CN102889488A - Led灯条 - Google Patents

Led灯条 Download PDF

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Publication number
CN102889488A
CN102889488A CN2011102051413A CN201110205141A CN102889488A CN 102889488 A CN102889488 A CN 102889488A CN 2011102051413 A CN2011102051413 A CN 2011102051413A CN 201110205141 A CN201110205141 A CN 201110205141A CN 102889488 A CN102889488 A CN 102889488A
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CN
China
Prior art keywords
led
lamp bar
substrate
led lamp
matsurface
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Pending
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CN2011102051413A
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English (en)
Inventor
林新强
曾文良
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Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
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Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
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Application filed by Rongchuang Energy Technology Co ltd, Zhanjing Technology Shenzhen Co Ltd filed Critical Rongchuang Energy Technology Co ltd
Priority to CN2011102051413A priority Critical patent/CN102889488A/zh
Priority to TW100126144A priority patent/TWI427759B/zh
Priority to US13/337,127 priority patent/US20130020607A1/en
Publication of CN102889488A publication Critical patent/CN102889488A/zh
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

一种LED灯条，其包括一基板及安装在基板上的若干LED，其中，基板在其表面避开LED的位置处形成粗糙面以增加其散热面积。本发明通过增加基板表面的散热面积，使基板能更快的把热量散发到空气中，LED灯条获得更好的散热效果。

Description

LED灯条
技术领域
本发明涉及一种LED灯条，尤其涉及一种具有较佳散热效果的LED灯条。
背景技术
LED产业是近几年最受瞩目的产业之一，发展至今，LED产品已具有节能、省电、高效率、反应时间快、寿命周期时间长、且不含汞、具有环保效益等优点，已被使用在照明用途上。但是，LED的散热问题在很大程度上影响LED的效率。散热不良将会直接缩短LED的寿命甚至让LED灯报废。因此，必须对LED进行散热。然而由于LED灯条的封装限制，对LED灯条进行散热一直是业界研究的重点问题。
发明内容
有鉴于此，本发明提供一种可提高散热效率的LED灯条。
一种LED灯条，其包括一基板及安装在基板上的若干LED，其中，基板在其表面避开LED的位置处形成粗糙面以增加其散热面积。
本发明通过增加基板表面的散热面积，使基板能更快的把热量散发到空气中，LED 灯条获得更好的散热效果。
附图说明
图1是本发明第一实施例的LED灯条的剖视图。
图2是图1所示LED灯条的俯视图。
图3是本发明第二实施例的LED灯条的剖视图。
主要元件符号说明
10 灯条
20 基板
21 第一金属层
210 粗糙面
211 第一粗糙面
212 第二粗糙面
22 绝缘层
23 第二金属层
24 支撑层
30 LED
31 芯片
32 封装体
33 反光杯
34 导线
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
下面将结合附图对本发明作一具体介绍。
请参阅图1-2，示出了本发明灯条10的剖视图和俯视图。灯条10呈一长条形。该灯条10包括一长条形基板20及若干LED 30。LED 30均匀排布在基板20上。基板20包括一第一金属层21、一绝缘层22及一第二金属层23。第一金属层21、绝缘层22、第二金属层23从上到下顺序叠加。在灯条10的两端第一金属层21、绝缘层22垂直弯折，绝缘层22包覆第二金属层23，第一金属层21在最外面包覆绝缘层22。其中，第一金属层21与LED 30直接接触。第一金属层21的厚度大于绝缘层22的厚度，并远小于第二金属层23的厚度。第一金属层21的厚度优选为约35μm，绝缘层22的厚度优选为约25μm，第二金属层23的厚度优选为约300μm。基板20为一具有可挠性的基板20，其中的两层金属层21、23以及绝缘层22均具有如薄质金属板一样的可挠性，即其可以任意角度的折叠、扭转。基板20经过折叠、扭转等处理方式处理后，在其原本光滑的表面留下折痕形成弯折部（图未标），即基板20可通过整体的折或扭等方式产生皱褶使其表面产生粗糙面210。该基板20在不同位置经过多次折叠或扭转，其产生的多个皱褶使基板20的表面产生多个粗糙面210。由于粗糙面210的存在，基板20具有更大的表面积，更利于灯条10的散热。当然，基板20还可以通过其他方式产生粗糙面210，如通过腐蚀较厚的基板20形成粗糙面210，或者在基板20表面烧结金属粉末形成粗糙面210，或者通过电镀其它金属材料形成粗糙面210等等。在本实施例中，优选折或扭的方式产生粗糙面210。
第一金属层21形成一具有正负两种电极的多电极电路结构，LED 30搭载在第一金属层21上。LED 30包括芯31、封装体32、反光杯33、导线34。第一金属层21的其中一个电极承载芯片31。该芯片31通过导线34分别与正负两个电极达成电性连接。所述电极通电后，该芯片31可产生向四周发散的光线。反光杯33环绕芯片31，反光杯33具有反射层，对芯片31发出的光线进行反射以达到聚光效果。从图2中能看出，该反光杯33可制造成长方形等有利于发光的形状。封装体32为一透明结构，其覆盖在芯片31上，并与反光杯33紧靠。封装体32内还可包括荧光粉。
LED 30均匀分布在基板20上，每两个LED 30之间都裸露着基板20的一部分，且在每两个LED 30之间裸露的基板20均经过处理使其表面产生粗糙面210。在本实施例中，粗糙面210包括第一粗糙面211和第二粗糙面212。其中，第一粗糙面211的粗糙程度更甚于第二粗糙面212。第一粗糙面211比第二粗糙面212更靠近灯条10的中央位置。在本实施例中，灯条10由四个LED 30组成。在灯条10中间的两个LED 30中间，具有第一粗糙面211，在最边的两个LED 30与中间的LED 30之间具有第二粗糙面212。当然，当灯条10具有更多个LED 30的情况下，还可能存在更多粗糙程度不一样的粗糙面210，并且粗糙程度最大的第一粗糙面211位于灯条10的最中间，越靠近灯条10的边缘，基板20表面的粗糙程度越小。可以理解地，各粗糙面210的粗糙程度也可以是一样的，只要是通过表面粗糙增大其表面积，即可达到增加散热效率的技术效果。
请再参阅图3，示出了本发明LED灯条10的第二实施例的剖视图。第二实施例是在第一实施例的基础上在LED灯条10的基板20最下面增加一支撑层24。该支撑层24比第一金属层21、绝缘层22、第二金属层23硬度大，且不与第一金属层21、绝缘层22、第二金属层23一起折叠、扭转。该支撑层24可在基板20粗糙化之后再形成于基板20底面。该支撑层24增加了整个基板20的机械强度，可避免其在受力情况下变形以致影响灯条10的性能。
另外，本领域技术人员还可在本发明精神内做其它变化，当然，这些依据本发明精神所做的变化，都应包含在本发明所要求保护的范围之内。

Claims (11)

1.一种LED灯条，其包括一基板及安装在基板上的若干LED，其特征在于：该基板在其表面避开LED的位置处形成粗糙面以增加其散热面积。
2.如权利要求1所述的LED灯条，其特征在于：该基板具有多个位于LED之间的弯折部。
3.如权利要求2所述的LED灯条，其特征在于：所述弯折部通过折叠、扭转形成。
4.如权利要求1所述的LED灯条，其特征在于：该灯条具有粗糙程度不一样的粗糙面。
5.如权利要求1所述的LED灯条，其特征在于：LED均匀分布在基板上且每个LED之间有裸露的基板。
6.如权利要求5所述的LED灯条，其特征在于：每个LED之间裸露的基板均具有粗糙面。
7.如权利要求4-6任一项所述的LED灯条，其特征在于：该LED灯条越靠中间的位置，基板表面的粗糙程度越大。
8.如权利要求1所述的LED灯条，其特征在于：该基板包括第一金属层、绝缘层和第二金属层。
9.如权利要求7所述的LED 灯条，其特征在于：该第一金属层、绝缘层和第二金属层均具有可挠性。
10.如权利要求7述的LED灯条，其特征在于：第一金属层的厚度大于绝缘层的厚度，并远小于第二金属层的厚度。
11.如权利要求9述的LED灯条，其特征在于：第一金属层的厚度为约35μm，绝缘层的厚度为约25μm，第二金属层的厚度为约300μm。
CN2011102051413A 2011-07-21 2011-07-21 Led灯条 Pending CN102889488A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2011102051413A CN102889488A (zh) 2011-07-21 2011-07-21 Led灯条
TW100126144A TWI427759B (zh) 2011-07-21 2011-07-25 Led燈條
US13/337,127 US20130020607A1 (en) 2011-07-21 2011-12-25 Led module and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011102051413A CN102889488A (zh) 2011-07-21 2011-07-21 Led灯条

Publications (1)

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CN102889488A true CN102889488A (zh) 2013-01-23

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ID=47533096

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Application Number Title Priority Date Filing Date
CN2011102051413A Pending CN102889488A (zh) 2011-07-21 2011-07-21 Led灯条

Country Status (3)

Country Link
US (1) US20130020607A1 (zh)
CN (1) CN102889488A (zh)
TW (1) TWI427759B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104728629A (zh) * 2013-12-24 2015-06-24 苏睿 一种led灯
CN108534001A (zh) * 2018-04-18 2018-09-14 苏州盛威佳鸿电子科技有限公司 一种散热型led灯条

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US20210364157A1 (en) * 2018-02-12 2021-11-25 Signify Holding B.V. Lighting arrangement comprising a substrate for light emitting elements
TWI648886B (zh) * 2018-05-09 2019-01-21 相豐科技股份有限公司 發光二極體結構

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CN1933695A (zh) * 2005-09-16 2007-03-21 财团法人工业技术研究院 可挠式散热电路基板
CN101079459A (zh) * 2006-05-23 2007-11-28 台达电子工业股份有限公司 发光装置
TWM338440U (en) * 2008-04-02 2008-08-11 Hsin Sun Engineering Co Ltd Flexible LED module
TWM350096U (en) * 2008-08-22 2009-02-01 Golden Sun News Tech Co Ltd Heat-dissipation structure of LED substrate and LED lamp tube thereof
CN102054924A (zh) * 2009-11-02 2011-05-11 三星电机株式会社 用于光学元件的封装基板及其制造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104728629A (zh) * 2013-12-24 2015-06-24 苏睿 一种led灯
CN108534001A (zh) * 2018-04-18 2018-09-14 苏州盛威佳鸿电子科技有限公司 一种散热型led灯条

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Publication number Publication date
TWI427759B (zh) 2014-02-21
US20130020607A1 (en) 2013-01-24
TW201306228A (zh) 2013-02-01

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Application publication date: 20130123