet valve, ultrasonic gauge tap corresponding on the second rinsing cell body, close inlet valve, ultrasonic gauge tap corresponding on the first rinsing cell body simultaneously, after being reached to Wafer Cleaning in the second rinsing cell body the stipulated time, then moved into the 3rd rinsing cell body and cleaned.
Because silicon chip is all that batch is produced, therefore, be also that multiple silicon chip carries out simultaneously when ultrasonic cleaning is carried out to silicon chip.But, because the inlet valve of cell body each in existing ultrasonic cleaning equipment and overflow area are all independently, therefore, when needing when all there being silicon chip in three cell bodies to clean, then need to open inlet valve corresponding to described three cell bodies simultaneously, and now pure water is discharged from the overflow area that three cell bodies are corresponding, this just makes the utilization rate of pure water not high, causes the waste of a large amount of pure water.
Summary of the invention
In view of this, the invention provides a kind of silicon chip ultrasonic cleaning equipment, this device can improve the utilization rate of pure water, avoids the waste of a large amount of pure water.
For achieving the above object, the invention provides following technical scheme:
A kind of silicon chip ultrasonic cleaning equipment, this device comprises:
Multiple rinsing cell body be arranged in order;
Be arranged on the Vltrasonic device on each rinsing cell body;
The pure water water inlet manifold be connected with a cell body in described multiple rinsing cell body be arranged in order;
Be arranged on the pure water switch electromagnetic valve on described pure water water inlet manifold;
Wherein, in described multiple rinsing cell body, adjacent rinsing cell body is interconnected.
Preferably, in said apparatus, described Vltrasonic device comprises: ultrasonic gauge tap and ultrasonic gauge.
Preferably, in said apparatus, the multiple ultrasonic gauge tap in multiple Vltrasonic device is parallel with one another;
Multiple ultrasonic gauge tap after parallel connection is connected with described pure water switch electromagnetic valve.
Preferably, said apparatus also comprises:
Be arranged on described pure water water inlet manifold, in order to regulate the Flow-rate adjustment controller of pure water flow of inlet water.
Preferably, in said apparatus, the rinsing cell body be connected with described pure water water inlet manifold is the rinsing cell body of the one end in described multiple rinsing cell body be arranged in order, and the rinsing cell body be connected with described pure water water inlet manifold is the first rinsing cell body.
Preferably, in said apparatus, adjacent rinsing cell body is interconnected by the limbers of cell body sidewall, and described limbers height is formula decline in gradient from the first rinsing cell body.
Preferably, in said apparatus, the number of described rinsing cell body is 3.
Preferably, said apparatus also comprises temperature control equipment.
Preferably, in said apparatus, described temperature control equipment comprises: be arranged on the computer heating control switch on each rinsing cell body and temperature controller.
Preferably, in said apparatus, described temperature control equipment is specially: be arranged on the constant temperature thermal source on pure water water inlet manifold.
As can be seen from technique scheme, silicon chip ultrasonic cleaning equipment provided by the present invention comprises: multiple rinsing cell body be arranged in order; Be arranged on the Vltrasonic device on each rinsing cell body; The pure water water inlet manifold be connected with a cell body in described multiple rinsing cell body be arranged in order; Be arranged on the pure water switch electromagnetic valve on described pure water water inlet manifold; Wherein, in described multiple rinsing cell body, adjacent rinsing cell body is interconnected.Silicon chip ultrasonic cleaning equipment provided by the present invention, rinsing cell body adjacent in multiple rinsing cell body is interconnected, this just makes described multiple potcher body form a total rinsing cell body be communicated with, when cleaning a large amount of silicon chip, only described a large amount of silicon chip need be put into corresponding rinsing cell body respectively, and open pure water water inlet manifold, like this, first pure water flows into the rinsing cell body be connected with pure water water inlet manifold, in succession flow into all the other rinsing cell bodies afterwards, because described multiple potcher body forms a total rinsing cell body be communicated with, therefore, can only discharge from the rinsing cell body of the one or both ends of multiple rinsing cell body be arranged in order the sewage after Wafer Cleaning, thus when cleaning a large amount of silicon chip, the utilization rate of pure water can be improved, avoid the waste of pure water.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of silicon chip cleaning device structural representation in prior art;
A kind of silicon chip cleaning device structural representation that Fig. 2 provides for the embodiment of the present invention;
The another kind of silicon chip cleaning device structural representation that Fig. 3 provides for the embodiment of the present invention;
The electrical block diagram of the ultrasonic gauge tap that Fig. 4 provides for the embodiment of the present invention and pure water switch electromagnetic valve.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment one
With reference to the structural representation of a kind of silicon chip ultrasonic cleaning equipment that figure 2, Fig. 2 provides for the embodiment of the present invention, this silicon chip ultrasonic cleaning equipment comprises: three rinsing cell bodies be arranged in order
and limbers
by these three rinsing cell bodies
be connected; Rinsing cell body
10. be connected with pure water water inlet manifold, therefore, first pure water can enter rinsing cell body
in, when rinsing cell body
interior water level reaches limbers
during shown height, pure water enters rinsing cell body
in, pure water can from limbers afterwards
place enters rinsing cell body
finally, the sewage (comprising the organic matter etc. floating on water surface) after cleaning silicon chip is from rinsing cell body
the discharge outlet of sidewall
flow out, in figure, arrow direction is the overflow direction of pure water in each rinsing cell body; Corresponding rinsing cell body
on be also respectively arranged with temperature control equipment A, C, E, described temperature control equipment comprises computer heating control switch and temperature controller; Rinsing cell body
on be also respectively arranged with Vltrasonic device B, D, F, described Vltrasonic device is ultrasonic gauge tap; In addition, 10. go up at pure water water inlet manifold pure water switch electromagnetic valve J is also housed.
Temperature control equipment described in the present invention also can be mounted in the constant temperature thermal source that 10. pure water water inlet manifold is gone up, and two kinds of modes can realize the temperature controlling pure water in rinsing cell body, to keep its rinse-active.Meanwhile, in the present invention in order to better realize the circulation of pure water in rinsing cell body, limbers
and discharge outlet
height reduce successively.
In the device of the present embodiment, when there being silicon chip to need cleaning in one or more rinsing cell body, manual unlocking pure water switch electromagnetic valve J and have silicon chip to need ultrasonic gauge tap corresponding on the rinsing cell body of cleaning and computer heating control switch.Pure water is from rinsing cell body
bottom enters, and flow through each rinsing cell body successively, clean silicon chip, the sewage after cleaning is from discharge outlet
discharge.
Pure water water inlet manifold is set in the present embodiment
with rinsing cell body
be connected, certainly, its also can with rinsing cell body
be connected, now should limbers be set
height be not less than limbers
height; Also can at rinsing cell body
the sidewall of right-hand member arranges osculum, if like this, limbers
height arrange must be identical.This kind of situation can play the object improving pure water utilization rate relative to existing technologies, but the effect of structure is not good as shown in Figure 2.
Certainly; the number of the rinsing cell body be arranged in order described in the present embodiment is not construed as limiting protection scope of the present invention; in the present embodiment for 3 rinsing cell bodies just for the ease of describing the formation of device in the present embodiment and introducing the using method of device; therefore; in actual applications, the number of rinsing cell body can set as required.
As can be seen from above-described embodiment, silicon chip ultrasonic cleaning equipment provided by the present invention, in multiple rinsing cell bodies on it, adjacent rinsing cell body is interconnected by limbers, this just makes described multiple potcher body form a total rinsing cell body be communicated with, when cleaning a large amount of silicon chip, only described a large amount of silicon chip need be put into corresponding rinsing cell body respectively, and open pure water water inlet manifold, like this, first pure water flows into the rinsing cell body be connected with pure water water inlet manifold, in succession flow into all the other rinsing cell bodies afterwards, because described multiple potcher body forms a total rinsing cell body be communicated with, therefore, can only discharge from the rinsing cell body of the one or both ends of multiple rinsing cell body be arranged in order the sewage after Wafer Cleaning, thus when cleaning a large amount of silicon chip, the utilization rate of pure water can be improved, avoid the waste of pure water.
Embodiment two
In order to realize the automatic control of pure water switch electromagnetic valve and the control of pure water flow in silicon chip ultrasonic cleaning process, present invention also offers another kind of silicon chip ultrasonic cleaning equipment.
With reference to the structural representation of the another kind of silicon chip ultrasonic cleaning equipment that figure 3, Fig. 3 provides for the embodiment of the present invention, this silicon chip ultrasonic cleaning equipment comprises: three rinsing cell bodies be arranged in order
and limbers
by these three rinsing cell bodies
be connected; Rinsing cell body
10. be connected with pure water water inlet manifold, pure water water inlet manifold 10. on be provided with pure water switch electromagnetic valve J; Rinsing cell body
on be provided with discharge outlet
and limbers
and discharge outlet
height in gradient formula decline; Rinsing cell body
on be respectively arranged with temperature control equipment A, C, E, described temperature control equipment comprises computer heating control switch and temperature controller.
With embodiment one difference be, the silicon chip ultrasonic cleaning equipment that the present embodiment provides, at pure water switch electromagnetic valve J and rinsing cell body
between pure water water inlet manifold 10. on be provided with Flow-rate adjustment controller H.The function of described Flow-rate adjustment controller H is: when pure water switch electromagnetic valve J opens, pure water enters rinsing cell body by Flow-rate adjustment controller H with certain flow velocity
in, can be regulated by adjust flux adjustment control H and enter rinsing cell body
the flow velocity of interior pure water, thus can control easily to flow into potcher body
the uninterrupted of interior pure water; And, flow into rinsing cell body
the uninterrupted of interior pure water can realize visual, thus can ensure the cleaning quality of silicon chip better.
Further, with embodiment one difference be, the silicon chip ultrasonic cleaning equipment that the present embodiment provides, rinsing cell body
on be respectively arranged with Vltrasonic device B ', D ', F ', described Vltrasonic device not only comprises ultrasonic gauge tap, but also comprise ultrasonic gauge, described ultrasonic gauge can cut out ultrasonic gauge tap automatically carrying out silicon chip realization when ultrasonic cleaning reaches Preset Time, thus stops carrying out ultrasonic cleaning to silicon chip.
The ultrasonic gauge tap provided for the embodiment of the present invention with reference to figure 4, Fig. 4 and the electrical block diagram of pure water switch electromagnetic valve.Ultrasonic gauge tap in the present embodiment in three Vltrasonic device B ', D ', F ' KA1, KA2, KA3 respectively in corresponding diagram 4, button KM1, KM2, a KM3 and these three ultrasonic gauge tap KA1, KA2, KA3 connect respectively, branch road after series connection is connected in parallel to each other, connect with button KM4 after parallel connection, namely described button KM4 is the button controlling pure water switch electromagnetic valve J again.
In the present embodiment, when any one in ultrasonic gauge tap KA1, KA2, KA3 is closed, pure water switch electromagnetic valve J is in channel status, carry out the supply of pure water, when ultrasonic gauge tap KA1, KA2, KA3 all disconnect, pure water switch electromagnetic valve J open circuit, stops the supply of pure water.The closed and disconnected of ultrasonic gauge tap KA1, KA2, KA3 all realizes by manually pressing corresponding button KM1, KM2, KM3.And, for the situation that ultrasonic gauge tap KA1, KA2, KA3 disconnect, also realize by ultrasonic gauge.
In specific implementation process, when there being silicon chip to need rinsing in one or more rinsing cell body, open ultrasonic gauge tap corresponding on described one or more rinsing cell body and corresponding computer heating control switch, corresponding ultrasonic gauge starts timing, and now pure water switch electromagnetic valve J is in channel status, pure water switch electromagnetic valve J opens, and each rinsing cell body is carried out to the supply of pure water, and first pure water enters rinsing cell body by Flow-rate adjustment controller H with the flow velocity of setting
then rinsing cell body is entered successively
with rinsing cell body
last from discharge outlet
discharge.After the ultrasonic gauge on a certain rinsing cell body reaches setting rinsing time, ultrasonic gauge tap on corresponding rinsing cell body disconnects, after all ultrasonic gauge taps disconnect, then pure water switch electromagnetic valve J is in off state, now, stop supplying pure water in each rinsing cell body, silicon chip ultrasonic cleaning terminates.
As from the foregoing, the silicon chip ultrasonic cleaning equipment that the present embodiment provides, except having advantage described in embodiment one, also tool has the following advantages:
Pure water switch electromagnetic valve is series in the circuit of ultrasonic gauge tap, when any one ultrasonic gauge tap is closed, described pure water switch electromagnetic valve will be in channel status, only have when all ultrasonic gauge taps all disconnect, described pure water switch electromagnetic valve is just in off state, therefore, avoid the unlatching of Non-follow control pure water switch electromagnetic valve, avoid and to forget because people's carelessness and open pure water switch electromagnetic valve and cause the generation of Wafer Cleaning compromised quality situation.
In addition, by increasing ultrasonic gauge, can make silicon chip after completing the cleaning in Preset Time, realize the automatic disconnection of ultrasonic gauge tap, eliminate the ultrasonic gauge tap of artificial manually disconnection, due to the closed of described ultrasonic gauge tap with disconnect determine pure water switch electromagnetic valve path whether, therefore, described pure water switch electromagnetic valve after all silicon chips have all cleaned also can be avoided still to be in channel status, namely to avoid the waste of a large amount of pure water.
Have again, by increasing Flow-rate adjustment controller, and then the control that can realize pure water flow, the waste causing a large amount of pure water because flow is excessive can be avoided on the one hand, rinsing cell body is even made to have little time heating, rinse temperature can not ensure, and then affects the activity of rinsing, affects the rinsing quality of silicon chip; It also avoid not washing clean clearly of causing because flow is too small on the other hand, the cleanliness factor of silicon chip and presentation quality are affected.
In the present invention, each embodiment adopts the mode of going forward one by one to be described, and all has emphasis to the description of each embodiment, is correlated with, similarity can reference mutually.
It should be noted that, in this article, the such as relational terms of first and second grades and so on is only used for an entity or operation to separate with another entity or operating space, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, article or equipment and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, article or equipment.When not more restrictions, the key element limited by statement " comprising ... ", and be not precluded within process, method, article or the equipment comprising described key element and also there is other identical element.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (1)
1. a silicon chip ultrasonic cleaning equipment, is characterized in that, comprising:
Multiple rinsing cell body be arranged in order, adjacent rinsing cell body is interconnected by the limbers of cell body sidewall, and described limbers height is formula decline in gradient from the first rinsing cell body, and the number of described rinsing cell body is 3;
Be arranged on the Vltrasonic device on each rinsing cell body;
The pure water water inlet manifold be connected with a cell body in described multiple rinsing cell body be arranged in order, the rinsing cell body be connected with described pure water water inlet manifold is the rinsing cell body of the one end in described multiple rinsing cell body be arranged in order, and the rinsing cell body be connected with described pure water water inlet manifold is the first rinsing cell body;
Be arranged on the pure water switch electromagnetic valve on described pure water water inlet manifold;
Wherein, in described multiple rinsing cell body, adjacent rinsing cell body is interconnected by limbers;
Ultrasonic gauge tap and ultrasonic gauge, the multiple ultrasonic gauge tap in multiple Vltrasonic device is parallel with one another;
Multiple ultrasonic gauge tap after parallel connection is connected with described pure water switch electromagnetic valve;
Be arranged on described pure water water inlet manifold, in order to regulate the Flow-rate adjustment controller of pure water flow of inlet water;
Temperature control equipment, comprising: be arranged on the computer heating control switch on each rinsing cell body and temperature controller, or for being arranged on the constant temperature thermal source on pure water water inlet manifold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110208933.6A CN102896106B (en) | 2011-07-25 | 2011-07-25 | Ultrasonic cleaning device for silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110208933.6A CN102896106B (en) | 2011-07-25 | 2011-07-25 | Ultrasonic cleaning device for silicon wafers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102896106A CN102896106A (en) | 2013-01-30 |
| CN102896106B true CN102896106B (en) | 2015-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110208933.6A Expired - Fee Related CN102896106B (en) | 2011-07-25 | 2011-07-25 | Ultrasonic cleaning device for silicon wafers |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114289405A (en) * | 2022-01-10 | 2022-04-08 | 南通康芯半导体科技有限公司 | Semiconductor wafer overflow ultrasonic cleaning device |
| CN115582338A (en) * | 2022-09-05 | 2023-01-10 | 上海中欣晶圆半导体科技有限公司 | Method for enhancing silicon wafer cleaning effect |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2463261Y (en) * | 2001-01-09 | 2001-12-05 | 兰州先灵检测设备有限责任公司 | Full-automatic ultrasonic wave cleaner for bearing and fittings specially adapted for railway |
| CN2471437Y (en) * | 2001-05-08 | 2002-01-16 | 山东省济宁市超声电子仪器厂 | Ultrasonic cleaning machine |
| CN2768909Y (en) * | 2004-12-07 | 2006-04-05 | 珠海市华冠电容器有限公司 | A ultrasonic wave cleaning machine |
| CN201684745U (en) * | 2010-01-20 | 2010-12-29 | 常州亿晶光电科技有限公司 | Step-type multistage silicon material cleaning apparatus |
-
2011
- 2011-07-25 CN CN201110208933.6A patent/CN102896106B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2463261Y (en) * | 2001-01-09 | 2001-12-05 | 兰州先灵检测设备有限责任公司 | Full-automatic ultrasonic wave cleaner for bearing and fittings specially adapted for railway |
| CN2471437Y (en) * | 2001-05-08 | 2002-01-16 | 山东省济宁市超声电子仪器厂 | Ultrasonic cleaning machine |
| CN2768909Y (en) * | 2004-12-07 | 2006-04-05 | 珠海市华冠电容器有限公司 | A ultrasonic wave cleaning machine |
| CN201684745U (en) * | 2010-01-20 | 2010-12-29 | 常州亿晶光电科技有限公司 | Step-type multistage silicon material cleaning apparatus |
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Owner name: YUHUI YANGGUANG ENERGY RESOURCES CO., LTD., ZHEJIA Free format text: FORMER OWNER: RENESOLA ENERGY SAVING TECHNOLOGY CO., LTD. Effective date: 20130225 |
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Address after: Jiaxing City, Zhejiang province 314117 Jiashan County Yaozhuang Manhattan Road No. 158 building three layer 1 Applicant after: Zhejiang Yuhui Energy Saving Technology Co.,Ltd. Address before: Jiaxing City, Zhejiang province 314117 Jiashan County Yaozhuang Manhattan Road No. 158 building three layer 1 Applicant before: Zhejiang Sibosi New Material Technology Co.,Ltd. |
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