CN102896106A - Ultrasonic cleaning device for silicon wafers - Google Patents
Ultrasonic cleaning device for silicon wafers Download PDFInfo
- Publication number
- CN102896106A CN102896106A CN2011102089336A CN201110208933A CN102896106A CN 102896106 A CN102896106 A CN 102896106A CN 2011102089336 A CN2011102089336 A CN 2011102089336A CN 201110208933 A CN201110208933 A CN 201110208933A CN 102896106 A CN102896106 A CN 102896106A
- Authority
- CN
- China
- Prior art keywords
- pure water
- cell body
- rinsing cell
- rinsing
- inlet manifold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 58
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 52
- 239000010703 silicon Substances 0.000 title claims abstract description 52
- 238000004506 ultrasonic cleaning Methods 0.000 title claims abstract description 28
- 235000012431 wafers Nutrition 0.000 title abstract 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 78
- 210000005056 cell body Anatomy 0.000 claims description 120
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 9
- 230000007423 decrease Effects 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 abstract description 15
- 239000002699 waste material Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 14
- 210000004027 cell Anatomy 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 4
- 239000010865 sewage Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000005416 organic matter Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 235000008216 herbs Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Images
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
An embodiment of the invention discloses an ultrasonic cleaning device for silicon wafers. The device comprises a plurality of sequentially arrayed rinsing tanks, ultrasonic devices, a pure water inlet manifold and a pure water switch electromagnetic valve, wherein each ultrasonic device is arranged on the corresponding rinsing tank, the pure water inlet manifold is connected with one of the sequentially arrayed rinsing tanks, the pure water switch electromagnetic valve is arranged on the pure water inlet manifold, and each two adjacent rinsing tanks are mutually communicated. Since each two adjacent rinsing tanks are mutually communicated, and the pure water inlet manifold is only connected with one rinsing tank, the utilization rate of pure water can be increased during cleaning of the silicon wafers in a large quantity, and waste of the pure water is avoided.
Description
Technical field
The present invention relates to the semiconductor device fabrication process technical field, more particularly, relate to a kind of silicon chip ultrasonic cleaning equipment.
Background technology
Silicon chip is the carrier of solar cell, the quality of Si wafer quality has directly determined the height of conversion efficiency of solar cell, and affect a cleanliness factor that key factor is silicon chip surface of Si wafer quality quality, therefore, for so that solar cell has higher conversion efficiency, need at first to guarantee that silicon chip surface has higher cleanliness factor.
In order to make silicon chip surface have higher cleanliness factor, need to clean silicon chip, wherein, cleaning process comprises that the chemical liquid in early stage cleans and the pure water ultrasonic cleaning in later stage.Silicon chip is being carried out after the antecedent chemical liquid cleans, silicon chip surface can residual acid, alkali or surfactant-based organic matter etc., and these materials that remain in silicon chip surface can produce harmful effect in follow-up process for etching, such as color spot, turn white or not making herbs into wool etc.; In addition, if silicon chip surface has the residual of metal ion or particle, will affect the conversion efficiency of solar cell.Therefore, the later stage need to be carried out ultrasonic cleaning to silicon chip with a large amount of pure water, to remove the residual particle of silicon chip surface, metal and organic matter etc.
4., 5., 6. the structural representation of the existing device that silicon chip is carried out the pure water ultrasonic cleaning there is shown three rinsing cell bodies of ultrasonic cleaning equipment as shown in Figure 1; 1., 2., 3. 4., 5., 6. these three rinsing cell bodies connect respectively independently inlet valve, and 10. inlet valve 1., 2., 3. all be communicated with the pure water water inlet manifold; And 7., 8., 9. 4., 5., 6. these three rinsing cell bodies be respectively arranged with the single-stage overflow area, and the arrow direction is the overflow direction of pure water in the cell body among the figure; 4., 5., 6. corresponding rinsing cell body is gone up and also is respectively arranged with heating gauge tap and temperature controller A, C, E; In addition, 4., 5., 6. the rinsing cell body is gone up and also is respectively arranged with ultrasonic gauge tap B, D, F.
When having silicon chip to clean in the cell body, the inlet valve that needs the corresponding cell body of manual rotation, and the inlet valve by the corresponding cell body of rotation to the position of 45° angle with the control flow of inlet water, the pure water in the cell body can overflow from corresponding overflow area when reaching certain capacity; The ultrasonic gauge tap, heating gauge tap and the temperature controller that also need the corresponding cell body of manual unlocking in the cleaning process.After Wafer Cleaning being reached the stipulated time (such as 5min), need silicon chip is moved into the second rinsing cell body, need to open inlet valve, ultrasonic gauge tap corresponding on the second rinsing cell body this moment, close simultaneously inlet valve, ultrasonic gauge tap corresponding on the first rinsing cell body, after in the second rinsing cell body, Wafer Cleaning being reached the stipulated time, again it is moved into the 3rd rinsing cell body and clean.
Because silicon chip all is to produce in batches, therefore, also is that a plurality of silicon chips carry out simultaneously when silicon chip is carried out ultrasonic cleaning.But, because inlet valve and the overflow area of each cell body all are independently in the existing ultrasonic cleaning equipment, therefore, when all having silicon chip to clean in three cell bodies, then need to open simultaneously described three inlet valves that cell body is corresponding, and this moment, pure water was discharged from three overflow area corresponding to cell body, and this causes the waste of a large amount of pure water just so that the utilization rate of pure water is not high.
Summary of the invention
In view of this, the invention provides a kind of silicon chip ultrasonic cleaning equipment, this device can improve the utilization rate of pure water, avoids the waste of a large amount of pure water.
For achieving the above object, the invention provides following technical scheme:
A kind of silicon chip ultrasonic cleaning equipment, this device comprises:
A plurality of rinsing cell bodies that are arranged in order;
Be arranged on the Vltrasonic device on each rinsing cell body;
The pure water water inlet manifold that links to each other with a cell body in described a plurality of rinsing cell bodies that are arranged in order;
Be arranged on the pure water switch electromagnetic valve on the described pure water water inlet manifold;
Wherein, adjacent rinsing cell body is interconnected in described a plurality of rinsing cell body.
Preferably, in the said apparatus, described Vltrasonic device comprises: ultrasonic gauge tap and ultrasonic gauge.
Preferably, in the said apparatus, a plurality of ultrasonic gauge tap in a plurality of Vltrasonic devices is parallel with one another;
A plurality of ultrasonic gauge tap after the parallel connection is connected with described pure water switch electromagnetic valve.
Preferably, said apparatus also comprises:
Be arranged on the described pure water water inlet manifold, in order to regulate the Flow-rate adjustment controller of pure water flow of inlet water.
Preferably, in the said apparatus, the rinsing cell body that links to each other with described pure water water inlet manifold is the rinsing cell body of the end in described a plurality of rinsing cell body that is arranged in order, and the rinsing cell body that links to each other with described pure water water inlet manifold is the first rinsing cell body.
Preferably, in the said apparatus, adjacent rinsing cell body is interconnected by the limbers of cell body sidewall, and described limbers height is in gradient formula decline from the first rinsing cell body.
Preferably, in the said apparatus, the number of described rinsing cell body is 3.
Preferably, said apparatus also comprises temperature control equipment.
Preferably, in the said apparatus, described temperature control equipment comprises: be arranged on heating gauge tap and temperature controller on each rinsing cell body.
Preferably, in the said apparatus, described temperature control equipment is specially: be arranged on the constant temperature thermal source on the pure water water inlet manifold.
Can find out that from technique scheme silicon chip ultrasonic cleaning equipment provided by the present invention comprises: a plurality of rinsing cell bodies that are arranged in order; Be arranged on the Vltrasonic device on each rinsing cell body; The pure water water inlet manifold that links to each other with a cell body in described a plurality of rinsing cell bodies that are arranged in order; Be arranged on the pure water switch electromagnetic valve on the described pure water water inlet manifold; Wherein, adjacent rinsing cell body is interconnected in described a plurality of rinsing cell body.Silicon chip ultrasonic cleaning equipment provided by the present invention, rinsing cell body adjacent in a plurality of rinsing cell bodies is interconnected, this is just so that described a plurality of potcher body forms total rinsing cell body of a connection, when a large amount of silicon chips are cleaned, only need described a large amount of silicon chips are put into respectively corresponding rinsing cell body, and unlatching pure water water inlet manifold, like this, pure water at first flows into the rinsing cell body that links to each other with the pure water water inlet manifold, in succession flow into afterwards all the other rinsing cell bodies, because described a plurality of potcher body forms total rinsing cell body of a connection, therefore, can only discharge from the rinsing cell body of the one or both ends of a plurality of rinsing cell bodies that are arranged in order the sewage behind the Wafer Cleaning, thereby when a large amount of silicon chips are cleaned, can improve the utilization rate of pure water, avoid the waste of pure water.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art, apparently, accompanying drawing in the following describes only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is a kind of silicon chip cleaning device structural representation in the prior art;
A kind of silicon chip cleaning device structural representation that Fig. 2 provides for the embodiment of the invention;
The another kind of silicon chip cleaning device structural representation that Fig. 3 provides for the embodiment of the invention;
The ultrasonic gauge tap that Fig. 4 provides for the embodiment of the invention and the electrical block diagram of pure water switch electromagnetic valve.
The specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
Embodiment one
With reference to figure 2, the structural representation of a kind of silicon chip ultrasonic cleaning equipment that Fig. 2 provides for the embodiment of the invention, this silicon chip ultrasonic cleaning equipment comprises: three rinsing cell bodies that are arranged in order
And limbers
With these three rinsing cell bodies
Be connected; The rinsing cell body
10. link to each other with the pure water water inlet manifold, therefore, pure water can at first enter the rinsing cell body
In, when the rinsing cell body
Interior water level reaches the limbers
Shown in when height, pure water enters the rinsing cell body
In, pure water can be from the limbers afterwards
The place enters the rinsing cell body
At last, the sewage (comprising organic matter that floats on water surface etc.) after silicon chip is cleaned is from the rinsing cell body
The discharge outlet of sidewall
Flow out, the arrow direction is the overflow direction of pure water in each rinsing cell body among the figure; Corresponding rinsing cell body
On also be respectively arranged with temperature control equipment A, C, E, described temperature control equipment comprises heating gauge tap and temperature controller; The rinsing cell body
On also be respectively arranged with Vltrasonic device B, D, F, described Vltrasonic device is ultrasonic gauge tap; In addition, 10. go up at the pure water water inlet manifold pure water switch electromagnetic valve J also is housed.
Temperature control equipment described in the present invention also can be mounted in the constant temperature thermal source that 10. the pure water water inlet manifold is gone up, and dual mode can both realize controlling the temperature of pure water in the rinsing cell body, to keep its rinse-active.Simultaneously, among the present invention in order better to realize the circulation of pure water in the rinsing cell body, limbers
And discharge outlet
Height reduce successively.
In the device of present embodiment, when having silicon chip to clean in one or more rinsing cell bodies, manual unlocking pure water switch electromagnetic valve J and ultrasonic gauge tap corresponding on the rinsing cell body that silicon chip need to clean is arranged and the heating gauge tap.Pure water is from the rinsing cell body
The bottom enters, and each rinsing cell body of flowing through successively cleans silicon chip, and the sewage after the cleaning is from discharge outlet
Discharge.
The pure water water inlet manifold is set in the present embodiment
With the rinsing cell body
Link to each other, certainly, its also can with the rinsing cell body
Link to each other, should arrange the limbers this moment
Height be not less than the limbers
Height; Also can be at the rinsing cell body
On the sidewall of right-hand member osculum is set, if like this, the limbers
Height arrange must be identical.This kind situation can play the purpose that improves the pure water utilization rate relative to existing technologies, but the effect of structure is not good as shown in Figure 2.
Certainly; the number of the rinsing cell body that is arranged in order described in the present embodiment is not construed as limiting protection scope of the present invention; in the present embodiment as an example of 3 rinsing cell bodies example just for the ease of the formation of installing in the narration present embodiment and the using method of introducing device; therefore; in actual applications, the number of rinsing cell body can be set as required.
Can find out from above-described embodiment, silicon chip ultrasonic cleaning equipment provided by the present invention, adjacent rinsing cell body is interconnected by the limbers in a plurality of rinsing cell bodies on it, this is just so that described a plurality of potcher body forms total rinsing cell body of a connection, when a large amount of silicon chips are cleaned, only need described a large amount of silicon chips are put into respectively corresponding rinsing cell body, and unlatching pure water water inlet manifold, like this, pure water at first flows into the rinsing cell body that links to each other with the pure water water inlet manifold, in succession flow into afterwards all the other rinsing cell bodies, because described a plurality of potcher body forms total rinsing cell body of a connection, therefore, can only discharge from the rinsing cell body of the one or both ends of a plurality of rinsing cell bodies that are arranged in order the sewage behind the Wafer Cleaning, thereby when a large amount of silicon chips are cleaned, can improve the utilization rate of pure water, avoid the waste of pure water.
Embodiment two
For the automatic control that realizes pure water switch electromagnetic valve in the silicon chip ultrasonic cleaning process and the control of pure water flow, the present invention also provides another kind of silicon chip ultrasonic cleaning equipment.
With reference to figure 3, the structural representation of the another kind of silicon chip ultrasonic cleaning equipment that Fig. 3 provides for the embodiment of the invention, this silicon chip ultrasonic cleaning equipment comprises: three rinsing cell bodies that are arranged in order
And limbers
With these three rinsing cell bodies
Be connected; The rinsing cell body
10. link to each other with the pure water water inlet manifold, the pure water water inlet manifold is provided with pure water switch electromagnetic valve J on 10.; The rinsing cell body
On be provided with discharge outlet
And limbers
And discharge outlet
Height in gradient formula descend; The rinsing cell body
On be respectively arranged with temperature control equipment A, C, E, described temperature control equipment comprises heating gauge tap and temperature controller.
That the silicon chip ultrasonic cleaning equipment that present embodiment provides is at pure water switch electromagnetic valve J and rinsing cell body with embodiment one difference
Between the pure water water inlet manifold be provided with Flow-rate adjustment controller H on 10..The function of described Flow-rate adjustment controller H is: when pure water switch electromagnetic valve J opened, pure water entered the rinsing cell body by Flow-rate adjustment controller H with certain flow velocity
In, can regulate to enter the rinsing cell body by adjust flux adjustment control H
The flow velocity of interior pure water flows into the rinsing cell body thereby can control easily
The uninterrupted of interior pure water; And, flow into the rinsing cell body
The uninterrupted of interior pure water can be realized visual, thereby can guarantee better the cleaning quality of silicon chip.
Have again, with embodiment one difference be the silicon chip ultrasonic cleaning equipment that present embodiment provides, rinsing cell body
On be respectively arranged with Vltrasonic device B ', D ', F ', described Vltrasonic device not only comprises ultrasonic gauge tap, but also comprise ultrasonic gauge, described ultrasonic gauge can be realized the ultrasonic gauge tap of autoshutdown when silicon chip being carried out ultrasonic cleaning reach Preset Time, thereby stops silicon chip being carried out ultrasonic cleaning.
With reference to figure 4, the ultrasonic gauge tap that Fig. 4 provides for the embodiment of the invention and the electrical block diagram of pure water switch electromagnetic valve.Ultrasonic gauge tap in the present embodiment among three Vltrasonic device B ', D ', the F ' is KA1, KA2, the KA3 in the corresponding diagram 4 respectively, and these three ultrasonic gauge tap KA1, KA2, KA3 connect respectively button KM1, a KM2, KM3, branch road after the series connection is connected in parallel to each other, connect with button KM4 after the parallel connection, described button KM4 namely is the button of control pure water switch electromagnetic valve J again.
In the present embodiment, when any one closure among ultrasonic gauge tap KA1, KA2, the KA3, pure water switch electromagnetic valve J is in channel status, carry out the supply of pure water, as ultrasonic gauge tap KA1, when KA2, KA3 all disconnect, pure water switch electromagnetic valve J opens circuit, and stops the supply of pure water.The closed and disconnected of ultrasonic gauge tap KA1, KA2, KA3 all can by manually press corresponding button KM1, KM2, KM3 realize.And the situation for ultrasonic gauge tap KA1, KA2, KA3 disconnect also can realize by ultrasonic gauge.
In the specific implementation process, when having silicon chip to need rinsing in one or more rinsing cell bodies, open ultrasonic gauge tap corresponding on described one or more rinsing cell body and corresponding heating gauge tap, corresponding ultrasonic gauge begins timing, and this moment, pure water switch electromagnetic valve J was in channel status, pure water switch electromagnetic valve J opens, and each rinsing cell body is carried out the supply of pure water, and pure water at first enters the rinsing cell body by Flow-rate adjustment controller H with the flow velocity of setting
Then enter successively the rinsing cell body
With the rinsing cell body
At last from discharge outlet
Discharge.After the ultrasonic gauge on a certain rinsing cell body reaches the setting rinsing time, ultrasonic gauge tap on the corresponding rinsing cell body disconnects, after all ultrasonic gauge taps disconnect, then pure water switch electromagnetic valve J is in off state, at this moment, stop to supply pure water in each rinsing cell body, the silicon chip ultrasonic cleaning finishes.
As from the foregoing, the silicon chip ultrasonic cleaning equipment that present embodiment provides except having described in the embodiment one advantage, also has following advantage:
The pure water switch electromagnetic valve is series in the circuit of ultrasonic gauge tap, when closed for any one ultrasonic gauge tap, described pure water switch electromagnetic valve will be in channel status, only have when all ultrasonic gauge taps all disconnect, described pure water switch electromagnetic valve just is in off state, therefore, avoided the unlatching of manual control pure water switch electromagnetic valve, avoided forgetting unlatching pure water switch electromagnetic valve because of people's carelessness and caused the generation of Wafer Cleaning compromised quality situation.
In addition, by increasing ultrasonic gauge, can make the cleaning of silicon chip in finishing Preset Time realize afterwards the automatic disconnection of ultrasonic gauge tap, save the artificial ultrasonic gauge tap that manually disconnects, since the closure of described ultrasonic gauge tap with disconnect determined the pure water switch electromagnetic valve path whether, therefore, also can avoid all silicon chips all clean finish after described pure water switch electromagnetic valve still be in channel status, namely avoided the waste of a large amount of pure water.
Have again, by increasing the Flow-rate adjustment controller, and then can realize control to the pure water flow, can avoid causing because flow is excessive on the one hand the waste of a large amount of pure water, even so that the rinsing cell body has little time heating, the rinsing temperature can not guarantee, and then affects the activity of rinsing, affects the rinsing quality of silicon chip; Also avoided on the other hand the cleaning that causes because flow is too small unclean, so that the cleanliness factor of silicon chip and presentation quality are affected.
Each embodiment adopts the mode of going forward one by one to be described among the present invention, and the description of each embodiment is all had emphasis, relevant, mutually reference of similarity.
Need to prove, in this article, relational terms such as the first and second grades only is used for an entity or operation are made a distinction with another entity or operation, and not necessarily requires or hint and have the relation of any this reality or sequentially between these entities or the operation.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thereby not only comprise those key elements so that comprise process, method, article or the equipment of a series of key elements, but also comprise other key elements of clearly not listing, or also be included as the intrinsic key element of this process, method, article or equipment.Do not having in the situation of more restrictions, the key element that is limited by statement " comprising ... ", and be not precluded within process, method, article or the equipment that comprises described key element and also have other identical element.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and General Principle as defined herein can in the situation that does not break away from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. a silicon chip ultrasonic cleaning equipment is characterized in that, comprising:
A plurality of rinsing cell bodies that are arranged in order;
Be arranged on the Vltrasonic device on each rinsing cell body;
The pure water water inlet manifold that links to each other with a cell body in described a plurality of rinsing cell bodies that are arranged in order;
Be arranged on the pure water switch electromagnetic valve on the described pure water water inlet manifold;
Wherein, adjacent rinsing cell body is interconnected in described a plurality of rinsing cell body.
2. device according to claim 1 is characterized in that, described Vltrasonic device comprises: ultrasonic gauge tap and ultrasonic gauge.
3. device according to claim 2 is characterized in that,
A plurality of ultrasonic gauge tap in a plurality of Vltrasonic devices is parallel with one another;
A plurality of ultrasonic gauge tap after the parallel connection is connected with described pure water switch electromagnetic valve.
4. device according to claim 1 is characterized in that, also comprises:
Be arranged on the described pure water water inlet manifold, in order to regulate the Flow-rate adjustment controller of pure water flow of inlet water.
5. device according to claim 1, it is characterized in that, the rinsing cell body that links to each other with described pure water water inlet manifold is the rinsing cell body of the end in described a plurality of rinsing cell body that is arranged in order, and the rinsing cell body that links to each other with described pure water water inlet manifold is the first rinsing cell body.
6. device according to claim 5 is characterized in that, adjacent rinsing cell body is interconnected by the limbers of cell body sidewall, and described limbers height is in gradient formula decline from the first rinsing cell body.
7. device according to claim 1 is characterized in that, the number of described rinsing cell body is 3.
8. device according to claim 1 is characterized in that, also comprises temperature control equipment.
9. device according to claim 8 is characterized in that, described temperature control equipment comprises: be arranged on heating gauge tap and temperature controller on each rinsing cell body.
10. device according to claim 8 is characterized in that, described temperature control equipment is specially: be arranged on the constant temperature thermal source on the pure water water inlet manifold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110208933.6A CN102896106B (en) | 2011-07-25 | 2011-07-25 | Ultrasonic cleaning device for silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110208933.6A CN102896106B (en) | 2011-07-25 | 2011-07-25 | Ultrasonic cleaning device for silicon wafers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102896106A true CN102896106A (en) | 2013-01-30 |
| CN102896106B CN102896106B (en) | 2015-04-08 |
Family
ID=47568764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110208933.6A Expired - Fee Related CN102896106B (en) | 2011-07-25 | 2011-07-25 | Ultrasonic cleaning device for silicon wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102896106B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114289405A (en) * | 2022-01-10 | 2022-04-08 | 南通康芯半导体科技有限公司 | Semiconductor wafer overflow ultrasonic cleaning device |
| WO2024051135A1 (en) * | 2022-09-05 | 2024-03-14 | 上海中欣晶圆半导体科技有限公司 | Method for improving silicon-wafer cleaning effect |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2463261Y (en) * | 2001-01-09 | 2001-12-05 | 兰州先灵检测设备有限责任公司 | Full-automatic ultrasonic wave cleaner for bearing and fittings specially adapted for railway |
| CN2471437Y (en) * | 2001-05-08 | 2002-01-16 | 山东省济宁市超声电子仪器厂 | Ultrasonic cleaning machine |
| CN2768909Y (en) * | 2004-12-07 | 2006-04-05 | 珠海市华冠电容器有限公司 | A ultrasonic wave cleaning machine |
| CN201684745U (en) * | 2010-01-20 | 2010-12-29 | 常州亿晶光电科技有限公司 | Step-type multistage silicon material cleaning apparatus |
-
2011
- 2011-07-25 CN CN201110208933.6A patent/CN102896106B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2463261Y (en) * | 2001-01-09 | 2001-12-05 | 兰州先灵检测设备有限责任公司 | Full-automatic ultrasonic wave cleaner for bearing and fittings specially adapted for railway |
| CN2471437Y (en) * | 2001-05-08 | 2002-01-16 | 山东省济宁市超声电子仪器厂 | Ultrasonic cleaning machine |
| CN2768909Y (en) * | 2004-12-07 | 2006-04-05 | 珠海市华冠电容器有限公司 | A ultrasonic wave cleaning machine |
| CN201684745U (en) * | 2010-01-20 | 2010-12-29 | 常州亿晶光电科技有限公司 | Step-type multistage silicon material cleaning apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114289405A (en) * | 2022-01-10 | 2022-04-08 | 南通康芯半导体科技有限公司 | Semiconductor wafer overflow ultrasonic cleaning device |
| WO2024051135A1 (en) * | 2022-09-05 | 2024-03-14 | 上海中欣晶圆半导体科技有限公司 | Method for improving silicon-wafer cleaning effect |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102896106B (en) | 2015-04-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102727149B (en) | Energy-saving ultrasonic dish-washing machine with hot water source and method for washing kitchen utensils by using same | |
| CN102836842A (en) | Multi-groove circulating silicon wafer cleaning machine | |
| CN203900007U (en) | Solar silicon wafer cleaning device | |
| CN102896106B (en) | Ultrasonic cleaning device for silicon wafers | |
| CN108453084A (en) | Nozzle cleaning and wafer cleaning equipment | |
| CN103878141A (en) | Semiconductor wafer washing device | |
| CN104157735A (en) | Solar cell texturing process | |
| CN202823983U (en) | Multi-tank circulating silicon wafer cleaning machine | |
| CN106216338A (en) | Automatically pipette station is washed | |
| CN102266859A (en) | Method and device for cleaning cauliflower-shaped polycrystalline silicon raw material with oxides on surface thereof | |
| CN108649006A (en) | Wafer cleaning device and method for cleaning wafer | |
| CN201956323U (en) | Wafer cleaning equipment | |
| CN204486400U (en) | The integrated equipment of multi-functional recyclable cleaning in a kind of extraction process | |
| CN205398271U (en) | Automatic wash integrated filtration system with constant pressure water supply | |
| CN205863147U (en) | A kind of Novel silicon slice cleans device | |
| CN206935922U (en) | A kind of silicon chip of solar cell rinse bath | |
| CN209541531U (en) | A kind of airplane heat exchanger flushing device | |
| CN202438485U (en) | Silicon wafer cleaning system capable of reusing water resource and cleaning slot of same | |
| CN206771515U (en) | A kind of domestic intelligent heating cleaner | |
| CN203862609U (en) | Semiconductor wafer cleaning device | |
| CN208500748U (en) | A kind of glass tempering water cooling plant | |
| CN201478277U (en) | Porous silicon removing system for a polycrystal groove type fine-hair making device | |
| CN208116285U (en) | A kind of supersonic wave cleaning machine rinse bath | |
| CN202681885U (en) | Energy-saving ultrasonic dish washing machine with hot water source | |
| CN110801188A (en) | Drying waste heat circulation type full-automatic dish washing machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: YUHUI YANGGUANG ENERGY RESOURCES CO., LTD., ZHEJIA Free format text: FORMER OWNER: RENESOLA ENERGY SAVING TECHNOLOGY CO., LTD. Effective date: 20130225 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: Jiaxing City, Zhejiang province 314117 Jiashan County Yaozhuang Manhattan Road No. 158 building three layer 1 Applicant after: Zhejiang Yuhui Energy Saving Technology Co.,Ltd. Address before: Jiaxing City, Zhejiang province 314117 Jiashan County Yaozhuang Manhattan Road No. 158 building three layer 1 Applicant before: Zhejiang Sibosi New Material Technology Co.,Ltd. |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: NEW MATERIAL TECHNOLOGY CO., LTD. ZHEJIANG SI BOEN TO: RENESOLA ENERGY SAVING TECHNOLOGY CO., LTD. |
|
| TA01 | Transfer of patent application right |
Effective date of registration: 20130225 Address after: 314117 Yao Town Industrial Park, Jiaxing, Zhejiang, Jiashan Applicant after: RENESOLA ZHEJIANG Ltd. Address before: Jiaxing City, Zhejiang province 314117 Jiashan County Yaozhuang Manhattan Road No. 158 building three layer 1 Applicant before: Zhejiang Yuhui Energy Saving Technology Co.,Ltd. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150408 Termination date: 20210725 |