TWI427759B - Led燈條 - Google Patents

Led燈條 Download PDF

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Publication number
TWI427759B
TWI427759B TW100126144A TW100126144A TWI427759B TW I427759 B TWI427759 B TW I427759B TW 100126144 A TW100126144 A TW 100126144A TW 100126144 A TW100126144 A TW 100126144A TW I427759 B TWI427759 B TW I427759B
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TW
Taiwan
Prior art keywords
light bar
substrate
led light
metal layer
led
Prior art date
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TW100126144A
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English (en)
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TW201306228A (zh
Inventor
Hsin Chiang Lin
Wen Liang Tseng
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Advanced Optoelectronic Tech
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Application filed by Advanced Optoelectronic Tech filed Critical Advanced Optoelectronic Tech
Publication of TW201306228A publication Critical patent/TW201306228A/zh
Application granted granted Critical
Publication of TWI427759B publication Critical patent/TWI427759B/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Description

LED燈條
本發明涉及一種LED燈條，尤其涉及一種具有較佳散熱效果的LED燈條。
LED產業是近幾年最受矚目的產業之一，發展至今，LED產品已具有節能、省電、高效率、反應時間快、壽命週期時間長、且不含汞、具有環保效益等優點，已被使用在照明用途上。但是，LED的散熱問題在很大程度上影響LED的效率。散熱不良將會直接縮短LED的壽命甚至讓LED燈報廢。因此，必須對LED進行散熱。然而由於LED燈條的封裝限制，對LED燈條進行散熱一直是業界研究的重點問題。
有鑒於此，本發明提供一種可提高散熱效率的LED燈條。
一種LED燈條，其包括一基板及安裝在基板上的復數LED，其中，基板在其表面避開LED的位置處形成粗糙面以增加其散熱面積。
本發明通過增加基板表面的散熱面積，使基板能更快的把熱量散發到空氣中，LED燈條獲得更好的散熱效果。
10‧‧‧燈條
20‧‧‧基板
21‧‧‧第一金屬層
210‧‧‧粗糙面
211‧‧‧第一粗糙面
212‧‧‧第二粗糙面
22‧‧‧絕緣層
23‧‧‧第二金屬層
24‧‧‧支撐層
30‧‧‧LED
31‧‧‧晶片
32‧‧‧封裝體
33‧‧‧反光杯
34‧‧‧導線
圖1是本發明第一實施例的LED燈條的剖視圖。
圖2是圖1所示LED燈條的俯視圖。
圖3是本發明第二實施例的LED燈條的剖視圖。
請參閱圖1-2，示出了本發明燈條10的剖視圖和俯視圖。燈條10呈一長條形。該燈條10包括一長條形基板20及復數LED 30。LED 30均勻排布在基板20上。基板20包括一第一金屬層21、一絕緣層22及一第二金屬層23。第一金屬層21、絕緣層22、第二金屬層23從上到下順序疊加。在燈條10的兩端第一金屬層21、絕緣層22垂直彎折，絕緣層22包覆第二金屬層23，第一金屬層21在最外面包覆絕緣層22。其中，第一金屬層21與LED 30直接接觸。第一金屬層21的厚度大於絕緣層22的厚度，並遠小於第二金屬層23的厚度。第一金屬層21的厚度優選為約35μm，絕緣層22的厚度優選為約25μm，第二金屬層23的厚度優選為約300μm。基板20為一具有可撓性的基板20，其中的兩層金屬層21、23以及絕緣層22均具有如薄質金屬板一樣的可撓性，即其可以任意角度的折疊、扭轉。基板20經過折疊、扭轉等處理方式處理後，在其原本光滑的表面留下折痕形成彎折部(圖未標)，即基板20可通過整體的折或扭等方式產生皺褶使其表面產生粗糙面210。該基板20在不同位置經過多次折疊或扭轉，其產生的多個皺褶使基板20的表面產生多個粗糙面210。由於粗糙面210的存在，基板20具有更大的表面積，更利於燈條10的散熱。當然，基板20還可以通過其他方式產生粗糙面210，如通過腐蝕較厚的基板20形成粗糙面210，或者在基板20表面燒結金屬粉末形成粗糙面210，或者通過電鍍其他金屬材料形成粗糙面210等等。在本實施例中，優選折或扭的方式 產生粗糙面210。
第一金屬層21形成一具有正負兩種電極的多電極電路結構，LED 30搭載在第一金屬層21上。LED 30包括芯31、封裝體32、反光杯33、導線34。第一金屬層21的其中一個電極承載晶片31。該晶片31通過導線34分別與正負兩個電極達成電性連接。所述電極通電後，該晶片31可產生向四周發散的光線。反光杯33環繞晶片31，反光杯33具有反射層，對晶片31發出的光線進行反射以達到聚光效果。從圖2中能看出，該反光杯33可製造成長方形等有利於發光的形狀。封裝體32為一透明結構，其覆蓋在晶片31上，並與反光杯33緊靠。封裝體32內還可包括螢光粉。
LED 30均勻分佈在基板20上，每兩個LED 30之間都裸露著基板20的一部分，且在每兩個LED 30之間裸露的基板20均經過處理使其表面產生粗糙面210。在本實施例中，粗糙面210包括第一粗糙面211和第二粗糙面212。其中，第一粗糙面211的粗糙程度更甚於第二粗糙面212。第一粗糙面211比第二粗糙面212更靠近燈條10的中央位置。在本實施例中，燈條10由四個LED 30組成。在燈條10中間的兩個LED 30中間，具有第一粗糙面211，在最邊的兩個LED 30與中間的LED 30之間具有第二粗糙面212。當然，當燈條10具有更多個LED 30的情況下，還可能存在更多粗糙程度不一樣的粗糙面210，並且粗糙程度最大的第一粗糙面211位於燈條10的最中間，越靠近燈條10的邊緣，基板20表面的粗糙程度越小。可以理解地，各粗糙面210的粗糙程度也可以是一樣的，只要是通過表面粗糙增大其表面積，即可達到增加散熱效率的技術效果。
請再參閱圖3，示出了本發明LED燈條10的第二實施例的剖視圖。 第二實施例是在第一實施例的基礎上在LED燈條10的基板20最下面增加一支撐層24。該支撐層24比第一金屬層21、絕緣層22、第二金屬層23硬度大，且不與第一金屬層21、絕緣層22、第二金屬層23一起折疊、扭轉。該支撐層24可在基板20粗糙化之後再形成於基板20底面。該支撐層24增加了整個基板20的機械強度，可避免其在受力情況下變形以致影響燈條10的性能。
另外，本領域技術人員還可在本發明精神內做其他變化，當然，這些依據本發明精神所做的變化，都應包含在本發明所要求保護的範圍之內。
10‧‧‧燈條
20‧‧‧基板
21‧‧‧第一金屬層
210‧‧‧粗糙面
211‧‧‧第一粗糙面
212‧‧‧第二粗糙面
22‧‧‧絕緣層
23‧‧‧第二金屬層
30‧‧‧LED
33‧‧‧反光杯
34‧‧‧導線

Claims (11)

  1. 一種LED燈條，其包括一基板及安裝在基板上的復數LED，其改良在於：該基板在其承載LED的表面避開LED的位置處形成粗糙面以增加其散熱面積。
  2. 如申請專利範圍第1項所述的LED燈條，其中該基板具有多個位於LED之間的彎折部。
  3. 如申請專利範圍第2項所述的LED燈條，其中所述彎折部通過折疊、扭轉形成。
  4. 如申請專利範圍第1項所述的LED燈條，其中該燈條具有粗糙程度不一樣的粗糙面。
  5. 如申請專利範圍第1項所述的LED燈條，其中LED均勻分佈在基板上且每個LED之間有裸露的基板。
  6. 如申請專利範圍第4項所述的LED燈條，其中每個LED之間裸露的基板均具有粗糙面。
  7. 如申請專利範圍4-6任一項所述的LED燈條，其中該LED燈條越靠中間的位置，基板表面的粗糙程度越大。
  8. 如申請專利範圍第1項所述的LED燈條，其中該基板包括第一金屬層、絕緣層和第二金屬層。
  9. 如申請專利範圍第7項所述的LED燈條，其中該第一金屬層、絕緣層和第二金屬層均具有可撓性。
  10. 如申請專利範圍第7項所述的LED燈條，其中第一金屬層的厚度大於絕緣層的厚度，並遠小於第二金屬層的厚度。
  11. 如申請專利範圍第9項所述的LED燈條，其中第一金屬層的厚度為約35μm ，絕緣層的厚度為約25μm，第二金屬層的厚度為約300μm。
TW100126144A 2011-07-21 2011-07-25 Led燈條 TWI427759B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011102051413A CN102889488A (zh) 2011-07-21 2011-07-21 Led灯条

Publications (2)

Publication Number Publication Date
TW201306228A TW201306228A (zh) 2013-02-01
TWI427759B true TWI427759B (zh) 2014-02-21

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ID=47533096

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Application Number Title Priority Date Filing Date
TW100126144A TWI427759B (zh) 2011-07-21 2011-07-25 Led燈條

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US (1) US20130020607A1 (zh)
CN (1) CN102889488A (zh)
TW (1) TWI427759B (zh)

Cited By (1)

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TWI648886B (zh) * 2018-05-09 2019-01-21 相豐科技股份有限公司 發光二極體結構

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CN104728629A (zh) * 2013-12-24 2015-06-24 苏睿 一种led灯
JP7405755B2 (ja) * 2018-02-12 2023-12-26 シグニファイ ホールディング ビー ヴィ 発光要素用の基板を備える照明構成
CN108534001A (zh) * 2018-04-18 2018-09-14 苏州盛威佳鸿电子科技有限公司 一种散热型led灯条

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TW200737540A (en) * 2006-03-24 2007-10-01 Gigno Technology Co Ltd LED module
TWM383195U (en) * 2009-12-24 2010-06-21 Jiuh Rong Electronics Ltd High thermal conductive aluminum board micro-etching geometric structure of

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI648886B (zh) * 2018-05-09 2019-01-21 相豐科技股份有限公司 發光二極體結構

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CN102889488A (zh) 2013-01-23
US20130020607A1 (en) 2013-01-24
TW201306228A (zh) 2013-02-01

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